Polymer composites for overvoltage protection

Polymer composites for overvoltage protection

A composition and devices utilizing these compositions for providing protection against electrical overstress including a matrix formed of a mixture of an insulating binder, conductive particles having an average particle size of less than 10 microns, and semiconductive particles having an average particle size of less than 10 microns. The compositions exhibit improved clamping voltages in a range of about 30 volts to greater than 2,000 volts.

Surface-mountable device for protection against electrostatic damage to electronic components

Surface-mountable device for protection against electrostatic damage to electronic components

The thin film, electrical device is an subminiature overvoltage circuit protection device in a surface mountable configuration for use in printed circuit board or thick film hybrid circuit technology. The surface mountable device (SMD) is designed to protect against electrostatic discharge (ESD) damage to electronic components. The circuit protection device comprises three material subassemblies. The first subassembly generally includes a substrate carrier, electrodes, and terminal pads for connecting the protection device 60 to a PC board. The second subassembly includes a voltage variable polymer material with nonlinear resistance characteristics, and the third subassembly includes a cover coat for protecting other elements of the circuit protection device. The devices of the present invention employ various electrode configurations and profiles to control the electrical field created between the electrodes and increase the active area of the electrodes in contact with the voltage variable ...

Polymerverbundmaterialien zum Schutz vor Überspannung

Oberflächen-montierbare Vorrichtung zum Schutz gegen elektrostatische Beschädigung von elektronischen Komponenten

Electrostatic discharge multifunction resistor

The present invention provides a multifunction resistor having an improved voltage variable material (“VVM”). More specifically, the present invention provides a polymer VVM that has been formulated with a high percentage loading of conductive and/or semiconductive particles. A known length of the relatively conductive VVM is placed between adjacent electrodes to produce a desired Ohmic normal state resistance. When an electrostatic discharge event occurs, the VVM of the multifunctional resistor becomes highly conductive and dissipates the ESD threat. One application for this “resistor” is the termination of a transmission line, which prevents unwanted reflections and distortion of high frequency signals.

ELECTRICAL DEVICE FOR PROVIDING PROTECTION AGAINST EOS TRANSIENTS AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To secure a space on a printed circuit board by filling a voltage variable material between electrical leads and a ground plane, and physically connecting the electrical leads and the ground plane to thereby incorporate a portion to be protected from electrical overstress transients into an existing electrical device structure. SOLUTION: A voltage variable material 10 is applied to a lead frame 50 comprised of a plurality of electrical leads 60, 60', 61, 61', 62, 62', 63, 63', 64, 64', and a ground plane 70. The electrical leads are spaced from one another at a predetermined distance A. The plane 70 is adjacently spaced from the corresponding leads 60, 60' and the like at a predetermined distance B. A layer made of the material 10 fills a space between the leads 60, 60' and the like as well as a space between the leads 60, 60' and the like and the plane 70. The layer made of the material 10 physically connects the electrical leads to the plane 70. COPYRIGHT: (C)2000 ...

ELECTROSTATIC DISCHARGE PROTECTING POLYMER COMPOSITE MATERIAL

PROBLEM TO BE SOLVED: To protect an electric component to a transient electric excessive stress phenomenon by including an insulating binder, a doped semiconductive particle, and a semi-conductive particle. SOLUTION: The insulating binder preferably contains a silicone resin, and this resin is cross-linked by a peroxide hardener. As the doped semiconductive particle, silicon powder doped with aluminum is preferably used. The average particle size is preferably set to less than 10 μm. The semiconductive particle is preferably formed of silicon carbide. The average particle size is preferably set to less than 5 μm. In a composition having such components, the insulating binder, the doped semiconductive particle and the semiconductive particle are preferably set to about 30-65 vol.% of the whole composition, about 10-60 vol.%, and about 5-45 vol.%, respectively. Consequently, the composition can impart a fixed voltage of about 20-2,000 V, more preferably, about 20-100 V. COPYRIGHT: (C)1999 ...

Protection of electrical devices with voltage variable materials

An arrangement of voltage variable materials for the protection of electrical components from electrical overstress (EOS) transients. A device having a plurality of electrical leads, a ground plane and a layer of voltage variable material. The voltage variable material physically bonds the plurality of electrical leads to one another as well as provides an electrical connection between the plurality of electrical leads and the ground plane. A die having a circuit integrated therein is attached to the ground plane. Conductive members electrically connect the plurality of electrical leads to the integrated circuit. At normal operating voltages, the voltage variable material has a high resistance, thus channeling current from the electrical leads to the integrated circuit via the conductive members. In response to a high voltage EOS transient, the voltage variable material essentially instantaneously switches to a low resistance state, channeling the potentially harmful EOS transient to the ...

