Full system type video demodulation circuit with high-precision multi-window automatic phase control mode

The invention relates to an all-standard video demodulation circuit with a high precision multi-window automatic phase controlling model. One output end of an internal VCO oscillation module (11) is connected with the input end of a frequency divider in an analog single rough adjusting module (12), and another output end of the internal VCO oscillation module (11) is connected with the input end of a counter in a digital AFC adjusting module (13). A third output end of the internal VCO oscillation module (11) is connected with the input end of a multiplier in an analog single fine adjusting module (14). The output end of the multiplier in the analog single fine adjusting module (14), the output end of a logic element calculation in the digital AFC adjusting module (13), and the output end of the multiplier in the analog single rough adjusting module (12) are respectively connected with the input end of a PLL feedback module (15). In the AFC phase process, the demodulation circuit has the ...

High-temperature temperature measuring, sampling, installing and operating system

The utility model provides an installation and operation system for temperature measurement and sampling at high temperature. The installation and operation system comprises a bomb frame device, a sampling bomb frame, a robot gripper device, a temperature measurement and sampling mechanical device, an electric push rod device, an electric controller, a touch screen and an upper computer, wherein the sampling bomb frame comprises a temperature measurement bomb frame for placing temperature measurement bombs and a sampling bomb, and the touch screen and the upper computer are connected with theelectric controller. The temperature measurement sampling installation and operation system provided by the utility model is suitable for temperature measurement sampling in a high-temperature environment, is particularly suitable for a temperature measurement sampling production link in the steel industry, and realizes automation, standardization, data visualization and tracking intelligence of amolten ...

Structure of overlapping capacitors in semiconductor manufacture process

The invention relates to a structure of an overlapping capacitor in a semiconductor manufacture process, which is an overlapping capacitor manufacture technology compatible with a bipolar complementary metal oxide semiconductor (BiCMOS) process and a complementary metal oxide semiconductor (CMOS) process. A capacitor the unit-area capacitance Cox of which reaches a high capacitance value of 4.1ff/um<2> is provided in the CMOS process, and BV is higher than 12V, and additional processes are not needed. Under the circumstance of not adding any processing step, the unit-area capacitance value Cox of an overlapped capacitor is increased to 4.1 ff/um<2> from 2.5 ff/um<2> of typical polyl1/Nw or poly1/diff in the manner of overlapping a layer of ONO capacitor on a poly1/Nw or poly1/diff capacitor, i.e. the unit-area capacitance value is increased by 64 percent, thereby greatly increasing the integration level of the capacitor; moreover, the overlapping capacitor manufacture technology is compatible ...

Spoke-like vehicle body automatic ordering buffer area and ordering method thereof

The invention relates to a spoke-like vehicle body automatic ordering buffer area and an ordering method thereof; the buffer area comprises eight linear tracks which form a star-shaped spoke and a circular scheduling track which forms a circular rim; the star-shaped spoke is in a symmetric structure, and comprises a primary buffer area and a secondary buffer area which respectively comprises three adjacent linear racks; the other two linear tracks are adjacent to the primary and the secondary buffer areas, and respectively serve as a front scheduling track and a front scheduling track; the eight linear tracks form a transfer area at the cross point of the star shape; the primary and the secondary buffer areas are respectively connected with an inlet track and an outlet track; and the ordering method uses the buffer areas to complete the scheduling and the ordering of a vehicle by determining the ordering a target, encoding and ordering. Compared with a traditional automobile production ...

Bionic liposome nanoreactor, preparation method and application thereof

The invention provides a bionic lipidosome nanoreactor as well as a preparation method and application thereof, and relates to the technical field of biomedical engineering. The bionic liposome nanoreactor comprises a liposome, a thylakoid membrane fragment and an electron donor. According to the invention, a thylakoid fragment (Tk) is integrated into a liposome (Lip), and an electron donor is loaded into the liposome, so that the bionic liposome nano reactor is prepared. The bionic liposome nanoreactor can be taken in by renal epithelial cells to catalyze generation of NAD < + >; under ultrasonic driving, a large number of electrons are transferred to cytoplasm by an electron transfer chain on the material, NAD < + > is reduced into NADH, generation of ATP is promoted, and AKI is rapidly relieved in the early stage. Besides, in the presence of electrons, NADPH is effectively generated, oxidative stress of ROS and the like is fundamentally prevented, and development from AKI to CKD can ...

