Method for manufacturing circuit board with high light reflectivity

A method for manufacturing a circuit board is disclosed. An inner wiring base board with a first opening is provided. A base board is fixed in the first opening, and a first wiring base board and a second wiring base board are pressed on opposite surfaces of the inner wiring base board. The base board is made of ceramic and has a high light reflectivity of 92% to 97%. A first conductor layer and a second conductor layer are formed on opposite surfaces of the laminated structure. The first conductor layer includes a plurality of connecting pads on the base board. A solder mask is formed on an outer side of the first conductor layer, the solder mask has a high light reflectivity of 92% to 95%, and the base board is exposed outside the solder mask.

Embedded circuit board and manufacturing method thereof

An embedded circuit board made without gas bubbles or significant internal gaps according to a manufacturing method which is here disclosed comprises an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces, a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

Embedded circuit board and method of making same

An embedded circuit board includes a flexible printed circuit board, a component, a conductive material, two adhesive layers, and two substrates. The flexible printed circuit board defines at least one cavity passing through the flexible printed circuit board. The flexible printed circuit board includes a base layer, a first conductive circuit layer formed on at least one surface of the base layer, and a protective layer formed on both sides of the base layer. The base layer and the first conductive circuit layer protrude into the cavity. The component is received within the cavity and abuts against the first conductive circuit layer protruding into the cavity. The conductive material is applied in a gap between the component and the first conductive circuit layer. The two substrates are adhered to the flexible printed circuit board by the two adhesive layers.

Multi-sided light-emitting circuit board and manufacturing method thereof

The present invention relates to a multi-sided light-emitting circuit board, which includes: a transparent substrate layer and a first conductive circuit layer on at least one surface of the transparent substrate layer. The first conductive circuit layer includes conductive portions arranged at intervals. A metal piece is formed on a surface of each conductive portion away from the transparent substrate layer. An accommodation space is formed between adjacent metal pieces. The accommodation space is provided with a light-emitting chip. Each light-emitting chip includes two electrodes. The two electrodes are respectively located at opposite ends of the light-emitting chip. The electrodes are respectively electrically connected to adjacent metal pieces. An encapsulant layer is formed on a surface of the first conductive circuit layer. The encapsulant layer covers and encapsulates the metal pieces and the light-emitting chips. The invention also relates to a method for manufacturing a multi-faceted light-emitting circuit board.

Circuit board and method for making the same

A circuit board film-plated against corrosion of conductive traces comprises a substrate, at least one conductive circuit layer attached to the substrate, at least one plating film attached to a surface of the conductive circuit layer away from the substrate, and a covering film. Each of the at least one plating film comprises a surface away from the conductive circuit layer, and at least one side surface. The circuit board defines at least one through hole. Each of the at least one through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surface of the plating film, and the through hole. The film-covered conductive circuit layer and the film-covered side surface of the plating film cannot be corroded. A method for making the circuit board is also provided.

Circuit board, method for manufacturing the same, and backlight

A circuit board (100) includes an insulating base layer (11), a first conductive circuit layer (40) disposed on the base layer (11); a solder mask layer (60) covering the first conductive circuit layer (40) away from the base layer (11), wherein the solder mask layer (60) defines a slot (601), the slot (601) exposes a portion of the first conductive circuit layer (40), the solder mask layer (60) includes a sidewall (602) at the slot (601); and a cover film (70) covering the solder mask layer (60), wherein the cover film (70) defines an opening (701), the opening (701) corresponds to the slot (601) and exposes the solder pad (7401), the cover film (70) includes a covering portion (74) and a side reflecting portion (75), the covering portion (74) is disposed on the solder mask layer (60), the side reflecting portion (75) is connected to the covering portion (74) and covers the sidewall (602).

Rigid-flex printed circuit board and method for making same

An RFPCB includes a reinforcement layer and at least two FPCBs spliced together to match the reinforcement layer in shape and size. The FPCBs are adhered onto the reinforcement layer. The reinforcement layer includes circuits connected with the FPCB and has portions removed to obtain a desired flexibility.

Flexible printed circuit board, method for manufacturing the same and loudspeaker with the same

A flexible printed circuit board used in a loudspeaker as a dome and a holder supporting the dome has a top surface and a bottom surface opposite to the top surface. The flexible printed circuit board comprises a dome portion and a supporting portion surrounding the dome portion. The dome portion is formed by the top surface being depressed from the top surface to the bottom surface and the bottom surface projecting from the top surface to the bottom surface; and a supporting portion surrounds the dome portion.

