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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 108. Отображено 82.
26-01-2012 дата публикации

METHOD AND SYSTEM FOR ALIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE

Номер: US20120018666A1
Автор: Kuczynski Joseph, SINHA Arvind K., Splittstoesser Kevin A., Tofil Timothy J.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

The exemplary embodiments of the present invention provide a method and system for aligning graphite nanofibers in a thermal interface material to enhance the thermal interface material performance. The method includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. The system includes the graphite nanofibers configured in a herringbone configuration and a means for dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The system further includes a means for applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. 1. A method for aligning graphite nanofibers in a thermal interface material to enhance the thermal interface material performance , comprising:creating the graphite nanofibers from graphite particles in a configuration around a magnetic catalytic seed;dispersing the graphite nanofibers into the thermal interface material;applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material.2. The method of claim 1 , wherein the magnetic catalytic seed is metal.3. The method of claim 1 , comprising:casting the thermal interface material into a sheet mold; andcutting the thermal interface material into a desired footprint.4. The method of claim 1 , wherein the graphite particles are in a herringbone configuration around the catalytic seed in the graphite nanofibers.5. The method of claim 1 , wherein the graphite nanofibers are aligned along the conductive axis of the graphite fibers.6. The method of claim 5 , wherein the graphite nanofibers are aligned perpendicular to mating surfaces of the thermal interface material.7. The method ...

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Номер записи: 1
15-03-2012 дата публикации

ELECTRONIC MODULE WITH LATERALLY-CONDUCTING HEAT DISTRIBUTOR LAYER

Номер: US20120063095A1
Автор: SINHA Arvind K., WECKMAN Kory W.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure. 1. An electronic module comprising:a first component disposed over a second component;a plurality of electrical connect structures disposed between and electrically connecting the first component and the second component; anda heat distributor disposed between the first component and the second component, the heat distributor comprising a thermally conductive material and extending laterally beyond an edge of at least the first component to facilitate conduction of heat laterally out from between the first component and the second component past the edge of the first component, the heat distributor comprising a plurality of openings sized and positioned to allow the plurality of electrical connect structures to pass therethrough without electrically contacting the heat distributor, the heat distributor being electrically isolated from the plurality of electrical connect structures.2. The electronic module of claim 1 , further comprising a thermally conductive enclosure sized and configured to facilitate ...

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Номер записи: 2
12-04-2012 дата публикации

Providing Thermal Compensation for Topographic Measurement at an Elevated Temperature Using a Non-Contact Vibration Transducer

Номер: US20120086952A1
Автор: Arvind K. Sinha
Принадлежит: International Business Machines Corp

A mechanism for providing thermal compensation when measuring surface topography at an elevated temperature using a non-contact vibration transducer, such as a laser Doppler vibrometer (LDV). Thermal compensation is provided to a detector output signal to correct for thermal diffraction of a reflected portion of a beam of radiant energy directed at a surface of a test object. The thermal compensation is based on a calculated deviation between the detector output signal r 2 at an elevated temperature and the detector output signal r 1 at approximately room temperature. In one embodiment, the thermal compensation mechanism calculates a stationary signal r 3 (t) which represents the detector output signal without noise and corrected for thermal diffraction at the elevated temperature according to the following equation: r 3  ( t ) = lim T → ∞  1 / T  ∫ - t / 2 + t / 2  r 2 *  ( t ) * r 2 *  ( t + Δ   t )    t , wherein T represents the total number of spectrums measured at the elevated temperature at multiple times upon which the compensation is based, and wherein r 2 *=r 2 −r 2 (baseline).

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Номер записи: 3
29-11-2012 дата публикации

Use of a Local Constraint to Enhance Attachment of an IC Device to a Mounting Platform

Номер: US20120299201A1
Автор: Arvind K. Sinha, Eric V. Kline, Michael R. Rasmussen
Принадлежит: International Business Machines Corp

An embodiment is directed to an IC mounting assembly that comprises an IC device having a first planar surface, wherein multiple electrically conductive first terminals are located at the first surface. The assembly further comprises an IC device mounting platform having a second planar surface in closely spaced relationship with the first surface, wherein multiple electrically conductive second terminals are located at the second surface, each second terminal corresponding to one of the first terminals. A solder element extends between each first terminal and its corresponding second terminal, and a constraining element is fixably joined to the second surface, wherein the constraining element has a CTE which is selectively less than the CTE of the mounting platform at the second surface. The constraining element is provided with a number of holes or apertures, and each hole is traversed by a solder element that extends between a first terminal and its corresponding second terminal.