Effective electrostatic discharge protection circuit

The invention relates to an effective electrostatic discharge protection circuit; electrostatic discharge (ESD) is the most important reliability problem in the current integrated circuits. Along with the development of manufacturing technology of the integrated circuits, characteristic dimension is reduced continuously, the anti-static electricity capacity is weaker, however, under the micro-electronic manufacturing and using environment, the chance that devices suffer from ESD is more, and the effect of the ESD on the integrated circuits is greater, and ESD damage is an attention focus on the new process. The invention starts from the basic starting point, the limit of the traditional simple ESD protective circuit is broken through, and the ESD protective circuit is improved on the structure with the consideration of domain layout and design rules, but the process flows are basically consistent with the regular BICMOS processes, thereby ensuring good ESD protecting capacity of the integrated ...

Shield gate power device and manufacturing method thereof

The invention relates to the technical field of semiconductors, and particularly discloses a shield gate power device and a manufacturing method thereof, the shield gate power device comprises a cellular structure and a terminal structure, the cellular structure comprises drain electrode metal, a first conductive type substrate layer, a first conductive type epitaxial layer and source electrode metal which are sequentially arranged from bottom to top; p-base regions, P-plus regions and N-plus regions are arranged on the surface, making contact with the source electrode metal, of the first conduction type epitaxial layer, and the P-base regions are located on the two sides of the groove structure; a groove structure and a doped column structure are longitudinally arranged in the first conductive type epitaxial layer, the doped column structure comprises first conductive type columns located at the edges of the two sides of the cellular structure, and the lower ends of the first conductive ...

Big emergent pupil binocular eyepiece optical system of single display shares

The utility model belongs to the technical field of optics. The refraction and the transmission of the spherical lens group of arranging through the coaxial, eyes pupil in the exit pupil position to the mode of dividing the wavefront divides into the emergent light and controls two bundles, realizes that it observes to carry out the binocular to the individual monitor image that shares. The utility model relates to a big emergent pupil binocular eyepiece optical system of single display shares, for arranging the battery of lens between display and the diaphragm in, its characterized in that: the battery of lens is a coaxial n spherical lens who arranges in proper order, and n is for being not less than 3 natural number, place the display in the front focal plane of battery of lens at its center and the coincidence of battery of lens optical axis, including a 2n optical surface to diaphragm surperficial (1) is the starting point, is (2n) and (2n+1) respectively, surperficial be (the 2n+2 ...

Method and system for realizing balanced production of whole-automobile general assembly shop

The invention discloses a method and a system for realizing the balanced production of a whole-automobile general assembly shop. The method comprises: (1) a preprocessing step, (2) a classification monitoring and acquisition step, (3) an alarming step and (4) a disturbance factor processing step. The system comprises a shop information interactive terminal (1), a station information acquisition unit (2), an information display terminal (3) and a disturbance processing unit (4). The method and the system are suitable for the automobile general assembly shop using mixed-line production, and can fast and effectively process various disturbance factors during the production of the automobile general assembly shop, improve the capacity of fast recovering the balanced production of a production system of the automobile general assembly shop after a plurality of disturbance factors occur, and find out weak links during the production of the automobile general assembly shop by statistical analysis ...

Method for over-temperature protection through monitoring power tube junction temperature by collecting anode penetration current

The invention relates to a method for monitoring large power valve junction temperature for over-temperature protection whose principle is that collector ICEO of triode increases in exponent of 2 following temperature. Ordinarily, upper polar plate of oscillator capacitance has positive charge, lower polar plate has negative charge. Charging tube charges positive charge to the lower polar plate of the oscillator capacitance untill lower polar plate is the same potential with upper polar plate when charging tube has current all along, and discharging current ic3 is neglected when charging tube charges oscillator capacitance; when discharging tube is discharged, current of discharging tube is small, whole period is decided by discharging time; ICEO increases in exponent of 2 following temperature which can guarantee the in time monitoring for output tube junction temperature, that is, ICEO is in closed state in large time and effectively promote reliability of circuit.

