Method for fabricating fluid ejection device

A method for fabricating an ejection chip of a fluid ejection device includes forming a drive circuitry layer on a substrate, fabricating at least one fluid ejection element on the substrate, forming at least one slot within a top portion of the substrate, filling each slot of the at least one slot with a protective material, grinding the substrate from a bottom portion of the substrate up to a predetermined height, removing the protective material from the each slot of the at least one slot, and laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot.

FLUID EJECTION DEVICE

Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned method.

METHOD FOR FABRICATING FLUID EJECTION DEVICE

Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned to method.

Method for fabricating fluid ejection device

A method for fabricating a fluid ejection device includes forming a drive circuitry layer on a substrate, fabricating at least one fluid ejection element on a top portion of the substrate, grinding the substrate from a bottom portion of the substrate up to a predetermined height, etching the top portion of the substrate to configure at least one slot within the top portion of the substrate, depositing a layer of an etch-stop material over the top portion of the substrate while filling the at least one slot with the etch-stop material, etching the bottom portion of the substrate to configure at least one fluid feed trench within the bottom portion of the substrate, removing the layer of the etch-stop material from the top portion of the substrate, and laminating a flow feature layer and a nozzle plate as a single unit over the top portion of the substrate.

Substrate structure for ejection chip and method for fabricating substrate structure

Disclosed is a substrate structure for an ejection chip that includes a first substrate layer, a second substrate layer disposed beneath the first substrate layer, and an intermediate layer configured between the first substrate layer and the second substrate layer. The substrate structure also includes a plurality of fluid channels configured within the second substrate layer. Further, the substrate structure includes a plurality of fluid ports configured within the first substrate layer. At least one fluid port of the plurality of fluid ports is configured in alignment with a corresponding fluid channel of the plurality of fluid channels. Furthermore, the substrate structure includes a plurality of slots configured within the intermediate layer such that the at least one fluid port is in fluid communication with the corresponding fluid channel. Further disclosed is a method for fabricating the substrate structure and an ejection chip employing the substrate structure.

Method for fabricating fluid ejection device

Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned method.

METHOD FOR FABRICATING FLUID EJECTION DEVICE

Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned method.

SUBSTRATE STRUCTURE FOR EJECTION CHIP AND METHOD FOR FABRICATING SUBSTRATE STRUCTURE

Disclosed is a substrate structure for an ejection chip that includes a first substrate layer, a second substrate layer disposed beneath the first substrate layer, and an intermediate layer configured between the first substrate layer and the second substrate layer. The substrate structure also includes a plurality of fluid channels configured within the second substrate layer. Further, the substrate structure includes a plurality of fluid ports configured within the first substrate layer. At least one fluid port of the plurality of fluid ports is configured in alignment with a corresponding fluid channel of the plurality of fluid channels. Furthermore, the substrate structure includes a plurality of slots configured within the intermediate layer such that the at least one fluid port is in fluid communication with the to corresponding fluid channel. Further disclosed is a method for fabricating the substrate structure and an ejection chip employing the substrate structure.

METHOD FOR FABRICATING FLUID EJECTION DEVICE

Disclosed is a method for fabricating a fluid ejection device that includes forming a drive circuitry layer on a substrate and fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and filling each slot of the at least one slot with a protective material. Additionally, the method includes grinding the substrate from a bottom portion thereof. Moreover, the method includes removing the protective material from the each slot. Further, the method includes depositing a layer of a polymeric bonding material on a bottom surface of the substrate. Furthermore, the method includes attaching a manifold chip to the layer of the polymeric bonding material. The method also includes laminating a flow feature layer and a nozzle plate over the substrate. Further disclosed are an ejection chip and a method for fabricating the ejection chip.

Methods for improving flow through fluidic channels

A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.

Fluid ejection device structures and methods therefor

Methods of forming a fluid channel in a semiconductor substrate may include providing a semiconductor substrate having a backside and a device side, wherein the device side is configured to secure ink ejecting devices thereon and applying a material layer to the backside of the semiconductor substrate. The method may further include providing a gray scale mask configured with a pattern corresponding to a fluid channel having a plurality of slots, exposing the material layer to sufficient light radiation energy through the gray scale mask and etching the exposed material layer and the semiconductor substrate through to the device side of the semiconductor substrate.

Waterfast aqueous inks

A waterfast ink having 3.0% Food Black 2, 2.5% highly hydroxyethylated polyethyleneimine, 10.0% ammonium benzoate, and the balance water. The invention appears to function upon loss of water after printing by a polar neutralizing between the dye and the polyimine, which results in an affinity of the dye to paper. It is applicable to any dye having anionic solubilizing groups but not having quaternary ammonium and to any ammonium salt.

Improved micro-fluid ejection assemblies

A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.

Methods for improving flow through fluidic channels

Dry etching methods

A process for etching semiconductor substrates using a deep reactive ion etching process to produce through holes or slots (referred to collectively as “slots”) in the substrates. The process includes applying a first layer to a first surface of substrate to provide an etch mask material layer on the first surface of the substrate. A second layer is applied to a second surface of the substrate to provide an etch stop material layer on the second surface of the substrate. The first layer and the second layer have similar solubilities in one or more organic solvents. The substrate is etched from the first surface of the wafers to provide a slot in the substrate. After etching the substrate, the etch mask material layer and the etch stop material layer are removed by contacting the first surface and the second surface of the substrate with a single organic solvent.