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Номер записи: 4
24-01-2013 дата публикации

System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3d chip stacks

Номер: US20130020716A1
Автор: Arvind K. Sinha, Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil
Принадлежит: International Business Machines Corp

The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip.

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Номер записи: 5
07-02-2013 дата публикации

IMPLEMENTING ENHANCED THERMAL CONDUCTIVITY IN STACKED MODULES

Номер: US20130032935A1
Автор: "OConnell Kevin M.", SINHA Arvind K., WECKMAN Kory W.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A method and structures are provided for implementing enhanced thermal conductivity between a lid and heat sink for stacked modules. A chip lid and lateral heat distributor includes cooperating features for implementing enhanced thermal conductivity. The chip lid includes a groove along an inner side wall including a flat wall surface and a curved edge surface. The lateral heat distributor includes a mating edge portion received within the groove. The mating edge portion includes a bent arm for engaging the curved edge surface groove and a flat portion. The lateral heat distributor is assembled into place with the chip lid, the mating edge portion of the lateral heat distributor bends and snaps into the groove of the chip lid. The bent arm portion presses on the curved surface of the groove, and provides an upward force to push the flat portion against the flat wall surface of the groove. 1. A structure for implementing enhanced thermal conductivity for stacked modules comprising:a chip lid;a lateral heat distributor;said chip lid and said lateral heat distributor including cooperating mating features for implementing enhanced thermal conductivity between said chip lid and said lateral heat distributor;said chip lid including a groove along an inner side wall; said groove including a flat wall surface and a curved edge surface;said lateral heat distributor including a mating edge portion received within said groove of said chip lid; said mating edge portion including a bent arm for engaging said curved edge surface of said groove and a flat portion for engaging said flat wall surface of said chip lid groove; andsaid lateral heat distributor being assembled with said chip lid, said bent arm portion pressing on the curved surface of the groove, and providing an upward force to push said flat portion against said flat wall surface of said chip lid groove.2. The structure as recited in wherein the stacked module includes a stack including a first chip and a second chip; ...

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Номер записи: 6
28-02-2013 дата публикации

Motherboard Assembly for Interconnecting and Distributing Signals and Power

Номер: US20130055192A1
Автор: Colbert John L., SINHA Arvind K., Weekly Roger D.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Mechanisms for interconnecting and distributing signals and power between PCBs are provided. A first PCB having land grid arrays (LGAs) and a first wiring layer designed for interconnect components on the first PCB, and a second wiring layer for connecting the components to a second PCB, are provided. The second PCB has opposed parallel first and second surfaces, the first surface having a LGA. A wiring layer designed to interconnect components on the second PCB, and a layer for interconnecting the components on the second PCB with the components on the first PCB, are provided. A first interposer couples to a LGA of a first surface of the first PCB and connects a component to the first PCB. A second interposer is sandwiched between and couples to a LGA of a second surface of the first PCB and to the LGA of the first surface of the second PCB. 110-. (canceled)11. A computer-implemented method for generating a motherboard assembly having first and second multilayered coplanar printed circuit boards (PCBs) , each having opposed parallel first and second surfaces , and first and second LGA interposers , comprising;disposing at least one land grid array (LGA) on each surface of the first PCB;assigning at least one wiring layer (Y) of the first PCB to only electrically interconnect components on or within the first PCB, and at least one wiring layer (X) to only electrically connect the components on the first PCB to the second PCB;disposing at least one LGA on the first surface of the second PCB;assigning at least one wiring layer (V) of the second PCB to only electrically interconnect components on or within the second PCB, and at least one layer (X) to only electrically interconnect the components on the second PCB with the components on the first PCB;coupling a first LGA interposer to the LGA disposed on the first surface of the first PCB for electrically connecting at least one component to the first PCB; andcoupling a second LGA interposer to the LGA disposed on the ...

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Номер записи: 7
16-05-2013 дата публикации

Plug and receptacle arrangement with connection sensor

Номер: US20130122738A1
Автор: Arvind K. Sinha, Mark D. Plucinski, Phillip V. Mann, Sandra J. Shirk/Heath
Принадлежит: International Business Machines Corp

An electrical connector monitoring system for a plug and receptacle assembly, that includes a plug connected to the plug assembly, a recess located within the plug, an electrically insulative layer disposed in the recess, a wear member disposed on the plug that at least partially traverses the insulated recess and in electrical contact with the plug, a contact member movably connected with a receptacle of the receptacle, and a signal device in electrical connection through a circuit with the plug, wear member, and contact member when the plug is fully seated within the receptacle.

