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Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Применить Всего найдено 21. Отображено 21.
15-06-2011 дата публикации

Method of manufacturing printed wiring board

Номер: CN0102098881A
Автор: KATSUHIKO TANNO, YOUICHIROU KAWAMURA, TANNO KATSUHIKO, KAWAMURA YOUICHIROU
Принадлежит:

The invention provides a method of manufacturing a printed wiring board capable of surely forming a high solder bump on a small diameter connection pad provided in the opening of a solder resist. A solder ball (77) is molten by reflowing to form a high solder bump (78U) from the solder ball (77) installed in the upper surface opening (71). Since a distance between the solder ball (77) installed in the opening (71) and the connection pad (158P) is reduced by adjusting the thickness of a solder resist layer (70), the solder bump (78U) can be surely connected to the connection pad (158P) when the solder ball (77) is molten by reflowing.

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Номер записи: 1
26-02-2008 дата публикации

PRINTED-CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE SAME

Номер: KR1020080017431A
Автор: TANNO KATSUHIKO, KAWAMURA YOUICHIROU
Принадлежит:

Provided is a method for manufacturing a printed-circuit board, which can form bumps at substantially identical heights on connection pads having different opening diameters of a solder resist. Diametrically-small bumps (78S), which are made high of solder balls (77) mounted in diametrically-small openings (71S) of a solder resist layer (70), are flattened to have the same height as that of the solder bumps (78P) of diametrically-large openings (71P). The solder bumps (78S) of the diametrically small openings (71S) and the solder bumps (78P) of the diametrically large openings (71P) are identical in the solder quantity. No connection occurs at the solder bumps (78S) of the diametrically small openings (71S) so that the connection reliability between an IC chip (90) and a multilayer printed-circuit board (10) can be retained. © KIPO & WIPO 2008 ...

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Номер записи: 2
09-02-2012 дата публикации

Printed Wiring Board And A Method Of Manufacturing A Printed Wiring Board

Номер: US20120031659A1
Автор: Katsuhiko TANNO, Youichirou Kawamura, TANNO KATSUHIKO, KAWAMURA YOUICHIROU
Принадлежит: IBIDEN CO., LTD

A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 m.

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Номер записи: 3
31-03-2008 дата публикации

METHOD OF MANUFACTURING PRINTED WIRING BOARD

Номер: KR1020080028467A
Автор: TANNO KATSUHIKO, KAWAMURA YOUICHIROU
Принадлежит:

... [PROBLEMS] To provide a method of manufacturing a printed wiring board capable of surely forming a high solder bump on a small diameter connection pad provided in the opening of a solder resist. [MEANS FOR SOLVING THE PROBLEMS] A solder ball (77) is molten by reflowing to form a high solder bump (78U) from the solder ball (77) installed in the upper surface opening (71). Since a distance between the solder ball (77) installed in the opening (71) and the connection pad (158P) is reduced by adjusting the thickness of a solder resist layer (70), the solder bump (78U) can be surely connected to the connection pad (158P) when the solder ball (77) is molten by reflowing. © KIPO & WIPO 2008 ...

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Номер записи: 4
13-02-2008 дата публикации

METHOD AND APPARATUS FOR MOUNTING SOLDER BALL

Номер: KR1020080014143A
Автор: TANNO KATSUHIKO, KAWAMURA YOUICHIROU
Принадлежит:

... [PROBLEMS] To provide a solder ball mounting apparatus capable of mounting fine solder balls on electrodes. [MEANS FOR SOLVING THE PROBLEMS] The solder balls (78s) are collected by sucking air from a mounting tube (24) positioned above a ball arranging mask (16). A printed wiring board (10) and the ball arranging mask (16) are moved horizontally to move the solder balls (78s) collected just below the mounting tube (24) onto the ball arranging mask (16) and drop them onto the electrodes (75) of the multilayer printed wiring board (10) through the openings (16a) of the ball arranging mask (16). © KIPO & WIPO 2008 ...

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Номер записи: 5
17-11-2010 дата публикации

Printed-circuit board, and method for manufacturing the same

Номер: CN0101888747A
Автор: TANNO KATSUHIKO, KAWAMURA YOUICHIROU, KATSUHIKO TANNO, YOUICHIROU KAWAMURA
Принадлежит:

Provided is a method for manufacturing a printed-circuit board, which can form bumps at substantially identical heights on connection pads having different opening diameters of a solder resist. Diametrically-small bumps (78S), which are made high of solder balls (77) mounted in diametrically-small openings (71S) of a solder resist layer (70), are flattened to have the same height as that of the solder bumps (78P) of diametrically-large openings (71P). The solder bumps (78S) of the diametrically small openings (71S) and the solder bumps (78P) of the diametrically large openings (71P) are identical in the solder quantity. No connection occurs at the solder bumps (78S) of the diametrically small openings (71S) so that the connection reliability between an IC chip (90) and a multilayer printed-circuit board (10) can be retained.