Method for over-temperature protection through monitoring power tube junction temperature by collecting anode penetration current

The invention relates to a method for monitoring large power valve junction temperature for over-temperature protection whose principle is that collector ICEO of triode increases in exponent of 2 following temperature. Ordinarily, upper polar plate of oscillator capacitance has positive charge, lower polar plate has negative charge. Charging tube charges positive charge to the lower polar plate of the oscillator capacitance untill lower polar plate is the same potential with upper polar plate when charging tube has current all along, and discharging current ic3 is neglected when charging tubecharges oscillator capacitance; when discharging tube is discharged, current of discharging tube is small, whole period is decided by discharging time; ICEO increases in exponent of 2 following temperature which can guarantee the in time monitoring for output tube junction temperature, that is, ICEO is in closed state in large time and effectively promote reliability of circuit.

Isolation LED drive circuit

The invention discloses an isolation LED drive circuit, and belongs to the technical field of LED drive. The isolation LED drive circuit comprises a fly-wheel diode, a transformer, an auxiliary winding, a power tube, a sense resistor and a constant current controller. An LED is connected with a primary side winding of the transformer in series, the fly-wheel diode is connected with the two ends of a series branch formed by the LED and the primary side winding of the transformer in parallel in the reverse direction, the input end of the power tube is connected with the primary side winding of the transformer, the output end of the power tube is grounded through the sensor resistor, and the auxiliary winding is connected in a secondary side loop of the transformer in series. The constant current controller comprises a zero crossing detector, a bottom detector, a peak detector, a scaling factor amplifier, an on-off control unit, an integral unit, a transconductance amplifier, a comparator ...

Packaging method used for high-power integrated circuit

The invention discloses a packaging method for a high-power integrated circuit, which adopts a packaging manufacturing process for inserting a metal base into a metal substrate. During the package, the method comprises the following steps: firstly, punching a hole of which size is slightly smaller than the size of the metal base on the metal substrate, and inserting the base into the hole of the substrate; secondly, sintering a chip and the base by soldering paste, and sintering a terminal pin and the substrate by the soldering paste; and bonding the chip and the terminal pin, and finally carrying out pouring molding and packing. In the conventional package process, because the metal base is contacted with an outer radiating fin through the metal substrate, the thermal resistance is large, and the heat dissipation is slow; and by adopting the package process for inserting the metal base into the metal substrate, the metal base is directly contacted with the radiating fin, so the thermal ...

Wall surface smoothing device and using method thereof

The invention relates to the technical field of wall surface grinding equipment, and discloses a wall surface grinding device which comprises a moving seat, an electric push rod, a dust blocking cover, a dust treatment pipe, a dust suction transmission mechanism, a rotating sleeve and a grinding mechanism, and the electric push rod is fixedly connected to the moving seat; the dust blocking cover is fixedly connected to the end of the electric push rod. The dust treatment pipe is connected and fixedly arranged on the dust blocking cover; the dust extraction transmission mechanism is rotationally connected and arranged in the dust treatment pipe; the rotating sleeve is connected and fixedly arranged on the dust blocking cover; the grinding mechanism is arranged on the rotating sleeve in a sliding fit mode. According to the wall surface polishing device, the technical means of the polishing mechanism is adopted, so that the technical problems in the prior art are effectively solved, polishing ...

High-voltage bidirectional silicon-controlled electrostatic discharge protection device and preparation method thereof

The invention relates to the technical field of semiconductors, and particularly discloses a high-voltage bidirectional silicon-controlled electrostatic discharge protection device and a preparation method thereof, and the protection device comprises a central unit, a first side unit and a second side unit in a P-type epitaxial layer; the central unit comprises a first P well arranged below the N + region, the P + region and the field oxide layer and a first deep P well region surrounding the first P well, and the concentration of the first deep P well region is smaller than that of the first P well; the first side unit comprises an N well and a deep N well region, the deep N well region surrounds the N well, each deep N well region is in contact with the first deep P well region, and the concentration of the deep N well region is smaller than that of the N well; each second side unit comprises a second P well and a second deep P well region surrounding the second P well, each second deep ...

