INTEGRATED BOUND-MODE SPECTRAL/ANGULAR SENSORS

A 2-D sensor array includes a semiconductor substrate and a plurality of pixels disposed on the semiconductor substrate. Each pixel includes a coupling region and a junction region, and a slab waveguide structure disposed on the semiconductor substrate and extending from the coupling region to the region. The slab waveguide includes a confinement layer disposed between a first cladding layer and a second cladding layer. The first cladding and the second cladding each have a refractive index that is lower than a refractive index of the confinement layer. Each pixel also includes a coupling structure disposed in the coupling region and within the slab waveguide. The coupling structure includes two materials having different indices of refraction arranged as a grating defined by a grating period. The junction region comprises a p-n junction in communication with electrical contacts for biasing and collection of carriers resulting from absorption of incident radiation. 1. A 2-D sensor array , comprising:a semiconductor substrate, at least one coupling region and at least one junction region;', 'a slab waveguide structure disposed on the semiconductor substrate and extending from the at least one coupling region to the at least one junction region, and comprising a confinement layer disposed between a first cladding layer and a second cladding layer, wherein the first cladding and the second cladding each have a refractive index that is lower than a refractive index of the confinement layer; and', 'at least one coupling structure disposed in the coupling region and within the slab waveguide, the coupling structure comprising at least two materials having different indices of refraction, and arranged as a grating defined by a grating period,', 'wherein the junction region comprises a p-n junction in communication with electrical contacts for biasing and collection of carriers resulting from absorption of incident radiation., 'a plurality of pixels disposed on the ...

STRUCTURAL ILLUMINATION AND EVANESCENT COUPLING FOR THE EXTENSION OF IMAGING INTERFERMETRIC MICROSCOPY

In accordance with the invention, there are imaging interferometric microscopes and methods for imaging interferometric microscopy using structural illumination and evanescent coupling for the extension of imaging interferometric microscopy. Furthermore, there are coherent anti-Stokes Raman (CARS) microscopes and methods for coherent anti-Stokes Raman (CARS) microscopy, wherein imaging interferometric microscopy techniques are applied to get material dependent spectroscopic information. 1. An apparatus for coherent anti-Stokes Raman (CARS) microscopy comprising:an object plane on which is disposed a first surface of a planar substrate, wherein the substrate is characterized by a homogeneous refractive index and a surface normal, wherein the substrate is arranged to support an object;{'sub': 1', '2', '1', '2', '1', '2', 'sub', '1, 'a first optical system disposed to provide an illumination of the object plane, the illumination characterized by two substantially coincident coherent beams with wavelengths λand λand corresponding angular frequencies ωand ωwith ω>ω, a radius of curvature, and disposed at one of a plurality of incident wave vectors from about 0 to about 2πn/λwith respect to the surface normal of the substrate and at a plurality of azimuth angles spanning about 0 to about 2π;'}{'sub': sub', '1', '1, 'a second optical system having an optical axis disposed at one of a plurality of center wave vectors from about 0 to about 2πn/λwith respect to the surface normal of the substrate, wherein the second optical system is characterized by a numerical aperture and is responsive to optical signals at frequencies greater than ω;'}{'sub': 1', '2, 'a third optical system disposed between the first optical system and an entrance aperture of a first optical element of the second optical system to provide interferometric reintroduction of the illumination as a reference beam at an angular frequency of 2ω−ωinto the second optical system, wherein each of an amplitude, a ...

Conductor Structural Element and Method for Producing a Conductor Structural Element

The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed. 1. A method for producing a conductor structural element , comprising:providing a rigid carrier;electrodepositing a copper coating on the rigid carrier;applying a conductive pattern structure on the copper coating, followed by possible component assembly;laminating the carrier with at least one electrically insulating layer;detaching the rigid carrier; andat least partially removing of the remaining copper coating of the rigid carrier, such that an exposure of the conductive pattern structure takes place.2. The method according to claim 1 , wherein the rigid carrier is composed of an amphoteric metal.3. The method according to claim 1 , wherein the rigid carrier is composed of aluminum (Al) or an aluminum alloy.4. The method according to claim 1 , wherein the copper coating of the rigid carrier has a thickness of between approximately 2 and approximately 7 μm.5. The method according to claim 1 , wherein the applied conductive pattern structure is composed of copper.6. The method according to claim 1 , in which the conductive pattern structure is electrodeposited.7. The method according to claim 1 , in which the copper coating is not removed until a further outer conductive pattern has been deposited on it.8. The method according to claim 1 , and further comprising the step of depositing an etch-resistant metal layer under (before the application thereof) the conductive pattern structure.9. The method according to claim 1 , and further ...

STRUCTURAL ILLUMINATION AND EVANESCENT COUPLING FOR THE EXTENSION OF IMAGING INTERFEROMETRIC MICROSCOPY

In accordance with the aspects of the present disclosure, a method and apparatus is disclosed for imaging interferometric microscopy (IIM), which can use an immersion medium to enhance resolution up to a resolution of linear systems resolution limit of λ/4n, where λ is the wavelength in free space and n is the index of refraction of a transmission medium. 1. A method for microscopy comprising:{'sub': pp', 'pp, 'providing a plane-parallel optical element operable to be positioned adjacent to an object, wherein the plane-parallel optical element is characterized by a homogeneous refractive index (n) and a thickness (t), such that a distance of separation between the plane-parallel optical element and the object is within about a wavelength of illumination light incident upon the object;'}{'sub': 'pp', 'providing a first optical system disposed to provide a substantially coherent illumination of the object, wherein the illumination light is characterized by a wavelength λ, a radius of curvature, a center position, and a field-of-view and disposed at one of a plurality of incident wave vectors from about 0 to about 2πn/λ with respect to a surface normal of the plane-parallel optical element and at a plurality of azimuth angles spanning about 0 to 2π;'}providing a second optical system including one or more optical components defining an optical axis which is disposed on a side of the plane parallel optical element, the second optical system including a first set of optical media characterized by indices of refraction and thicknesses in which light scattered by the object propagates to the first optical component of the second optical system, an effective numerical aperture (NA) of the combined one or more optical components of the second optical system, a focal plane of the optical system conjugate with a image plane of an optical image recording device, and a field-of-view in the focal plane, wherein the optical axis of the second optical system is disposed at one of a ...

Fabrication of Enclosed Nanochannels Using Silica Nanoparticles

In accordance with the invention, there is a method of forming a nanochannel including depositing a photosensitive film stack over a substrate and forming a pattern on the film stack using interferometric lithography. The method can further include depositing a plurality of silica nanoparticles to form a structure over the pattern and removing the pattern while retaining the structure formed by the plurality of silica nanoparticles, wherein the structure comprises an enclosed nanochannel. 1. A method of forming a nanochannel comprising:depositing a photosensitive film stack over a substrate;forming a first pattern on the film stack using interferometric lithography to form a nanochannel;forming a second pattern on the film stack using interferometric lithography and a mask aligner to form a barrier in the nanochannel;depositing a plurality of silica nanoparticles to form a structure over the pattern; andremoving the first pattern and the second pattern while retaining the structure formed by the plurality of silica nanoparticles, wherein the structure comprises an enclosed nanochannel with the barrier formed along a portion of the enclosed nanochannel.2. The method of claim 1 , wherein the depositing a photosensitive film stack comprises depositing a first layer comprising an antireflective coating over the substrate and depositing a second layer comprising a photoresist over the first layer.3. The method of claim 2 , wherein the second layer comprises a layer of positive photoresist or a layer of negative photoresist.4. The method of claim 1 , wherein the depositing the plurality of silica nanoparticles comprises at least one cycle of spin coating using a suspension of silica nanoparticles.5. The method of claim 1 , wherein the depositing the plurality of silica nanoparticles comprises multiple cycles of spin coating wherein each cycle of spin coating uses a suspension of silica nanoparticles with a same size distribution.6. The method of claim 1 , wherein the ...

Optical Communications System, an Optical Communication Module, and a Method

The invention relates to an optical communications system, including an optical module, including a module motherboard provided with a substrate having an upper surface and a lower surface, an optical component on the upper surface of the substrate, the optical component being configured to submit and/or receive optical signals and being connected to electrical conductors extending through the substrate, an optical coupling module having a first light coupling port, a second light coupling port, and at least one light guiding component guiding light signals between the first and second light coupling ports, and a connector receptacle, a longitudinal axis of the connector receptacle being provided parallel or with an acute angle to the plane of the substrate, and a fiber cable connector provided on an end portion of an optical fiber cable and received in the connector receptacle. 1. An optical communications system , comprising:an optical module, comprisinga module motherboard provided with a substrate having an upper surface and a lower surface,an optical component disposed on the upper surface of the substrate, the optical component being configured to submit and/or receive optical signals and being connected to electrical conductors extending through the substrate,an optical coupling module having a first light coupling port, a second light coupling port, and at least one light guiding component guiding light signals between the first and second light coupling ports, anda connector receptacle, a longitudinal axis of the connector receptacle being provided with an acute angle to the plane of the substrate, anda fiber cable connector provided on an end portion of an optical fiber cable and received in the connector receptacle, thereby, optically coupling a plurality of optical fibers of the optical fiber cable to the first or second light coupling ports.2. System according to claim 1 , the connector receptacle comprises a module receptacle provided in the optical ...