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Номер записи: 8
11-07-2013 дата публикации

IMPLEMENTING ENHANCED DIMENSIONAL STABILITY WITH GRAPHITE NANOTUBE HYBRID SOCKET

Номер: US20130178092A1
Автор: "OConnell Kevin M.", Mann Phillip V., Plucinski Mark D., Shirk/Heath Sandra J., SINHA Arvind K.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A method and structure for implementing enhanced dimensional stability with a graphite nanotube hybrid socket. A socket housing wall includes a plurality of aligned graphite nanofibers. The plurality of aligned graphite nanofibers distributing heat and providing enhanced dimensional stability. For example, the plurality of aligned graphite nanofibers more evenly distributes heat when the socket is undergoing solder reflow processes, thereby reducing strain. 2. The structure as recited in wherein said socket housing wall containing said plurality of aligned graphite nanofibers is formed by an extrusion process using a die and a set mixture of a resin and graphite nanofibers.3. The structure as recited in wherein said plurality of aligned graphite nanofibers includes a plurality of vertically aligned graphite nanofibers (VAGNF).4. The structure as recited in wherein said plurality of aligned graphite nanofibers includes a plurality of horizontally aligned graphite nanofibers (HAGNF).5. The structure as recited in wherein said plurality of aligned graphite nanofibers includes a plurality of vertically aligned graphite nanofibers (VAGNF) and a plurality of horizontally aligned graphite nanofibers (HAGNF).6. The structure as recited in wherein said socket housing wall including the aligned graphite nanofibers is formed of a durable claim 1 , insulating material.7. The structure as recited in wherein said socket housing wall including the aligned graphite nanofibers is formed of a plastic material.8. The structure as recited in wherein said socket housing wall including the aligned graphite nanofibers is formed of a polymer material.9. The structure as recited in wherein said socket includes a hybrid land grid array (LGA) socket housing.10. A method for implementing enhanced dimensional stability for a hybrid socket comprising:providing a socket housing wall including a plurality of aligned graphite nanofibers contained in said socket housing wall; anddistributing heat ...

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Номер записи: 9
05-12-2013 дата публикации

Heat spreader flatness detection

Номер: US20130321008A1
Автор: Arvind K. Sinha, Kory W. WECKMAN
Принадлежит: International Business Machines Corp

A heat spreader includes a plurality of sensors that indicate that the heat spreader is flat against a chip stack. One or more nodes within a sensor are electrically connected. The electrical resistance values of the connection may be compared to determine if the nodes within the sensors are relatively flat. Sensor flatness may be correlated to heat spreader flatness for determining whether the heat spreader is flat against the chip stack when the heat spreader is installed upon the chip stack.

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Номер записи: 10
16-01-2014 дата публикации

ELECTRONIC MODULE WITH LATERALLY-CONDUCTING HEAT DISTRIBUTOR LAYER

Номер: US20140016271A1
Автор: SINHA Arvind K., WECKMAN Kory W.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure. 1. An electronic module comprising:a first component disposed over a second component;a plurality of electrical connect structures disposed between and electrically connecting the first component and the second component; anda heat distributor disposed between the first component and the second component, the heat distributor comprising a thermally conductive material and extending laterally beyond an edge of at least the first component to facilitate conduction of heat laterally out from between the first component and the second component past the edge of the first component, the heat distributor comprising a plurality of openings sized and positioned to allow the plurality of electrical connect structures to pass therethrough without electrically contacting the heat distributor, the heat distributor being electrically isolated from the plurality of electrical connect structures.2. The electronic module of claim 1 , further comprising a thermally conductive enclosure sized and configured to facilitate ...

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Номер записи: 11
13-03-2014 дата публикации

HORIZONTALLY AND VERTICALLY ALIGNED GRAPHITE NANOFIBERS THERMAL INTERFACE MATERIAL FOR USE IN CHIP STACKS

Номер: US20140070393A1
Автор: Bartley Gerald K., III John E., Johnson Charles L., Kelly, Kuczynski Joseph, Motschman David R., SINHA Arvind K., Splittstoesser Kevin A., Tofil Timothy J.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip 1. A method for enhancing the cooling of a chip stack of semiconductor chips , comprising:creating a first chip with circuitry on a first side;creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors; andplacing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip.2. The method of claim 1 , wherein the nanofibers aligned parallel to mating surfaces of the first chip and the second chip draw heat from the first chip and the second chip to the edges of the thermal interface material pad and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip creates a vertical heat transmission channel between the mating surfaces of the first chip and the second chip.3. The method of claim 2 , wherein the vertical heat transmission block is created by a localized heating of an area in the thermal interface material pad and using a magnetic mask to align nanofibers perpendicular to mating surfaces of the first chip and the second chip in the heated area.4. The method of claim 2 , wherein the vertical heat transmission block is created by cutting into pieces a thermal interface material with ...

