APPARATUS, SYSTEM, AND METHOD OF PROVIDING A CIRCUIT BOARD CARRIER FOR AN UNDERFILL SYSTEM

An apparatus, system and method for a carrier suitable to carry a circuit board through a semiconductor underfill process. The apparatus, system and method includes a modular carrier capable of supporting a printed circuit board during at least an underfill process, the modular carrier comprising: an outer frame having, at least about a center point thereof, at least one open aspect; and at least one frame inset suitable to be removably placed within the at least one open aspect, and capable of supporting at least a first type of the printed circuit board. 1. A carrier capable of supporting a printed circuit board during at least an underfill process , comprising:an outer frame having, at least about a center point thereof, at least one open aspect;at least one frame inset suitable to be removably placed within the at least one open aspect, and capable of supporting at least a first type of the printed circuit board.2. The carrier of claim 1 , wherein the at least one frame inset includes a plurality of clips suitable to maintain a position of the printed circuit board.3. The carrier of claim 2 , wherein at least ones of the plurality of clips rotate over and away from the printed circuit board.4. The carrier of claim 1 , wherein the at least one frame inset comprises at least two handles suitable to provide for manual removal of the printed circuit board.5. The carrier of claim 4 , wherein a first portion of the handles is within the at least one frame inset claim 4 , and a second portion of the handles is within the outer frame adjacent to the first portion of the handles.6. The carrier of claim 4 , wherein the handles include a slidably opening portion claim 4 , and wherein the slidable opening is suitable to receive human fingers therethrough.7. The carrier of claim 4 , wherein the handles are spring-actuated.8. The carrier of claim 4 , wherein the handles are spring-closing.9. The carrier of claim 1 , wherein the outer frame comprises at least one heater and at ...

APPARATUS, SYSTEM, AND METHOD OF PROVIDING A DISPENSER OF CIRCUIT BOARD COMPONENT UNDERFILL

An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system, and method includes a dispensing end effector suitable for dispensing underfill to components on a printed circuit board within an underfill chamber. The dispensing end effector may include: an electromechanical connection to at least one dispensing robot arm capable of physically situating the dispensing proximate to the circuit board; a communicative connection to a dispense controller capable of communicatively controlling at least the dispensing; a dispenser which includes an underfill output port, which is capable of the dispensing, and which is removably mounted to the electromechanical association; and a protective enclosure at least substantially about the dispenser. 1. A dispensing end effector suitable for dispensing underfill to components on a printed circuit board within an underfill chamber , comprising:an electromechanical connection to at least one dispensing robot arm capable of physically situating the dispensing proximate to the circuit board;a communicative connection to a dispense controller capable of communicatively controlling at least the dispensing;a dispenser which includes an underfill output port, which is capable of the dispensing, and which is removably mounted to the electromechanical association; anda protective enclosure at least substantially about the dispenser.2. The dispensing end effector of claim 1 , wherein the dispenser comprises a piezo-jet dispenser.3. The dispensing end effector of claim 2 , wherein the piezo-jet dispenser dispenses the underfill at a rate of between about 100 and about 300 drops per second.4. The dispensing end effector of claim 2 , wherein an angle of a piezo-hammer of the piezo-jet dispenser at least partially dictates a flow rate of the underfill.5. The dispensing end effector of claim 1 , wherein the protective enclosure is substantially sealed.6. The dispensing end effector of ...

APPARATUS, SYSTEM, AND METHOD OF PROVIDING UNDERFILL ON A CIRCUIT BOARD

An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system and method may include an underfill chamber having an input through which the printed circuit board is received; at least one dispensing robot capable of dispensing the underfill to the components; a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber; and an overhead heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber. 1. An apparatus for dispensing underfill to components on a printed circuit board , comprising:an underfill chamber having an input through which the printed circuit board is received;at least one dispensing robot capable of dispensing the underfill to the components;a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber; andan overhead heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber.2. The apparatus of claim 1 , further comprising a conveyer capable of conveying the printed circuit board through the input.3. The apparatus of claim 2 , wherein the conveyer comprises a slide.4. The apparatus of claim 2 , wherein the conveyer is automated and the conveying through the input is subjected to an automated timer.5. The apparatus of claim 1 , further comprising a carrier upon which the printed circuit board passes into the underfill chamber.6. The apparatus of claim 5 , wherein the lower heater comprises the carrier.7. The apparatus of claim 6 , wherein the carrier comprises finned heaters.8. The apparatus of claim 6 , wherein the carrier comprises air circulators.9. The apparatus of ...

Apparatus, system, and method of providing underfill on a circuit board

Apparatus, system, and method of providing a dispenser of circuit board component underfill

An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system, and method includes a dispensing end effector suitable for dispensing underfill to components on a printed circuit board within an underfill chamber. The dispensing end effector may include: an electromechanical connection to at least one dispensing robot arm capable of physically situating the dispensing proximate to the circuit board; a communicative connection to a dispense controller capable of communicatively controlling at least the dispensing; a dispenser which includes an underfill output port, which is capable of the dispensing, and which is removably mounted to the electromechanical association; and a protective enclosure at least substantially about the dispenser.

