Metallurgy purification method for polysilicon

The invention discloses a method for metallurgical purification of a polysilicon, which particularly to a purification technology being capable of decreasing the contents of boron and phosphor which influence the battery efficiency. The method comprises the following steps: sodium oxide, lime and fluorite are added during the slagging and oxidation process, boron and phosphor are made into oxide by a displacement reaction, the oxide is dissolved in slag, the melting temperature is reduced by adding with the fluorite, the fluxing medium dissolves in the leaching process of the dilute acid, the oxidizing acid oxidizes and dissolves boride and metallic compounds at the transition zone, and then the complexant for hydrofluoric acid and boron corrodes the surface of silicon, and the boron impurity is extracted from the surface of silicon particles to a solvent under the effect of complexant. The method has low energy consumption and no pollution, and can improve the purity of polysilicon.

Fresh food housekeeping robot for household logistics

The invention relates to the technical field of robots, in particular to a household logistics fresh food housekeeper robot which comprises a machine body, storage boxes are fixedly connected to the middles of the outer walls of the two sides of the machine body, cover plates are arranged on the upper surfaces of the storage boxes, partition plates are fixedly connected to the inner walls of the storage boxes, and a plurality of mounting cavities are formed in the storage boxes; and semiconductor chilling plates are arranged in the mounting cavities. According to the fresh food housekeeper robot for household logistics, the partition plates are arranged in the storage box, so that different types of food can be stored at the same time, and through the infrared sensor arranged on the lower portion of the inner wall of the storage box, when it is detected that fresh food in the storage box reaches the bottom, a signal is transmitted to the signal receiving and transmitting module; the signal ...

Artificial floating island for coral bionic environment restoration

The invention discloses an artificial floating island for coral bionic environment restoration, which comprises a floating island main body made of a foaming buoyancy material, and the whole floating island main body is of a dish-shaped structure of which the upper part and the lower part are convex outwards; an axial through hole communicated with the seabed is formed in the center of the floating island body, the bottom of the through hole is connected with at least two anchor cables, and the bottom ends of the anchor cables are anchored to the seabed. The slopes on the two sides of the upper convex part of the floating island main body are coral growth platforms, and the slopes on the two sides of the lower convex part of the floating island main body are wave power generation structure mounting platforms; the middle of the top face of the upper protruding part of the floating island body is of a plane structure, the plane structure is located below the sea surface in the rising tide ...

Pin wiring structure of card insertion end of flexible printed circuit board

The invention discloses a pin wiring structure of a card insertion end of a flexible printed circuit board, which comprises a substrate, a first conductive layer, a second conductive layer and a plurality of conducted elements, wherein the first and second conductive layers are arranged on the two surfaces of the substrate respectively; the first conductive layer is provided with a plurality of first wires; the second conductive layer is provided with a plurality of second wires; the first wires electrically extend a plurality of first pins and are provided with a plurality of second pins in different positions from the first pins; the second wires are correspondingly extended to the corresponding positions of the second pins; and the conducted elements are electrically communicated to thesecond pins and the second wires respectively so that the second pins, the first wires and the first pins are in a non-contacted off state to form the card insertion end of the flexible printed circuit ...

Pin wiring structure of card insertion end of flexible printed circuit board

The invention discloses a pin wiring structure of a card insertion end of a flexible printed circuit board, which comprises a substrate, a first conductive layer, a second conductive layer and a plurality of conducted elements, wherein the first and second conductive layers are arranged on the two surfaces of the substrate respectively; the first conductive layer is provided with a plurality of first wires; the second conductive layer is provided with a plurality of second wires; the first wires electrically extend a plurality of first pins and are provided with a plurality of second pins in different positions from the first pins; the second wires are correspondingly extended to the corresponding positions of the second pins; and the conducted elements are electrically communicated to the second pins and the second wires respectively so that the second pins, the first wires and the first pins are in a non-contacted off state to form the card insertion end of the flexible printed circuit ...