Protection of electrical devices with voltage variable materials

An arrangement of voltage variable materials for the protection of electrical components from electrical overstress (EOS) transients. A device having a plurality of electrical leads, a ground plane and a layer of voltage variable material. The voltage variable material physically bonds the plurality of electrical leads to one another as well as provides an electrical connection between the plurality of electrical leads and the ground plane. A die having a circuit integrated therein is attached to the ground plane. Conductive members electrically connect the plurality of electrical leads to the integrated circuit. At normal operating voltages, the voltage variable material has a high resistance, thus channeling current from the electrical leads to the integrated circuit via the conductive members. In response to a high voltage EOS transient, the voltage variable material essentially instantaneously switches to a low resistance state, channeling the potentially harmful EOS transient to the ...

SINTERABLE FILMS AND PASTES AND METHODS FOR USE THEREOF

Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor. 1. A composition for a sintering film , comprising:a thermosetting resin or thermoplastic resin component, selected from the group consisting of one or more epoxy monomers, oligomers, or polymers, an acrylic monomer, oligomer, or polymer, a phenolic, a novalac, a polyurethane, a cyanate ester, a polyvinyl alcohol, a polyester, a polyurea, a polyvinyl acetal resin, a phenoxy resin, a maleimide, a bismaleimide, a polyimide, or mixtures thereof;one or more conductive fillers; andoptionally an organic diluent,wherein the composition undergoes lamination onto a wafer at a temperature of 100° C. or lower and a pressure of 40 psi or lower; and{'sup': '2', 'wherein the composition, when cured or sintered, has a die shear strength of at least 1.0 kg/mmat 260° C.'}2. The composition of claim 1 , wherein the composition claim 1 , when attached to a die claim 1 , bonds to a substrate at a pressure of 0.2 kg/mmto 1 kg/mm.3. The composition of claim 1 , further comprising one or more of a fluxing agent claim 1 , a flow additive claim 1 , an adhesion promoter claim 1 , a rheology modifier claim 1 , a conductivity promoter claim 1 , a surfactant claim 1 , a toughening agent claim 1 , a film flexibilizer claim 1 , an epoxy-curing catalyst claim 1 , a curing agent claim 1 , a radical polymerization regulator claim 1 , a radical stabilizer claim 1 , or mixtures thereof.4. The composition of claim 1 , wherein the ...

METAL SINTERING FILM COMPOSITIONS

A sintering film comprising one or more metals, one or more metal alloys, or blends of one or more metals and one or more metal alloys, is prepared optionally using a solid or semi-solid organic binder. The organic binder can have fluxing functionality; the organic binder can be one that will partially or completely decompose upon sintering of the metal or metal alloy in the composition. In one embodiment, the sintering film is provided on an end use substrate, such as a silicon die or wafer, or a metal circuit board or foil, or the sintering film is provided on a carrier, such as a metal mesh. Preparation is accomplished by dispersing the metal or metal alloy in a suitable solvent, with or without a binder, and exposing the composition to high temperature to evaporate off the solvent and partially sinter the metal or metal alloy. 1. A composition of matter comprising one or more metals and/or one or more metal alloys , wherein the one or more metals and/or one or more metal alloys are present in a high melting point phase and a low metal point phase , wherein the low melting point phase melts at a temperature of less than about 300° C.2. The composition of matter of claim 1 , wherein the low melting point phase when exposed to a temperature of greater than 50° C. but less than about 300° C. melts and forms intermetallic compounds with the high melting point phase.3. The composition of matter of claim 1 , wherein the intermetallic connections are formed in the composition at a level of less than 100%.4. The composition of matter of claim 1 , wherein the low melting point phase is present in an amount of at least 5% by weight of the composition of matter.5. The composition of matter of claim 1 , in the form of a sintering film.6. A composition of matter comprising a metal or a metal alloy and a decomposable organic binder claim 1 , which when exposed to a temperature of greater than 50° C. claim 1 , the metal or metal alloy sinters and is in the form of a film.7. The ...

