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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 12. Отображено 11.
10-02-2022 дата публикации

HOLOGRAPHIC ANTENNA AND HOLOGRAPHIC ANTENNA ARRANGEMENT

Номер: US20220045436A1
Автор: Ott Arndt Thomas
Принадлежит: Sony Group Corporation

A holographic antenna comprises an optically transparent substrate; a hologram arranged on a first surface of the substrate, the hologram comprising two or more hologram stripes, each having a plurality of linearly arranged hologram pixels, each comprising a switching component; a ground plane arranged on a second surface, opposite the first surface, of the substrate; one or more surface wave launchers arranged on or in a surface of the substrate, the one or more surface wave launchers being configured to feed a feeding signal in a frequency range above 50 GHz into the hologram; and control lines connected to the switching components of the hologram pixels for controlling the hologram pixels individually or in groups. 1. Holographic antenna comprising:an optically transparent substrate;a hologram arranged on a first surface of the substrate, the hologram comprising two or more hologram stripes, each having a plurality of linearly arranged hologram pixels, each comprising a switching component;a ground plane arranged on a second surface, opposite the first surface, of the substrate;one or more surface wave launchers arranged on or in a surface of the substrate, the one or more surface wave launchers being configured to feed a feeding signal in a frequency range above 50 GHz into the hologram; andcontrol lines connected to the switching components of the hologram pixels for controlling the hologram pixels individually or in groups.2. Holographic antenna as claimed in claim 1 ,wherein the spacing between neighboring hologram pixels of a hologram stripe is substantially identical for all hologram stripes.3. Holographic antenna as claimed in claim 1 ,wherein the spacing between neighboring hologram pixels of a hologram stripe is substantially identical for each second hologram stripe and amounts to a first spacing value and the spacing between neighboring hologram pixels of a hologram stripe is substantially identical for the other hologram stripes and amounts to a ...

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Номер записи: 1
18-04-2019 дата публикации

MICROWAVE ANTENNA APPARATUS, PACKING AND MANUFACTURING METHOD

Номер: US20190115643A1
Автор: Khan Wasif Tanveer, Ott Arndt Thomas, TOPAK Ali Eray
Принадлежит: SONY CORPORATION

A microwave antenna apparatus comprises a semiconductor element and an antenna element embedded into a mold layer, which is covered by a redistribution layer. The antenna element is preferably configured as SMD component so that it can be handled by a standard pick and place process. The coupling between semiconductor element and antenna element is provided either by a metal layer or aperture coupling within the redistribution layer. The microwave antenna apparatus may be coupled to a PCB arrangement thus forming an embedded wafer-level ball grid array (eWLB) or embedded micro-wafer-level-packaging (emWLP) package. 2. Microwave antenna apparatus as claimed in claim 1 ,wherein the antenna element is configured as an SMD component.3. Microwave antenna apparatus as claimed in claim 1 ,wherein the antenna substrate layer is made of a microwave material, or of a BT, FR4 or FR408 type substrate material, or of ceramics, or of Rogers substrate material, of PTFE, or of a mold type material.4. Microwave antenna apparatus as claimed in claim 1 ,wherein multiple antenna elements are arranged within the mold layer, in particular around the semiconductor element.5. Microwave antenna apparatus as claimed in claim 1 ,wherein the antenna element comprises one or more antenna feed lines arranged on a first surface of the antenna substrate layer opposite the second surface and the radiating element arranged on the second surface of the antenna substrate layer, wherein the antenna element is arranged within the mold layer such that an outer surface of the antenna feed lines is not covered by mold material, andwherein the redistribution layer is arranged on the surface of the mold layer such that the metal layer is in contact with the outer surfaces of one or more antenna feed lines.6. Microwave antenna apparatus as claimed in claim 5 ,wherein the antenna element comprises one or more connection lines connecting one or more antenna feed lines with the radiating element through the ...

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Номер записи: 2
30-05-2019 дата публикации

SYNTHESIZER AND PHASE FREQUENCY DETECTOR

Номер: US20190165794A1
Автор: Krempig Mathias, Ott Arndt Thomas
Принадлежит: SONY CORPORATION

A synthesizer comprises a two-point modulation phase locked tow, TPM PLL, circuit configured to receive a frequency tuning signal and to generate a stepped chirp signal in an intermediate frequency range by applying a two-point modulation PLL on the frequency tuning signal, and a subsampling PLL circuit configured to receive the stepped chirp signal in a mm-wave frequency range and to generate a smoothened chirp signal in a mm-wave frequency range by applying a subsampling PLL on the stepped chirp signal. 1. A synthesizer comprisinga two-point modulation phase locked loop, TPM PLL, circuit configured to receive a frequency tuning signal and to generate a stepped chirp signal in an intermediate frequency range by applying a two-point modulation PLL on the frequency tuning signal, anda subsamplinq PLL circuit configured to receive the stepped chirp signal in a mm-wave frequency range and to generate a smoothened chirp signal in a mm-wave frequency range by applying a subsampling PLL on the stepped chirp signal.2. The synthesizer as claimed in claim 1 , a first phase detector circuit configured to receive the frequency tuning signal and the stepped chirp signal and to generate a first phase detection signal,', 'a first frequency divider configured to apply a frequency division on the stepped chirp signal, and', 'a first phase-frequency detector and charge pump circuit configured to receive the frequency tuning signal and the stepped chirp signal after application of the frequency-division and to generate a second phase detection signal., 'wherein the TPM PLL circuit comprises'}3. The synthesizer as claimed in claim 2 , a first loop fitter configured to receive the first phase detection signal and the second phase detection signal or to receive a first combined phase detection signal resulting from a combination of the first phase detection signal and the second phase detection signal and generate a first oscillator tuning signal and', 'a first oscillator configured to ...