Integrated bound-mode spectral/angular sensors

A 2-D sensor array includes a semiconductor substrate and a plurality of pixels disposed on the semiconductor substrate. Each pixel includes a coupling region and a junction region, and a slab waveguide structure disposed on the semiconductor substrate and extending from the coupling region to the region. The slab waveguide includes a confinement layer disposed between a first cladding layer and a second cladding layer. The first cladding and the second cladding each have a refractive index that is lower than a refractive index of the confinement layer. Each pixel also includes a coupling structure disposed in the coupling region and within the slab waveguide. The coupling structure includes two materials having different indices of refraction arranged as a grating defined by a grating period. The junction region comprises a p-n junction in communication with electrical contacts for biasing and collection of carriers resulting from absorption of incident radiation.

Radio frequency transmitting/receiving element and method for producing a radio frequency transmitting/receiving element

A method for producing a radio frequency transmitting/receiving element comprising at least one radio frequency antenna and at least one radio frequency chip, and to a corresponding radio frequency transmitting/receiving element made by the method. The method comprises the following steps: providing a temporary rigid carrier; applying a conductor pattern structure comprising the antenna structure of the at least one radio frequency antenna and connection contacts—connected thereto via leads—for the at least one radio frequency chip; arranging the at least one radio frequency chip on the connection contacts of the conductor pattern structure; applying an electrically insulating layer on the conductor pattern structure, such that the at least one radio frequency chip is surrounded by the electrically insulating layer; and removing the temporary rigid carrier.

AN ELECTRONIC SUB-ASSEMBLY, A METHOD FOR MANUFACTURING THE SAME, AND A PRINTED CIRCUIT BOARD WITH ELECTRONIC SUB-ASSEMBLY

Electronic sub-assembly comprising a carrier layer and a mounting area with at least one electronic component, wherein the carrier layer has at least in portions a material with a low coefficient of thermal expansion to adjust the coefficient of thermal expansion of the carrier layer, and wherein at least one compensation layer is provided on the carrier layer adjacent to the installation area, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided. 1. An electronic sub-assembly comprising:a carrier layer and a mounting area with at least one electronic component;the carrier layer has at least in portions a material with a low coefficient of thermal expansion to adjust the coefficient of thermal expansion of the carrier layer; andat least one compensation layer is provided on the carrier layer adjacent to the mounting area, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided.2. An electronic sub-assembly comprising;a carrier layer of electrically conductive material, the carrier layer having at least one electronic component mounted on at least one mounting area and at least one compensation layer being provided adjacent to the mounting area on the carrier layer, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided; andthe carrier layer has, at least in one section beneath the at least one mounting area, a coefficient of thermal expansion adjusted to that of the mounted component.3. The electronic sub-assembly according to claim 1 , wherein the carrier layer has a core layer of electrically conductive material with a first layer of electrically conductive material applied to both sides.4. The electronic sub-assembly according to claim 1 , wherein a core layer of the carrier layer is at least in ...

ELECTRONIC SUB-ASSEMBLY AND METHOD FOR THE PRODUCTION OF AN ELECTRONIC SUB-ASSEMBLY

An electronic sub-assembly () comprising at least one electronic component () embedded in a sequence of layers, wherein the electronic component () is arranged in a recess of an electrically conductive central layer () and directly adjoins a resin layer () on each side.

INTEGRATED BOUND-MODE SPECTRAL/ANGULAR SENSORS

A 2-D sensor array includes a semiconductor substrate and a plurality of pixels disposed on the semiconductor substrate. Each pixel includes a coupling region and a junction region, and a slab waveguide structure disposed on the semiconductor substrate and extending from the coupling region to the region. The slab waveguide includes a confinement layer disposed between a first cladding layer and a second cladding layer. The first cladding and the second cladding each have a refractive index that is lower than a refractive index of the confinement layer. Each pixel also includes a coupling structure disposed in the coupling region and within the slab waveguide. The coupling structure includes two materials having different indices of refraction arranged as a grating defined by a grating period. The junction region comprises a p-n junction in communication with electrical contacts for biasing and collection of carriers resulting from absorption of incident radiation. 134-. (canceled)35. A 2-D sensor array , comprising: a slab waveguide portion,', 'a single mode waveguide portion,', 'an adiabatic taper portion for funneling incident light from the slab waveguide portion into the single mode waveguide portion, and', 'a plurality of resonant add-drop filters formed substantially adjacent to the single mode waveguide portion,', a confinement layer disposed between a first cladding layer and a second cladding layer, wherein the first cladding and the second cladding each have a refractive index that is lower than a refractive index of the confinement layer, and', 'a grating disposed in the first cladding layer for coupling incident light into the slab waveguide., 'wherein the slab waveguide comprises], 'a plurality of pixels including at least a first pixel and a second pixel, wherein each of the first and second pixels comprise36. The 2-D sensor array of claim 35 , wherein the first pixel's grating has a first grating period and the second pixel's grating has a second ...

Ferrule for an Optical Connector

Ferrule for an optical connector, an optical connector containing such a ferrule, and a method for assembling such a ferrule. The ferrule includes a base, at least one cover, at least one fiber section running through a channel between the base and the cover from a cable connection side to an opposite contact face exposing distal ends of the fiber sections. The fibers are adhered to the base and/or to the cover at a bonding section at a distance from the contact face. 1. A ferrule comprising a base , at least one cover , at least one fiber section running through a channel between the base and the cover from a cable connection side to an opposite contact face exposing distal ends of the fiber sections , wherein the fibers are adhered to the base and/or to the cover at a bonding section at a distance from the contact face.2. A ferrule according to wherein a glue barrier separates the bonding section from an adhesive-free section at the contact face.3. A ferrule according to wherein the glue barrier includes a slot extending parallel to the contact face.4. A ferrule according to wherein the width of the channels guiding the fibers ends forms a tight fit with the fiber ends between the contact face and the glue barrier slot claim 3 , and a clearance fit between the glue barrier slot and the bonding section.5. A ferrule according to wherein the channels comprise sections extending between the contact face and the glue barrier claim 1 , these sections being formed by V-shaped grooves in one part and a flat surface of a second part capping the V-shaped grooves.6. A ferrule according to comprising at least one row of fiber sections running through respective channels between the base and the cover.7. A ferrule according to wherein the bonding section comprises a series of parallel grooves individually receiving a respective fiber.8. A ferrule according to wherein the glue barrier slot and/or the fiber receiving grooves are positioned in a surface of the cover facing the ...

INTEGRATED BOUND-MODE SPECTRAL SENSORS WITH CHIRPED GRATINGS

Provided is a spectral sensor array, including: a planar waveguide on a substrate; a chirped input coupling grating, wherein the chirped input coupling grating comprises a transverse chirp to provide a spectrally selective coupling of incident light into the planar waveguide; an output coupling grating; and an array of photodetectors arranged to receive the light coupled out of the waveguide. 1. A spectral sensor array , comprising:a planar waveguide on a substrate;a chirped input coupling grating, wherein the chirped input coupling grating comprises a transverse chirp to provide a spectrally selective coupling of incident light into the planar waveguide;an output coupling grating; andan array of photodetectors arranged to receive the light coupled out of the waveguide.2. The spectral sensor array of claim 1 , further comprising a restrictor to restrict angular acceptance of the light incident to the input coupling grating.3. The spectral sensor array of claim 1 , wherein the chirped input coupling grating comprises a variation of the grating period along a length of the grating claim 1 , and wherein a spectral composition of light coupled into the waveguide varies as a result of variation of the grating period along the length of the grating.4. The spectral sensor array of claim 1 , further comprising a shield to shield the array of photodetectors from incident light scattered into the detector array without coupling into the planar waveguide.5. The spectral sensor array of claim 1 , wherein the array of photodetectors comprises a linear array.6. The spectral sensor array of claim 5 , wherein the linear array of photodetectors generate an array of electrical signals corresponding to the spectra of the incident light.7. The spectral sensor array of claim 6 , further comprising electronics to receive and condition the electrical signals from the linear array of photodetectors to provide a spectrum of the incident light.8. The spectral sensor array of claim 7 , ...

