09-03-2017 дата публикации
Номер: US20170070685A1
Принадлежит:
An uncooled high-resolution 12 micron pixel pitch 3D-stacked component thermal camera including an electronics board, a camera circuit card assembly (CCA) with an application-specific integrated circuit (ASIC), a synchronous dynamic random access memory (SDRAM), flash memory, a spacer, a wafer level packaged Focal Plane Array (FPA) wafer with a lens housing attach ring on the FPA, and a window. 1. An uncooled high-resolution 12 micron pixel pitch 3D-stacked component thermal camera device comprising:a camera circuit card assembly (CCA) comprising:an application-specific integrated circuit (ASIC);a synchronous dynamic random access memory (SDRAM);a flash memory wafer; anda wafer level packaged Focal Plane Array (FPA) wafer.2. The system of claim 1 , wherein said CCA comprises a small circuit board with said FPA on one side claim 1 , said ASIC claim 1 , said SDRAM memory and said flash memory and other supporting circuits and output connector on a back side of said CCA.3. The system of claim 1 , wherein configuration of said camera comprises said FPA and electronics adjacent to each other on a same side of a circuit board of said CCA.4. The system of claim 1 , wherein said wafer level packaged FPA comprises a focal plane and a window claim 1 , a lens integrated with said camera by a lens housing attach ring on said FPA claim 1 , and a spacer between said SDRAM memory and flash memory.5. The system of claim 1 , wherein said CCA comprises Surface Mount Technology (SMT) devices.6. The system of claim 1 , wherein said camera operates at 15 Hz claim 1 , 30 Hz claim 1 , and 60 Hz with a slow frame rate of about 7.5 Hz to about 8.33 Hz.7. The system of claim 1 , wherein said ASIC claim 1 , said SDRAM claim 1 , and said flash memory wafers comprise full thickness substrates.8. The system of claim 1 , wherein said ASIC claim 1 , said SDRAM claim 1 , and said flash memory wafers are thinned.9. The system of claim 1 , wherein at least one of said ASIC claim 1 , said SDRAM claim ...
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