Dynamic automatic scheduling system for finished automobile production planning

The invention provides a finished automobile production planning dynamic automatic scheduling system, comprising three modules, i.e. a final assembly module, a coating operation module and a welding operation module. The three modules respectively complete the production planning and scheduling of a final assembly production line, a coating production line and a welding production line. Through the integrated management of the related production planning of automobile body welding, coating and final assembly workshops, the production planning of an upstream workshop and the production planning of a downstream workshop are unified, the optimizing configuration of manufacturing resources of different workshops can be realized, the inventory of the automobile bodies is reduced, and at the same time, the invention ensures that each workshop can be timely supplied with the required automobile body.

Single-display-shared large-exit-pupil binocular eyepiece optical system

The invention belongs to the technical field of optics. Through refraction and transmission of a spherical lens group coaxially arranged, a binocular eye pupil at an exit pupil position divides outgoing light into a left beam and a right beam in a wavefront-splitting manner, and binocular observation for a shared single display image is achieved. The single-display-shared large-exit-pupil binocular eyepiece optical system to which the invention relates is the lens groups arranged between the display and a diaphragm. The lens group is characterized in that the lens group comprises n spherical lenses which are successively and coaxially arranged, and n is a natural number not less than 3; the display is placed on a front focal plane of the lens group, and the center of the display coincides with an optical axis of the lens group; and the lens group comprises 2n optical surfaces which are (2n) and (2n+1) taking a diaphragm surface (1) as a starting point, and a display surface is (2n+2). The ...

Full system type video demodulation circuit with high-precision multi-window automatic phase control mode

The invention relates to an all-standard video demodulation circuit with a high precision multi-window automatic phase controlling model. One output end of an internal VCO oscillation module (11) is connected with the input end of a frequency divider in an analog single rough adjusting module (12), and another output end of the internal VCO oscillation module (11) is connected with the input end of a counter in a digital AFC adjusting module (13). A third output end of the internal VCO oscillation module (11) is connected with the input end of a multiplier in an analog single fine adjusting module (14). The output end of the multiplier in the analog single fine adjusting module (14), the output end of a logic element calculation in the digital AFC adjusting module (13), and the output endof the multiplier in the analog single rough adjusting module (12) are respectively connected with the input end of a PLL feedback module (15). In the AFC phase process, the demodulation circuit has the ...

Finished automobile production planning dynamic automatic scheduling system

The invention provides a finished automobile production planning dynamic automatic scheduling system, comprising three modules, i.e. a final assembly module, a coating operation module and a welding operation module. The three modules respectively complete the production planning and scheduling of a final assembly production line, a coating production line and a welding production line. Through the integrated management of the related production planning of automobile body welding, coating and final assembly workshops, the production planning of an upstream workshop and the production planning of a downstream workshop are unified, the optimizing configuration of manufacturing resources of different workshops can be realized, the inventory of the automobile bodies is reduced, and at the same time, the invention ensures that each workshop can be timely supplied with the required automobile body.

Ultralow temperature coefficient band-gap reference circuit based on mixed-mode high-order compensation

The invention publishes an ultralow temperature coefficient band-gap reference circuit based on mixed-mode high-order compensation, which comprises a band-gap reference current generating circuit, a feedback control loop, a temperature regulating circuit and an output circuit, wherein the band-gap reference current generating circuit comprises four PMOS (P-channel Metal Oxide Semiconductor) pipes, two NMOS (N-Mental Oxide Semiconductor) pipes, two resistors and two PNP (Plug-and-Play) triodes, the feedback control loop comprises two PMOS pipes, two NMOS pipes and two PNF (Power Noise Filter) triodes, the temperature regulating circuit comprises two NMOS pipes, and the output circuit comprises two PMOS pipes, four resistors and a PNP triode. The circuit has lower temperature coefficient, higher power supply rejection ratio and higher process stability.