Structural illumination and evanescent coupling for the extension of imaging interferometric microscopy

In accordance with the aspects of the present disclosure, a method and apparatus is disclosed for three-dimensional imaging interferometric microscopy (IIM), which can use at least two wavelengths to image a three-dimensional object. The apparatus can include a first, a second, and a third optical system. The first optical system is disposed to provide a substantially coherent illumination to the 3D object, wherein the illumination is characterized by a plurality of wavelengths. The second optical system includes an optical image recording device and one or more additional optical components characterized by a numerical aperture NA. The third optical system provides interferometric reintroduction of a portion of the coherent illumination as a reference beam into the second optical system. An image recording device records each sub-image formed as a result of interference between the illumination that is scattered by the 3D object and the reference beam.

Optical Coupling Device and Optical Communication System

An optical coupling device including a housing, a first optical port provided on the housing, a second optical port provided on the housing and configured to couple to an optical fiber cable, an optical signal path guiding optical signals between the first and second optical port, a monitoring device provided on the housing, and an decoupling element optically coupled to the optical signal path and the monitoring device for coupling an optical monitoring signal coupled out from the optical signals guided between the first and second optical port onto the monitoring device. Furthermore, an optical communication system is provided, the system including an optical module with an optical signal processing device, the optical signal processing device being configured for at least one of receiving optical signals by a receiving device and transmitting optical signals by an optical signal source, and an optical coupling device guiding the optical signals. 1. An optical coupling device , comprising:a housing,a first optical port provided on the housing,a second optical port provided on the housing and configured to couple to an optical fiber cable,an optical signal path guiding optical signals between the first and second optical port,a monitoring device provided on the housing, andan decoupling element optically coupled to the optical signal path and the monitoring device for coupling an optical monitoring signal coupled out from the optical signals guided between the first and second optical port onto the monitoring device.2. Device according to claim 1 , wherein one or more strip conductors are provided on the housing claim 1 , the strip conductors being connected to a connector port of the monitoring device.3. Device according to claim 1 , wherein the decoupling element is a light guiding element provided in the optical signal path.4. Device according to claim 1 , wherein the monitoring device is provided on the decoupling element.5. Device according to claim 1 , ...

OPTOELECTRICAL CONNECTOR MODULE

The present disclosure relates to an optoelectrical connector module comprising a flexible circuit board () having a first region and a second region and a printed circuit board (PCB) () that is attached to the first region of the flexible circuit board, and an optical module () that is attached to the second region of the flexible circuit board. The optical module is configured to transmit and/or receive light signals. The optoelectrical connector module comprises further a rigid support structure () having a first and a second surface that enclose a defined angle. The first surface of the rigid support structure is thereby arranged in parallel to the PCB and the second surface of the rigid support structure is connected to the flexible circuit board opposite the second region. 1. An optoelectrical connector module , comprising:{'b': 10', '11', '12, 'a flexible circuit board () having a first region () and a second region (),'}{'b': '20', 'a printed circuit board (PCB) () that is attached to the first region of the flexible circuit board, and'}{'b': 30', '30, 'an optical module (, ′) that is attached to the second region of the flexible circuit board, characterized in that the optoelectrical connector module further comprises{'b': 40', '41', '42', '41', '20', '42', '12, 'a rigid support structure () having a first () and a second () surface, wherein the first surface () is arranged parallel to the plane of the printed circuit board (PCB) () and the second surface () is connected to the flexible circuit board opposite the second region () of the flexible circuit board, and'}the first and second surfaces of the rigid support structure enclose an angle (α) that is different from 0° and 90°.2414240. The optoelectrical connector module of claim 1 , wherein the first () and second () surfaces of the support structure () enclose an angle (α) that is preferably between 5° and 85° claim 1 , more preferably between 5° and 70° claim 1 , still more preferably between 8° and 60 ...

Light-Transmitting Pane for Displaying an Image of a Head-Up Display for Polarized Sunglasses

A light-transmitting pane for displaying an image of a head-up display is provided. The light-transmitting pane includes a cholesteric liquid-crystal layer arrangement, which is arranged in the interior of the pane or is arranged on a surface of the pane. Depending on the polarization of the incident light, at least a portion of the light generated by an image generating device of a head-up display arrangement can be reflected on the cholesteric liquid-crystal layer arrangement such that the reflected light has a p-polarized fraction, which can be perceived through polarized sunglasses. 115-. (canceled)16. A light-transmitting pane for a head-up display arrangement for displaying an image that is visible through polarized sunglasses , the light-transmitting pane comprising:a cholesteric liquid-crystal layer arrangement, which is arranged in an interior of the pane or is arranged on a surface of the pane.17. The light-transmitting pane according to claim 16 , wherein:the cholesteric liquid-crystal layer arrangement comprises at least one helical molecule arrangement with a pitch in a layer plane, andthe at least one helical molecule arrangement is spirally wound and has a chirality within a period of the pitch.18. The light-transmitting pane according to claim 17 ,wherein the at least one helical molecule arrangement has a right-handed winding of its molecules within the period of the pitch.19. The light-transmitting pane according to claim 16 , wherein:the cholesteric liquid-crystal layer arrangement comprises a plurality of helical molecule arrangements in different layer planes that are arranged above one another,the helical molecule arrangements in the different layer planes have at least one of a different pitch or a different overall length, andthe helical molecule arrangements in the different layer planes have a same chirality.20. The light-transmitting pane according to claim 16 , wherein:the cholesteric liquid-crystal layer arrangement comprises first ...

OPTOELECTRICAL CONNECTOR SYSTEM

An optoelectrical connector system can include an optical coupler that is configured to be positioned over a photonic device on the PCB. The optoelectrical connector system can further include a connector housing that is configured to be attached to the optical coupler after the optical coupler is positioned over the photonic device, so that the coupler can be aligned and fixed without the housing attached thereto. 1. An optoelectrical connector system , comprising:an optical coupler that includes a coupler body that defines a light input/output face, and a light guide that extends through the coupler body and is in optical communication with the input/output face, wherein the optical coupler is configured to be mounted on a printed circuit board such that the light guide is aligned with a photonic device that is mounted on the printed circuit board; anda connector housing that is separate from the optical coupler and configured to mate with a counter connector such that the counter connector is in optical communication with the light input/output face, wherein the connector housing is configured to attach to the optical coupler after the light guide of the optical coupler has been aligned with the photonic device.2. The optoelectrical connector system of claim 1 , wherein the optical coupler is designed such that the coupler is mountable onto the printed circuit board only when the connector housing is not attached to the coupler.3. The optoelectrical connector system of claim 1 , wherein the optical coupler comprises is configured to precisely align the light guide with the photonic device.4. The optoelectrical connector system of claim 1 , wherein the connector housing defines a receptacle that is sized to receive the counter connector so as to mate the counter connector with the connector housing.5. The optoelectrical connector system of claim 4 , wherein the optical coupler does not define any receptacle that matingly receives a corresponding counter connector. ...

Circuit board and method for production thereof

A circuit board ( 10, 10′, 10 ″) includes at last one insulating substrate layer (SL 1 , SL 2 , SL 3 , SL 4 , SL 5 ) and a plurality of electrically conductive copper coats (C 1 , C 2 , C 3 ) arranged on the at least one insulating substrate layer (SL 1 , SL 2 , SL 3 , SL 4 , SL 5 ), wherein at least one of the electrically conductive copper coats (C 1 , C 2 , C 3 ) is coated at least on both sides with a layer (HSI, HS 2 , HS 3 ) made of a material for inhibiting electromigration, wherein on a layer (HS 1 , HS 2 ) made of a material for inhibiting electromigration a further metal layer (M 1 , M 2 , M 3 , M 3 ′) is provided, which is in turn coated with a further layer (HS 3 , HS 3 ′) made of a material for inhibiting electromigration.

Innovative Nanopore Sequencing Technology

Methods and apparatus for long read, label-free, optical nanopore long chain molecule sequencing. In general, the present disclosure describes a novel sequencing technology based on the integration of nanochannels to deliver single long-chain molecules with widely spaced (>wavelength), ˜1-nm aperture “tortuous” nanopores that slow translocation sufficiently to provide massively parallel, single base resolution using optical techniques. A novel, directed self-assembly nanofabrication scheme using simple colloidal nanoparticles is used to form the nanopore arrays atop nanochannels that unfold the long chain molecules. At the surface of the nanoparticle array, strongly localized electromagnetic fields in engineered plasmonic/polaritonic structures allow for single base resolution using optical techniques.

