PACKAGED MICRODEVICES AND METHODS FOR MANUFACTURING PACKAGED MICRODEVICES

Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die. The first conductive elements are attached to the second conductive elements at corresponding interfaces such that the interconnects connect the contacts of the substrate directly to corresponding pads on the die within the gap. 1. A packaged microdevice , comprising:a substrate including a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts;a die across from the mounting area and spaced apart from the substrate by a gap, wherein the die has an integrated circuit and pads electrically coupled to the integrated circuit; andfirst conductive elements in the gap electrically connected to contacts on the substrate and second conductive elements in the gap electrically coupled to corresponding pads of the die, wherein the first conductive elements are attached to the second conductive elements at corresponding diffusion joints such that the first and second conductive elements form direct interconnects in the gap between the contacts and corresponding pads.2. A method of packaging a microelectronic device , comprising:forming a plurality of first conductive elements on contacts of a substrate, wherein the ...

Packaged microdevices and methods for manufacturing packaged microdevices

Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die. The first conductive elements are attached to the second conductive elements at corresponding interfaces such that the interconnects connect the contacts of the substrate directly to corresponding pads on the die within the gap.

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