Single-chip control circuit of radiofrequency amplifying circuit of C and Ku wave bands of satellite television signals

The invention discloses a single-chip control integrated circuit of a radiofrequency amplifying circuit of C and Ku wave bands of satellite television signals, the control circuit comprises a polarization controller (1), a horizontal polarization control signal (2), a vertical polarization control signal (3), a band-pass filter (4), a comparator (5), a feedback voltage-current source (6), a negative voltage source (7) and a low PSRR LDO (8), wherein an output end of the polarization controller (1) outputs the horizontal polarization control signal (2) and is connected with an input end of a first amplifier (D1), an output end of the polarization controller (1) outputs the vertical polarization control signal (3) and is connected with an input end of a second amplifier (D2), output ends of the first amplifier (D1) and the second amplifier (D2) are merged and are then connected with an input end of a third amplifier (D3), and an output end of the third amplifier (D3) is connected with an ...

Automobile radio circuit having pilot signal suppression

Disclosed is an automobile receiver circuit with pilot signal suppression, which relates to an integrated circuit of a vehicle sound equipment, and mainly relates to an automobile radio circuit, and the circuit comprises: a voltage controlled oscillating module (1), a 19kHz and 38kHz square wave generating module (2), a pilot signal demodulation module (3), an inhibit signal generating module (4)and a differential amplification module (5); wherein, an output end of the voltage controlled oscillating module (1) is connected with an input end of the 19kHz and 38kHz square wave generating module (2), output ends of the 19kHz and 38kHz square wave generating module (2) and the pilot signal demodulation module (3) are respectively connected with an input end of the inhibit signal generating module (4), and an output end of the inhibit signal generating module (4) is connected with an input end of the differential amplification module (5); input ends of the voltage controlled oscillating module ...

Spoke-like vehicle body automatic ordering buffer area and ordering method thereof

The invention relates to a spoke-like vehicle body automatic ordering buffer area and an ordering method thereof; the buffer area comprises eight linear tracks which form a star-shaped spoke and a circular scheduling track which forms a circular rim; the star-shaped spoke is in a symmetric structure, and comprises a primary buffer area and a secondary buffer area which respectively comprises three adjacent linear racks; the other two linear tracks are adjacent to the primary and the secondary buffer areas, and respectively serve as a front scheduling track and a front scheduling track; the eight linear tracks form a transfer area at the cross point of the star shape; the primary and the secondary buffer areas are respectively connected with an inlet track and an outlet track; and the ordering method uses the buffer areas to complete the scheduling and the ordering of a vehicle by determining the ordering a target, encoding and ordering. Compared with a traditional automobile production ...

Automobile radio circuit having pilot signal suppression

Disclosed is an automobile receiver circuit with pilot signal suppression, which relates to an integrated circuit of a vehicle sound equipment, and mainly relates to an automobile radio circuit, and the circuit comprises: a voltage controlled oscillating module (1), a 19kHz and 38kHz square wave generating module (2), a pilot signal demodulation module (3), an inhibit signal generating module (4) and a differential amplification module (5); wherein, an output end of the voltage controlled oscillating module (1) is connected with an input end of the 19kHz and 38kHz square wave generating module (2), output ends of the 19kHz and 38kHz square wave generating module (2) and the pilot signal demodulation module (3) are respectively connected with an input end of the inhibit signal generating module (4), and an output end of the inhibit signal generating module (4) is connected with an input end of the differential amplification module (5); input ends of the voltage controlled oscillating module ...