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Номер записи: 6
28-01-2009 дата публикации

Method and apparatus for mounting solder ball

Номер: CN0101356866A
Автор: KATSUHIKO TANNO, YOUICHIROU KAWAMURA, TANNO KATSUHIKO, KAWAMURA YOUICHIROU
Принадлежит:

The present invention provides a solder ball mounting apparatus capable of mounting fine solder balls on electrodes. The solder balls (78s) are collected by sucking air from a mounting tube (24) positioned above a ball arranging mask (16). A printed wiring board (10) and the ball arranging mask (16) are moved horizontally to move the solder balls (78s) collected just below the mounting tube (24) onto the ball arranging mask (16) and drop them onto the electrodes (75) of the multilayer printed wiring board (10) through the openings (16a) of the ball arranging mask (16).

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Номер записи: 7
22-03-2012 дата публикации

METHOD AND APPARATUS FOR LOADING SOLDER BALLS

Номер: US20120067938A1
Автор: Katsuhiko Tanno, Youichirou Kawamura, TANNO KATSUHIKO, KAWAMURA YOUICHIROU
Принадлежит: IBIDEN CO., LTD.

A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having openings that correspond to the pads, one or more cylinder members is positioned over the holding device such that an opening portion of the cylinder member faces the holding device, the cylinder member gathering solder balls on the surface of the ball array mask under the cylinder member by suctioning air through the opening portion. A conveyor mechanism for moving the ball array mask and the printed wiring board relative to the cylinder member such that solder balls gathered under the opening portion of the cylinder member can be loaded onto the pads of the board through the openings of the mask held by the holding device. 1. A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board , comprising:a holding device configured to hold a printed wiring board having a plurality of pads and to hold a ball array mask having a plurality of openings that correspond to pads of the printed wiring board;at least one cylinder member positioned over the holding device such that an opening portion of the cylinder member faces the holding device, the cylinder member being configured to gather solder balls on a surface of the ball array mask under the cylinder member by suctioning air through the opening portion of the cylinder member; anda conveyor mechanism configured to move the ball array mask and the printed wiring board relative to the cylinder member such that solder balls gathered under the opening portion of the cylinder member can be loaded onto the pads of the printed wiring board through the openings of the ball array mask held by the holding device.2. The apparatus of claim 1 , wherein the at least one cylinder member comprises a plurality of cylinder members arranged in proportion to a size of a printed wiring board held by the ...

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Номер записи: 8
10-01-2012 дата публикации

Method and apparatus for loading solder balls

Номер: US0008091766B2
Автор: Katsuhiko Tanno, Youichirou Kawamura, TANNO KATSUHIKO, KAWAMURA YOUICHIROU
Принадлежит: Ibiden Co., Ltd., TANNO KATSUHIKO, KAWAMURA YOUICHIROU, IBIDEN CO LTD, IBIDEN CO., LTD.

A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having of openings that correspond to pads of the printed wiring board, one or more cylinder members positioned over the holding device such that an opening portion of the cylinder member faces the holding device, the cylinder member gathering solder balls on the surface of the ball array mask under the cylinder member by suctioning air through the opening portion of the cylinder member, and a conveyor mechanism for moving the ball array mask and the printed wiring board relative to the cylinder member such that solder balls gathered under the opening portion of the cylinder member can be loaded onto the pads of the printed wiring board through the openings of the ball array mask held by the holding device.

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Номер записи: 9
02-02-2011 дата публикации

Method of manufacturing printed wiring board

Номер: CN0101331812B
Автор: YOUICHIROU KAWAMURA, KATSUHIKO TANNO, KAWAMURA YOUICHIROU, TANNO KATSUHIKO
Принадлежит:

To provide a method of manufacturing a printed wiring board capable of surely forming a high solder bump on a small diameter connection pad provided in the opening of a solder resist. A solder ball (77) is molten by reflowing to form a high solder bump (78U) from the solder ball (77) installed in the upper surface opening (71). Since a distance between the solder ball (77) installed in the opening (71) and the connection pad (158P) is reduced by adjusting the thickness of a solder resist layer (70), the solder bump (78U) can be surely connected to the connection pad (158P) when the solder ball (77) is molten by reflowing.