Manipulating the translation of dna strands across and through nanopore sequencing systems using raman signatures to identify dna bases and methods

Nucleic acid sequencing methods and systems, the systems including nanochannel chip including: a nanochannel formed in an upper surface of the nanochannel chip and; a roof covering the nanochannel and comprising nanopores and a field enhancement structure; and a barrier disposed in the nanochannel. The method including: introducing a buffer solution including long-chain nucleic acids to the nanochannel chip; applying a voltage potential across the nanochannel chip to drive the nucleic acids through the nanochannel, towards the barrier, and to translocate the nucleic acids through nanopores adjacent to the barrier, such that bases of each of the nucleic acids pass through the field enhancement structure one base at a time and emerge onto an upper surface of the roof; detecting the Raman spectra of the bases of the nucleic acids as each base passes through the electromagnetic-field enhancement structure; and sequencing the nucleic acids based on the detected Raman spectra.

INTEGRATED BOUND-MODE SPECTRAL/ANGULAR SENSORS

An occupancy sensor covering a wide field in an integrated chip is disclosed. The occupancy sensor includes an array of grating coupled waveguide sensors wherein continuous wave (cw) signals monitor an ambient light field for dynamic changes on times scales of seconds, and high frequency signals map in three-dimensions of the space using time-of-flight (TOF) measurements, pixel level electronics that perform signal processing; array level electronics that perform additional signal processing; and communications and site level electronics that interface with actuators to respond to occupancy sensing. 1. A 2-D optical sensor array , comprising:a semiconductor substrate; a single-mode slab waveguide portion on the semiconductor substrate,', [ the first cladding and the second cladding each have a refractive index that is lower than a refractive index of the confinement layer;', 'the thickness of the confinement layer allows only a single transverse mode over a range of wavelengths of operation; and', 'a separation of the confinement layer from the semiconductor substrate is sufficient to allow low loss propagation of light in the single-mode slab waveguide portion over the range of wavelengths of operation;, 'a confinement layer having a thickness and disposed between a first cladding layer and a second cladding layer, wherein, 'a grating disposed in at least one of the first cladding layer or the second cladding layer for coupling incident light into the single-mode slab waveguide portion;', 'a propagation region in the single-mode slab waveguide portion; and', 'an optical detector that is shielded from direct illumination and is responsive to light coupled into and propagating in the single-mode slab waveguide portion., 'wherein the slab waveguide comprises], 'a plurality of pixels including at least a first pixel and a second pixel, wherein each of the first and second pixels comprise2. The 2-D sensor array of claim 1 , wherein the first pixel comprises a first ...

Beam splitting for laser power monitoring in molded optical coupling units

An optical module can include a beam steering portion and a first side defining an inner surface that faces the beam steering portion. The optical module can further include a second side that defines an inner surface adjacent to the inner surface of the first side. The inner surface of the second side can face the beam steering portion. The optical module can be configured to direct an initial light beam from the first side to the beam steering portion along a first direction. The optical module, and in particular the beam steering portion that can include a beam splitter, can divide the initial beam into a signal light beam and a fractional light beam.

Optical Cable Assembly, an Optical Module, and a Method for Mounting an Optical Cable Assembly to an Optical Module

An optical cable assembly is provided, an optical cable provided with one or more optical fibers, a strain-relieve device mounted on the optical cable and configured to provide a strain relieve when the optical cable is fed into an optical module through an opening in a housing of the optical module, wherein the strain-relieve device is provided with an adjustment mechanism configured to adjust a distance between an end portion of the one or more optical fibers and the strain-relieve device. Furthermore, an optical module and a method for assembling an optical cable assembly are provided. 1. An optical cable assembly , comprising:an optical cable provided with one or more optical fibers,a strain-relieve device mounted on the optical cable and configured to provide a strain relieve when the optical cable is fed into an optical module through an opening in a housing of the optical module,wherein the strain-relieve device is provided with an adjustment mechanism configured to adjust a distance between an end portion of the one or more optical fibers and the strain-relieve device.2. Assembly according to claim 1 , wherein the end portion of the one or more optical fibers is received in a ferrule configured to be received in a plug-in of the optical module.3. Assembly according to claim 1 , wherein the adjustment mechanism is provided with a fine adjustment.4. Assembly according to claim 1 , wherein the adjustment mechanism is provided with a rotation adjustment mechanism.5. Assembly according to claim 1 , wherein the rotation adjustment mechanism is provided with a screw rotation adjustment mechanism.6. Assembly according to claim 1 , whereinthe optical cable is located a channel provided in the strain-relieve device, andthe strain-relieve device comprises an adjustment member which is, in relation to the end portion of the one or more optical fibers, movable along the longitudinal axis of the optical cable.7. Assembly according to claim 6 , wherein the adjustment ...

Optically Cooled Platform For Thermal Management Applications

A semiconductor device comprising a waveguide having a core, said core having inserted therein one or more layers of nanoemitters.

INNOVATIVE NANOPORE SEQUENCING TECHNOLOGY

Methods and apparatus for long read, label-free, optical nanopore long chain molecule sequencing. In general, the present disclosure describes a novel sequencing technology based on the integration of nanochannels to deliver single long-chain molecules with widely spaced (>wavelength), ˜1-nm aperture “tortuous” nanopores that slow translocation sufficiently to provide massively parallel, single base resolution using optical techniques. A novel, directed self-assembly nanofabrication scheme using simple colloidal nanoparticles is used to form the nanopore arrays atop nanochannels that unfold the long chain molecules. At the surface of the nanoparticle array, strongly localized electromagnetic fields in engineered plasmonic/polaritonic structures allow for single base resolution using optical techniques. 1. A method for forming a device for the manipulation of targeted long chain molecules comprising:providing a nanochannel having a common porous roof comprising a plurality of tortuous nanopores; andsealing some of the nanopores in the porous roof via conformal atomic layer deposition (ALD).2. The method of further comprising forming a layer over the roof via chemical vapor deposition (CVD).3. The method of wherein the size of at least one of the unsealed pores enables translocation of single long chain molecules one at a time.4. The method of wherein the density of the unsealed nanopores enables optical resolution of individual nanopores.5. The method of further comprising depositing a field enhancement structure on the roof of the nanochannel.6. The method of wherein the field enhancement structure is self-aligned to the nanopores.7. The method of further comprising forming an additional optically transparent layer spaced away from the field enhancement structure.8. The method of wherein the field enhancement structure is a metal insulator metal (MIM) structure.9. The method of wherein the MIM structure is deposited by a combination of anisotropic and isotropic ...

INTEGRATED CHIRPED-GRATING SPECTROMETER-ON-A-CHIP

A spectral sensor and a method for forming the spectral sensor is disclosed. The spectral sensor includes a planar waveguide on a substrate; a restriction mechanism that restricts a range of angles of incidence of light impinging onto the chirped input coupling grating; the chirped input grating formed to couple incident light into the planar waveguide, wherein the chirped input coupling grating comprises a first transverse chirp to provide a spectrally selective coupling of incident light Into the planar waveguide; a propagation region to filter out light that is not coupled into the planar waveguide; a detector array arranged on the opposite side of the propagation region from the chirped input coupling S grating to receive light coupled out of the planar waveguide and produce output signals representative of the light; and an electrical circuit to readout output signals from the detector array. 1. A spectral sensor comprising:a planar waveguide on a substrate;a restriction mechanism that restricts a range of angles of incidence of light impinging onto the chirped input coupling grating;the chirped input grating formed to couple incident light into the planar waveguide, wherein the chirped input coupling grating comprises a first transverse chirp to provide a spectrally selective coupling of incident light into the planar waveguide;a propagation region to filter out light that is not coupled into the planar waveguide;a detector array arranged on the opposite side of the propagation region from the chirped input coupling grating to receive light coupled out of the planar waveguide and produce output signals representative of the light; andan electrical circuit to readout output signals from the detector array.2. The spectral sensor of claim 1 , further comprising an output grating that couples the light from the planar waveguide to the detector array.3. The spectral sensor of claim 2 , wherein the output grating comprises a second transverse chip.4. The spectral ...

Electronic sub-assembly and method for the production of an electronic sub-assembly

An electronic sub-assembly (36) comprising at least one electronic component (14) embedded in a sequence of layers, wherein the electronic component (14) is arranged in a recess of an electrically conductive central layer (16) and directly adjoins a resin layer (12, 20) on each side.