Technique for preparing thin extensive integrated injection logic using phosphorus-buried technique

The thin epitaxial integrated injection logic manufacturing process using phosphorus burying technology is a process method for manufacturing integrated injection logic (I<2>L) compatible with general thin epitaxial shallow base, the invention carries out an extra phosphorus burying layer injection in front of epitaxial via PWELL design, in order to enhance the concentration of transmission area and greatly improve the performance of I<2>L. The thin epitaxial integrated injection logic manufacturing process using phosphorus burying technology only add once photo-etching and injection, but not the photo-etching design and annealing process. In the invention, material sheet of the I<2>L manufactured by the thin epitaxial integrated injection logic process using phosphorus burying technology is P-type andlt;111andgt; crystallographic direction, resistance rate is 10 to 20 Omega.cm.

Method for forming ash removing water film for wet electric dust remover and dust collecting pole plate used by same

The invention discloses a method for forming an ash removing water film for a wet electric dust remover and a dust collecting pole plate used by the same. The invention solves the problem that a water film for completely covering the pole plate can not be formed on a super-high pole plate higher than 10 meters, thus the wet electric dust remover can be used for removing dust in super-large-flow flue gas such as flue gas in coal burning boilers of thermal power plants and the like, and the invention has the advantages of reducing floor space, saving dust removing water, and the like. The method for forming the ash removing water film comprises the following steps: dividing the dust collecting pole plate into a plurality of vertical strip-shaped regions along the airflow direction, supplying water to the pole plate from the upper space of the dust collecting pole plate, limiting the dust removing water in each narrow strip-shaped region to flow downwards, and covering each small strip-shaped ...

Ultralow temperature coefficient band-gap reference circuit based on mixed-mode high-order compensation

The invention publishes an ultralow temperature coefficient band-gap reference circuit based on mixed-mode high-order compensation, which comprises a band-gap reference current generating circuit, a feedback control loop, a temperature regulating circuit and an output circuit, wherein the band-gap reference current generating circuit comprises four PMOS (P-channel Metal Oxide Semiconductor) pipes, two NMOS (N-Mental Oxide Semiconductor) pipes, two resistors and two PNP (Plug-and-Play) triodes, the feedback control loop comprises two PMOS pipes, two NMOS pipes and two PNF (Power Noise Filter) triodes, the temperature regulating circuit comprises two NMOS pipes, and the output circuit comprises two PMOS pipes, four resistors and a PNP triode. The circuit has lower temperature coefficient, higher power supply rejection ratio and higher process stability.

Method and system for realizing balanced production of whole-automobile general assembly shop

The invention discloses a method and a system for realizing the balanced production of a whole-automobile general assembly shop. The method comprises: (1) a preprocessing step, (2) a classification monitoring and acquisition step, (3) an alarming step and (4) a disturbance factor processing step. The system comprises a shop information interactive terminal (1), a station information acquisition unit (2), an information display terminal (3) and a disturbance processing unit (4). The method and the system are suitable for the automobile general assembly shop using mixed-line production, and canfast and effectively process various disturbance factors during the production of the automobile general assembly shop, improve the capacity of fast recovering the balanced production of a productionsystem of the automobile general assembly shop after a plurality of disturbance factors occur, and find out weak links during the production of the automobile general assembly shop by statistical analysis ...

Double-extension manufacturing technique for double-pole suspending PNP pipe adopting phosphorus-buried technology

Double-extension manufacturing technique for double-pole suspending PNP pipe adopting phosphorus-buried technology

A biepitaxial process of bipolar suspended PNP tube uses phosphorus-embedded technology. The process includes feeding, oxidation, phosphorus-embedded photolithography, etching, phosphorus-embedded injection, phosphorus-embedded annealing, boron-embedded first photolithography, injection, boron-embedded first annealing, first extension, antimony-embedded photolithography, injection, antimony-embedded annealing, boron-embedded second photolithography, injection, boron-embedded annealing, second extension, N-well photolithography, injection, N-well annealing, phosphorus deep diffusion, isolated diffusion, P-, base region injection, P+ injection, P+ annealing, emission region injection, emission region annealing, contact hole photolithography, etching, first aluminum sputtering, dielectric deposition, via-hole photolithography, etching, second aluminum sputtering, point photolithography, etching: forming IC point area. The process can reduce saturated voltage drop of suspended PNP tube, and ...

