Microchip, e.g. heterojunction bipolar transistor, flip-chip mounting method, involves coating surfaces of microchips, with gold-tin-solder, where chips are soldered by heating of arrangement along with substrate

The method involves coating contact surfaces, active layer surface and heat dissipation surfaces of microchips, with gold-tin-solder in a thickness which is greater than planar difference of a gold layer of the chips. The surfaces of the microchips correspond to the contact surfaces and the active layer surface. The chips are soldered by heating of the arrangement along with the substrate. An independent claim is also included for an electronic component comprising a microchip mounted on a carrier.