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Номер записи: 3
19-07-2018 дата публикации

MICROWAVE ANTENNA COUPLING APPARATUS, MICROWAVE ANTENNA APPARATUS AND MICROWAVE ANTENNA PACKAGE

Номер: US20180205134A1
Автор: Hotopan Ramona, Khan Wasif Tanveer, Nauman Mudassar, Ott Arndt Thomas
Принадлежит: SONY CORPORATION

A microwave antenna coupling apparatus forming an eWLB package, comprises an antenna coupling element comprising a coupling unit, a coupling feed line arranged on a first surface of the coupling unit and an internal coupling component to provide signal coupling between the coupling feed line and the second surface of the coupling unit, wherein the antenna coupling element is arranged within the mold layer separate from the semiconductor element and such that an outer surface of the coupling feed line is not covered by mold material. Different multi-layer antenna structures can be placed on top of eWLB package. By this type of integration Package-on-Package (PoP) antenna are constructed. The elements can be integrated by a standard pick and place process 1. Microwave antenna coupling apparatus comprising:a mold layer of mold material,a semiconductor element comprising a semiconductor unit and a semi-conductor feed line arranged on a first surface of the semiconductor unit, wherein the semiconductor element is arranged within the mold layer such that an outer surface of the semiconductor feed line is not covered by mold material,an antenna coupling element comprising a coupling unit, a coupling feed line arranged on a first surface of the coupling unit and an internal coupling component to provide signal coupling between the coupling feed line and the second surface of the coupling unit, wherein the antenna coupling element is arranged within the mold layer separate from the semiconductor element and such that an outer surface of the coupling feed line is not covered by mold material, and{'b': '124', 'a redistribution layer comprising at least one redistribution substrate layer and a conductive layer, wherein the redistribution layer is arranged on a first surface of the mold layer and configured such that the conductive layer connects the outer surface () of the semiconductor feed line with the outer surface of the coupling feed line.'}2. Microwave antenna coupling ...

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Номер записи: 4
22-08-2019 дата публикации

SYNTHESIZER

Номер: US20190260617A1
Автор: Ott Arndt Thomas
Принадлежит: SONY CORPORATION

A synthesizer comprises a first two-point modulation phase locked loop, TPM PLL, circuit that receives a first reference clock signal at a first reference frequency and a feedback signal at a feedback frequency and generates a first chirp signal by applying a two-point modulation PLL on the first reference clock signal, a second integer-n TPM PLL circuit that receives a second reference clock signal at a second reference frequency lower than the first reference frequency and generates a second chirp signal by applying a TPM PLL on the second reference clock signal, a mixer that downconverts the first chirp signal by the second chirp signal to obtain the feedback signal at the feedback frequency corresponding to the difference of the frequency of the first chirp signal and the second chirp signal, and a feedback path that feeds back the feedback signal to the first TPM PLL circuit. 1. A synthesizer comprisinga first two-point modulation phase locked loop, TPM PLL, circuit configured to receive a first reference clock signal at a first reference frequency and a feedback signal at a feedback frequency and to generate a first chirp signal in a first mm-wave frequency range by applying a two-point modulation PLL on the first reference clock signal,a second integer-n TPM PLL circuit configured to receive a second reference clock signal at a second reference frequency lower than the first reference frequency and to generate a second chirp signal in a second mm-wave frequency range by applying a two-point modulation PLL on the second reference clock signal,a mixer configured to downconvert the first chirp signal by the second chirp signal to obtain the feedback signal at the feedback frequency corresponding to the difference of the frequency of the first chirp signal and the second chirp signal, anda feedback path configured to feed back the feedback signal to the first TPM PLL circuit.2. The synthesizer as claimed in claim 1 ,wherein the first reference clock signal is K ...