AUTONOMOUS DOMOTIC TRANSMITTER SENSOR AND METHOD FOR OPERATING SAME

Translucent glass for displaying an image of a polarized sunglass head-up display

Eine lichtdurchlässige Scheibe (11) zum Anzeigen eines Bildes eines Head-Up Displays umfasst eine cholesterische Flüssigkristall-Schichtanordnung (100a, 100b, 100c), die im Inneren der Scheibe (11) oder auf einer Oberfläche (O11) der Scheibe (11) angeordnet ist. Je nach Polarisation des einfallenden Lichts kann zumindest ein Teil des von einer Bilderzeugungseinrichtung (12) einer Head-up Display Anordnung erzeugten Lichts an der cholesterischen Flüssigkristall-Schichtanordnung (100a, 100b, 100c) derart reflektiert werden, dass das reflektierte Licht einen p-polarisierten Anteil aufweist, der mit einer polarisierten Sonnenbrille wahrgenommen werden kann. A translucent disk (11) for displaying an image of a head-up display comprises a cholesteric liquid crystal layer arrangement (100a, 100b, 100c) arranged inside the disk (11) or on a surface (O11) of the disk (11) is. Depending on the polarization of the incident light, at least part of the light generated by an image generation device (12) of a head-up display arrangement can be reflected at the cholesteric liquid crystal layer arrangement (100a, 100b, 100c) in such a way that the reflected light has a p-polarization Share that can be perceived with a polarized sunglasses.

Electronic sub-assembly and method for the production of an electronic sub-assembly

The invention relates to an electronic sub-assembly (36) having at least one electronic component (14) embedded in a sequence of layers, the electronic component(14) being arranged in a recess of an electrically conducting central layer (16) and directly adjoining a resin layer (12, 20) on each side.

Cladding device for a motor vehicle and a motor vehicle body with a covering device of this type

Die Erfindung betrifft eine Verkleidungsvorrichtung (2) für ein Kraftfahrzeug mit mindestens einem Gehäusekörper (4), der an einer Tragstruktur (5) des Kraftfahrzeugs festlegbar oder festgelegt ist, mit mindestens einer Optikeinrichtung (6), die mindestens eine Optikeinheit (8), wie Scheinwerfer oder Sensor, aufweist die mindestens ein Optikgehäuse (10) umfasst, das an oder in dem Gehäusekörper (4) festlegbar oder festgelegt ist, und mit mindestens einem den Gehäusekörper (4) nach außen begrenzenden Abdeckelement (12), das an einer der Tragstruktur (5) abgewandten Seite des Gehäusekörpers (4) am Gehäusekörper (4) festlegbar oder festgelegt ist und das mindestens einen transparenten und/oder transluzenten ersten Abdeckabschnitt (14) umfasst, der zumindest die Optikeinheit (8) zumindest bereichsweise überfängt und einen Gehäuseabschnitt (16) der Optikeinheit (8) bildet, wobei der den Gehäuseabschnitt (16) der Optikeinheit (8) zumindest bereichsweise bildende erste Abdeckabschnitt (14) des Abdeckelements (12) ein Optikelement (18), wie Linse, der Optikeinheit (8) bildet. Darüber hinaus betrifft die Erfindung eine Kraftfahrzeugkarosserie mit einer derartigen Verkleidungsvorrichtung (2). The invention relates to a cladding device (2) for a motor vehicle with at least one housing body (4) which can be or is fixed to a support structure (5) of the motor vehicle, with at least one optical device (6), the at least one optical unit (8), such as Headlight or sensor, which comprises at least one optics housing (10) which can be fixed or fixed on or in the housing body (4), and with at least one cover element (12) which delimits the housing body (4) outwardly and which is attached to one of the support structure (5) facing away from the housing body (4) on the housing body (4) can be fixed or fixed and which comprises at least one transparent and / or translucent first cover section (14) which at least partially overlaps at least the optical unit (8) and a housing section (16 ) ...

Innovative nanopore sequencing technology including a self-assembled porous membrane

Methods and apparatus for long read, label-free, optical nanopore long chain molecule sequencing. In general, the present disclosure describes a novel sequencing technology based on the integration of nanochannels to deliver single long-chain molecules with widely spaced (>wavelength), ˜1-nm aperture “tortuous” nanopores that slow translocation sufficiently to provide massively parallel, single base resolution using optical techniques. A novel, directed self-assembly nanofabrication scheme using simple colloidal nanoparticles is used to form the nanopore arrays atop nanochannels that unfold the long chain molecules. At the surface of the nanoparticle array, strongly localized electromagnetic fields in engineered plasmonic/polaritonic structures allow for single base resolution using optical techniques.

Method for producing an electronic assembly

The invention relates to a method for producing an electronic assembly (21), wherein, in a first step, at least one electronic component (9) is fastened on an isolating layer (5) of a conductive film (1), the conductive film (1) with the electronic component (9) is laminated onto a printed circuit board carrier (13) and finally a conductor structure (15) is formed by structuring the conductive film (1). The coefficient of expansion of the isolating layer (5) is between the coefficient of expansion of the printed circuit board carrier (13) and the coefficient of expansion of the conductor structure (15), and/or electronic components (9), which need small passages for contacting with the conductor structure (15), are pressed further into the isolating layer (5) than electronic components (9), which need larger passages in the isolating layer (5), and/or the conductor structure (15) is forced apart before the application of a further conductor structure (27).

Innovative nanopore sequencing technology

Methods and apparatus for long read, label-free, optical nanopore long chain molecule sequencing. In general, the present disclosure describes a novel sequencing technology based on the integration of nanochannels to deliver single long-chain molecules with widely spaced (> wavelength), ~ 1-nm aperture "tortuous" nanopores that slow translocation sufficiently to provide massively parallel, single base resolution using optical techniques. A novel, directed self-assembly nanofabrication scheme using simple colloidal nanoparticles is used to form the nanopore arrays atop nanochannels that unfold the long chain molecules. At the surface of the nanoparticle array, strongly localized electromagnetic fields in engineered plasmonic/polaritonic structures allow for single base resolution using optical techniques.

Innovative nanopore sequencing technology

Methods and apparatus for long read, label-free, optical nanopore long chain molecule sequencing. In general, the present disclosure describes a novel sequencing technology based on the integration of nanochannels to deliver single long-chain molecules with widely spaced (> wavelength), ~ 1-nm aperture "tortuous" nanopores that slow translocation sufficiently to provide massively parallel, single base resolution using optical techniques. A novel, directed self-assembly nanofabrication scheme using simple colloidal nanoparticles is used to form the nanopore arrays atop nanochannels that unfold the long chain molecules. At the surface of the nanoparticle array, strongly localized electromagnetic fields in engineered plasmonic/polaritonic structures allow for single base resolution using optical techniques.

Manipulating the translation of DNA strands across and through nanopore sequencing systems using Raman signatures to identify DNA bases and methods

Nucleic acid sequencing methods and systems, the systems including nanochannel chip including: a nanochannel formed in an upper surface of the nanochannel chip and; a roof covering the nanochannel and comprising nanopores and a field enhancement structure; and a barrier disposed in the nanochannel. The method including: introducing a buffer solution including long-chain nucleic acids to the nanochannel chip; applying a voltage potential across the nanochannel chip to drive the nucleic acids through the nanochannel, towards the barrier, and to translocate the nucleic acids through nanopores adjacent to the barrier, such that bases of each of the nucleic acids pass through the field enhancement structure one base at a time and emerge onto an upper surface of the roof; detecting the Raman spectra of the bases of the nucleic acids as each base passes through the electromagnetic-field enhancement structure; and sequencing the nucleic acids based on the detected Raman spectra.

Method for producing an electronic assembly

The invention relates to a method for producing an electronic assembly (21), wherein, in a first step, at least one electronic component (9) is fastened on an isolating layer (5) of a conductive film (1), the conductive film (1) with the electronic component (9) is laminated onto a printed circuit board carrier (13) and finally a conductor structure (15) is formed by structuring the conductive film (1). The coefficient of expansion of the isolating layer (5) is between the coefficient of expansion of the printed circuit board carrier (13) and the coefficient of expansion of the conductor structure (15), and/or electronic components (9), which need small passages for contacting with the conductor structure (15), are pressed further into the isolating layer (5) than electronic components (9), which need larger passages in the isolating layer (5), and/or the conductor structure (15) is forced apart before the application of a further conductor structure (27).

Innovative nanopore sequencing technology

Methods and apparatus for long read, label-free, optical nanopore long chain molecule sequencing. In general, the present disclosure describes a novel sequencing technology based on the integration of nanochannels to deliver single long-chain molecules with widely spaced (> wavelength), ~ 1-nm aperture "tortuous" nanopores that slow translocation sufficiently to provide massively parallel, single base resolution using optical techniques. A novel, directed self-assembly nanofabrication scheme using simple colloidal nanoparticles is used to form the nanopore arrays atop nanochannels that unfold the long chain molecules. At the surface of the nanoparticle array, strongly localized electromagnetic fields in engineered plasmonic/polaritonic structures allow for single base resolution using optical techniques.