Method for manufacturing an ultrathin heat dissipation structure

A method for manufacturing the ultrathin heat dissipation structure includes providing a copper clad sheet, the copper clad sheet comprising an insulation layer and a copper clad layer; stamping the copper clad sheet to form a plurality of containing grooves and a plurality of ribs around each of the plurality of containing grooves, the cooper clad layer is used as an inner surface of the containing groove and the insulation layer is then an outer surface of the containing groove; providing bond blocks on each of the plurality of ribs; infilling phase-change material into the containing grooves of the copper clad sheet; providing a cover, pressing the cover to the bond blocks, the cover is fixed with the copper clad sheet by the bond blocks, the cover seals the containing grooves, and the phase-change material is received in the containing grooves; and solidifying the bond blocks.

Circuit board with high light reflectivity and method for manufacturing the same

A circuit board with high light reflectivity includes an inner wiring base board, a base board with a high light reflectivity, a first insulation layer, a first conductor layer, and a second insulation layer. A first opening in the inner wiring base board receives the base board. The first insulation layer is stacked on a surface of the inner wiring base board and defines a second opening corresponding in position to the first opening and exposing a portion of the base board. The first conductor layer is on a surface of the first insulation layer away from the inner wiring base board and includes connecting pads on the base board. The second insulation layer and the second conductor are stacked in that order on another surface of the inner wiring base board. A method for manufacturing the circuit board is also disclosed.

Method of making a rigid/flex circuit board

Manufacturing a rigid-flex circuit board includes providing an inner flexible circuit board and a first flexible metal clad laminate, laminating the first flexible metal clad laminate on a surface of the inner flexible circuit board through a first adhesive film, causing the first copper layer to form a third conductive circuit layer, partially covering the metal protective layer exposed by the third conductive circuit layer, removing the metal protective layer exposed by the third conductive circuit layer and the covered area, providing a second copper foil, laminating the second copper foil on a surface of the third conductive circuit layer through a second adhesive film, removing the metal protective layer at the opening area, and causing the second copper foil to form a fifth conductive circuit layer. The first flexible metal clad laminate includes a second base material layer, a metal protective layer, and a first copper layer.

Flexible printed circuit board

A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed on the flexible base. The working trace is formed by a number of working traces. In the flexible base, the at least one reinforcement trace is disposed at a periphery of the working trace region.

Method for making circuit board

A circuit board film-plated against corrosion of conductive traces comprises a substrate, a conductive circuit layer attached to the substrate, a plating film attached to outer surface of the conductive circuit layer, and a covering film. Each plating film comprises a top outer surface and a side surface. The circuit board defines at least one through hole. Each through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surfaces, and the through holes. The conductive circuit layer and the side surfaces of the plating films are sealed against the atmosphere and cannot be corroded. A method for making the circuit board is also provided.

Flexible printed circuit board, method for manufacturing the same and loudspeaker with the same

A method for manufacturing a flexible printed circuit board comprising: providing a first flexible precursor board having a layer; adhering a first covering layer with a lower opening, a portion of the circuit layer exposed; adhering a second covering layer with an upper opening to the first covering layer, the upper opening being formed in the lower opening, and a portion of circuit layer being exposed to obtain a second flexible precursor board; providing an upper mound having a protruding portion and a lower mound having a recessed portion, moving the second flexible precursor board between the upper mound and the lower mound, the upper opening being positioned away from the protruding portion and the recessed portion, pressing the upper mound to the lower mound to press the protruding portion into the recessed portion; removing the upper mound and the lower mound to get the flexible printed circuit board.

