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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 3. Отображено 3.
22-06-2017 дата публикации

BULK SOLDER REMOVAL ON PROCESSOR PACKAGING

Номер: US20170179066A1
Автор: Russell S. Aoki, John W. Jaeger, Michael S. Brazel, Daniel P. Carter, Anthony P. Valpiani, Michael R. Hui, Rashelle Yee, Joseph J. Jasniewski, Shelby A. Ferguson, Thomas A. Boyd, Jonathan W. Thibado, Penny K. Woodcock, Rachel G. Taylor, Laura S. Mortimer, AOKI RUSSELL S, JAEGER JOHN W, BRAZEL MICHAEL S, CARTER DANIEL P, VALPIANI ANTHONY P, HUI MICHAEL R, YEE RASHELLE, JASNIEWSKI JOSEPH J, FERGUSON SHELBY A, BOYD THOMAS A, THIBADO JONATHAN W, WOODCOCK PENNY K, TAYLOR RACHEL G, MORTIMER LAURA S, Aoki Russell S., Jaeger John W., Brazel Michael S., Carter Daniel P., Valpiani Anthony P., Hui Michael R., Yee Rashelle, Jasniewski Joseph J., Ferguson Shelby A., Boyd Thomas A., Thibado Jonathan W., Woodcock Penny K., Taylor Rachel G., Mortimer Laura S.
Принадлежит:

Reflow Grid Array technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a BGA package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is solder cleaning and removal when removing a BGA package. Technical solutions described herein provide processes and equipment for bulk solder removal from a BGA package that can be executed in the field. 1. A method comprising:reflowing a solder on a reflow grid array (RGA) interposer;separating a soldered component from the RGA interposer; andremoving the solder from the RGA interposer.21. The method of , wherein reflowing the solder on the RGA interposer includes heating the RGA interposer.31. The method of , wherein removing the solder from the RGA interposer includes swiping a solder squeegee across the RGA interposer.43. The method of , wherein removing the solder from the RGA interposer includes placing a mask on the RGA interposer to surround and isolate the RGA interposer.53. The method of , wherein swiping the solder squeegee across the RGA interposer includes swiping a solder vacuum across the RGA interposer.61. The method of , wherein removing the solder from the RGA interposer includes disposing a solder-wicking pad on the RGA interposer.76. The method of , wherein disposing the solder-wicking pad includes heating the solder-wicking pad.87. The method of , wherein heating the solder-wicking pad includes applying a wicking heating element to a conductive surface disposed between the wicking heating element and the solder-wicking pad.96. The method of , wherein disposing the solder-wicking pad includes wicking the solder from the RGA interposer into the solder-wicking pad , the wicking based on capillary action.106. The method of , wherein the solder-wicking pad includes a copper mesh wicking pad.11. An apparatus comprising:a reflow grid ...

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Номер записи: 1
22-06-2017 дата публикации

BALL GRID ARRAY SOLDER ATTACHMENT

Номер: US20170179069A1
Автор: Jonathon R. Carstens, Michael S. Brazel, Russell S. Aoki, Laura S. Mortimer, CARSTENS JONATHON R, BRAZEL MICHAEL S, AOKI RUSSELL S, MORTIMER LAURA S, Carstens Jonathon R., Brazel Michael S., Aoki Russell S., Mortimer Laura S.
Принадлежит:

Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package. 1. A method comprising:disposing solder on each of a plurality of interposer contacts on a reflow grid array (RGA) interposer; andreflowing the solder to form solid solder bumps, the solid solder bumps configured to be reflowed by the RGA interposer to solder an electrical component to the RGA interposer.21. The method of , wherein reflowing the solder includes heating an interposer heater trace.3. The method of claim 1 , further including soldering the electrical component to the RGA interposer.4. The method of claim 3 , wherein soldering the electrical component includes applying flux to the solid solder bumps.5. The method of claim 4 , wherein soldering the electrical component includes aligning the solid solder bumps with a plurality of component contacts on the electrical component.6. The method of claim 5 , wherein aligning the solid solder bumps includes disposing an alignment fixture on the RGA interposer and disposing the electrical component within the alignment fixture.7. The method of claim 3 , wherein soldering the electrical component includes reflowing the solid solder bumps.8. The method of claim 7 , wherein soldering the electrical component includes reflowing a plurality of electrical component solder bumps on the electrical component to form electrical contacts between the plurality of electrical component solder bumps and the solid solder bumps.9. The method of claim 1 , wherein disposing ...

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Номер записи: 2
06-12-2018 дата публикации

BALL GRID ARRAY SOLDER ATTACHMENT

Номер: US20180350767A1
Автор: Aoki Russell S., BRAZEL MICHAEL S., CARSTENS JONATHON R., Mortimer Laura S.
Принадлежит:

Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package. 1. An apparatus comprising:an interposer;a plurality of electrical component interposer contacts on a first surface of the interposer; anda heater trace within the interposer proximate to one or more of the plurality of electrical component interposer contacts.2. The apparatus of claim 1 , further including a plurality of conductive through-holes within the interposer and proximate to the heater trace claim 1 , each of the conductive through-holes electrically connected to each of the plurality of electrical component interposer contacts.3. The apparatus of claim 1 , further including a plurality of motherboard interposer contacts on a second surface of the interposer claim 1 , the second surface of the interposer opposite from the first surface of the interposer claim 1 , each of the conductive through-holes electrically connecting each of the plurality of electrical component interposer contacts and each of the plurality of motherboard interposer contacts.4. The apparatus of claim 1 , further including a thermal sensor trace within the interposer to generate temperature sensor data.5. The apparatus of claim 4 , further including a controller to receive temperature sensor data from the thermal sensor trace and control a heater current applied to the heater trace.6. The apparatus of claim 1 , further including:a second plurality of electrical component interposer contacts within a second zone on the first ...

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Номер записи: 3