Stabilization amd performance of autocatalytic electroless processes.

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Stabilization amd performance of autocatalytic electroless processes.

STABILIZATION AMD PERFORMANCE OF AUTOCATALYTIC ELECTROLESS PROCESSES

Disclosed is a method of plating a substrate with a metal using an autocatalytic electroless plating bath wherein the bath is operated above its cloud point temperature such that at least two phases are present in the bath. An autocatalytic electroless plating bath for coating silver metal is also described. A method for autocatalytic plating of silver metal directly onto a silicon surface without the need for an intervening layer of metal is also disclosed. The deposits of silver obtained are uniform, non-porous and have electrical properties. The technique can be applied for different processes and bath formulations i.e. different metals, complexing agents and reducing agents. © KIPO & WIPO 2007 ...

VERBESSERTE MIKROWELLENBAUELEMENTE

Stabilization and Performance of Autocatalytic Electroless Processes

Disclosed is a method of plating a substrate with a metal using an autocatalytic electroless plating bath wherein the bath is operated above its cloud point temperature such that at least two phases are present in the bath. An autocatalytic electroless plating bath for coating silver metal is also described. A method for autocatalytic plating of silver metal directly onto a silicon surface without the need for an intervening layer of metal is also disclosed. The deposits of silver obtained are uniform, non-porous and have electrical properties. The technique can be applied for different processes and bath formulations i.e. different metals, complexing agents and reducing agents.

A method for plating a substrate with a metal

The invention relates to a method for plating a substrate with a metal. The method comprises the steps of: mixing: a metal salt, a complexing agent, a surfactant, and an acid in water thereby forming a non-autocatalytic aqueous plating bath, and subjecting the substrate to the non-autocatalytic aqueous plating bath. The method may further include an additional plating step.

Stabilization and performance of autocatalytic electroless processes

Stabilization amd performance of autocatalytic electroless processes

The present invention relates to stabilization and performance of autocatalytic electroless processes. Disclosed is a method of plating a substrate with a metal using an autocatalytic electroless plating bath wherein the bath is operated above its cloud point temperature such that at least two phases are present in the bath. An autocatalytic electroless plating bath for coating silver metal is also described. A method for autocatalytic plating of silver metal directly onto a silicon surface without the need for an intervening layer of metal is also disclosed. The deposits of silver obtained are uniform, non-porous and have electrical properties . The technique can be applied for different processes and bath formulations i.e. different metals, complexing agents and reducing agents.