Apparatus, system, and method of providing radial section identification for pick and place

An apparatus, system and method for placing components on a circuit board by a pick and place machine. The apparatus, system and method may include a rotational table suitable to receive and hold the circuit board for the pick and place machine; at least one sensor capable of sensing an off-center fiducial on the circuit board after association with the rotational table; and at least one processor connective with at least one computing memory having therein non-transitory computing code. The steps performed by execution of the code may include receiving sensor data from the sensor indicative of at least a physical location the off-center fiducial; dividing the board into radial sections based on the sensor data; accessing at least one placement program for placement of at least first components by the pick and place machine; monitoring for a change to a second at least one of the radial sections based on rotation of the rotational table according to the sensor data; and accessing at least one second placement program for placement of second components upon a change to the physical location.

Apparatus, system, and method of providing a circuit board carrier for an underfill system

Apparatus, system, and method of providing radial section identification for pick and place

An apparatus, system and method for placing components on a circuit board by a pick and place machine. The apparatus, system and method may include a rotational table suitable to receive and hold the circuit board for the pick and place machine; at least one sensor capable of sensing an off-center fiducial on the circuit board after association with the rotational table; and at least one processor connective with at least one computing memory having therein non-transitory computing code. The steps performed by execution of the code may include receiving sensor data from the sensor indicative of at least a physical location the off-center fiducial; dividing the board into radial sections based on the sensor data; accessing at least one placement program for placement of at least first components by the pick and place machine; monitoring for a change to a second at least one of the radial sections based on rotation of the rotational table according to the sensor data; and accessing at least one second placement program for placement of second components upon a change to the physical location.

Apparatus, system, and method of providing radial section identification for pick and place

Apparatus, system, and method of providing radial section identification for pick and place

Apparatus, system, and method of providing a circuit board carrier for an underfill system

The present invention discloses a carrier (316, 802, 1166) configured to support a printed circuit board (104, 310, 806, 1162) during at least an underfill process, comprising: an outer frame comprising an open aspect, at least one heater (804, 1002), and an air circulator (1004) for distributing heat from the at least one heater (804, 1002) onto a bottom of the printed circuit board (104, 310, 806, 1162); and at least one frame inset (810) configured to be removably placed within the open aspect, and configured to support the printed circuit board (104, 310, 806, 1162).

Apparatus, system, and method of providing a circuit board carrier for an underfill system

The present invention discloses a carrier (316, 802, 1166) configured to support a printed circuit board (104, 310, 806, 1162) during at least an underfill process, comprising: an outer frame comprising an open aspect, at least one heater (804, 1002), and an air circulator (1004) for distributing heat from the at least one heater (804, 1002) onto a bottom of the printed circuit board (104, 310, 806, 1162); and at least one frame inset (810) configured to be removably placed within the open aspect, and configured to support the printed circuit board (104, 310, 806, 1162).

Apparatus, system, and method of providing radial section identification for pick and place

An apparatus, system and method for placing components on a circuit board by a pick and place machine. The apparatus, system and method may include a rotational table suitable to receive and hold the circuit board for the pick and place machine; at least one sensor capable of sensing an off-center fiducial on the circuit board after association with the rotational table; and at least one processor connective with at least one computing memory having therein non-transitory computing code. The steps performed by execution of the code may include receiving sensor data from the sensor indicative of at least a physical location the off-center fiducial; dividing the board into radial sections based on the sensor data; accessing at least one placement program for placement of at least first components by the pick and place machine; monitoring for a change to a second at least one of the radial sections based on rotation of the rotational table according to the sensor data; and accessing at least one second placement program for placement of second components upon a change to the physical location.

Apparatus, system, and method of providing a circuit board carrier for a pick and place system

Apparatus, system, and method of providing a circuit board carrier for a pick and place system

The disclosure is and includes at least an apparatus, system and method for a rotary table suitable to receive surface mount technology (SMT) components onto a circuit board associated therewith. The apparatus, system and method may include a frame suitable for insertion into a pick and place machine, and having a receiving inset therein; a fixture suitable for removable insertion to the receiving inset; a plurality of roller bearings interactively associated with the fixture, and which impart a low friction roll to at least a perimeter potion of the fixture; and at least one guide on the frame suitable to at least partially positional maintain the circuit board associated with the fixture.

Apparatus, system, and method of providing underfill on a circuit board

An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system and method may include an underfill chamber having an input through which the printed circuit board is received; at least one dispensing robot capable of dispensing the underfill to the components; a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber; and an overhead heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber.

Apparatus, system, and method of providing a dispenser of circuit board component underfill

Apparatus, system, and method of providing a circuit board carrier for a pick and place system

The disclosure is and includes at least an apparatus, system and method for a rotary table suitable to receive surface mount technology (SMT) components onto a circuit board associated therewith. The apparatus, system and method may include a frame suitable for insertion into a pick and place machine, and having a receiving inset therein; a fixture suitable for removable insertion to the receiving inset; a plurality of roller bearings interactively associated with the fixture, and which impart a low friction roll to at least a perimeter portion of the fixture; and at least one guide on the frame suitable to at least partially positional maintain the circuit board associated with the fixture.