Single chip integration making technology for enhanced and consumption-up vertical dual diffusion field effect pipe

Effective electrostatic discharge protection circuit

The invention relates to an effective electrostatic discharge protection circuit; electrostatic discharge (ESD) is the most important reliability problem in the current integrated circuits. Along with the development of manufacturing technology of the integrated circuits, characteristic dimension is reduced continuously, the anti-static electricity capacity is weaker, however, under the micro-electronic manufacturing and using environment, the chance that devices suffer from ESD is more, and the effect of the ESD on the integrated circuits is greater, and ESD damage is an attention focus on the new process. The invention starts from the basic starting point, the limit of the traditional simple ESD protective circuit is broken through, and the ESD protective circuit is improved on the structure with the consideration of domain layout and design rules, but the process flows are basically consistent with the regular BICMOS processes, thereby ensuring good ESD protecting capacity of the integrated ...

Single chip integration making technology for enhanced and consumption-up vertical dual diffusion field effect pipe

The utility model relates to a monolithic fabrication technology for the enhanced and depletion VDMOS, belonging to a technology applying for fabricating a enhanced and a depletion VDMOS with a high voltage (650V) common drain in one IC, which is characterized in that the material of the VDMOS adopting a N(100) substrate doped arsenic, which has a resistivity below 0.005 Omega-CM, the thickness of the epitaxy is 55Mum, the resistivity of the epitaxy is 24 Omega-CM. The withstand voltage can be stable on 650V, and up to 700V. To add a depletion VDMOS on the surface of the enhanced VDMOS, the depletion area needs a individual switching voltage adjustment, which is adding once more VT impurity, while adjusting the pre-and post process. The utility model has the advantages of fewer photoetching, low cost and simple fabricating control.

Junction type field effect transistor with super-large resistor and large-volume capacitor and preparation method thereof

The invention relates to a junction type field effect transistor with a super-large resistor and a large-volume capacitor and a preparation method thereof, which is an improved junction type field effect transistor adding a polysilicon resistor with super-large resistance and a large-volume capacitor on the basis of the common junction type field effect transistor. The junction type field effect transistor adopts the structure that the polysilicon resistor with super-large resistance is added between a grid electrode and a source electrode, and the large-volume capacitor is added between the grid electrode and a drain electrode. The common junction type field effect transistor, the improved junction type field effect transistor with the polysilicon resistor with super-large resistance and the improved junction type field effect transistor with the ONO capacitor structure adopt P which is less than 111 and resistivity which is 8 to 13 ohm*cm. The invention has the characteristics of high ...

Technique for preparing thin extensive integrated injection logic using phosphorus-buried technique

The thin epitaxial integrated injection logic manufacturing process using phosphorus burying technology is a process method for manufacturing integrated injection logic (I<2>L) compatible with general thin epitaxial shallow base, the invention carries out an extra phosphorus burying layer injection in front of epitaxial via PWELL design, in order to enhance the concentration of transmission area and greatly improve the performance of I<2>L. The thin epitaxial integrated injection logic manufacturing process using phosphorus burying technology only add once photo-etching and injection, but not the photo-etching design and annealing process. In the invention, material sheet of the I<2>L manufactured by the thin epitaxial integrated injection logic process using phosphorus burying technology is P-type <111> crystallographic direction, resistance rate is 10 to 20 Omega.cm.

Method for forming ash removing water film for wet electric dust remover and dust collecting pole plate used by same

The invention discloses a method for forming an ash removing water film for a wet electric dust remover and a dust collecting pole plate used by the same. The invention solves the problem that a water film for completely covering the pole plate can not be formed on a super-high pole plate higher than 10 meters, thus the wet electric dust remover can be used for removing dust in super-large-flow flue gas such as flue gas in coal burning boilers of thermal power plants and the like, and the invention has the advantages of reducing floor space, saving dust removing water, and the like. The method for forming the ash removing water film comprises the following steps: dividing the dust collecting pole plate into a plurality of vertical strip-shaped regions along the airflow direction, supplying water to the pole plate from the upper space of the dust collecting pole plate, limiting the dust removing water in each narrow strip-shaped region to flow downwards, and covering each small strip-shaped ...