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Номер записи: 10
01-09-2010 дата публикации

Printed-circuit board, and method for manufacturing the same

Номер: CN0101356642B
Автор: KATSUHIKO TANNO, YOUICHIROU KAWAMURA, TANNO KATSUHIKO, KAWAMURA YOUICHIROU
Принадлежит:

Provided is a method for manufacturing a printed-circuit board, which can form bumps at substantially identical heights on connection pads having different opening diameters of a solder resist. Diametrically-small bumps (78S), which are made high of solder balls (77) mounted in diametrically-small openings (71S) of a solder resist layer (70), are flattened to have the same height as that of the solder bumps (78P) of diametrically-large openings (71P). The solder bumps (78S) of the diametrically small openings (71S) and the solder bumps (78P) of the diametrically large openings (71P) are identical in the solder quantity. No connection occurs at the solder bumps (78S) of the diametrically small openings (71S) so that the connection reliability between an IC chip (90) and a multilayer printed-circuit board (10) can be retained.

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Номер записи: 11
16-12-2007 дата публикации

Method of manufacturing printed wiring board

Номер: TW0200746964A
Автор: TANNO KATSUHIKO, KAWAMURA YOUICHIROU, TANNO, KATSUHIKO, KAWAMURA, YOUICHIROU
Принадлежит:

To provide a method of manufacturing a printed wiring board capable of surely forming a high solder bump on a small diameter connection pad provided in the opening of a solder resist. A solder ball (77) is molten by reflowing to form a high solder bump (78U) from the solder ball (77) installed in the upper surface opening (71). Since a distance between the solder ball (77) installed in the opening (71) and the connection pad (158P) is reduced by adjusting the thickness of a solder resist layer (70), the solder bump (78U) can be surely connected to the connection pad (158P) when the solder ball (77) is molten by reflowing.

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Номер записи: 12
16-12-2007 дата публикации

Method and apparatus for mounting solder ball

Номер: TW0200746965A
Автор: TANNO KATSUHIKO, KAWAMURA YOUICHIROU, TANNO, KATSUHIKO, KAWAMURA, YOUICHIROU
Принадлежит:

To provide a solder ball mounting apparatus capable of mounting fine solder balls on electrodes. The solder balls (78s) are collected by sucking air from a mounting tube (24) positioned above a ball arranging mask (16). A printed wiring board (10) and the ball arranging mask (16) are moved horizontally to move the solder balls (78s) collected just below the mounting tube (24) onto the ball arranging mask (16) and drop them onto the electrodes (75) of the multilayer printed wiring board (10) through the openings (16a) of the ball arranging mask (16).

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Номер записи: 13
25-10-2016 дата публикации

Printed wiring board and a method of manufacturing a printed wiring board

Номер: US0009480170B2
Автор: Katsuhiko Tanno, Youichirou Kawamura, TANNO KATSUHIKO, KAWAMURA YOUICHIROU, Tanno Katsuhiko, Kawamura Youichirou
Принадлежит: IBIDEN Co., Ltd., TANNO KATSUHIKO, KAWAMURA YOUICHIROU, IBIDEN CO LTD, Tanno Katsuhiko, Kawamura Youichirou

A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 μm.

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Номер записи: 14
27-12-2011 дата публикации

Method for manufacturing a printed wiring board

Номер: US0008083123B2
Автор: Katsuhiko Tanno, Youichirou Kawamura, TANNO KATSUHIKO, KAWAMURA YOUICHIROU
Принадлежит: IBIDEN Co., Ltd., TANNO KATSUHIKO, KAWAMURA YOUICHIROU, IBIDEN CO LTD, IBIDEN CO., LTD.

A method of manufacturing a printed wiring board having at least one solder bump includes forming a solder resist layer on a conductor layer. The solder resist layer has at least one opening that exposes a connection pad of the conductor layer, and the at least one opening in the solder resist layer has a depth D, from the solder resist layer to the exposed connection pad, of from 3 m to 18 m. The method also includes loading a solder ball into each of the at least one opening in the solder resist layer, and forming a bump on the exposed connection pad by heating the solder ball to a reflow temperature.

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Номер записи: 15
03-01-2012 дата публикации

Printed wiring board and a method of manufacturing a printed wiring board

Номер: US0008087164B2
Автор: Katsuhiko Tanno, Youichirou Kawamura, TANNO KATSUHIKO, KAWAMURA YOUICHIROU
Принадлежит: IBIDEN Co., Ltd., TANNO KATSUHIKO, KAWAMURA YOUICHIROU, IBIDEN CO LTD, IBIDEN CO., LTD.