Signal transmission on a window or a door

The invention relates to a signal transmission device (1) on a window or a door, comprising a sensor for detecting an operating state of the window or the door, an evaluation unit which addresses the sensor, and a transmitter for the wireless transmission of the sensor signal to a control center. In order to provide a signal transmission device (1), which is optimized with regard to the power generation without significantly enlarging the volume of the generator, a power generation module is provided which is actuated by actuating a locking device of the window or of the door, or by moving a movable part thereof several times in succession.

Integrated bound-mode spectral/angular sensors

A 2-D sensor array includes a semiconductor substrate and a plurality of pixels disposed on the semiconductor substrate. Each pixel includes a coupling region and a junction region, and a slab waveguide structure disposed on the semiconductor substrate and extending from the coupling region to the region. The slab waveguide includes a confinement layer disposed between a first cladding layer and a second cladding layer. The first cladding and the second cladding each have a refractive index that is lower than a refractive index of the confinement layer. Each pixel also includes a coupling structure disposed in the coupling region and within the slab waveguide. The coupling structure includes two materials having different indices of refraction arranged as a grating defined by a grating period. The junction region comprises a p-n junction in communication with electrical contacts for biasing and collection of carriers resulting from absorption of incident radiation.

Assembly for monitoring a closure

Optical communications system and method with an optical communication module having an acute angle connection

The invention relates to an optical communications system, including an optical module, including a module motherboard provided with a substrate having an upper surface and a lower surface, an optical component on the upper surface of the substrate, the optical component being configured to submit and/or receive optical signals and being connected to electrical conductors extending through the substrate, an optical coupling module having a first light coupling port, a second light coupling port, and at least one light guiding component guiding light signals between the first and second light coupling ports, and a connector receptacle, a longitudinal axis of the connector receptacle being provided parallel or with an acute angle to the plane of the substrate, and a fiber cable connector provided on an end portion of an optical fiber cable and received in the connector receptacle.

Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate

A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface of the microelectronic component. An electrically conducting bump is applied to the electrical contact face of the microelectronic component. A metal foil or metal coat is applied via a coating of an insulating binder to the surface of the circuit board under an action of pressure and/or heat so that the electrically conducting bump penetrates the coating of the insulating binder to make the electrical connection between the metal foil or metal coat and the electrical contact face.

Optoelectrical connector system

An optoelectrical connector system can include an optical coupler that is configured to be positioned over a photonic device on the PCB. The optoelectrical connector system can further include a connector housing that is configured to be attached to the optical coupler after the optical coupler is positioned over the photonic device, so that the coupler can be aligned and fixed without the housing attached thereto.

Structural illumination and evanescent coupling for the extension of imaging interferometric microscopy

In accordance with the invention, there are imaging interferometric microscopes and methods for imaging interferometric microscopy using structural illumination and evanescent coupling for the extension of imaging interferometric microscopy. Furthermore, there are coherent anti-Stokes Raman (CARS) microscopes and methods for coherent anti-Stokes Raman (CARS) microscopy, wherein imaging interferometric microscopy techniques are applied to get material dependent spectroscopic information.

Enhancement structures for surface-enhanced raman scattering

The invention generally relates to improved enhancement structures for use in surface- enhanced Raman scattering (SERS) and/or surface-enhanced fluorescence-based analysis.

Verfahren zum betrieb einer autonomen sensorvorrichtung für den hausgebrauch zum erfassen der existenz und/oder zum messen der intensität eines physikalischen phänomens

Integrated chirped-grating spectrometer-on-a-chip

A spectral sensor and a method for forming the spectral sensor is disclosed. The spectral sensor includes a planar waveguide on a substrate; a restriction mechanism that restricts a range of angles of incidence of light impinging onto the chirped input coupling grating; the chirped input grating formed to couple incident light into the planar waveguide, wherein the chirped input coupling grating comprises a first transverse chirp to provide a spectrally selective coupling of incident light Into the planar waveguide; a propagation region to filter out light that is not coupled into the planar waveguide; a detector array arranged on the opposite side of the propagation region from the chirped input coupling grating to receive light coupled out of the planar waveguide and produce output signals representative of the light; and an electrical circuit to readout output signals from the detector array.

Collecting unit for collecting a substance and method for assembling the collecting unit

A collecting unit and method for assembling the collecting unit are described in the present disclosure. The unit comprises a detachable frame structure and a collector arrangement. The frame structure comprises legs and a hub having holes on the surface of the hub. A first end of each of the legs is inserted in at least one hole of the hub. The arrangement comprises a collapsible plane having a first side for collecting a substance and a bottom side facing hub. Connecting assembly is provisioned for establishing a connection between each corner of the plane and the second end of the corresponding leg. The collector arrangement further comprises a geometry defining mechanism to define the geometry of the plane.

Innovative nanopore sequencing technology

Methods and apparatus for long read, label-free, optical nanopore long chain molecule sequencing. In general, the present disclosure describes a novel sequencing technology based on the integration of nanochannels to deliver single long-chain molecules with widely spaced (>wavelength), ˜1-nm aperture “tortuous” nanopores that slow translocation sufficiently to provide massively parallel, single base resolution using optical techniques. A novel, directed self-assembly nanofabrication scheme using simple colloidal nanoparticles is used to form the nanopore arrays atop nanochannels that unfold the long chain molecules. At the surface of the nanoparticle array, strongly localized electromagnetic fields in engineered plasmonic/polaritonic structures allow for single base resolution using optical techniques.

Manipulating the translation of dna strands across and through nanopore sequencing systems using raman signatures to identify dna bases and methods

Nucleic acid sequencing methods and systems, the systems including nanochannel chip including: a nanochannel formed in an upper surface of the nanochannel chip and; a roof covering the nanochannel and comprising nanopores and a field enhancement structure; and a barrier disposed in the nanochannel. The method including: introducing a buffer solution including long-chain nucleic acids to the nanochannel chip; applying a voltage potential across the nanochannel chip to drive the nucleic acids through the nanochannel, towards the barrier, and to translocate the nucleic acids through nanopores adjacent to the barrier, such that bases of each of the nucleic acids pass through the field enhancement structure one base at a time and emerge onto an upper surface of the roof; detecting the Raman spectra of the bases of the nucleic acids as each base passes through the electromagnetic-field enhancement structure; and sequencing the nucleic acids based on the detected Raman spectra.

Radio frequency transmitting/receiving element and method for producing a radio frequency transmitting/receiving element

A method for producing a radio frequency transmitting/receiving element comprising at least one radio frequency antenna and at least one radio frequency chip, and to a corresponding radio frequency transmitting/receiving element made by the method. The method comprises the following steps: providing a temporary rigid carrier; applying a conductor pattern structure comprising the antenna structure of the at least one radio frequency antenna and connection contacts—connected thereto via leads—for the at least one radio frequency chip; arranging the at least one radio frequency chip on the connection contacts of the conductor pattern structure; applying an electrically insulating layer on the conductor pattern structure, such that the at least one radio frequency chip is surrounded by the electrically insulating layer; and removing the temporary rigid carrier.

Enhancement structures for surface-enhanced Raman scattering

The invention generally relates to improved enhancement structures for use in surface-enhanced Raman scattering (SERS) and/or surface-enhanced fluorescence-based analysis.

Enhancement structures for surface-enhanced raman scattering

The invention generally relates to improved enhancement structures for use in surface- enhanced Raman scattering (SERS) and/or surface-enhanced fluorescence-based analysis.

Einheit aus Brennstoffzelle und Nachbrenner mit Latentwärmespeicher und Wärmetauscher

Einheit aus einer Brennstoffzelle (12), einem Nachbrenner (13) für das Brennstoffzellen-Restgas sowie einem Latentwärmespeicher (16) zur Speicherung und einem Wärmetauscher (14) zur Nutzung zumindest eines Teils der im Nachbrenner (13, 15) erzeugten Abwärme, dadurch gekennzeichnet, dass der Latentwärmespeicher (16) in oder innerhalb an einer diese Einheit umhüllenden Wärme-Isolationsschicht (3, 32) vorgesehen und ausgelegt ist, bei sich aufgrund nicht betriebener Brennstoffzelle (12) abkühlender Wärme-Isolationsschicht (3) durch Phasenwechsel Wärme an die Isolationsschicht (3) abzugeben.

Procédé de fonctionnement d'un dispositif de capteur domotique autonome pour détecter l'existence et/ou mesurer l'intensité d'un phénomène physique

Le procédé de fonctionnement s'applique à un dispositif de capteur domotique autonome pour détecter l'existence et/ou mesurer l'intensité d'un premier phénomène physique, comprenant un moyen de conversion d'un effet d'un deuxième phénomène physique en énergie électrique et un moyen de détermination de la puissance instantanée du deuxième phénomène physique qui est convertible en énergie électrique. Il est caractérisé en ce qu'un premier mode de fonctionnement normal du dispositif ou un deuxième mode de fonctionnement à économie d'énergie du dispositif est activé selon une valeur définie à partir de la détermination de la puissance instantanée convertible en énergie électrique.