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Номер записи: 12
13-03-2014 дата публикации

Chassis with an airflow adjustment

Номер: US20140073234A1
Автор: Arvind K. Sinha, Bret P. Elison, Phillip V. Mann
Принадлежит: International Business Machines Corp

An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, an adjustable vane is positioned so that air in a channel is diverted from a first cooling zone to a second cooling zone by the adjustable vane to another part of the chassis using a control mechanism. The apparatus can be controlled in a way that regulates temperature of an electronic component by adjusting airflow within the chassis.

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Номер записи: 13
27-03-2014 дата публикации

IMPLEMENTING MICROSCALE THERMOACOUSTIC HEAT AND POWER CONTROL FOR PROCESSORS AND 3D CHIPSTACKS

Номер: US20140083094A1
Автор: Elison Bret P., Mann Phillip V., SINHA Arvind K.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A method and apparatus are provided for implementing microscale thermoacoustic heat and power control for processors and three dimensional (3D) chip stacks. A thermoacoustic heat engine is integrated with a 3D chip-stack and high power processors. The thermoacoustic heat engine is used in cooperation with a heat sink associated with the 3D chip-stack. Predefined connecting layers connect the 3D chip-stack to a cooling end of a thermoacoustic stack of the thermoacoustic heat engine, allowing the cooled end of the resonator to maintain temperature within the 3D chip-stack and to increase the efficiency of the heat sink. 1. An apparatus for implementing microscale thermoacoustic heat and power control for processors and three dimensional (3D) chip stacks comprising:a thermoacoustic heat engine integrated with a 3D chip-stack;said thermoacoustic heat engine being used in cooperation with a heat sink associated with the 3D chip-stack; said thermoacoustic heat engine including an acoustic resonator connected to a thermoacoustic stack; anda plurality of predefined layers connecting the 3D chip-stack to a first cool end of said thermoacoustic stack of said thermoacoustic heat engine, allowing said first cool end of said resonator to maintain temperature within the 3D chip-stack and to increase the efficiency of the heat sink.2. The apparatus as recited in wherein said predefined connecting layers are formed of a highly conductive material.3. The apparatus as recited in wherein said highly conductive material includes graphene.4. The apparatus as recited in wherein said predefined connecting layers include highly conductive thin fins.5. The apparatus as recited in wherein said thermoacoustic heat engine claim 1 , under low load or idle operation allows residual heat to force resonation of the transformer providing waste heat power generation.6. The apparatus as recited in further includes a hot plate in direct contact said heat sink associated with said 3D chip-stack.7. The ...

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Номер записи: 14
27-03-2014 дата публикации

IMPLEMENTING GRAPHENE INTERCONNECT FOR HIGH CONDUCTIVITY APPLICATIONS

Номер: US20140083741A1
Автор: Plucinski Mark D., SINHA Arvind K., Thompson Thomas S.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A method, and structures for implementing enhanced interconnects for high conductivity applications. An interconnect structure includes an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane. A winded graphene ribbon is carried around the electrically conductive interconnect member, providing increased electrical current carrying capability and increased thermal conductivity. 1. A structure for implementing enhanced interconnects for high conductivity applications comprising:an interconnect structure comprisingan electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane; anda winded graphene ribbon being carried around said electrically conductive interconnect member, said winded graphene ribbon providing increased electrical current carrying capability and increased thermal conductivity.2. The structure as recited in wherein said predefined shape of said electrically conductive interconnect member includes a generally S-shape.3. The structure as recited in wherein said predefined shape of said electrically conductive interconnect member includes a controlled cross-section geometry defining a predefined area for receiving said winded graphene ribbon.4. The structure as recited in wherein said electrically conductive interconnect member is formed of beryllium copper.5. The structure as recited in wherein said winded graphene ribbon comprises graphene nano-ribbons.6. The structure as recited in wherein said winded graphene ribbon extends around the predefined shape of the electrically conductive interconnect member including the spaced apart end portions.7. The structure as recited in wherein said winded graphene ribbon enables substantially increased electrical current carrying capability without substantially increasing Joule heating.9. The structure as recited in includes ...