A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 m.

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Номер записи: 16
28-01-2009 дата публикации

Printed-circuit board, and method for manufacturing the same

Номер: CN0101356642A
Автор: KATSUHIKO TANNO, YOUICHIROU KAWAMURA, TANNO KATSUHIKO, KAWAMURA YOUICHIROU
Принадлежит:

Provided is a method for manufacturing a printed-circuit board, which can form bumps at substantially identical heights on connection pads having different opening diameters of a solder resist. Diametrically-small bumps (78S), which are made high of solder balls (77) mounted in diametrically-small openings (71S) of a solder resist layer (70), are flattened to have the same height as that of the solder bumps (78P) of diametrically-large openings (71P). The solder bumps (78S) of the diametrically small openings (71S) and the solder bumps (78P) of the diametrically large openings (71P) are identical in the solder quantity. No connection occurs at the solder bumps (78S) of the diametrically small openings (71S) so that the connection reliability between an IC chip (90) and a multilayer printed-circuit board (10) can be retained.

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Номер записи: 17
24-12-2008 дата публикации

Method of manufacturing printed wiring board

Номер: CN0101331812A
Автор: KATSUHIKO TANNO, YOUICHIROU KAWAMURA, TANNO KATSUHIKO, KAWAMURA YOUICHIROU
Принадлежит:

To provide a method of manufacturing a printed wiring board capable of surely forming a high solder bump on a small diameter connection pad provided in the opening of a solder resist. A solder ball (77) is molten by reflowing to form a high solder bump (78U) from the solder ball (77) installed in the upper surface opening (71). Since a distance between the solder ball (77) installed in the opening (71) and the connection pad (158P) is reduced by adjusting the thickness of a solder resist layer (70), the solder bump (78U) can be surely connected to the connection pad (158P) when the solder ball (77) is molten by reflowing.

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Номер записи: 18
06-10-2010 дата публикации

Method and apparatus for mounting solder ball

Номер: CN0101356866B
Автор: YOUICHIROU KAWAMURA, KATSUHIKO TANNO, KAWAMURA YOUICHIROU, TANNO KATSUHIKO
Принадлежит:

The present invention provides a solder ball mounting apparatus capable of mounting fine solder balls on electrodes. The solder balls (78s) are collected by sucking air from a mounting tube (24) positioned above a ball arranging mask (16). A printed wiring board (10) and the ball arranging mask (16) are moved horizontally to move the solder balls (78s) collected just below the mounting tube (24) onto the ball arranging mask (16) and drop them onto the electrodes (75) of the multilayer printed wiring board (10) through the openings (16a) of the ball arranging mask (16).

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Номер записи: 19
08-10-2008 дата публикации

Method and apparatus for mounting solder ball

Номер: EP1978794A1
Автор: Katsuhiko c/o IBIDEN CO. LTD. TANNO, Youichirou c/o IBIDEN Co. Ltd. KAWAMURA
Принадлежит: Ibiden Co Ltd

[Subject Matter] To provide a solder-ball loading apparatus for loading microscopic solder balls onto electrodes [Solution] By suctioning air through loading cylinder 24 positioned above ball array mask 16, solder balls (78s) are gathered. By horizontally moving printed wiring board 10 and ball array mask 16, solder balls (78s) gathered directly under loading cylinder 24 are moved on ball array mask 16 and dropped onto electrodes 75 of multilayered printed wiring board 10 through openings (16a) of ball array mask 16.

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Номер записи: 20
02-08-2007 дата публикации

プリント配線板の製造方法

Номер: WO2007086509A1
Автор: Katsuhiko Tanno, Youichirou Kawamura
Принадлежит: IBIDEN CO., LTD.

　　【課題】　ソルダーレジストの開口に設けられた小径の接続パッドに高さの高いバンプを確実に形成できるプリント配線板の製造方法を提供する。 　　【解決手段】　リフローすることにより半田ボール７７を溶融し、上面の開口７１に搭載した半田ボール７７から高さの高い半田バンプ７８Ｕを形成する。この際に、ソルダーレジスト層７０の厚みを調整することで、開口７１に搭載された半田ボール７７と接続パッド１５８Ｐとの距離を近接させるため、半田ボール７７をリフローした際に半田バンプ７８Ｕと接続パッド１５８Ｐとの接続を確実に取ることができる。

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Номер записи: 21