Packaging method used for high-power integrated circuit

The invention discloses a packaging method for a high-power integrated circuit, which adopts a packaging manufacturing process for inserting a metal base into a metal substrate. During the package, the method comprises the following steps: firstly, punching a hole of which size is slightly smaller than the size of the metal base on the metal substrate, and inserting the base into the hole of the substrate; secondly, sintering a chip and the base by soldering paste, and sintering a terminal pin and the substrate by the soldering paste; and bonding the chip and the terminal pin, and finally carrying out pouring molding and packing. In the conventional package process, because the metal base is contacted with an outer radiating fin through the metal substrate, the thermal resistance is large, and the heat dissipation is slow; and by adopting the package process for inserting the metal base into the metal substrate, the metal base is directly contacted with the radiating fin, so the thermal ...

Radio PLL system and carrier wave phase locking method

The invention relates to a radio PLL system and a carrier wave phase locking method. The radio PLL system comprises an oscillator module, a proposed frequency divider, an adjustable frequency divider, a back-stage frequency divider and a phase discriminator, wherein the oscillator module, the proposed frequency divider, the adjustable frequency divider, the back-stage frequency divider and the phase discriminator are connected in sequence; the radio PLL system further comprises a bus controller, a first comparator, a second comparator, a logic control unit and a quasi counter, the bus controller is respectively connected with the proposed frequency divider and the adjustable frequency divider, the input end of the phase discriminator is connected with the output end of the back-stage frequency divider, the output end of the phase discriminator is respectively connected with the input end of the logic control unit, the output end of the logic control unit is respectively connected with the ...

Structure of overlapping capacitors in semiconductor manufacture process

The invention relates to a structure of an overlapping capacitor in a semiconductor manufacture process, which is an overlapping capacitor manufacture technology compatible with a bipolar complementary metal oxide semiconductor (BiCMOS) process and a complementary metal oxide semiconductor (CMOS) process. A capacitor the unit-area capacitance Cox of which reaches a high capacitance value of 4.1ff/um<2> is provided in the CMOS process, and BV is higher than 12V, and additional processes are not needed. Under the circumstance of not adding any processing step, the unit-area capacitance value Cox of an overlapped capacitor is increased to 4.1 ff/um<2> from 2.5 ff/um<2> of typical polyl1/Nw or poly1/diff in the manner of overlapping a layer of ONO capacitor on a poly1/Nw or poly1/diff capacitor, i.e. the unit-area capacitance value is increased by 64 percent, thereby greatly increasing the integration level of the capacitor; moreover, the overlapping capacitor manufacture technology is compatible ...

Vehicle body soldering, and drop forging shop work integration control system

The invention discloses an integrated control system of welding of car body and punching workshop operation; a welding material controller is connected with a welding upper and lower line recognizer so that the upper and lower line car body information of the welding production line is received; subsequently, the material decomposition is carried out according to the process material list corresponding to the car body; the material information required by welding production is generated; relevant information is sent to a material delivery electronic kanban; the welding material controller also sends the welding workpiece require plan to a punching operation scheduler; the data of the punching storage database is updated; the punching operation scheduler obtains the welding workpiece require plan from the welding material controller, obtains the punching part storage quantity from the punching storage database, carries out the scheduling control to the punching operation according to the ...

Antistatic protection circuit

The invention discloses an antistatic protection circuit. The circuit is divided into three parts, wherein the first part comprises a resistor and capacitor coupling circuit which is formed by connecting a resistor with a capacitor in series, the second part comprises a CMOS phase inverter which is formed by connecting a PMOS tube with an NMOS tube in series, the third part comprises a main discharge tube which is an NMOS tube of a multi-finger-strip structure, and the three parts are connected between a power supply VDD and a ground VSS and then connected with one another through connecting wires. According to the antistatic protection circuit, the time for response of the antistatic protection circuit to ESD pulses is shortened, components in the integrated circuit are effectively protected, and the antistatic capacity and the reliability of the circuit are improved.