TREATMENT OF CONVERSION-COATED METAL SUBSTRATES WITH PREFORMED REACTION PRODUCTS OF CATECHOL COMPOUNDS AND FUNCTIONALIZED CO-REACTANT COMPOUNDS

The corrosion resistance of conversion-coated metal substrate surfaces is further enhanced by treating such surfaces with aqueous mixtures of preformed reaction products obtained by reacting catechol compounds, such as dopamine or a dopamine salt, and functionalized co-reactant compounds, such as a polyethyleneimine. 1. A method , comprising contacting a surface of a conversion-coated metal substrate with an aqueous mixture comprised of at least one preformed reaction product of at least one catechol compound and at least one co-reactant compound comprised of one or more functional groups reactive with the at least one catechol compound to provide a sealed conversion-coated metal substrate.2. The method of claim 1 , wherein the one or more functional groups reactive with the at least one catechol compound include one or more functional groups selected from the group consisting of (meth)acryl groups claim 1 , secondary amino groups claim 1 , primary amino groups claim 1 , thiol groups and hydroxyl groups.3. The method of claim 1 , wherein the at least one catechol compound includes at least one amine-functionalized catechol compound or salt thereof.4. The method of claim 1 , wherein the at least one catechol compound includes at least one catechol compound selected from the group consisting of catechol and aminoalkyl-functionalized catechols and salts thereof.5. The method of claim 1 , wherein the at least one catechol compound includes at least dopamine or a salt thereof.6. The method of claim 1 , wherein the at least one co-reactant compound includes at least one amine compound.7. The method of claim 6 , wherein the at least one amine compound includes at least one polyamine containing two or more amine groups per molecule which are primary amine groups claim 6 , secondary amine groups or both primary and secondary amine groups.8. The method of claim 6 , wherein the at least one amine compound includes at least one oligomeric or polymeric amine compound comprising ...

USE OF PREFORMED REACTION PRODUCTS OF CATECHOL COMPOUNDS AND FUNCTIONALIZED CO-REACTANT COMPOUNDS TO REDUCE OXIDATION OF BARE METAL SURFACES

The tendency of a bare metal surface to oxidize (e.g., flash-rust) may be alleviated by contacting the bare metal surface with an aqueous mixture of at least one preformed reaction product obtained by reaction of at least one catechol compound, such as dopamine or a salt thereof, with at least one co-reactant compound functionalized with one or more functional groups reactive with the at least one catechol compound, such as (meth)acryl, primary amino, secondary amino, thiol and/or hydroxyl groups, with polyethyleneimine being an example of a suitable co-reactant compound. Such a rinsing procedure does not interfere with subsequent conversion coating of the metal surface. 1. A method , comprising a step a) comprising contacting a bare metal substrate surface with an aqueous mixture comprised of at least one preformed reaction product of at least one catechol compound and at least one co-reactant compound comprised of one or more functional groups reactive with the at least one catechol compound to provide a pre-rinsed metal substrate surface , and a step b) comprising conversion coating the pre-rinsed metal substrate surface to provide a conversion-coated metal substrate.2. The method of claim 1 , wherein the one or more functional groups include one or more functional groups selected from the group consisting of (meth)acryl groups claim 1 , secondary amino groups claim 1 , primary amino groups claim 1 , thiol groups and hydroxyl groups.3. The method of claim 1 , wherein the at least one catechol compound includes at least one amine-functionalized catechol compound or salt thereof.4. The method of claim 1 , wherein the at least one catechol compound includes at least one catechol compound selected from the group consisting of catechol and aminoalkyl-functionalized catechols and salts thereof.5. The method of claim 1 , wherein the at least one catechol compound includes at least dopamine or a salt thereof.6. The method of claim 1 , wherein the at least one co-reactant ...

REACTION PRODUCTS OF CATECHOL COMPOUNDS AND FUNCTIONALIZED CO-REACTANT COMPOUNDS FOR METAL PRETREATMENT APPLICATIONS

An aqueous, acidic, anti-corrosion conversion coating composition (in particular, an aqueous, acidic Group IV metal-containing anti-corrosion conversion coating composition) for metal substrates comprising as an additive a catechol compound and/or the reaction products of at least one catechol compound and at least one co-reactant compound having one or more functional groups reactive with the at least one catechol compound, desirably the reaction product of a catechol and an polyamine (e.g., a polyethyleneimine), that enhances the anti-corrosion effects of the conversion coating composition; methods of making and applying the conversion coating compositions and coated metal substrates. The catechol-containing conversion coating composition can be applied to metal substrate surfaces at temperatures as low as below 40° C. and with exposure times of 5 minutes or less. The catechol compound or reaction product thereof can become incorporated into the conversion coating formed on the metal substrate. 1. An additive that enhances corrosion protection of an aqueous , acidic conversion coating composition , wherein the additive comprises:one or more reaction products of an aqueous liquid mixture of at least one catechol compound with at least one co-reactant compound comprised of one or more functional groups reactive with the at least one catechol compound reacted at a temperature of at least 0° C., desirably 10° C. to 100° C. or more, at a pressure of about 1 atmosphere or greater, over a period of time ranging from 30 minutes to 20 hours, said aqueous solution or dispersion having a molar ratio of catechol compound to functional groups reactive with the at least one catechol compound in the co-reactant compound of from 1:0.05 to 1:25.2. The additive as recited in wherein said at least one catechol compound is selected from the group consisting of dopamine; catechol; 3 claim 1 ,4-dihydroxy-L-phenylalanine; and salts and mixtures thereof.3. The additive as recited in ...

