Wafer packaging method

IMAGE SENSOR CHIP PACKAGE FABRICATING METHOD

Passive component structure and manufacturing method thereof

Electronic component package body and manufacturing method thereof

The present invention discloses an electronic component package body and a manufacturing method thereof, wherein the electronic component package body comprises: a semiconductor substrate containing a plurality of electronic component chips; a protective layer arranged on the semiconductor substrate and provided with an opening; a conductive projection arranged inside the opening of the protective layer; and a stress release structure arranged inside the protective layer and surrounding the conductive projection. And the manufacturing method of the electronic component package body comprises the steps of: forming the protective layer on the semiconductor substrate; patterning the protective layer; forming a first opening and a plurality of second openings which surround the first opening;and forming the conductive projection inside the first opening, wherein the plurality of second openings form the stress release structure to surround the conductive projection.

Electronic device package and fabricating method thereof

An electronic device package is disclosed. The package includes at least one semiconductor chip having a first surface and a second surface opposite thereto, in which at least one redistribution layer is disposed on the first surface of the semiconductor chip and is electrically connected to at least one conductive pad structure. At least one abut portion is disposed on the redistribution layer and electrically contacting thereto. A passivation layer covers the first surface of the semiconductor chip and surrounds the abut portion. A substrate is attached onto the second surface of the semiconductor chip. A fabrication method of the electronic device package is also disclosed.

Electronic element packager and manufacturing method thereof

The invention provides an electronic element packager and a manufacturing method thereof. The electronic element packager comprises a carrying wafer, an electronic element chip, an insulating laminate, a plurality of rerouting circuit patterns which are insulated with one another, and a plurality of conductive bumps, wherein the electronic element chip is arranged above the carrying wafer, and a plurality of conductive pads are arranged on the electronic element chip; the insulating laminate comprises a lower first insulating layer and an upper second insulating layer, the first insulating layer covers the carrying wafer and the electronic element chip, and a plurality of openings are formed on the insulating laminate to expose the conductive pads respectively; the plurality of rerouting circuit patterns are sequentially formed in the insulating laminate and the openings, and are electrically connected with the conductive pads; and the plurality of conductive bumps are formed on the rerouting ...

Image sensor chip package and fabricating method thereof

Electronic device package and fabricating method thereof

Support plate structure

The invention relates to a carrier plate structure which is defined with a packaging area and a detection area which are adjacent to each other, a plurality of substrates are arranged on the packaging area, and at least one of a testing part, a monitoring part and a metal part is arranged on the detection area, so that the application of subsequent packaging and detection processes is facilitated.