Production method of steel clad copper composite

The invention discloses a production method of a steel clad copper composite. The method includes the steps: firstly, selecting steel or stainless steel and copper or copper alloy; secondly, cleaning the surfaces of the selected materials prior to drying and laminating to form a composite blank, loading and putting the composite blank in a graphite boat, filling the space between the outer material and the inner wall of the graphite boat with emery prior to filling and tamping, and additionally placing extra materials of the same model on the inner material; thirdly, putting the graphite boat loaded with the composite blank into a heat treatment furnace fed with high-purity argon for protection, enabling molten copper base alloy liquid flow to fully contact with the steel, generating physicochemical reaction between copper and iron to form solid solution or alloy compound, and then cooling in the furnace prior to taking out to obtain the blank of the steel clad copper composite; fourthly ...

Part welding pad wiring structure of flexible printed circuit board

The invention provides a part welding pad wiring structure of a flexible printed circuit board, comprising a top-layer base material, a middle-layer base material, a bottom-layer base material, at least one upper-layer wire, at least one lower-layer wire, at least one welding pad and at least one through hole with conductivity, wherein the top-layer base material, the middle-layer base material and the bottom-layer base material are parallel and overlaid; the upper-layer wire is arranged between the top-layer base material and the middle-layer base material; the lower-layer wire is arranged between the middle-layer base material and the bottom-layer base material; the welding pad is overlaid on the upper-layer wire and exposes out of the top-layer base material so as to electrically connect the welding pad with the upper-layer wire; and the through hole with conductivity corresponds to the welding pad and sequentially penetrates through the upper-layer wire, the middle-layer base material ...

Soft printed circuit board and LCD module with this soft printed circuit board

This invention relates to a soft PCB and a LCD module with the PCB, in which, the LCD module includes a frame, a soft PCB and multiple electronic components, and the frame includes a containing groove, at least a fin is extended from the side of the soft board of the PCB to increase the insertion space for inserted electronic components and said fin is turned over against the soft board and contained in the containing groove of the frame so as to insert more electronic components without increasing size of modules.

Method for refining metal silicon

The embodiment of the invention provides a method for refining metal silicon, belonging to the field of chemical engineering. The method uses metallurgy principle to prepare a quasi-solar energy grade silicon material under a condition of maintaining solid state of metallurgical silicon according to impurities affecting the service life of carriers and cell performance, and differences of physical performance and chemical performance of silicon; the method uses air blowing and high-temperature vacuum evaporation technology to promote the impurities inside silicon powder at high temperature tobe transferred to the surface of the silicon and removed by diffusing and segregating boron-phosphor oxide on the surface of a crystal boundary and reducing evaporation of substances with smaller vapor pressure, and leaching second phase substances of the crystal boundary by hydrofluoric acid to ensure that the purity of the metallurgical silicon is improved in a certain degree. The method has the advantages ...

Purification method of silicon

The embodiment of the invention provides a purification method of silicon, which belongs to the fields of solar energy and chemical engineering and comprises the following steps of: mixing silicon grains and Al with the purity of 99.99 percent, putting the mixture into a crucible, putting the crucible with the mixture of Si and Al into a medium frequency induction furnace for melting, introducing the mixed gas of Ar and H2 into the induction furnace, adding Ti grains with the purity of 99.99 percent into a Si-Al fused mass and continuously keeping melting and stirring states for 10-30 minutes; casting a Si-Al-Ti melt in the melting state into a directionally solidified furnace crucible, and inhabiting the lateral heat dispersion of the Si-Al-Ti melt through a maintaining furnace; and introducing water to the bottom of a directionally solidified furnace crucible mould for directional solidification to obtain a silicon ingot. The method has the advantage of high boron removing rate.