Enhancement structures for surface-enhanced raman scattering

The invention generally relates to improved enhancement structures for use in surface- enhanced Raman scattering (SERS) and/or surface-enhanced fluorescence-based analysis.

Procede de fonctionnement d'un dispositif de capteur domotique autonome pour detecter l'existence et/ou mesurer l'intensite d'un phenomene physique

Le procédé de fonctionnement s'applique à un dispositif de capteur domotique autonome pour détecter l'existence et/ou mesurer l'intensité d'un premier phénomène physique, comprenant un moyen de conversion d'un effet d'un deuxième phénomène physique en énergie électrique et un moyen de détermination de la puissance instantanée du deuxième phénomène physique qui est convertible en énergie électrique. Il est caractérisé en ce qu'un premier mode de fonctionnement normal du dispositif ou un deuxième mode de fonctionnement à économie d'énergie du dispositif est activé selon une valeur définie à partir de la détermination de la puissance instantanée convertible en énergie électrique.

Procedimiento de funcionamiento de un dispositivo de captador domotico autonomo para detectar la existencia y/o para medir la intendisidad de un fenomeno fisico.

Procedimiento de funcionamiento de un dispositivo (10) de captador domótico autónomo para detectar la existencia y/o para medir la intensidad de un primer fenómeno físico, que comprende un medio (20) para la conversión de un efecto de un segundo fenómeno físico en energía eléctrica, para alimentar el dispositivo y un medio (80) para la determinación de la potencia instantánea del segundo fenómeno físico, que es convertible en energía eléctrica, caracterizado porque es activado un primer modo de funcionamiento normal del dispositivo o es activado un segundo modo de funcionamiento con economía de energía del dispositivo, según un valor definido a partir de la determinación de la potencia instantánea convertible en energía eléctrica, teniendo el dispositivo un consumo eléctrico menor en el segundo modo que en el primer modo, obteniéndose la reducción del consumo eléctrico por medio de, al menos, una de las características siguientes: - la frecuencia de medida de la intensidad del primer fenómeno físico es mayor en el primer modo de funcionamiento que en el segundo modo de funcionamiento, - la frecuencia de envío de señales de estado y/o de datos es mayor en el primer modo de funcionamiento que en el segundo modo de funcionamiento, - un número de tramas emitidas en una señal de estado es mayor en el primer modo de funcionamiento que en el segundo modo de funcionamiento, - una unidad lógica de tratamiento (40) funciona, en el primer modo de funcionamiento, a una frecuencia mayor que la que funciona en el segundo modo de funcionamiento, - un medio (30) de almacenamiento de energía eléctrica está cargado por intermedio de un convertidor-elevador (70) o directamente desde el medio para la conversión de un efecto del segundo fenómeno físico en energía eléctrica según el nivel de carga del medio de almacenamiento, en el primer modo de funcionamiento, siendo cargado de manera permanente el medio de almacenamiento de energía eléctrica directamente desde el medio para la ...

Collecting unit for collecting a substance and method for assembling the collecting unit

A collecting unit and method for assembling the collecting unit are described in the present disclosure. The unit comprises a detachable frame structure and a collector arrangement. The frame structure comprises legs and a hub having holes on the surface of the hub. A first end of each of the legs is inserted in at least one hole of the hub. The arrangement comprises a collapsible plane having a first side for collecting a substance and a bottom side facing hub. Connecting assembly is provisioned for establishing a connection between each corner of the plane and the second end of the corresponding leg. The collector arrangement further comprises a geometry defining mechanism to define the geometry of the plane.

Ringwalzwerk mit vorrichtung zur ringmanipulation

Vorrichtung (1) zum Walzen von Ringen, die aufweist: eine Walzeinrichtung (10) mit einer Hauptwalze (11) und zumindest einer Dornwalze (13a), auf die ein Ring aufgebbar ist, wobei die Walzeinrichtung (10) eingerichtet ist, um den Ring auszuwalzen, indem die Dornwalze (13a) auf eine Innenseite des Rings und die Hauptwalze (11) auf eine Außenseite des Rings wirkt; und eine Manipuliereinrichtung (20) mit mindestens einem Roboter (21), der eingerichtet ist, um den Ring zu manipulieren, umfassend das Aufgeben des Rings auf die Dornwalze (13a) und/oder Entnehmen des Rings von der Dornwalze (13a).

Ringwalzwerk mit vorrichtung zur ringmanipulation

Vorrichtung (1) zum Walzen von Ringen, die aufweist: eine Walzeinrichtung (10) mit einer Hauptwalze (11) und zumindest einer Dornwalze (13a), auf die ein Ring aufgebbar ist, wobei die Walzeinrichtung (10) eingerichtet ist, um den Ring auszuwalzen, indem die Dornwalze (13a) auf eine Innenseite des Rings und die Hauptwalze (11) auf eine Außenseite des Rings wirkt; und eine Manipuliereinrichtung (20) mit mindestens einem Roboter (21), der eingerichtet ist, um den Ring zu manipulieren, umfassend das Aufgeben des Rings auf die Dornwalze (13a) und/oder Entnehmen des Rings von der Dornwalze (13a).

Active aero shutter for a motor vehicle

The invention refers to an active aero shutter for a motor vehicle, comprising a frame (20) with openings (21) through which air can flow, at least one closing plate (11) in each opening (21), which closes the opening (21) and stops the air flow when closed, and the frame (20) is formed by several struts (22,23), each connected to at least one other strut, wherein each closing plate (11) is pivoted with a hinge (25) on a basic strut (22). As the active aero shutter according to the invention has counterrotating closing plates (11) which are rotating in several angles it is possi-ble to explore new design concepts and ensure driving performance.

Verfahren zur Erfassung der magnetischen Antwort einer Verteilung magnetisierbarer Partikel auf ein magnetisches Anregungsfeld

Beschrieben wird ein Verfahren zur Erfassung der magnetischen Antwort einer Verteilung magnetisierbarer Partikel auf ein magnetisches Anregungsfeld mit einer vorbestimmten Grundfrequenz, wobei die magnetische Antwort in wenigstens einer Detektionsspule ein Spannungssignal mit Anteilen der Harmonischen der Grundfrequenz induziert und wobei in wenigstens einer Kompensationsspule ein vom magnetischen Anregungsfeld induziertes Kompensationssignal erzeugt und mit dem Spannungssignal destruktiv superponiert wird, so dass ein kompensiertes Spannungssignal an einem Ausgang der Spulenanordnung abgegriffen wird.Die beschriebene technische Lösung zeichnet sich durch eine spezielle Zuführung des kompensierten Spannungssignals, das Isolieren der führenden Harmonischen mit dem ersten Übertragungsglied, das Unterdrücken der führenden Harmonischen mit dem zweiten Übertragungsglied, das optionale Zuführen der verbleibenden Signalanteile zu einem weiteren Paar von Übertragungsgliedern mit einem vorbestimmten Bandbreitenbereich um die nächsthöhere Harmonische und wiederholen der vorhergehenden Schritte, das Digitalisieren des verbleibenden Signals, wobei jedem Digitalisierungsschritt im jeweiligen Übertragungsglied eine Signalverstärkung derart vorgeschaltet wird, dass die vorbekannte Messdynamik der Digitalisierungseinrichtung ausgeschöpft wird, und die Rekonstruktion der magnetischen Antwort der Partikelverteilung aus den digitalisierten Signalen unter Berücksichtigung der separaten Signalverstärkungen und vorab ermittelter Kalibrierdaten.

Leiterplatte und verfahren zu deren herstellung

Leiterplatte (10, 10', 10'') mit mindestens einer isolierenden Substratlage (SL1, SL2, SL3, S14, SL5) und einer Mehrzahl von auf der mindestens einen isolierenden Substratlage (SL1, SL2, SL3, S14, SL5) angeordneten elektrisch leitenden Kupferschichten (C1, C2, C3), wobei mindestens eine der elektrisch leitenden Kupferschichten (C1, C2, C3) zumindest beidseitig mit einer Schicht (HS1, HS2, HS3) aus einem Material zur Hemmung von Elektromigration beschichtet ist, wobei auf einer Schicht (HS1, HS2) aus einem Material zur Hemmung von Elektromigration eine weitere Metallschicht (M1, M2, M3, M3') vorgesehen ist, die wiederum mit einer weiteren Schicht (HS3, HS3') aus einem Material zur Hemmung von Elektromigration beschichtet ist.

Improvements in the Manufacture of Bodices or Corsets.

Improvements in the Manufacture of Bodices, Vests, Corsets, Jerseys, and the like.

