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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

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Применить Всего найдено 9. Отображено 9.
24-03-2022 дата публикации

METHOD OF FABRICATING AN AVALANCHE PHOTODIODE EMPLOYING SINGLE DIFFUSION

Номер: US20220093815A1
Принадлежит: NATIONAL RESEARCH COUNCIL OF CANADA

An avalanche photodiode with a diffused junction and the method for its fabrication are disclosed. The method comprising forming, on a substrate, a first high-doped region and a low-doped region; performing selective area growth (SAG) with in-situ etchant on the low-doped region to grow a SAG structure; and diffusing through the SAG structure to form a second high-doped region in the low-doped region. 1. A method for fabricating an avalanche photodiode comprising:forming, on a substrate, a first high-doped region and a low-doped region;performing selective area growth (SAG) with in-situ etchant on the low-doped region to grow a SAG structure; anddiffusing through the SAG structure to form a second high-doped region in the low-doped region.248.-. (canceled)49. The method of claim 1 , wherein the in-situ etchant is selected from CBrCl claim 1 , CBr claim 1 , CCl claim 1 , CHI claim 1 , HCl claim 1 , CHCl claim 1 , PCl claim 1 , AsCl claim 1 , CHCl claim 1 , or CHCl;wherein the SAG epitaxy is performed in an MOCVD reactor at a growth temperature range of about 550° C. to about 600° C.;wherein the SAG is performed to grow SAG structures using materials that match a lattice of the substrate;{'sub': 2', '2, 'wherein the SAG structure has a thickness of about 150 nm to about 250 nm; and/or wherein the substrate is selected from Si, InP, GaAs, Ge, GaP, GaSb, InAs, SiC, AlO, GaN, or InGaAs.'}50. The method of claim 49 , wherein when the substrate is InP claim 49 , the materials used to perform SAG are selected from InP claim 49 , InGaAs claim 49 , or InGaAsP;wherein when the substrate is Si, the material used to perform SAG is Si; orwherein when the substrate is GaAs, the material used to perform SAG is GaAs.51. The method of claim 1 , wherein when the substrate is InP claim 1 , the absorption layer is formed from InGaAs or InGaAsP; optionally claim 1 , when the substrate is InP claim 1 , the absorption layer has a thickness of about 0.2 μm to about 3.0 μm.52. The method of ...

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25-06-2020 дата публикации

Method of fabricating an avalanche photodiode employing single diffusion

Номер: CA3123461A1
Принадлежит: NATIONAL RESEARCH COUNCIL OF CANADA

An avalanche photodiode with a diffused junction and the method for its fabrication are disclosed. The method comprising forming, on a substrate, a first high-doped region and a low-doped region; performing selective area growth (SAG) with in-situ etchant on the low-doped region to grow a SAG structure; and diffusing through the SAG structure to form a second high-doped region in the low-doped region.

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17-06-2021 дата публикации

Buried heterostructure semiconductor optical amplifier and method for fabricating the same

Номер: CA3161505A1
Принадлежит: NATIONAL RESEARCH COUNCIL OF CANADA

A method for fabricating a buried heterostructure semiconductor optical amplifier is provided. The method includes a step providing a patterned dielectric layer on a substrate, the patterned dielectric layer having openings to expose uncovered regions of the substrate. The method also includes, in a single metal organic chemical vapour deposition (MOCVD) run: etching the uncovered regions of the substrate to form angles at corresponding edges thereof and diffusing a p-dopant in the substrate to obtain a p-dopant distribution in a portion of the substrate; etching a portion of the p-dopant thereby defining a recess in the substrate and growing a n-blocking layer in the recess; sequentially growing, over a portion of the n-blocking layer, an active region, a p-overclad, a p-contact, and a p-metal contact; and growing a n-metal contact on a backside of the substrate. The single MOCVD run combines selective area growth, p-dopant diffusion and etching techniques.

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14-04-2022 дата публикации

Corrugated buried heterostructure laser and method for fabricating the same

Номер: CA3194961A1
Принадлежит: NATIONAL RESEARCH COUNCIL OF CANADA

There is provided a method for fabricating a corrugated buried heterostructure laser, including patterning a dielectric layer coating a substrate having a <0-11> direction to obtain a hollow corrugated structure. The hollow corrugated structure includes a central portion and regularly spaced-apart tabs laterally extending from the central portion and aligned with the <0-11> direction. The method also includes, in a single metal organic chemical vapour deposition run, forming an active region in the hollow corrugated structure to obtain the corrugated buried heterostructure laser. The single run combines selective area growth, p-dopant diffusion and etching techniques. There is also provided a corrugated buried heterostructure laser including a substrate having a <0-11> direction, a corrugated structure defined in the substrate and including a central portion and regularly spaced-apart tabs laterally extending from the central portion and aligned with the <0-11> direction, and an active region grown in the corrugated structure.

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05-12-2023 дата публикации

Method of fabricating an avalanche photodiode employing single diffusion

Номер: US11837681B2
Принадлежит: NATIONAL RESEARCH COUNCIL OF CANADA

An avalanche photodiode with a diffused junction and the method for its fabrication are disclosed. The method comprising forming, on a substrate, a first high-doped region and a low-doped region; performing selective area growth (SAG) with in-situ etchant on the low-doped region to grow a SAG structure; and diffusing through the SAG structure to form a second high-doped region in the low-doped region.

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23-11-2023 дата публикации

Corrugated buried heterostructure laser and method for fabricating the same

Номер: US20230378721A1
Принадлежит: NATIONAL RESEARCH COUNCIL OF CANADA

There is provided a method for fabricating a corrugated buried heterostructure laser, including patterning a dielectric layer coating a substrate having a <0-11> direction to obtain a hollow corrugated structure. The hollow corrugated structure includes a central portion and regularly spaced-apart tabs laterally extending from the central portion and aligned with the <0-11> direction. The method also includes, in a single metal organic chemical vapour deposition run, forming an active region in the hollow corrugated structure to obtain the corrugated buried heterostructure laser. The single run combines selective area growth, p-dopant diffusion and etching techniques. There is also provided a corrugated buried heterostructure laser including a substrate having a <0-11> direction, a corrugated structure defined in the substrate and including a central portion and regularly spaced-apart tabs laterally extending from the central portion and aligned with the <0-11> direction, and an active region grown in the corrugated structure.

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02-11-2023 дата публикации

Buried heterostructure semiconductor laser and method of manufacture

Номер: US20230352912A1
Принадлежит: NATIONAL RESEARCH COUNCIL OF CANADA

A heterostructure laser is provided comprising an epitaxially grown substrate of first dopant type, an active region and layer of second dopant type, a narrow mesa having less than 20% open area and a side wall slope of less than 85 degrees, wherein said narrow mesa is etched through the active region and layer of second dopant type using in-situ MOCVD, a plurality of current blocking layers, an overclad layer and a contact layer of second dopant type, and an isolation mesa incorporating the narrow mesa, wherein the isolation mesa is etched through the active region, layer of second dopant type and plurality of current blocking layers and wherein the plurality of current blocking layers is grown without exposure to oxygen.

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24-03-2022 дата публикации

Buried heterostructure semiconductor laser and method of manufacture

Номер: CA3193011A1
Принадлежит: NATIONAL RESEARCH COUNCIL OF CANADA

A heterostructure laser is provided comprising an epitaxially grown substrate of first dopant type, an active region and layer of second dopant type, a narrow mesa having less than 20% open area and a side wall slope of less than 85 degrees, wherein said narrow mesa is etched through the active region and layer of second dopant type using in-situ MOCVD, a plurality of current blocking layers, an overclad layer and a contact layer of second dopant type, and an isolation mesa incorporating the narrow mesa, wherein the isolation mesa is etched through the active region, layer of second dopant type and plurality of current blocking layers and wherein the plurality of current blocking layers is grown without exposure to oxygen.

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26-07-2023 дата публикации

Buried heterostructure semiconductor laser and method of manufacture

Номер: EP4214808A1
Принадлежит: NATIONAL RESEARCH COUNCIL OF CANADA

A heterostructure laser is provided comprising an epitaxially grown substrate of first dopant type, an active region and layer of second dopant type, a narrow mesa having less than 20% open area and a side wall slope of less than 85 degrees, wherein said narrow mesa is etched through the active region and layer of second dopant type using in-situ MOCVD, a plurality of current blocking layers, an overclad layer and a contact layer of second dopant type, and an isolation mesa incorporating the narrow mesa, wherein the isolation mesa is etched through the active region, layer of second dopant type and plurality of current blocking layers and wherein the plurality of current blocking layers is grown without exposure to oxygen.

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