Reaction products of catechol compounds and functionalized co-reactant compounds for metal pretreatment applications

An aqueous, acidic, anti-corrosion conversion coating composition (in particular, an aqueous, acidic Group IV metal-containing anti-corrosion conversion coating composition) for metal substrates comprising as an additive a catechol compound and/or the reaction products of at least one catechol compound and at least one co-reactant compound having one or more functional groups reactive with the at least one catechol compound, desirably the reaction product of a catechol and an polyamine (e.g., a polyethyleneimine), that enhances the anti-corrosion effects of the conversion coating composition; methods of making and applying the conversion coating compositions and coated metal substrates. The catechol-containing conversion coating composition can be applied to metal substrate surfaces at temperatures as low as below 40 C and with exposure times of 5 minutes or less. The catechol compound or reaction product thereof can become incorporated into the conversion coating formed on the metal substrate.

Electrostatic discharge protecting polymer composite material

(57)【要約】 【課題】 電気過大応力過渡現象に対し電気部品を保護 するための組成物を提供する。 【解決手段】 絶縁性バインダ、ドープされた半導電性 粒子、及び半導電性粒子を含む電気過大応力過渡現象 （ＥＯＳ）に対し電気部品を保護するための組成物。こ の複合材料は通常の操作電圧に対して高い電気抵抗性を 示すが、ＥＯＳ過渡現象に応答して低い電気抵抗に変換 し、ＥＯＳ過渡現象の間、ＥＯＳ過渡電圧を低いレベル に保持する。

Treatment of conversion-coated metal substrates with preformed reaction products of catechol compounds and functionalized co-reactant compounds

The corrosion resistance of conversion-coated metal substrate surfaces is further enhanced by treating such surfaces with aqueous mixtures of preformed reaction products obtained by reacting catechol compounds, such as dopamine or a dopamine salt, and functionalized co-reactant compounds, such as a polyethyleneimine.

Protection of electrical devices with voltage variable materials

An arrangement of voltage variable materials for the protection of electrical components from electrical overstress (EOS) transients. A device having a plurality of electrical leads, a ground plane and a layer of voltage variable material. The voltage variable material physically bonds the plurality of electrical leads to one another as well as provides an electrical connection between the plurality of electrical leads and the ground plane. A die having a circuit integrated therein is attached to the ground plane. Conductive members electrically connect the plurality of electrical leads to the integrated circuit. At normal operating voltages, the voltage variable material has a high resistance, thus channeling current from the electrical leads to the integrated circuit via the conductive members. In response to a high voltage EOS transient, the voltage variable material essentially instantaneously switches to a low resistance state, channeling the potentially harmful EOS transient to the ground plane and away from the integrated circuit.

Use of preformed reaction products of catechol compounds and functionalized co-reactant compounds to reduce oxidation of bare metal surfaces

The tendency of a bare metal surface to oxidize (e.g., flash-rust) may be alleviated by contacting the bare metal surface with an aqueous mixture of at least one preformed reaction product obtained by reaction of at least one catechol compound, such as dopamine or a salt thereof, with at least one co-reactant compound functionalized with one or more functional groups reactive with the at least one catechol compound, such as (meth)acryl, primary amino, secondary amino, thiol and/or hydroxyl groups, with polyethyleneimine being an example of a suitable co-reactant compound. Such a rinsing procedure does not interfere with subsequent conversion coating of the metal surface.

Reaction products of catechol compounds and functionalized co-reactant compounds for metal pretreatment applications

Polymer composite materials for electrostatic discharge protection

A composition for providing protection against electrical overstress (EOS) comprising an insulating binder, doped semiconductive particles, and semiconductive particles. The composite materials exhibit a high electrical resistance to normal operating voltage values, but in response to an EOS transient switch to a low electrical resistance and clamp the EOS transient voltage to a low level for the duration of the EOS transient.

Treatment of conversion-coated metal substrates with preformed reaction products of catechol compounds and functionalized co-reactant compounds

Reaction products of catechol compounds and functionalized co-reactant compounds for metal pretreatment applications

An aqueous, acidic, anti-corrosion conversion coating composition (in particular, an aqueous, acidic Group IV metal-containing anti-corrosion conversion coating composition) for metal substrates comprising as an additive a catechol compound and/or the reaction products of at least one catechol compound and at least one co-reactant compound having one or more functional groups reactive with the at least one catechol compound, desirably the reaction product of a catechol and an polyamine (e.g., a polyethyleneimine), that enhances the anti-corrosion effects of the conversion coating composition; methods of making and applying the conversion coating compositions and coated metal substrates. The catechol-containing conversion coating composition can be applied to metal substrate surfaces at temperatures as low as below 40 C and with exposure times of 5 minutes or less. The catechol compound or reaction product thereof can become incorporated into the conversion coating formed on the metal substrate.

Treatment of conversion-coated metal substrates with preformed reaction products of catechol compounds and functionalized co-reactant compounds

The corrosion resistance of conversion-coated metal substrate surfaces is further enhanced by treating such surfaces with aqueous mixtures of preformed reaction products obtained by reacting catechol compounds, such as dopamine or a dopamine salt, and functionalized co-reactant compounds, such as a polyethyleneimine.

Reaction products of catechol compounds and functionalized co-reactant compounds for metal pretreatment applications

Use of preformed reaction products of catechol compounds and functionalized co-reactant compounds to reduce oxidation of bare metal surfaces

The tendency of a bare metal surface to oxidize (e.g., flash-rust) may be alleviated by contacting the bare metal surface with an aqueous mixture of at least one preformed reaction product obtained by reaction of at least one catechol compound, such as dopamine or a salt thereof, with at least one co-reactant compound functionalized with one or more functional groups reactive with the at least one catechol compound, such as (meth)acryl, primary amino, secondary amino, thiol and/or hydroxyl groups, with polyethyleneimine being an example of a suitable co-reactant compound. Such a rinsing procedure does not interfere with subsequent conversion coating of the metal surface.

焼結可能フィルムおよびペーストおよびその使用方法

【課題】ダイ半導体パッケージに使用するのに有利な特性を有する導電性のダイアタッチ材料としての焼結可能なフィルムおよびペースト、このようなフィルムおよびペーストの調製に有用な配合物、ならびにそのような配合物の製造方法を提供する。【解決手段】１種以上のエポキシモノマー、オリゴマーまたはポリマー、アクリルモノマー、オリゴマーまたはポリマー、フェノール系、ノボラックまたはそれらの混合物等からなる群から選択される、熱硬化性樹脂または熱可塑性樹脂成分、１種以上の導電性充填剤、および任意に有機希釈剤を含む焼結フィルムのための組成物であって、組成物が、１００℃以下の温度および４０ｐｓｉ以下の圧力でウエハー上にラミネートされ、硬化または焼結時に２６０℃で少なくとも１．０ｋｇ／ｍｍ２のダイせん断強度を有する、組成物とする。【選択図】なし

Sinterable films and pastes and methods for use thereof

Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.

Treatment of conversion-coated metal substrates with preformed reaction products of catechol compounds and functionalized co-reactant compounds

The corrosion resistance of conversion-coated metal substrate surfaces is further enhanced by treating such surfaces with aqueous mixtures of preformed reaction products obtained by reacting catechol compounds, such as dopamine or a dopamine salt, and functionalized co-reactant compounds, such as a polyethyleneimine.

Sinterable films and pastes and methods for use thereof

Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.

Process of and apparatus for treatment ofa perishable product ina closed space

金屬燒結膜組合物

本發明係關於視需要使用固體或半固體有機黏合劑製備包含一種或多種金屬、一種或多種金屬合金、或一種或多種金屬與一種或多種金屬合金之摻合物之燒結膜。該有機黏合劑可具有助熔官能基；該有機黏合劑可為在組合物中的金屬或金屬合金燒結時部分或完全分解的物質。在一實施例中，該燒結膜提供於最終用途基板(例如矽晶粒或矽晶圓、或金屬電路板或金屬箔)上，或該燒結膜提供於載體(例如金屬網)上。該製法係藉由在適宜的溶劑中分散金屬或金屬合金(具有或不具黏合劑)，並將組合物曝露於高溫下以蒸發掉該溶劑及部分燒結該金屬或金屬合金而完成。

Sinterable films and pastes and methods for the use thereof

Produkty reakcji związków katecholowych i funkcjonalizowanych związków będących współreagentami do zastosowań do obróbki wstępnej metalu