Integrated circuit package with embedded bridge

The IC package may include a bridge connector 120 having first and second electrical routing features coupled to a portion of the first and second I/O interconnect structures of semiconductor ICs 102a and 102b. The first and second electrical routing features may be disposed on one side of the bridge adjacent to the ICs. Third electrical routing features may be disposed on an opposite side of the bridge and connect to through substrate vias in the bridge and additional ICs can be stacked on the bridge. The first and second electrical routing features may be configured to route electrical signals between the first die and the second die and the third electrical routing features may be configured to route electrical signals between the one side and the opposite side of the bridge connector. The first die, the second die, and the bridge may be embedded in electrically insulating material. A system in package arrangement may comprise the first and second processor ICs 102a, b, the bridge may ...