Semiconductor power module and power device

The invention provides a semiconductor power module and a power device, the power module comprises a lining plate, the surface of the lining plate is provided with a plurality of metal layers which are sequentially distributed along a first direction, and the metal layers at least comprise a first metal layer, a second metal layer and a third metal layer which are sequentially distributed; the first metal layer and the third metal layer are strip-shaped and extend along a second direction perpendicular to the first direction, the second metal layer is adjacent to the first metal layer and the third metal layer, and the width of the second metal layer is matched with that of the lining plate in the second direction. Based on the technical scheme of the invention, by performing layout design on the metal layers, reducing the number of small-area metal islands and performing integration, the utilization rate of the surface space of the lining plate is improved, and the area of at least one ...

Method for preparing solar energy level polysilicon with high temperature vacuum preprocessing

The invention discloses a method for preparing solar grade polysilicon through high-temperature vacuum pretreatment. The method comprises the following steps: firstly, metallurgic silicon is crushed and grinded into powder, and an oil layer on the surface of the metallurgic silicon is leached out by ethanol; secondly, high-temperature treatment is performed at a temperature of between 1,000 and 1,300 DEG C under the protection of Ar gas; and thirdly, intermediate-temperature treatment is performed at a temperature of over 150 DEG C under the vacuum environment of between 0.1 and 1 MPa. The silicon powder after two steps of pretreatment of high temperature and vacuum is impregnated in an HF acid with a concentration of 0.35 mol per liter, and magnetic force is used for stirring during the impregnating process; and the impregnated silicon powder is washed by deionized water and then placed into a vacuum tank for drying. The method is convenient in operation, has no pollution, has low cost ...

Method for preparing solar energy level polysilicon with high temperature vacuum preprocessing

The invention discloses a method for preparing solar grade polysilicon through high-temperature vacuum pretreatment. The method comprises the following steps: firstly, metallurgic silicon is crushed and grinded into powder, and an oil layer on the surface of the metallurgic silicon is leached out by ethanol; secondly, high-temperature treatment is performed at a temperature of between 1,000 and 1,300 DEG C under the protection of Ar gas; and thirdly, intermediate-temperature treatment is performed at a temperature of over 150 DEG C under the vacuum environment of between 0.1 and 1 MPa. The silicon powder after two steps of pretreatment of high temperature and vacuum is impregnated in an HF acid with a concentration of 0.35 mol per liter, and magnetic force is used for stirring during the impregnating process; and the impregnated silicon powder is washed by deionized water and then placed into a vacuum tank for drying. The method is convenient in operation, has no pollution, has low cost ...

Flexible printed circuit board structure

The invention provides a flexible printed circuit board structure, which comprises a circuit board body which has flexibility; the circuit board body is provided with at least one solder pad and at least one solder brushing area; the solder brushing area is arranged on the circuit board body; when the circuit board body is bent by taking at least one lateral margin of the solder brushing area as a reference, a meander line is formed on the circuit board body, doses not passes through the solder pad and has a certain distance from the outer margin of the solder pad; and the position of the meander line generated when the flexible printed circuit board is bent is changed by means of the solder brushing area, so solder crack or solder pad breakage of electronic parts arranged on the circuit board body caused by bending stress can be prevented.

Method for refining metal silicon

The embodiment of the invention provides a method for refining metal silicon, belonging to the field of chemical engineering. The method uses metallurgy principle to prepare a quasi-solar energy gradesilicon material under a condition of maintaining solid state of metallurgical silicon according to impurities affecting the service life of carriers and cell performance, and differences of physicalperformance and chemical performance of silicon; the method uses air blowing and high-temperature vacuum evaporation technology to promote the impurities inside silicon powder at high temperature tobe transferred to the surface of the silicon and removed by diffusing and segregating boron-phosphor oxide on the surface of a crystal boundary and reducing evaporation of substances with smaller vapor pressure, and leaching second phase substances of the crystal boundary by hydrofluoric acid to ensure that the purity of the metallurgical silicon is improved in a certain degree. The method has theadvantages ...

