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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 5. Отображено 5.
26-12-2013 дата публикации

DEVICE FOR ESTABLISHING COMMUNICATIONS INTEROPERABILITY AT AN INCIDENT SITE INCLUDING MEANS FOR RECORDING CRISIS INCIDENTS

Номер: US20130342361A1

What is provided is recording capability for each of the modules utilized by the first responders and other personnel within the area of the incident, with the stored information at each of the first responders' modules being read out through the ad hoc network, where it can be uploaded to storage. The stored information can be displayed at an incident commander work station in real time to give the incident commander a realistic view of the timeline and the severity of the incident, as well as the response. The use of the ad hoc network permits offloading stored information from each of the first responders' modules so as to free up storage within the modules. By providing storage at every node of the ad hoc network, one has access to a timeline of the actions at the incident as well as redundancy, which enhances the memories and observational skills of the first responders. Incident reporting is made complete due to the fact of all recordings being: made available at one node on the temporary ad hoc network from which information reports and analysis can proceed, as well as subsequent training. 1. A method for establishing post-incident analysis and training relating to an incident at which first responders respond , comprising the steps of:establishing an ad hoc temporary incident area network having and providing communication between transceivers remote from an incident command location, said network having a number of standard non-specialized transceivers having a dedicated module including a separate transceiver coupled to the associated standard transceiver, modules that intercommunicate, with each module coupled to an associated transceiver;recording data at each module relating to said incident;transmitting said data over said network to a node on said network;storing received data at said node; and,playing back stored data to establish what was happening at each of said modules in the course of responding to said incident.2. The method of claim 1 , and ...

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09-03-2017 дата публикации

STACKED MODULAR ARCHITECTURE HIGH-RESOLUTION THERMAL CHIP CAMERA

Номер: US20170070685A1
Принадлежит:

An uncooled high-resolution 12 micron pixel pitch 3D-stacked component thermal camera including an electronics board, a camera circuit card assembly (CCA) with an application-specific integrated circuit (ASIC), a synchronous dynamic random access memory (SDRAM), flash memory, a spacer, a wafer level packaged Focal Plane Array (FPA) wafer with a lens housing attach ring on the FPA, and a window. 1. An uncooled high-resolution 12 micron pixel pitch 3D-stacked component thermal camera device comprising:a camera circuit card assembly (CCA) comprising:an application-specific integrated circuit (ASIC);a synchronous dynamic random access memory (SDRAM);a flash memory wafer; anda wafer level packaged Focal Plane Array (FPA) wafer.2. The system of claim 1 , wherein said CCA comprises a small circuit board with said FPA on one side claim 1 , said ASIC claim 1 , said SDRAM memory and said flash memory and other supporting circuits and output connector on a back side of said CCA.3. The system of claim 1 , wherein configuration of said camera comprises said FPA and electronics adjacent to each other on a same side of a circuit board of said CCA.4. The system of claim 1 , wherein said wafer level packaged FPA comprises a focal plane and a window claim 1 , a lens integrated with said camera by a lens housing attach ring on said FPA claim 1 , and a spacer between said SDRAM memory and flash memory.5. The system of claim 1 , wherein said CCA comprises Surface Mount Technology (SMT) devices.6. The system of claim 1 , wherein said camera operates at 15 Hz claim 1 , 30 Hz claim 1 , and 60 Hz with a slow frame rate of about 7.5 Hz to about 8.33 Hz.7. The system of claim 1 , wherein said ASIC claim 1 , said SDRAM claim 1 , and said flash memory wafers comprise full thickness substrates.8. The system of claim 1 , wherein said ASIC claim 1 , said SDRAM claim 1 , and said flash memory wafers are thinned.9. The system of claim 1 , wherein at least one of said ASIC claim 1 , said SDRAM claim ...

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06-11-2008 дата публикации

Device for recording and communicating crisis incidents

Номер: WO2006053111A3

A recording capability for modules (60) utilized by first responders and other personal within the area of an incident, with the stored information at each of the first responders' modules (60) being read out through an ad hoc network (62), where it can be uploaded to storage. The stored information can be displayed at an incident commander work station (321) in real time to give the incident commander a realistic view of the timeline and the severity of the incident, as well as the response. The ad hoc network (62) permits offloading stored information from each of the first responders' modules (60) so as to free up storage within the modules (60). By providing storage at every node of the ad hoc network (62), one has access to a timeline of the action at the incident as well as redundancy, which enhances the memories and observational skills of the first responders.

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10-10-2017 дата публикации

Stacked modular architecture high-resolution thermal chip camera

Номер: US09787914B2

An uncooled high-resolution 12 micron pixel pitch 3D-stacked component thermal camera including an electronics board, a camera circuit card assembly (CCA) with an application-specific integrated circuit (ASIC), a synchronous dynamic random access memory (SDRAM), flash memory, a spacer, a wafer level packaged Focal Plane Array (FPA) wafer with a lens housing attach ring on the FPA, and a window.

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02-05-2017 дата публикации

Device for establishing communications interoperability at an incident site including means for recording crisis incidents

Номер: US09640068B2

What is provided is recording capability for each of the modules utilized by the first responders and other personnel within the area of the incident, with the stored information at each of the first responders' modules being read out through the ad hoc network, where it can be uploaded to storage. The stored information can be displayed at an incident commander work station in real time to give the incident commander a realistic view of the timeline and the severity of the incident, as well as the response. The use of the ad hoc network permits offloading stored information from each of the first responders' modules so as to free up storage within the modules. By providing storage at every node of the ad hoc network, one has access to a timeline of the actions at the incident as well as redundancy, which enhances the memories and observational skills of the first responders. Incident reporting is made complete due to the fact of all recordings being made available at one node on the temporary ad hoc network from which information reports and analysis can proceed, as well as subsequent training.

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