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Номер записи: 15
27-03-2014 дата публикации

SECURING OPPOSING COMPONENTS TO A CIRCUIT BOARD

Номер: US20140087586A1
Автор: "OConnell Kevin M.", SINHA Arvind K., WECKMAN Kory W.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

According to embodiments of the invention, an assembly having first and second components may be provided. The first component may include one or more connectors corresponding to one or more through-holes of a circuit board. The second component may include one or more receptacles to fixedly receive the connectors, wherein the first and second components are adapted to be located on opposing sides of the circuit board in an assembled position. In some embodiments, the first and second components may include electrical connectors soldered to the circuit board. In some embodiments, the connectors may include one or more pawls and the receptacles may include one or more ratchets. In other embodiments, the connectors may be threaded members and the receptacles may be threaded apertures. 1. An assembly comprising:a first component having one or more connectors corresponding to one or more through-holes of a circuit board; anda second component having one or more receptacles to fixedly receive the connectors, wherein the first and second components are adapted to be located on opposing sides of the circuit board in an assembled position.2. The assembly of claim 1 , wherein the first and second components have electrical connectors soldered to the circuit board.3. The assembly of claim 1 , wherein the connectors include one or more pawls and the receptacles include one or more ratchets.4. The assembly of claim 3 , wherein a pawl is located on a portion of the outer circumference of a connector.5. The assembly of claim 4 , wherein the connector is coupled to the first component in a manner that allows the connector to be rotated about its axis.6. The assembly of claim 3 , wherein a ratchet is located on a portion of the inner circumference of a receptacle.7. The assembly of claim 6 , wherein the receptacle is coupled to the second component in a manner that allows the receptacle to be rotated about its axis.8. The assembly of claim 1 , wherein the connectors are threaded ...

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Номер записи: 16
07-01-2016 дата публикации

Ball Grid Array Rework

Номер: US20160007457A1
Автор: Arvind K. Sinha, Eric V. Kline
Принадлежит: International Business Machines Corp

Embodiments of the invention relates to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

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Номер записи: 17
07-01-2016 дата публикации

Ball Grid Array Rework

Номер: US20160007515A1
Автор: Arvind K. Sinha, Eric V. Kline
Принадлежит: International Business Machines Corp

Embodiments of the invention relates to a method for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

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Номер записи: 18
21-01-2016 дата публикации

AIR VALVE FOR ELECTRONICS ENCLOSURES

Номер: US20160018008A1
Автор: Anderl William J., Elison Bret P., Mann Phillip V., Moore Arden L., SINHA Arvind K.
Принадлежит:

A method includes rotating a first elongated, inlet-side member of an air valve toward an open configuration when a fan blade is rotating and rotating the first inlet-side member to toward a closed configuration when the fan blade is not rotating. The air valve includes a frame and a sheet of thin material. The frame may have an outlet-side member configured to be mounted on a fan housing and the inlet-side member rotatably coupled to the outlet-side member. The material may have top and bottom edges, and a plurality of folds perpendicular to the top and bottom side edges that divide the sheet into a plurality of sections. The material may be attached to the outlet-side member and the inlet-side member, and configurable between folded and expanded positions. 1. A method for preventing air from flowing through a fan comprising:rotating a first elongated, inlet-side member of an air valve toward an open configuration when a fan blade is rotating; androtating the first inlet-side member to toward a closed configuration when the fan blade is not rotating; [ a first elongated, outlet-side member having a first centrally located pivot point for attachment of a pin and a spring, and configured to be mounted in a fixed position, and', 'the first inlet-side member having a second centrally located pivot point for receiving the pin, and a first end having a first magnetic component attached thereto, the inlet-side member being rotatably coupled to the outlet-side member by the pin,, 'a frame having, 'a first sheet of thin material having top, bottom, first, and second side edges, and a plurality of folds perpendicular to the top and bottom side edges that divide the first sheet into a plurality of sections, wherein the material is configurable between a folded position in which the sections are folded together and an expanded position in which the sections are unfolded, the first side edge of the sheet being attached to the first outlet-side member and the second side edge of ...