Protective film structure

The invention relates to a protective film structure. The protective film comprises a body which can be attached to any object. One side edge of the body is connected with at least one release lug which extends out of the body, and the connecting part of the release lug and the body is provided with irregular landless holes. The landless holes form at least one supporting lug which extends to the direction of the body from the connecting part of the release lug and the body. When the release lug is reversely folded toward the body, at least one supporting lug can be interlocked to extend to the bottom of the release lug out of the body so as to support the release lug to naturally tilt. Therefore, the aim of positioning can be achieved without adhesive materials so as to tear the protective film body.

Bending region structure of flexible printed circuit board

The present invention relates to a design of a bending region structure of a flexible printed circuit board, the flexible printed circuit board comprises a substrate, at least one printed circuit and a bending region, the bending region is staggered with at least one printed circuit, at least one groove is formed at the bending region of the printed circuit, the thickness of the groove is less than or equal to the thickness of the printed circuit, and the groove can not cut off the printed circuit; the design of the groove can effectively control the stress position at the bending region of the flexible printed circuit board, thereby achieving the purpose of precise bending angle of the flexible printed circuit board.

high-speed sliding electrical wear measuring device

Polysilicon grinding method

The embodiment of the inventive method provides a polysilicon grinding method, belonging to the solar energy field, the method comprises that: a packaged silicon briquette is crushed into silicon granules by a natural agate, and the diameter of the silicon granule is less than 5 mm; the silicon granules are put into a ball grinding mill into which inert gas is blown in after being dried, the radius of a big ball of the ball grinding mill is 15-20 mm, the radius of a middle ball of the ball grinding mill is 8-10 mm, the radius of a small ball of the ball grinding mill is 2-3 mm, number ratio ofthe big ball, the middle ball and the small ball in the ball grinding mill is 1:2-3:6-10; 100-200 meshes of silicon powder is obtained by grinding the silicon granules for 3-4 hours. The method has the advantages of high efficiency, difficult oxidation and high recovery rate.

Lifesaving air bag starting structure

The life-saving air bag starting structure includes one fixing part with one end pivoted with one starting part and the other end for elastically buckling with the starting part; one watch set on the surface of the starting part; one main body set in the center of the starting part; air bag inside the fixing part and air bottle with end exposed to the side of the starting part; one trigger in the position corresponding to the air bottle; and one belt in the bottom of the fixing part. The life-saving air bag starting structure has simple control, fast acting, high safety and high reliability.

Soft printed circuit board and LCD module with the soft printed circuit board

This invention relates to a soft PCB and a LCD module with the PCB, in which, the LCD module includes a frame, a soft PCB and multiple electronic components, and the frame includes a containing groove, at least a fin is extended from the side of the soft board of the PCB to increase the insertion space for inserted electronic components and said fin is turned over against the soft board and contained in the containing groove of the frame so as to insert more electronic components without increasing size of modules.

Design of bending region structure of flexible printed circuit board

The invention relates to a design of a bending region structure of a flexible printed circuit board, the flexible printed circuit board comprises a substrate, at least one printed circuit and a bending region, the bending region is staggered with at least one printed circuit, at least one groove is formed at the bending region of the printed circuit, the thickness of the groove is less than or equal to the thickness of the printed circuit, and the groove can not cut off the printed circuit; the design of the groove can effectively control the stress position at the bending region of the flexible printed circuit board, thereby achieving the purpose of precise bending angle of the flexible printed circuit board.

Flexible printed circuit board structure

The invention provides a flexible printed circuit board structure, which comprises a circuit board body which has flexibility; the circuit board body is provided with at least one solder pad and at least one solder brushing area; the solder brushing area is arranged on the circuit board body; when the circuit board body is bent by taking at least one lateral margin of the solder brushing area as areference, a meander line is formed on the circuit board body, doses not passes through the solder pad and has a certain distance from the outer margin of the solder pad; and the position of the meander line generated when the flexible printed circuit board is bent is changed by means of the solder brushing area, so solder crack or solder pad breakage of electronic parts arranged on the circuit board body caused by bending stress can be prevented.