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Номер записи: 5
12-09-2019 дата публикации

MICROWAVE ANTENNA APPARATUS AND PACKAGE

Номер: US20190280368A1
Автор: Hotopan Ramona, Khan Wasif Tanveer, Nauman Mudassar, Ott Arndt Thomas
Принадлежит: SONY CORPORATION

A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module. 1. Microwave antenna apparatus comprising:a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, andan antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer, wherein the footprint of the antenna module is larger than the footprint of the semiconductor package module.2. Microwave antenna apparatus as claimed in claim 1 ,wherein the semiconductor package module comprises a single redistribution layer arranged on a bottom surface of the semiconductor package module facing away from the antenna module.3. Microwave antenna apparatus as claimed in claim 1 ,wherein the semiconductor package module comprises two redistribution layers, a first redistribution layer being arranged on a bottom surface of the semiconductor package module facing away from the antenna module and a second redistribution layer being arranged on a top surface of the semiconductor package module facing the antenna module.4. Microwave antenna apparatus as claimed in claim 1 ,wherein the redistribution layer comprises at least one redistribution substrate layer and one or more metal layers arranged in and/or on the at least one redistribution substrate layer.5. Microwave antenna apparatus as claimed in claim 1 ,wherein the semiconductor package module comprises a ground layer arranged on a top surface of the ...

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Номер записи: 6
09-11-2017 дата публикации

MICROWAVE ANTENNA APPARATUS, PACKING AND MANUFACTURING METHOD

Номер: US20170324135A1
Автор: BLECH Marcel, Ott Arndt Thomas, TOPAK Ali Eray
Принадлежит: SONY CORPORATION

A microwave antenna apparatus includes: a redistribution layer including a carrier layer, a ground plane arranged on a first or second surface of the carrier layer, and a microstrip line arranged on the other one of the first or second surface of the carrier layer; a semiconductor element mounted on the first surface of the carrier layer and coupled to the ground plane and the microstrip line; a mold layer that covers the semiconductor element and the first surface of the carrier layer; and a waveguide arranged within the mold layer and on the first surface of the carrier layer and coupled to the semiconductor element by the microstrip line, wherein a solid state filling material is arranged within the waveguide. Further, integrated antennas and transitions are presented within eWLB packages. 120-. (canceled)21. A microwave antenna apparatus comprising:a redistribution layer comprising a carrier layer, a ground plane arranged on a first or second surface of the carrier layer, and a microstrip line arranged on the other one of the first or second surface of the carrier layer;a semiconductor element mounted on the first surface of the carrier layer and coupled to the ground plane and the microstrip line;a mold layer covering the semiconductor element and the first surface of the carrier layer; anda waveguide arranged within the mold layer and on the first surface of the carrier layer and coupled to the semiconductor element by the microstrip line, wherein a solid state filling material is arranged within the waveguide.22. A microwave antenna apparatus as claimed in claim 21 ,wherein the filling material is a foam-like filling material having a permittivity below 1.5.23. A microwave antenna apparatus as claimed in claim 21 ,wherein the filling material comprises one or more of PCB material, mold material of the mold layer, material of the carrier, PTFE, PEN, PET, acryl.24. A microwave antenna apparatus as claimed in claim 21 ,wherein the waveguide is open or closed on ...

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Номер записи: 7
01-10-2020 дата публикации

Microwave antenna apparatus

Номер: US20200315001A1
Автор: Ahmad Waleed, Arndt Thomas Ott, Ramona Hotopan, Wasif Tanveer Khan
Принадлежит: Sony Corp

A microwave antenna apparatus comprises a package module comprising a semiconductor unit, an antenna unit arranged on a first side of the package module and a redistribution layer group arranged on a second side of the package module opposite the first side, and an electromagnetic band gap structure, EBG, module coupled to the redistribution layer group of the package module.

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Номер записи: 8
21-12-2017 дата публикации

Planar antenna array

Номер: US20170365933A1
Автор: Ali Eray TOPAK, Arndt Thomas Ott, Ramona Hotopan
Принадлежит: Sony Corp

A planar antenna array comprises two or more linear arrays of radiation elements, said linear arrays being substantially arranged in parallel, a first connecting unit connecting first ends of said two or more linear arrays, a second connecting unit connecting second ends of said two or more linear arrays, and a feed port at least at one end of each one of said first and second connecting units for reception of a feed signal.

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Номер записи: 9
11-05-2021 дата публикации

Microwave antenna apparatus and package

Номер: US11005155B2
Автор: Arndt Thomas Ott, Mudassar Nauman, Ramona Hotopan, Wasif Tanveer Khan
Принадлежит: Sony Corp

A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.

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Номер записи: 10
05-12-2023 дата публикации

Holographic antenna and holographic antenna arrangement

Номер: US11837785B2
Автор: Arndt Thomas Ott
Принадлежит: Sony Group Corp

A holographic antenna comprises an optically transparent substrate; a hologram arranged on a first surface of the substrate, the hologram comprising two or more hologram stripes, each having a plurality of linearly arranged hologram pixels, each comprising a switching component; a ground plane arranged on a second surface, opposite the first surface, of the substrate; one or more surface wave launchers arranged on or in a surface of the substrate, the one or more surface wave launchers being configured to feed a feeding signal in a frequency range above 50 GHz into the hologram; and control lines connected to the switching components of the hologram pixels for controlling the hologram pixels individually or in groups.

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Номер записи: 11