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Номер записи: 19
19-01-2017 дата публикации

THERMOSET RESIN FLOW MODELS FOR PRINTED CIRCUIT BOARD LAMINATES

Номер: US20170017733A1
Автор: Kuczynski Joseph, SINHA Arvind K., Splittstoesser Kevin A., Tofil Timothy J.
Принадлежит:

In an example, a method includes storing thermoset resin rheology data associated with a thermoset resin at a memory. The thermoset resin rheology data includes a plurality of sets of dynamic fluid flow properties that are measured for the thermoset resin. The method includes receiving, at a computing device, information associated with a printed circuit board (PCB) laminate design. The method also includes receiving, at the computing device, a first set of PCB lamination parameters. The method further includes storing, at the computing device, a first thermoset resin flow model. The first thermoset resin flow model is generated based on the thermoset resin rheology data, the information associated with the PCB laminate design, and the first set of PCB lamination parameters. 1. A method comprising:storing thermoset resin rheology data at a memory, the thermoset resin rheology data including a plurality of dynamic fluid flow properties that are measured for a thermoset resin;receiving, at a computing device, information associated with a printed circuit board (PCB) laminate design;receiving, at the computing device, a first set of PCB lamination parameters; andstoring, at the computing device, a first thermoset resin flow model that is generated based on the thermoset resin rheology data, the information associated with the PCB laminate design, and the first set of PCB lamination parameters.2. The method of claim 1 , further comprising determining claim 1 , based on the first thermoset resin flow model claim 1 , whether a first PCB lamination process that is based on the first set of PCB lamination parameters is expected to result in resin starvation.3. The method of claim 2 , further comprising claim 2 , in response to determining that the first PCB lamination process is expected to result in resin starvation claim 2 , modifying at least one parameter of the first set of PCB lamination parameters to generate a second set of PCB lamination parameters.4. The method of ...

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Номер записи: 20
19-02-2015 дата публикации

SEALING CONNECTOR TO MITIGATE CORROSION

Номер: US20150050823A1
Автор: Mann Phillip V., Plucinski Mark D., Shirk/Heath Sandra J., SINHA Arvind K.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

An electrical connector system for mitigating corrosion and maintaining an internal environment conducive for connectivity and the protection of internal electrical contacts is disclosed. The electrical system can include a female connector device designed to couple with a male connector device, and to enclose a chamber containing a corrosion deterring fluid. One or more electrical contacts can be located within the chamber, and be configured to interface with connecting members of a male connector device. The electrical connector system can also include one or more sealing gates configured to act as a sealing membrane that is designed to separate the corrosion deterring fluid in the chamber from fluid external to the chamber while allowing the connecting members of the male connector device to be inserted through the gates and into the chamber. 1. A female connector device comprising:an outer casing defined by a top and bottom wall, a rear wall and a pair of side walls, and designed to couple with a male connector device and to enclose a chamber containing a corrosion deterring fluid;one or more electrical contacts within the chamber and configured to interface with connecting members of the male connector device; andone or more sealing gates configured to act as a sealing membrane that is designed to separate the corrosion deterring fluid in the chamber from fluid external to the chamber while allowing the connecting members of the male connector device to be inserted through the gates and into the chamber.2. The device according to claim 1 , wherein the sealing gates are configured to deform claim 1 , allowing for penetration by connecting members of the male connector device and forming a hermetic seal that impedes leakage of the corrosion deterring fluid.3. The device according to claim 1 , wherein support scaffolding upholds the electrical contacts claim 1 , and is configured to guide the connecting members to the electrical contacts.4. The device according to ...

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Номер записи: 21
15-03-2018 дата публикации

DEMAND-BASED CHARGING OF A HEAT PIPE

Номер: US20180073815A1
Автор: Anderl William J., Elison Bret P., Mann Phillip V., SINHA Arvind K.
Принадлежит:

A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level. 1. A heat pipe comprising:an interface for thermally coupling a heat source to the heat pipe;a substantially horizontal portion charged with a first quantity of liquid and coupled to the interface;a reservoir that contains a second quantity of the liquid, the reservoir overlying the substantially horizontal portion and having a width and a height, where the width is substantially greater than the height;a capillary connection that connects the reservoir to the substantially horizontal portion;a heater thermally coupled to the reservoir;a temperature sensor in proximity to the interface; anda controller coupled to the heater and the temperature sensor, wherein the controller detects when temperature detected by the temperature sensor exceeds a predetermined threshold, and in response, turns on the heater.2. The heat pipe of wherein the capillary connection has a diameter of 0.1 millimeters (mm) to 0.3 mm.3. The heat pipe of wherein the capillary connection has a hydrophobic coating.4. The heat pipe of wherein turning on the heater by the controller heats the second quantity of ...