Protective film structure

The invention relates to a protective film structure. The protective film comprises a body which can be attached to any object. One side edge of the body is connected with at least one release lug which extends out of the body, and the connecting part of the release lug and the body is provided with irregular landless holes. The landless holes form at least one supporting lug which extends to thedirection of the body from the connecting part of the release lug and the body. When the release lug is reversely folded toward the body, at least one supporting lug can be interlocked to extend to the bottom of the release lug out of the body so as to support the release lug to naturally tilt. Therefore, the aim of positioning can be achieved without adhesive materials so as to tear the protective film body.

Touchpad

The invention discloses a touchpad which has a touch sensing area and a peripheral area. The peripheral area is positioned on at least one side of the touch sensing area, the touchpad comprises a cover plate and a decorative frame, the cover plate has a touch face and an inner surface opposite to the touch face, the decorative frame is arranged on the inner surface of the cover plate of the peripheral area and comprises a first nonblack decorative layer and a second nonblack decorative layer arranged on the first nonblack decorative layer, the first nonblack decorative layer is arranged between the cover plate and the second nonblack decorative layer, the second nonblack decorative layer coats the first nonblack decorative layer in a vertical projection direction, and graph range of the second nonblack decorative layer is larger than that of the first nonblack decorative layer.

Bionic deep-sea pasture

The bionic deep-sea pasture comprises a fence and a base, the whole fence is in an ellipsoidal shape, and the base is installed at the lower end of the fence; the fence is composed of a plurality of longitudinal fence rods and transverse fence rods, and the longitudinal fence rods are flexible bendable rods; each longitudinal fence rod is vertically connected with a plurality of transverse fence rods in the length direction of the longitudinal fence rod, and the transverse fence rods on the adjacent longitudinal fence rods are arranged in a staggered mode. The tops of all the longitudinal fence rods integrally define a circular opening, and an automatic telescopic rope mechanism for controlling the size of the circular opening is installed on the circular opening. The whole base is a counter weight circular plate, and the bottom of the counter weight circular plate is provided with an inflatable buoy with automatic inflation and deflation equipment. The fence can be controlled to contract ...

Touch panel

The invention provides a touch panel. The touch panel comprises a substrate, a plurality of first conductive units, a plurality of second conductive units and an insulating layer. Each first conductive unit comprises a plurality of first electrodes which are electrically connected with one another, and a plurality of first connecting portions, and each first electrode comprises a first sub-electrode and a second sub-electrode which are overlapped and connected. Each second conductive unit comprises a plurality of second electrodes which are electrically connected with one another, and a plurality of second connecting portions, and each second electrode comprises a third sub-electrode and a fourth sub-electrode which are overlapped and connected. The first conductive units and the second conductive units are staggered and electrically insulated, each of the first sub-electrode and the third sub-electrode is formed by a first conductive layer, each of the second sub-electrode and the fourth ...

Metallurgy purification method for polysilicon

The invention discloses a method for metallurgical purification of a polysilicon, which particularly to a purification technology being capable of decreasing the contents of boron and phosphor which influence the battery efficiency. The method comprises the following steps: sodium oxide, lime and fluorite are added during the slagging and oxidation process, boron and phosphor are made into oxide by a displacement reaction, the oxide is dissolved in slag, the melting temperature is reduced by adding with the fluorite, the fluxing medium dissolves in the leaching process of the dilute acid, theoxidizing acid oxidizes and dissolves boride and metallic compounds at the transition zone, and then the complexant for hydrofluoric acid and boron corrodes the surface of silicon, and the boron impurity is extracted from the surface of silicon particles to a solvent under the effect of complexant. The method has low energy consumption and no pollution, and can improve the purity of polysilicon.