Auxiliary solvent mixture and ink composition

(57)【要約】 【課題】 速乾燥であり、及び／又は、印刷装置の部材 の妨げとならず、優れた印刷品質が得られる水性インク 組成物を提供する。 【解決手段】 グリコールなどのオキシカーボンと２， ２‘−チオジエタノールなどのビスヒドロキシ末端のチ オエーテルとからなる。

Methods for improving flow through fluidic channels

A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substance from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.

Die attach methods and apparatus for micro-fluid ejection device

A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The ejection device includes an ejection head substrate having a fluid supply side and a device side and containing two or more fluid flow paths therein for supplying fluid from the fluid supply side to the device side thereof. A multi-channel manifold is attached to the fluid supply side of the ejection head substrate for providing fluid from two or more fluid reservoirs to the fluid flow paths in the ejection head substrate. The multi-channel manifold has fluid flow channels therein in fluid flow communications with the fluid flow paths in the ejection head substrate and the manifold consists essentially of a patterned photoresist material.

Improved micro-fluid ejection assemblies

A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.

Dry etching methods

A process for etching semiconductor substrates using a deep reactive ion etching process to produce through holes or slots (referred to collectively as “slots”) in the substrates. The process includes applying a first layer to a first surface of substrate to provide an etch mask material layer on the first surface of the substrate. A second layer is applied to a second surface of the substrate to provide an etch stop material layer on the second surface of the substrate. The first layer and the second layer have similar solubilities in one or more organic solvents. The substrate is etched from the first surface of the wafers to provide a slot in the substrate. After etching the substrate, the etch mask material layer and the etch stop material layer are removed by contacting the first surface and the second surface of the substrate with a single organic solvent.

Waterfast aqueous inks

A waterfast ink having 3.0% Food Black 2, 2.5% highly hydroxyethylated polyethyleneimine, 10.0% ammonium benzoate, and the balance water. The invention appears to function upon loss of water after printing by a polar neutralizing between the dye and the polyimine, which results in an affinity of the dye to paper. It is applicable to any dye having anionic solubilizing groups but not having quaternary ammonium and to any ammonium salt.

Tintenstrahltinte enthaltend ein Amin als Tensid

Method for improving adhesion

A heater chip module for use in an ink jet printer

A heater chip (50) is provided comprising a carrier (52) adapted to be secured to an ink-filled container (22), at least one heater chip (60) having a base coupled to the carrier, and at least one nozzle plate (70) coupled to the heater chip. The carrier includes a support section (54) provided with at least one passage which defines a path for ink to travel from the container to the heater chip.

A heater chip module for use in an ink jet printer

A heater chip (50) is provided comprising a carrier (52) adapted to be secured to an ink-filled container (22), at least one heater chip (60) having a base coupled to the carrier, and at least one nozzle plate (70) coupled to the heater chip. The carrier includes a support section (54) provided with at least one passage which defines a path for ink to travel from the container to the heater chip.

A heater chip module for use in an ink jet printer

A heater chip (50) is provided comprising a carrier (52) adapted to be secured to an ink-filled container (22), at least one heater chip (60) having a base coupled to the carrier, and at least one nozzle plate (70) coupled to the heater chip. The carrier includes a support section (54) provided with at least one passage which defines a path for ink to travel from the container to the heater chip.

A heater chip module for use in an ink jet printer

A heater chip (50) is provided comprising a carrier (52) adapted to be secured to an ink-filled container (22), at least one heater chip (60) having a base coupled to the carrier, and at least one nozzle plate (70) coupled to the heater chip. The carrier includes a support section (54) provided with at least one passage which defines a path for ink to travel from the container to the heater chip.

A heater chip module for use in an ink jet printer

Semiconductor chip for an ink jet printhead and method for making same

The invention provides a method for improving adhesion between a polymeric planarizing film and a semiconductor chip surface. The method includes deposition resistive, conductive and/or insulative materials to a seimconductor chip surface to provide a semiconductor chip for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip. A polymeric planarizing film is applied to the activated surface of the semiconductor chip. As a result of the dry etch process, adhesion of the planarizing film is increased over adhesion between the planarizing film and a semiconductor surface in the absence of the dry etch treatment of the chip surface.

Method for improving adhesion

The invention provides a method for improving adhesion between a polymeric planarizing film (16) and a semiconductor chip (10) surface. The method includes the deposition of resistive, conductive and/or insulative materials (14) to semiconductor chip (10) surface to provide a semiconductor chip (10) for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip (10). A polymeric planarizing film (16) is applied to the activated surface of the semiconductor chip (10). As a result of the dry etch process, adhesion of the planarizing film (16) is increased over adhesion between the planarizing film (16) and a semiconductor surface in the absence of the dry etch treatment of the chip surface.

Tintenstrahldruck-Tinten ohne Bildung von Feststoffen

Tintennachfüllvorrichtung eines Behälters in einer Druckkassette

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Laser ablation method for uniform nozzle structure

The invention provides a method for forming ink jet nozzle structures in an ablatable material. More particularly, the invention provides uniform nozzle structure by ablating an ablatable material with a laser beam while setting a field lens unit to various locations relative to a projection lens. The resulting ink jet nozzle structures have substantially orthogonal ink delivery trajectory paths relative to a plane defined by the length and width of the ablatable material regardless of the nozzles hole position relative to the edges of the ablatable material.

Tintenstrahldruck-Tinten ohne Bildung von Feststoffen