Optical control nano second electric igniter

Method for preparing all-dry etching dissolved silicon chip for microstructure manufacturing

The invention discloses a method for preparing an all-dry etching dissolved silicon chip for microstructure manufacturing, which belongs to the technical field of microelectronic mechanical system (MEMS) processing. The method comprises the following processing steps of: (a) preparing a glass electrode; (b) preparing a silicon step and a microstructure; (c) performing glass-silicon electrostatic bonding and grooving a piece of borosilicate glass; and (d) processing the dissolved chip to obtain a needed product. The method uses an SOI silicon chip and uses an all-dry etching process to realizethe microstructure manufacturing. The all-dry etching dissolved silicon chip has the characteristics of thick movable silicon structure layer, small residual stress, no 'liquid bridge' adhesion, environmental protection, no toxicity and the like, and can be used for manufacturing a plurality of MEMS devices such as micro-inertia devices, optical devices, microwave devices, pressure sensors and the like ...

Method for preparing all-dry etching dissolved silicon chip for microstructure manufacturing

The invention discloses a method for preparing an all-dry etching dissolved silicon chip for microstructure manufacturing, which belongs to the technical field of microelectronic mechanical system (MEMS) processing. The method comprises the following processing steps of: (a) preparing a glass electrode; (b) preparing a silicon step and a microstructure; (c) performing glass-silicon electrostatic bonding and grooving a piece of borosilicate glass; and (d) processing the dissolved chip to obtain a needed product. The method uses an SOI silicon chip and uses an all-dry etching process to realize the microstructure manufacturing. The all-dry etching dissolved silicon chip has the characteristics of thick movable silicon structure layer, small residual stress, no 'liquid bridge' adhesion, environmental protection, no toxicity and the like, and can be used for manufacturing a plurality of MEMS devices such as micro-inertia devices, optical devices, microwave devices, pressure sensors and the ...

Static stiffness type silicon micro resonance acceleration sensor chip

The invention provides a static stiffness type silicon micro resonance acceleration sensor chip. The sensor chip comprises two clamped vibration beams, driving comb tooth capacitor fixing pole plates, detection parallel plate capacitor fixing pole plates and a mass block. The mass block is arranged between the two clamped vibration beams, a set of parallel pole plates on the clamped vibration beams and one set of parallel pole plates on the mass block form a parallel plate capacitor for introducing static stiffness to the clamped vibration beams, and the other set of parallel pole plates on the clamped vibration beams and the detection parallel plate capacitor fixing pole plates form a detection parallel plate capacitor. In the process of working, the clamped vibration beams conduct double-side driving and form closed loop resonance through the detection parallel plate capacitor and a driving circuit, direct-current bias voltages are exerted between parallel plate capacitance pole plates ...

Temperature control device for micro sensor

The invention discloses a local temperature control device for a micro sensor. The device is characterized in that a micro heater and a micro temperature sensor are arranged in the micro sensor; local environmental temperature of a mechanosensitive chip of the micro sensor is raised to a preset temperature point through the micro heater; the micro temperature sensor senses the change of the environmental temperature; and a temperature point control circuit is connected with the micro temperature sensor and the micro heater to control heating current of the micro heater according to output of the micro temperature sensor. The micro heater and the micro temperature sensor are micron-scale electronic parts which are prepared by using a micro electromechanical system machining process and are integrated with the mechanosensitive chip of the micro sensor to form an integrated element. Through the device, the using accuracy of the micro sensor can be improved; and the device is used for the micro ...

Micro-inertia switch chip and preparation method thereof

The invention provides a micro-inertia switch chip and a preparation method thereof. The micro-inertia switch chip comprises a glass seal cap, a silicon tube core, a silicon frame and a glass substrate, wherein the silicon tube core is a micro-structure of a plane rectangular spiral beam-square mass block; the square mass block moves toward the glass substrate under the inertia acceleration function; and a metal layer on the square mass block is contacted with two metal electrodes on the glass substrate at the same time when the inertia acceleration reaches a closed threshold so as to provide a switch close signal. By adopting the micro-structure of the plane rectangular spiral beam-square mass block, the invention solves the design problem of low-frequency spring-mass structure of the micro-inertia switch. Through using the micro-manufacture technology of a double-buried layer SOI (Silicon On Insulator) chip and MEMS (Micro-electromechanical Systems), the preparation problem of high-performance ...

Detection method and device thereof for charge balance type micro-accelerometer gauge head differential capacitor

The invention provides a detection method and a device thereof for a charge balance type micro-accelerometer gauge head differential capacitor. A capacitance type micro-accelerometer gauge head is provided with two fixed plate electrodes and a movable plate electrode, and the three electrodes form the differential capacitor. Alternating current drive signals are exerted on the two fixed plate electrodes and coupled to the movable plate electrode, wherein the phase positions of the alternating current drive signals are complementary and the amplitude of the alternating current drive signals can be regulated dynamically, alternating current charges of a middle electrode is detected, the amplitude of the alternating current drive signals is adjusted after demodulation and control of proportional-integral, so that the two fixed plate electrodes are coupled to the movable plate electrode, the charges are offset automatically, rebalance of the charges is formed, and the proportional-integral ...

A method and a device for igniting detonators

Completely-integrated impact piece ignitor and preparation method thereof

The invention discloses a completely-integrated impact piece ignitor and a preparation method thereof, which belong to the technical filed of initiators and pyrotechnics. On the basis of a micro electronic mechanical system (MEMS) processing technology, the assembly can be finished in the process of processing a bridge foil, a flying plate, an accelerating chamber and a reflection plate, thus thepreparation method is beneficial to improving the assembly precision of devices. In addition, the completely-integrated impact piece ignitor has the characteristic of parallel processing of an integrated circuit, is convenient to produce in large batch and reduces the manufacturing cost, and is beneficial to improving the consistency and the reliability of the process; and meanwhile, by using themetal bridge foil, the completely-integrated impact piece ignitor has short igniting time and can be widely applied to ignition of a plurality of novel high and safe initiators and pyrotechnics.