METHOD AND SYSTEM FOR DETECTING MASS OF OIL IN INORGANIC MINERAL OF SHALE

A system is provided for detecting the mass of oil in an inorganic mineral of shale. The system operates by performing an extraction test on a first shale sample by using chloroform to obtain a total content of shale oil in the shale; enriching kerogen from the second shale sample to obtain dry kerogen; and performing an extraction test on oven-dried kerogen by using chloroform to determine the mass of extracted kerogen. The system also operates by determining the mass of the oil in the organic matter of the shale sample and the mass of the oil in an inorganic mineral of the shale; establishing a model for predicting a ratio of the mass of the oil in the inorganic mineral of the shale to the mass of the oil in the organic matter; and using the prediction model to determine the mass of oil in an inorganic mineral. 1. A method for detecting a mass of oil in an inorganic mineral of shale , comprising:obtaining a shale sample and determining a parameter of the shale sample;dividing the shale sample into a first shale sample and a second shale sample, and performing an extraction test on the first shale sample by using chloroform to obtain a total content of shale oil in the shale;enriching kerogen from the second shale sample to obtain dry kerogen;oven-drying the dry kerogen to obtain oven-dried kerogen and determining the mass of the oven-dried kerogen;performing an extraction test on the oven-dried kerogen by using chloroform and determining a mass of extracted kerogen;determining a difference between the mass of the oven-dried kerogen and the mass of the extracted kerogen as the mass of oil in an organic matter;multiplying a ratio of the mass of the oil in the organic matter to the mass of the second shale sample by 100 to obtain the mass of the oil in the organic matter of the shale sample;subtracting the mass of the oil in the organic matter of the shale sample from the total content of the shale oil in the shale to obtain the mass of the oil in the inorganic ...

Ultrathin heat dissipation structure

An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.

Method and system for detecting mass of oil in inorganic mineral of shale

A system is provided for detecting the mass of oil in an inorganic mineral of shale. The system operates by performing an extraction test on a first shale sample by using chloroform to obtain a total content of shale oil in the shale; enriching kerogen from the second shale sample to obtain dry kerogen; and performing an extraction test on oven-dried kerogen by using chloroform to determine the mass of extracted kerogen. The system also operates by determining the mass of the oil in the organic matter of the shale sample and the mass of the oil in an inorganic mineral of the shale; establishing a model for predicting a ratio of the mass of the oil in the inorganic mineral of the shale to the mass of the oil in the organic matter; and using the prediction model to determine the mass of oil in an inorganic mineral.

EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

Flexible printed circuit board, method for manufacturing the same and loudspeaker with the same

A flexible printed circuit board used in a loudspeaker as a dome and a holder supporting the dome has a top surface and a bottom surface opposite to the top surface. The flexible printed circuit board comprises a dome portion and a supporting portion surrounding the dome portion. The dome portion is formed by the top surface being depressed from the top surface to the bottom surface and the bottom surface projecting from the top surface to the bottom surface; and a supporting portion surrounds the dome portion.

RIGID-FLEX PRINTED CIRCUIT BOARD AND METHOD FOR MAKING SAME

An RFPCB includes a reinforcement layer and at least two FPCBs spliced together to match the reinforcement layer in shape and size. The FPCBs are adhered onto the reinforcement layer. The reinforcement layer includes circuits connected with the FPCB and has portions removed to obtain a desired flexibility. 1. A method for making a rigid-flex printed circuit board (RFPCB) , the method comprising:providing a first FPCB, the first FPCB defining a plurality of cutouts at one side thereof and comprising a first FPCB unit;providing a second FPCB, the second FPCB comprising a plurality of protrusions corresponding to the cutouts at one side thereof and comprising a second FPPCB unit;splicing the second FPCB with the first FPCB by engagement between the cutouts and the protrusions to obtain a third FPCB;providing a reinforcement layer, the reinforcement layer having a shape and size matching with the third FPCB, the reinforcement layer comprising a copper foil and an adhesive layer;thermally pressing the third FPCB onto the reinforcement layer, with the adhesive layer bonding the copper foil to the third FPCB to obtain a first semifinished board;forming a first circuit pattern corresponding to the first FPCB unit and a second circuit pattern corresponding to the second FPCB from the copper foil and connecting the first circuit pattern and the first FPCB unit, and connecting the second circuit pattern and the second FPCB unit in desired manner to obtain a second semifinished board, and;removing desired parts of the reinforcement layer to expose corresponding parts of the first FPCB unit and the second FPCB unit, thus to obtain the RFPCB.2. The method of claim 1 , wherein each of the cutouts is circular and a central angle of each of the cutouts is larger than about 180 degrees.3. The method of claim 2 , wherein each of the protrusions is circular and a central angle of each of the protrusions is substantially equal to the central angle of each of the cutouts.4. The method of ...

