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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Применить Всего найдено 8. Отображено 8.
25-05-2023 дата публикации

VARIABLE GAP COMPENSATION MOUNTING SOLUTION FOR THERMAL MANAGEMENT ASSEMBLIES

Номер: US20230163046A1
Автор: Raphael Beaupré-Laflamme, Simon Savard, Lam Nguyen
Принадлежит: Ciena Corporation

An apparatus including first and second substrates. The first and second substrates each include a base and at least one peripheral wall extending from the base. One of the at least one peripheral walls of the first or second substrates includes at least one well, and the other of the at least one peripheral walls of the first or the seconds substrate that does not include a well is mechanically anchored to the well. The apparatus includes a stack having a first and second end, and the stack is disposed on the base of the first and/or the second substrates at the first and/or second ends. The stack includes at least one element configured to generate energy.

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Номер записи: 1
27-01-2022 дата публикации

Managing Adhesive Curing for Photonic System Assembly

Номер: US20220026637A1
Автор: Daniel Asselin, Raphael Beaupré-Laflamme, Luc Belanger, Simon-Pierre Pelletier, Éric Giguère
Принадлежит:

An apparatus for assembling a photonic system comprising a photonic integrated circuit (PIC) includes: a support structure configured to support the PIC; and a rigid structure surrounding a hollow passage that extends to an opening at a distal end of the rigid structure. The rigid structure includes an optically transmissive portion configured to transmit at least about 50% of a received beam of ultraviolet light, and configured such that at least a portion of the ultraviolet light transmitted through the rigid structure is incident upon an edge surface of the PIC at an angle of incidence that is less than about 60 degrees.

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Номер записи: 2
17-11-2022 дата публикации

Portable Suction Device Carrier for Assembly Processes

Номер: US20220362947A1
Автор: Raphael Beaupré-Laflamme, Simon-Pierre Pelletier
Принадлежит: Ciena Corporation

Disclosed herein is an apparatus that includes a housing including a first opening and a second opening. The first opening forms a suction connection with a transportable component. The apparatus includes a valve connected with the second opening a channel defined within the housing. The channel extends between the first opening and the second opening. The apparatus includes a vacuum maintaining mechanism disposed within the channel, and the vacuum maintaining mechanism holds a partial vacuum within the channel.

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Номер записи: 3
03-08-2023 дата публикации

Enhanced Thermal Control of a Hybrid Chip Assembly

Номер: US20230245993A1
Автор: Raphael Beaupré-Laflamme, François Pelletier, Louis-Philippe Bibeau
Принадлежит: Ciena Corporation

A method including disposing a structural adhesive onto an elevated surface of a first chip that includes a cavity disposed below the elevated surface. The method includes contacting a carrier with the structural adhesive. The carrier includes a second chip that optically aligns with a lateral surface of the cavity. The method includes curing the structural adhesive so that the carrier and host chip are mechanically anchored. An apparatus includes a first chip including a cavity located between lateral walls of the first chip and a carrier mechanically anchored with the first chip at a top portion of the lateral walls. The carrier includes a second chip that optically aligns with the first chip at a side portion of one of the lateral walls. The first and second chips are free of contact at a bottom surface of the second chip and a bottom surface of the cavity.

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Номер записи: 4
19-12-2023 дата публикации

Stress compensating pick-up tool

Номер: US0011846806B2
Автор: Raphael Beaupré-Laflamme, Simon Savard
Принадлежит: Ciena Corporation

A stress compensating pick-up tool for aligning a companion chip with a host chip includes a tool tip and an actuator. The tool tip holds the companion chip, and includes a first tip portion and a second tip portion. The actuator applies a force to the tool tip, wherein the force causes the first tip portion and the second tip portion to rotate in opposite directions with respect to one another to optically align a portion of the companion chip with a corresponding portion of the host chip.

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Номер записи: 5
03-10-2023 дата публикации

Portable suction device carrier for assembly processes

Номер: US0011772280B2
Автор: Raphael Beaupré-Laflamme, Simon-Pierre Pelletier
Принадлежит: Ciena Corporation

Disclosed herein is an apparatus that includes a housing including a first opening and a second opening. The first opening forms a suction connection with a transportable component. The apparatus includes a valve connected with the second opening a channel defined within the housing. The channel extends between the first opening and the second opening. The apparatus includes a vacuum maintaining mechanism disposed within the channel, and the vacuum maintaining mechanism holds a partial vacuum within the channel.

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Номер записи: 6
15-11-2022 дата публикации

Managing adhesive curing for photonic system assembly

Номер: US0011500156B2
Автор: Daniel Asselin, Raphael Beaupré-Laflamme, Luc Belanger, Simon-Pierre Pelletier, Éric Giguère
Принадлежит: Ciena Corporation

An apparatus for assembling a photonic system comprising a photonic integrated circuit (PIC) includes: a support structure configured to support the PIC; and a rigid structure surrounding a hollow passage that extends to an opening at a distal end of the rigid structure. The rigid structure includes an optically transmissive portion configured to transmit at least about 50% of a received beam of ultraviolet light, and configured such that at least a portion of the ultraviolet light transmitted through the rigid structure is incident upon an edge surface of the PIC at an angle of incidence that is less than about 60 degrees.

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Номер записи: 7
10-03-2022 дата публикации

Stress Compensating Pick-up Tool

Номер: US20220075117A1
Автор: Raphael Beaupré-Laflamme, Simon Savard
Принадлежит:

A stress compensating pick-up tool for aligning a companion chip with a host chip includes a tool tip and an actuator. The tool tip holds the companion chip, and includes a first tip portion and a second tip portion. The actuator applies a force to the tool tip, wherein the force causes the first tip portion and the second tip portion to rotate in opposite directions with respect to one another to optically align a portion of the companion chip with a corresponding portion of the host chip.

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Номер записи: 8