13-10-2016 дата публикации
Номер: US20160297941A1
Автор:
Choung Lai,
Ajay Padwal,
Marie J. Demers,
David W. Stresing,
John E. Langlois,
LAI CHOUNG,
PADWAL AJAY,
DEMERS MARIE J,
STRESING DAVID W,
LANGLOIS JOHN E,
Lai Choung,
Padwal Ajay,
Demers Marie J.,
Stresing David W.,
Langlois John E.
Принадлежит:
Embodiments of the present disclosure are directed to a composition and composite for protecting a transmission/reception device. The composite can include a reinforcing material and a cured epoxy composition impregnating the reinforcing material. The cured epoxy composition can contain reaction constituents including less than 50% stoichiometric amount of an anhydride curing agent to an epoxy resin. The composite can exhibit synergistic improvements in mechanical strength, weatherability, and signal transmission properties. 1. A composite for protecting a transmission/reception device , the composite comprising:a. a reinforcing material; andb. a cured epoxy composition impregnating the reinforcing material,c. wherein the cured epoxy composition has a cured epoxy composition impregnating the reinforcing material, wherein the epoxy composition comprises an epoxy resin, and a polyphenyl ether polymer or copolymer having a number average molecular weight in a range of from 300 to 14,000.2. The composite of claim 1 , wherein the cured epoxy composition has a dielectric constant of less than 3.0 at 10 giga hertz claim 1 , and a water absorption of less than 2.0%.3. The composite of claim 1 , wherein the cured epoxy composition comprises a polyphenylene ether or polyphenylene ether copolymer having a number average molecular weight of no greater than 10 claim 1 ,000.4. The composite of claim 1 , wherein the cured epoxy composition comprises a polyphenylene ether or polyphenylene ether copolymer having a number average molecular weight of no greater than 5 claim 1 ,000.5. The composite of claim 1 , wherein the cured epoxy composition comprises a polyphenylene ether or polyphenylene ether copolymer having a terminal group which is covalently bonded with the epoxy resin.6. The composite of claim 1 , wherein the cured epoxy composition comprises a polyphenylene ether or polyphenylene ether copolymer having a terminal group which is not covalently bonded with the epoxy resin.7 ...
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