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Номер записи: 22
26-03-2015 дата публикации

ELECTRONIC COMPONENT RETAINERS

Номер: US20150082627A1
Автор: Mann Phillip V., Plucinski Mark D., Shirk/Heath Sandra J., SINHA Arvind K.
Принадлежит:

According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include one or more elastic members affixed to the electronic component body. The electronic component assembly may also include a catch mechanism affixed to each elastic member adapted to allow insertion of the elastic member and the catch mechanism through a hole of a circuit board in an extended position, and upon release from the extended position, hold the electronic component body in a fixed position by the tension of the elastic member and the catch mechanism grasping an edge of a surface of the circuit board opposite a surface upon which the electronic component body rests. 1. A method comprising:providing an electronic component body; andaffixing one or more groups of one or more elastic filaments to the electronic component body, wherein the elastic filaments are adapted to deform to a constricted position when a constrictive force is applied and upon removal of the constrictive force return to a natural position; andplacing a tube over each group of one or more elastic filaments, wherein the tube is adapted to contain each group of filaments in the constricted position in order to allow insertion of the tube and the group of one or more elastic filaments into a hole of a circuit board.2. The method of claim 1 , further comprising inserting each group of one or more elastic filaments and the tube into respective holes of the circuit board until the electronic component body contacts a surface of the circuit board.3. The method of claim 1 , further comprising removing the tube from each group of one or more elastic filaments claim 1 , wherein the elastic filaments are allowed to attempt to return to a natural position and therefore grasp an edge of the hole of the circuit board and thereby hold the electronic component body in a fixed position. The ...

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Номер записи: 23
22-03-2018 дата публикации

DEMAND-BASED CHARGING OF A HEAT PIPE

Номер: US20180080720A1
Автор: Anderl William J., Elison Bret P., Mann Phillip V., SINHA Arvind K.
Принадлежит:

A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature. 1. A heat pipe comprising:an interface for thermally coupling a heat source to the heat pipe;a substantially horizontal portion charged with a first quantity of liquid and coupled to the interface;a reservoir in a lower portion of the substantially horizontal portion that contains a second quantity of the liquid; anda temperature-actuated valve overlying the reservoir, wherein the temperature-actuated valve seals the second quantity of the liquid in the reservoir when the temperature is below an actuation temperature and unseals the second quantity of liquid in the reservoir when the temperature is above the actuation temperature.2. The heat pipe of wherein claim 1 , when the temperature is above the actuation temperature claim 1 , the first and second quantities of the liquid combine to form a third quantity of the liquid that comprises a sum of the first and second quantities of the liquid.3. The heat pipe of wherein the temperature-actuated valve comprises a bi-metal valve.4. The heat pipe of wherein the bi-metal valve has a first end fixedly attached to an edge of the reservoir with an opposing second end free to move from a first position that seals the reservoir to a second position that unseals the reservoir.5. The heat pipe of wherein the reservoir comprises a valve seat the temperature-actuated ...

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Номер записи: 24
19-06-2014 дата публикации

ELECTRONIC COMPONENT RETAINERS

Номер: US20140165378A1
Автор: Mann Phillip V., Plucinski Mark D., Shirk/Heath Sandra J., SINHA Arvind K.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include one or more elastic members affixed to the electronic component body. The electronic component assembly may also include a catch mechanism affixed to each elastic member adapted to allow insertion of the elastic member and the catch mechanism through a hole of a circuit board in an extended position, and upon release from the extended position, hold the electronic component body in a fixed position by the tension of the elastic member and the catch mechanism grasping an edge of a surface of the circuit board opposite a surface upon which the electronic component body rests. 1. An assembly comprising:an electronic component body;one or more elastic members affixed to the electronic component body, wherein the elastic members are adapted to extend away from the electronic component body when a tensile force is applied and upon removal of the tensile force return to a natural position; anda catch mechanism affixed to each elastic member, wherein the catch mechanism is adapted to allow insertion of the elastic member and the catch mechanism through a hole of a circuit board in an extended position, and upon release from the extended position, hold the electronic component body in a fixed position by the tension of the elastic member, wherein the catch mechanism grasps an edge of a surface of the circuit board opposite a surface upon which the electronic component body rests.2. The assembly of claim 1 , further comprising the circuit board with one or more holes adapted to receive the one or more elastic members and catch mechanisms.3. The assembly of claim 1 , wherein the elastic members are springs.4. The assembly of claim 1 , wherein the elastic members are made from a material selected from one of a metal and a plastic.5. The assembly of claim 1 , ...

