28-11-2013 дата публикации
Номер: US20130313697A1
A semiconductor package includes a wiring board; a semiconductor chip mounted on the wiring board; and a radiation plate mounted on the semiconductor chip, including an insulating member including a resin that is the same as a resin included in the wiring board, as a main constituent, a first metal foil formed on a first surface of the insulating member, a second metal foil formed on a second surface of the insulating member, the second surface being an opposite to the first surface, the radiation plate being provided with a through hole that penetrates the first metal foil, the insulating member and the second metal foil, and a metal layer formed to cover the inner surface of the through hole to thermally connect the first metal foil and the second metal foil by penetrating the insulating member in a thickness direction. 1. A semiconductor package comprising:a wiring board;a semiconductor chip mounted on the wiring board; and an insulating member including a resin that is the same as a resin included in the wiring board, as a main constituent,', 'a first metal foil formed on a first surface of the insulating member,', 'a second metal foil formed on a second surface of the insulating member,', 'the second surface being an opposite to the first surface,', 'the radiation plate being provided with a through hole that penetrates the first metal foil, the insulating member and the second metal foil, and', 'a metal layer formed to cover the inner surface of the through hole to thermally connect the first metal foil and the second metal foil by penetrating the insulating member in a thickness direction., 'a radiation plate mounted on the semiconductor chip, including'}2. The semiconductor package according to claim 1 ,wherein the first metal foil and the second metal foil cover the entireties of the first surface and the second surface of the insulating member, respectively, andwherein the second metal foil is bonded to the semiconductor chip directly or via an adhesion ...
Подробнее