METHOD FOR MAKING CIRCUIT BOARD

A circuit board film-plated against corrosion of conductive traces comprises a substrate, a conductive circuit layer attached to the substrate, a plating film attached to outer surface of the conductive circuit layer, and a covering film. Each plating film comprises a top outer surface and a side surface. The circuit board defines at least one through hole. Each through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surfaces, and the through holes. The conductive circuit layer and the side surfaces of the plating films are sealed against the atmosphere and cannot be corroded. A method for making the circuit board is also provided. 1. A method for making a circuit board comprising:providing a copper clad laminate, the copper clad laminate comprises a substrate and at least one copper layer, the substrate comprises at least one first surface, each of the at least one copper layer is attached to one of the at least one first surface;etching the at least one copper layer to form at least one conductive circuit layer, a portion of each of the at least one first surface is exposed through one of the at least one conductive circuit layer, each of the at least one conductive circuit layer comprises a second surface away from the substrate;forming a dry film pattern layer, the dry film pattern layer covers the exposed portion of each of the at least one first surface, and a portion of the second surface, the other portion of the second surface not being covered by the dry film pattern layer is an exposing area;forming at least two plating films on the exposing area, each of the at least two plating films comprises a third surface away from the second surface and at least one side surface connecting the second surface and the third surface;removing the dry film pattern layer;forming at least one through hole to form an intermediate product, each of the at least one through hole is ...

Rigid-flex circuit board and method for making same

Manufacturing a rigid-flex circuit board includes providing an inner flexible circuit board and a first flexible metal clad laminate, laminating the first flexible metal clad laminate on a surface of the inner flexible circuit board through a first adhesive film, causing the first copper layer to form a third conductive circuit layer, partially covering the metal protective layer exposed by the third conductive circuit layer, removing the metal protective layer exposed by the third conductive circuit layer and the covered area, providing a second copper foil, laminating the second copper foil on a surface of the third conductive circuit layer through a second adhesive film, removing the metal protective layer at the opening area, and causing the second copper foil to form a fifth conductive circuit layer. The first flexible metal clad laminate includes a second base material layer, a metal protective layer, and a first copper layer.

METHOD AND SYSTEM FOR 360-DEGREE VIDEO PLAYBACK

The disclosure proposes a method and a system for 360-degree video playback. The method is applicable to a video playback system and includes at least the following steps. A current frame of a 360-degree video having a sequence of frames is received. Candidate objects in the current frame are detected, and a main object is selected from the candidate objects by using a selector recurrent neural network (RNN) model based on information of the candidate objects in the current frame. A viewing angle corresponding to the current frame is computed by using a regressor RNN model based on the main object in the current frame. The current frame is displayed on the screen according to the viewing angle. 1. A method for 360-degree video playback , applicable to a video playback system having a screen , comprising:receiving a current frame of a 360-degree video having a sequence of frames;detecting a plurality of candidate objects in the current frame;selecting a main object from the candidate objects by using a selector recurrent neural network (RNN) model based on information of the candidate objects in the current frame;computing a viewing angle corresponding to the current frame by using a regressor RNN model based on the main object in the current frame;displaying the current frame on the screen according to the viewing angle.2. The method according to claim 1 , wherein the step of detecting the candidate objects in the current video frame comprises:detecting a plurality of foreground objects in the current video frame; andsetting the foreground objects as the candidate objects.3. The method according to claim 1 , wherein the information of each of the candidate objects comprises an appearance feature claim 1 , a motion feature claim 1 , and a position of each of the candidate objects.4. The method according to claim 3 , wherein the step of selecting the main object from the candidate objects by using the selector RNN model based on the candidate objects in the current ...

FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME AND LOUDSPEAKER WITH THE SAME

A method for manufacturing a flexible printed circuit board comprising: providing a first flexible precursor board having a layer; adhering a first covering layer with a lower opening, a portion of the circuit layer exposed; adhering a second covering layer with an upper opening to the first covering layer, the upper opening being formed in the lower opening, and a portion of circuit layer being exposed to obtain a second flexible precursor board; providing an upper mound having a protruding portion and a lower mound having a recessed portion, moving the second flexible precursor board between the upper mound and the lower mound, the upper opening being positioned away from the protruding portion and the recessed portion, pressing the upper mound to the lower mound to press the protruding portion into the recessed portion; removing the upper mound and the lower mound to get the flexible printed circuit board. 1. A method for manufacturing a flexible printed circuit board , the method comprising:providing a first flexible precursor board having at least one circuit layer;adhering a first covering layer with a lower opening to the circuit layer, a portion of the circuit layer exposed by the lower opening;adhering a second covering layer with an upper opening to the first covering layer, the upper opening being formed in the lower opening, and a portion of circuit layer being exposed by the upper opening to obtain a second flexible precursor board;providing an upper mold having a protruding portion and a lower mold having a recessed portion, moving the second flexible precursor board between the upper mold and the lower mold, a portion of the second flexible precursor board being positioned between the protruding portion and the recessed portion, a periphery of the second flexible precursor board being positioned away from the protruding portion and the recessed portion, the upper opening being positioned away from the protruding portion and the recessed portion, ...

ULTRATHIN HEAT DISSIPATION STRUCTURE AND A METHOD FOR MANUFACTURING SAME

An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components. 1. An ultrathin heat dissipation structure comprising:a copper clad sheet comprising a plurality of containing grooves and a plurality of ribs round each containing groove, the containing groove is formed by stamping, the copper clad sheet comprising an insulation layer and a copper clad layer attached on the insulation layer, the copper clad layer is an inner surface of the containing grooves;a plurality of bond blocks arranging on the ribs;a cover being fixed on the copper clad sheet with the containing groove using the bond blocks, the cover sealing the containing grooves to form a plurality of a sealed cavities; anda phase-change material being received in the sealed cavity gathering and transferring out heat generated by components.2. The ultrathin heat dissipation structure of claim 1 , wherein an inner surface of each containing groove comprises micro-structures.3. The ultrathin heat dissipation structure of claim 2 , wherein each containing groove comprising a bottom wall and a side wall around the bottom wall claim 2 , and the bottom wall is substantially flat claim 2 , an angle between the side wall and the bottom wall is about 90°<α<180° claim 2 , a thickness of the side wall is thin than that of the bottom wall.4. The ultrathin heat dissipation structure of claim 1 , wherein the ...

METHOD FOR MANUFACTURING AN ULTRATHIN HEAT DISSIPATION STRUCTURE

A method for manufacturing the ultrathin heat dissipation structure includes providing a copper clad sheet, the copper clad sheet comprising an insulation layer and a copper clad layer; stamping the copper clad sheet to form a plurality of containing grooves and a plurality of ribs around each of the plurality of containing grooves, the cooper clad layer is used as an inner surface of the containing groove and the insulation layer is then an outer surface of the containing groove; providing bond blocks on each of the plurality of ribs; infilling phase-change material into the containing grooves of the copper clad sheet; providing a cover, pressing the cover to the bond blocks, the cover is fixed with the copper clad sheet by the bond blocks, the cover seals the containing grooves, and the phase-change material is received in the containing grooves; and solidifying the bond blocks. 1. A method for manufacturing the ultrathin heat dissipation structure , the method comprising:providing a copper clad sheet, the copper clad sheet comprising an insulation layer and a copper clad layer attached on the insulation layer;stamping the copper clad sheet to form a plurality of containing grooves and a plurality of ribs around each of the plurality of containing grooves, and wherein the cooper clad layer provides as an inner surface of the containing groove and the insulation layer is then an outer surface of the containing groove, wherein the copper clad layer has a same surface area as a surface area of the insulation layer, and a cross-section shape of the inner surface of each containing groove is same as a cross-section shape of the outer surface of each containing groove;providing bond blocks on each of the plurality of ribs;infilling phase-change material into the containing grooves of the copper clad sheet;providing a cover, pressing the cover to the bond blocks, wherein the cover is fixed with the copper clad sheet by the bond blocks, the cover seals the containing ...

Battery assembly, battery module, and method for manufacturing the same

A battery assembly includes a circuit board and a battery cell. The circuit board includes a first dielectric layer, a second dielectric layer, an adhesive film, a bus bar, a first copper block, a fuse, and a second copper block. The adhesive film is located between the first dielectric layer and the second dielectric layer and includes cavities. The first copper block and the bus bar are on the first dielectric layer. The second copper block and the fuse are on the second dielectric layer. The circuit board is divided into heat dissipation areas and bending areas which are connected and alternately arranged, the heat dissipation areas and the bending areas enclose a holding groove. The bus bar and the first block copper are accommodated in the holding groove. The battery cell is accommodated in the holding groove. A battery module and a manufacturing method are also disclosed.

Method for manufacturing circuit board with high light reflectivity

A method for manufacturing a circuit board is disclosed. An inner wiring base board with a first opening is provided. A base board is fixed in the first opening, and a first wiring base board and a second wiring base board are pressed on opposite surfaces of the inner wiring base board. The base board is made of ceramic and has a high light reflectivity of 92% to 97%. A first conductor layer and a second conductor layer are formed on opposite surfaces of the laminated structure. The first conductor layer includes a plurality of connecting pads on the base board. A solder mask is formed on an outer side of the first conductor layer, the solder mask has a high light reflectivity of 92% to 95%, and the base board is exposed outside the solder mask.

Embedded circuit board and manufacturing method thereof

An embedded circuit board made without gas bubbles or significant internal gaps according to a manufacturing method which is here disclosed comprises an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces, a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

Flexible printed circuit board

A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed on the flexible base. The working trace is formed by a number of working traces. In the flexible base, the at least one reinforcement trace is disposed at a periphery of the working trace region.

Flexible printed circuit board

Camera module having optical image stabilization function, and preparation method therefor

A camera module having OIS function and its preparation method are provided. The camera module includes a housing and an optical assembly in the housing, and further includes a circuit board in the housing. The circuit board includes a first board and a second board on the first board. The first board is flexible. The first board includes a first portion, a second portion, and a third portion successively connected in an extending direction of the first board. The second portion defines a slot. The second board is on the third portion. The optical assembly is on the second board. The first portion includes a fixed end connecting the second portion and an opposite free end. The housing defines a through hole. The first portion extends through the slot to form a bent portion and extends out of the through hole, such that the free end is outside the housing.

Image reconstructing method and image generation training method

An image reconstructing method for generating an output image according to an input image and a target EV is disclosed. The image reconstructing method comprises: (a) extracting at least one first feature map of the input image; (b) synthesizing at least one second feature map with the target EV to generate at least one third feature map; (c) performing affine brightness transformation to the third feature map to generate fourth feature maps; and (d) synthesizing the input image with the fourth feature maps to generate the output image. An image generation training method with a cycle training is also disclosed.

Mehrfach verwendbares schreibgeraet.

一种自动焊接用电池片托盘

本实用新型涉及焊接辅助设备技术领域，尤其是一种自动焊接用电池片托盘，包括托盘本体，托盘本体下表面具有向下凸起的底置功能调节盒，托盘本体内底面上开设有与底置功能调节盒内部相连通的条形平移槽，托盘本体内底面位于平移槽右侧面上开设有复数个与平移槽相连通的条形限位槽。本实用新型的一种自动焊接用电池片托盘通过在底部设置具有内部连接轴的底置功能调节盒，利用内部连接轴上的平移套板和翻转限位板对托盘本体上端的电池片进行位置固定和限定，使得电池片的稳定性大大提升。

Circuit board, method for manufacturing the same, and backlight

A circuit board (100) includes an insulating base layer (11), a first conductive circuit layer (40) disposed on the base layer (11); a solder mask layer (60) covering the first conductive circuit layer (40) away from the base layer (11), wherein the solder mask layer (60) defines a slot (601), the slot (601) exposes a portion of the first conductive circuit layer (40), the solder mask layer (60) includes a sidewall (602) at the slot (601); and a cover film (70) covering the solder mask layer (60), wherein the cover film (70) defines an opening (701), the opening (701) corresponds to the slot (601) and exposes the solder pad (7401), the cover film (70) includes a covering portion (74) and a side reflecting portion (75), the covering portion (74) is disposed on the solder mask layer (60), the side reflecting portion (75) is connected to the covering portion (74) and covers the sidewall (602).

Information display method and apparatus, computer device and storage medium

An information display method and apparatus, a computer device and a storage medium are provided. The method includes: receiving search information, the search information corresponding to a structured requirement for a search result; acquiring a plurality of target multimedia contents matching the search information, the target multimedia content including an image content and/or a video content; determining a display mode of the target multimedia content in a search result aggregation card according to an event attribute feature corresponding to the search information, the event attribute feature referring to a structured feature of an event matching the search information; and displaying the search result aggregation card corresponding to the search information according to the display mode determined.