27-07-2017 дата публикации
Номер: US20170210878A1
Принадлежит:
The present invention provides an LCP derivative/soft magnetic ferrite composite material, which is prepared by complexing and assembling an LCP derivative as a host and soft magnetic ferrite particles as a guest. The present invention also provides a method for preparing the composite material. The composite material of the present invention has high stability and is not easily dissociated, and has high customized magnestic permeability, dielectricity, thermal stability, environmental resistance, and chemical resistance; and the preparation process of the composite material meets the energy-saving and emission reduction requirements. Therefore, the composite material has a wide industrial application prospect. The composite material of the present invention can be widely applied to the wireless communication field, the aviation, spaceflight and military fields, the microwave and radio frequency component application field, the automotive electronic component field, and the like. 2. The composite material according to claim 1 , wherein the weight-average molecular weight of the LCP derivative is 20000˜35000.3. The composite material according to claim claim 1 , wherein the molar ratio of the structural unit c to the soft magnetic ferrite particles is 5˜6:1.4. The composite material according to claim 3 , wherein the soft magnetic ferrite particles are manganese/zinc (MnZn) ferrite or nickel/zinc (NiZn) ferrite.5. A preparation method of the LCP derivative/soft magnetic ferrite composite material according to claim 1 , comprising the steps of:A. reacting 2,5-dimethyl-p-acetoxybenzoic acid, 2,5-dimethyl-p-aminobenzoic acid and 1,5-dimethyl-6-acetyloxy-2-naphthoic acid in presence of an acidic catalyst to prepare a LCP derivative oligomer;B. polarizing the LCP derivative oligomer obtained in the step A to form a helical oligomer;C. mixing the helical oligomer obtained in the step B with soft magnetic ferrite particles and subjecting to host-guest complex assembly; andD ...
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