06-05-1994 дата публикации
Номер: JP0006122786A
Принадлежит:
PURPOSE: To obtain a fluidizing composition for forming a stable gold seed layer with little degradation useful for preparing a tight adhesion electric circuit on a substrate by compounding an org. gold compd., an org. polymer having a specific thermal decomposition temperature and a fluidizing vehicle and firing it on the substrate. CONSTITUTION: A fluidizing composition contains an org. gold compd., a resin deriv. and a fluidizing vehicle. This composition is applied to a substrate and forms substantially a gold seed layer suitable for preparing an electric circuit on the substrate by decomposing and firing the composition on the substrate. This gold seed layer maintains adhesion to the substrate even after being exposed at 150°C for 1000 hours. In this case, the resin deriv. contains an org. polymer having a thermal decomposition temperature by at least 200°C higher than that of the org. gold compd. and the thermal decomposition temperature means a temperature at which 90% of wt. loss ...
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