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Номер записи: 25
02-04-2015 дата публикации

Implementing redundant and high efficiency hybrid liquid and air cooling for chipstacks

Номер: US20150092349A1
Автор: Arden L. Moore, Arvind K. Sinha, Bret P. Elison, Phillip V. Mann
Принадлежит: International Business Machines Corp

A method and apparatus are provided for implementing redundant and high efficiency hybrid liquid and air cooling for chipstacks. The apparatus includes an electronic module having a chipstack of one or more semiconductor chips; a liquid heat sink lid over the chipstack; an inlet flow and an outlet flow enabling a low viscosity dielectric liquid to pass through the lid and around the chipstack of the electronic module; a top of said electronic module providing an airflow heat sink support surface for airflow cooling used in parallel to under-lid liquid cooling.

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Номер записи: 26
19-06-2014 дата публикации

RECEPTACLE WITH HEAT MANAGEMENT FOR ELECTRONIC AND OPTICAL SYSTEMS

Номер: US20140170898A1
Автор: Elison Bret P., Mann Phillip V., Moore Arden L., SINHA Arvind K.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

An apparatus that is a receptacle adapted for receiving a connector. The apparatus may further include a hinged heat sink included in the receptacle. The hinged heat sink adapted in an open position for insertion and removal of a cable. The hinged heat sink further adapted in a closed position to make thermal contact with a thermally active location of the connector wherein a thermal path is provided for a dissipation point on the outside of the electronic receptacle. 1. An apparatus , comprising:a receptacle adapted for receiving a connector;a hinged heat sink included in the receptacle, and adapted in an open position for insertion and removal of a cable and adapted in a closed position to make thermal contact with a thermally active location of the connector wherein a thermal path is provided for a dissipation point on the outside of the electronic receptacle.2. The apparatus of claim 1 , further comprising:a slider within the electronic receptacle, the slider adapted such that the hinged heat sink is prevented from closing when the connector is not fully inserted into the receptacle, and that full insertion of the connector into the receptacle results in the relocation of the slider such that the hinged heat sink will actuate into a closed position.3. The apparatus of claim 1 , further comprising:a latch mechanism built into the receptacle such that the receptacle locks onto the connector when fully inserted into the receptacle.4. The apparatus of claim 3 , further comprising a latch release mechanism built into the receptacle.5. The apparatus of claim 3 , wherein the latch is built into the hinged heat sink.6. The apparatus of claim 5 , further comprising a latch release mechanism built into the hinged heat sink.7. The apparatus of claim 1 , wherein the dissipation point on the outside of the receptacle is a fin.8. The apparatus of claim 1 , further comprising an element on the inside of the hinged heat sink adapted to make thermal contact with thermally active ...

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Номер записи: 27
30-03-2017 дата публикации

LIGHT PIPE CONNECTOR APPARATUS

Номер: US20170090129A1
Автор: "OConnell Kevin M.", Mann Phillip V., SINHA Arvind K., Stathakis Karl, WECKMAN Kory W.
Принадлежит:

Light can be transmitted between a light source and a light detector or target by using at least two mating connector sections of a light pipe connector. A protrusion of one of the connector sections is designed to be received within a receptacle of another of the connector sections, which can make the light pipe connector mechanically compliant. The two connector sections are fabricated from an optically transmissive material, and have optically reflective surfaces in orthogonal orientations to optically transmissive surfaces adjacent to the light source and the light detector. When the protrusion of one of the connector sections is engaged within the receptacle of another connector section, light can be transmitted through optically transmissive surfaces adjacent to a light source and a light detector, while the orthogonally oriented optically reflective surfaces direct light towards the light detector. 1. A method of operating a light pipe connector to transmit light between a light source and a light detector , the method comprising:optically coupling, to the light source, a first optically transmissive connector section the light pipe connector, the first optically transmissive connector section having a first surface and a first optically reflective surface orthogonal to the first surface;optically coupling, to the light detector, a second optically transmissive connector section of the light pipe connector;inserting a protrusion of the first optically transmissive connector section into a receptacle of the second optically transmissive connector section, the protrusion having a second surface opposite to and in a planar orientation to the first surface, the protrusion further having a second optically reflective surface orthogonal to the second surface, the receptacle having a third surface that, when the protrusion is inserted into the receptacle, is adjacent to and in a planar orientation to the second surface, the second optically transmissive connector ...

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Номер записи: 28
31-03-2016 дата публикации

Managing heat transfer for electronic devices

Номер: US20160095254A1
Автор: Arvind K. Sinha, Karl Stathakis, Kevin M. O'Connell, