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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 9. Отображено 8.
02-01-2020 дата публикации

Electronic Device Having a Composite Structure

Номер: US20200007670A1
Автор: Abhijeet Misra, Ian A. Spraggs, Marwan Rammah, Steven J. Osborne, William A. Counts
Принадлежит: Apple Inc

Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

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Номер записи: 1
24-01-2019 дата публикации

TECHNIQUES FOR JOINING ONE OR MORE STRUCTURES OF AN ELECTRONIC DEVICE

Номер: US20190025874A1
Автор: Corriveau Eric T., Ewing Tyler J., Garelli Adam T., Giddings Joss N., LEGGETT William F., MONTPLAISIR Sarah J., Osborne Steven J.
Принадлежит:

Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region. 1. A method for forming an electronic device having an enclosure comprising a first part and a second part rotatably coupled with the first part , the second part comprising a magnet , the method comprising:engaging an attachment feature with a bonding tool configured to bond the attachment feature with the first part; andactuating the attachment feature via the bonding tool that causes a solder material disposed between the attachment feature and the first part to melt and bond the attachment feature with the first part.2. The method of claim 1 , wherein in a closed configuration between the first part and the second part claim 1 , the attachment feature magnetically couples with the magnet to define a magnetic circuit claim 1 , and the first part is separated from the second part by a gap that is based upon the magnetic circuit.3. The method of claim 1 , further comprising co-planarizing the attachment feature and the enclosure.4. The method of claim 1 , wherein the solder material is disposed in a channel of the enclosure and wherein ...

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Номер записи: 2
22-03-2018 дата публикации

Electronic Device Having a Composite Structure

Номер: US20180084653A1
Автор: Abhijeet Misra, Ian A. Spraggs, Marwan Rammah, Steven J. Osborne, William A. Counts
Принадлежит: Apple Inc

Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

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Номер записи: 3
26-03-2020 дата публикации

SPARSE LASER ETCH ANODIZED SURFACE FOR COSMETIC GROUNDING

Номер: US20200100349A1
Автор: Farrell Lauren M., Gentile Rhett D., Jeziorek Peter N., Osborne Steven J., Venkatesh Sunita
Принадлежит:

A aesthetically appealing mounting system for an electronic device capable of forming a semi-conductive path for electro-static discharge. The mounting system can include an electrically conductive layer covered by a cosmetic anodized layer with multiple micro-perforations formed through the anodized layer exposing a small portion of the electrically conductive layer. The micro-perforations can be formed by laser-etching the cosmetic anodized layer to provide a grounding path while the micro-perforations remain visually undetectable. A semi-conductive wear layer can be configured to couple with the anodized layer. In some embodiments, the semi-conductive wear layer is in a recess on an electronic device. In some embodiments, the semi-conductive wear layer is comprised of a conformal conductive rubber. 1. A mounting system for an electronic device , the mounting system comprising:an electrically conductive layer;an anodized layer formed over the electrically conductive layer in a mounting region;a plurality of micro-perforations formed through the anodized layer in the mounting region exposing the electrically conductive layer; andone or more connection components configured to attach and secure a second electronic device to the mounting region.2. The mounting system of wherein the plurality of micro-perforations provide a path for discharging a flow of static electricity through the mounting region when the second electronic device is attached to the mounting region by the one or more connection components.3. The mounting system of wherein the one or more connection components includes a plurality of magnets configured to facilitate alignment of the second electronic device to the mounting region.4. The mounting system of wherein the one or more connection components includes a plurality of latches disposed around the mounting region.5. The mounting system of wherein the plurality of micro-perforations are formed through the anodized layer at a non-perpendicular ...

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Номер записи: 4
18-07-2019 дата публикации

FASTENERS UTILIZED WITHIN AN ENCLOSURE FOR AN ELECTRONIC DEVICE

Номер: US20190220065A1
Автор: Bir Karan, Deol Gurshan, DIFONZO John C., Habboub Kamal H., Hendren Keith J., Johnston Kent, LANCASTER-LAROCQUE SIMON REGIS LOUIS, LIGTENBERG Christiaan A., Maloney Michael, Osborne Steven J.
Принадлежит:

This application relates to hidden fasteners within an electronic device. An electronic device can include a top portion and a base portion that includes a housing and a cover attached to the housing by at least one fastener that is not visible through an external surface of the cover. Each fastener includes a receiver housing that retrains spherical components and a pin that can be inserted into an opening in the receiver housing. The pin is retained in the receiver housing by a force imparted against a surface of the pin by the spherical components, which are biased towards an inner surface of the receiver housing sloped towards the opening. The pin can be released when an external magnetic field from a magnet placed proximate the bottom surface of the receiver housing retracts the spherical components away from the opening, thereby reducing the force against the surface of the pin. 1. A portable electronic device , comprising:a top portion;a base portion attached to the top portion via a hinge, the base portion comprising a keyboard and housing that includes a cavity formed therein, the cavity covered by the keyboard;operational components disposed in the cavity and attached to the housing; and a receiver housing having a surface that includes an opening,', 'spherical components enclosed within the receiver housing,', 'a biasing module that biases the spherical components toward the; and', 'a pin configured to be inserted into the opening such that the spherical components are in contact with the pin and an inner surface of the receiver housing that is sloped toward the opening., 'a cover secured to the housing via a fastener to enclose the cavity, the fastener comprising2. The portable electronic device of claim 1 , wherein the opening in the surface of the receiver housing is chamfered.3. The portable electronic device of claim 1 , wherein the fastener is enclosed within the cavity when the cover is attached to the housing and not visible through an external ...

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Номер записи: 5
03-09-2015 дата публикации

COLD SPRAY OF STAINLESS STEEL

Номер: US20150248958A1
Автор: Garelli Adam T., Hamel Bradley J., LANCASTER-LAROCQUE SIMON REGIS LOUIS, Osborne Steven J.
Принадлежит:

The described embodiments relate generally to methods to form magnetic assemblies. In particular, extreme cold work (aka cold spray) is used to enhance magnetic properties of a steel alloy (most notably 316L stainless steel and others) that can then be formed into useful shapes and embedded within a substrate without undue machining operations. 120-. (canceled)21. A method for forming a magnetic assembly within a substrate formed of a first non-magnetic material , comprising:forming a magnetic shunt using a first solid state deposition by depositing a layer of a ferromagnetic material within a recess located at a first surface of the substrate;placing a magnet that provides a magnetic field into the recess in relation to the magnetic shunt such that the magnetic shunt redirects the magnetic field in a desired direction; andenclosing the magnet and the magnetic shunt within the substrate using a second solid state deposition that fills in a remaining portion of the recess with a second non-magnetic material.22. The method of claim 21 , wherein the second non-magnetic material is operated upon subsequent to the enclosing the magnet and the magnetic shunt to form a second surface co-planar with respect to the first surface of the substrate.23. The method of claim 22 , wherein the substrate comprises aluminum claim 22 , and wherein the second solid state deposition comprises aluminum.24. The method of claim 23 , wherein the first surface of the substrate combines with the second surface to define an appearance of continuity such that the second surface is substantially indistinguishable from the first surface.25. The method of claim 21 , wherein the first solid state deposition comprises particles selected from a group consisting of stainless steel and iron.26. The method of claim 21 , wherein when the first non-magnetic material and the second non-magnetic material are anodizable claim 21 , further comprises anodizing the substrate.27. The method of claim 26 , wherein ...

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Номер записи: 6
24-11-2016 дата публикации

TECHNIQUES FOR JOINING ONE OR MORE STRUCTURES OF AN ELECTRONIC DEVICE

Номер: US20160342179A1
Автор: Corriveau Eric T., Ewing Tyler J., Garelli Adam T., Giddings Joss N., LEGGETT William F., MONTPLAISIR Sarah J., Osborne Steven J.
Принадлежит:

Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region. 1. A method for forming an electronic device having an enclosure comprising a first part and a second part rotatably coupled with the first part , the second part comprising a magnet , the method comprising:engaging an attachment feature with a bonding tool configured to bond the attachment feature with the first part; andactuating the attachment feature via the bonding tool that causes a solder material disposed between the attachment feature and the first part to melt and bond the attachment feature with the first part.2. The method of claim 1 , wherein in a closed configuration between the first part and the second part claim 1 , the attachment feature magnetically couples with the magnet to define a magnetic circuit claim 1 , and the first part is separated from the second part by a gap that is based upon the magnetic circuit.3. The method of claim 1 , further comprising co-planarizing the attachment feature and the enclosure.4. The method of claim 1 , wherein the solder material is disposed in a channel of the enclosure and wherein ...

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Номер записи: 7
16-08-2022 дата публикации

Electronic device having a composite structure

Номер: US11418638B2
Автор: Abhijeet Misra, Ian A. Spraggs, Marwan Rammah, Steven J. Osborne, William A. Counts
Принадлежит: Apple Inc

Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

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Номер записи: 8