In-line angular optical multi-point scatterometry for nanomanufacturing systems

A method and system for high-speed 2Θ multi-point scatterometry is disclosed. The method includes directing a laser beam from a laser light source to a collimation optical system that collimates the laser beam to a collimated laser beam; adjusting a polarization of the collimated laser beam using a polarization control optics; directing the collimated laser beam that is polarized by a first optical system to illuminate a focal area on a sample surface; receiving reflected light from the focus of the laser light source at the sample surface by a second optical system; detecting the reflected light by a detector system to produce detection signals; and processing the detection signals to measure parameters of the sample surface.

Fernbefundungssystem zur Durchführung einer medizinischen Fernbefundung des Gesundheitszustandes eines ersten Akteurs durch einen zweiten Akteur

Es wird ein Fernbefundungssystem 10 zur Durchführung einer medizinischen Fernbefundung des Gesundheitszustands eines ersten Akteurs 1 durch einen zweiten Akteur 2 zur Verfügung gestellt. Das Fernbefundungssystem 10 umfasst ein Videokonferenzsystem 15, welches einen ersten Endpunkt E1 auf Seiten des ersten Akteurs 1 und einen zweiten Endpunkt E2 auf Seiten des zweiten Akteurs 2 aufweist. Mittels des Videokonferenzsystems 15 sind Datenpakete über mindestens ein Datennetzwerk 20 mit einer ersten Datenqualität zwischen dem ersten und dem zweiten Endpunkt E1, E2 austauschbar. Erfindungsgemäß umfasst das Fernbefundungssystem 10 ferner einen Replayrecorder 60 auf Seiten des erstens Akteurs 1, mittels welchem Videomaterial in einer zweiten Datenqualität aufnehmbar ist. Es wird ferner ein Verfahren zur Durchführung einer medizinischen Fernbefundung sowie ein Computerprogrammprodukt mit computerausführbarem Programmcode zur Durchführung des erfindungsgemäßen Verfahrens zur Verfügung gestellt

Imaging interferometric microscopy

Exemplary embodiments provide an image interferometric microscope (IIM) and methods for image interferometric microscopy. The disclosed IIM can approach the linear systems limits of optical resolution by using a plurality of off-axis illuminations to access high spatial frequencies along with interferometric reintroduction of a zero-order reference beam on the low-NA side of the optical system. In some embodiments, a thin object can be placed normal to the optical axis and the frequency space limit can be extended to about [(1+NA)n/λ], where NA is the numerical-aperture of the objective lens used, n is the refraction index of the transmission medium and λ is an optical wavelength. In other embodiments, tilting the object plane can further allow collection of diffraction information up to the material transmission bandpass limited spatial frequency of about 2n/λ.

Structural illumination and evanescent coupling for the extension of imaging interfermetric microscopy

In accordance with the invention, there are imaging interferometric microscopes and methods for imaging interferometric microscopy using structural illumination and evanescent coupling for the extension of imaging interferometric microscopy. Furthermore, there are coherent anti-Stokes Raman (CARS) microscopes and methods for coherent anti-Stokes Raman (CARS) microscopy, wherein imaging interferometric microscopy techniques are applied to get material dependent spectroscopic information.

Block stacking game

An optical communications system, an optical communication module, and a method

The invention relates to an optical communications system, comprising an optical module, comprising a module motherboard provided with a substrate having an upper surface and a lower surface, an optical component disposed on the upper surface of the substrate, the optical component being configured to submit and / or receive optical signals and being connected to electrical conductors extending through the substrate, an optical coupling module having a first light coupling port, a second light coupling port, and at least one light guiding component guiding light signals between the first and second light coupling ports, and a connector receptacle, a longitudinal axis of the connector receptacle being provided parallel or with an acute angle to the plane of the substrate, and a fiber cable connector provided on an end portion of an optical fiber cable and received in the connector receptacle, thereby, optically coupling a plurality of optical fibers of the optical fiber cable to the first or second light coupling ports. Furthermore, the invention relates to an optical module and a method for mounting an optical communications system, the method.

Enhancement structures for surface-enhanced raman scattering

The invention generally relates to improved enhancement structures for use in surface-enhanced Raman scattering (SERS) and/or surface-enhanced fluorescence-based analysis.

Interferometric lithography grating-mask-based wafer-scale large-area nanopatterning

According to examples of the present disclosure, a method for large-area, full-wafer nanopatterning is disclosed. The method includes providing a laser light source; providing beam conditioning and translation optics to expand the beam to illuminate a full wafer area; providing a grating beam-splitter; providing recombination optics to direct at least two beams from the grating beam splitter to a full wafer photoresist-coated target; and exposing the full wafer photoresist-coated target.

Active aero shutter for a motor vehicle

The invention refers to an active aero shutter for a motor vehicle, comprising a frame with openings through which air can flow, at least one closing plate in each opening, which closes the opening and stops the air flow when closed, and the frame is formed by several struts, each connected to at least one other strut, wherein each closing plate is pivoted with a hinge on a basic strut. As the active aero shutter according to the invention has counterrotating closing plates which are rotating in several angles it is possible to explore new design concepts and ensure driving performance.

Innovative nanopore sequencing technology including a self-assembled porous membrane

Methods and apparatus for long read, label-free, optical nanopore long chain molecule sequencing. In general, the present disclosure describes a novel sequencing technology based on the integration of nanochannels to deliver single long-chain molecules with widely spaced (>wavelength), ˜1-nm aperture “tortuous” nanopores that slow translocation sufficiently to provide massively parallel, single base resolution using optical techniques. A novel, directed self-assembly nanofabrication scheme using simple colloidal nanoparticles is used to form the nanopore arrays atop nanochannels that unfold the long chain molecules. At the surface of the nanoparticle array, strongly localized electromagnetic fields in engineered plasmonic/polaritonic structures allow for single base resolution using optical techniques.

Electronic sub-assembly, a method for manufacturing the same, and a printed circuit board with electronic sub-assembly

Electronic sub-assembly comprising a carrier layer and a mounting area with at least one electronic component, wherein the carrier layer has at least in portions a material with a low coefficient of thermal expansion to adjust the coefficient of thermal expansion of the carrier layer, and wherein at least one compensation layer is provided on the carrier layer adjacent to the installation area, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided.

Ferrule for an optical connector

Ferrule for an optical connector, an optical connector containing such a ferrule, and a method for assembling such a ferrule. The ferrule includes a base, at least one cover, at least one fiber section running through a channel between the base and the cover from a cable connection side to an opposite contact face exposing distal ends of the fiber sections. The fibers are adhered to the base and/or to the cover at a bonding section at a distance from the contact face.

Integrated bound-mode spectral/angular sensors

A 2-D sensor array includes a semiconductor substrate and a plurality of pixels disposed on the semiconductor substrate. Each pixel includes a coupling region and a junction region, and a slab waveguide structure disposed on the semiconductor substrate and extending from the coupling region to the region. The slab waveguide includes a confinement layer disposed between a first cladding layer and a second cladding layer. The first cladding and the second cladding each have a refractive index that is lower than a refractive index of the confinement layer. Each pixel also includes a coupling structure disposed in the coupling region and within the slab waveguide. The coupling structure includes two materials having different indices of refraction arranged as a grating defined by a grating period. The junction region comprises a p-n junction in communication with electrical contacts for biasing and collection of carriers resulting from absorption of incident radiation.

Optical coupling device and optical communication system

An optical coupling device including a housing, a first optical port provided on the housing, a second optical port provided on the housing and configured to couple to an optical fiber cable, an optical signal path guiding optical signals between the first and second optical port, a monitoring device provided on the housing, and an decoupling element optically coupled to the optical signal path and the monitoring device for coupling an optical monitoring signal coupled out from the optical signals guided between the first and second optical port onto the monitoring device. Furthermore, an optical communication system is provided, the system including an optical module with an optical signal processing device, the optical signal processing device being configured for at least one of receiving optical signals by a receiving device and transmitting optical signals by an optical signal source, and an optical coupling device guiding the optical signals.

Structural illumination and evanescent coupling for the extension of imaging interferometric microscopy

In accordance with the aspects of the present disclosure, a method and apparatus is disclosed for three-dimensional imaging interferometric microscopy (IIM), which can use at least two wavelengths to image a three-dimensional object. The apparatus can include a first, a second, and a third optical system. The first optical system is disposed to provide a substantially coherent illumination to the 3D object, wherein the illumination is characterized by a plurality of wavelengths. The second optical system includes an optical image recording device and one or more additional optical components characterized by a numerical aperture NA. The third optical system provides interferometric reintroduction of a portion of the coherent illumination as a reference beam into the second optical system. An image recording device records each sub-image formed as a result of interference between the illumination that is scattered by the 3D object and the reference beam.

Conductor structure element and method for producing a conductor structure element

The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed.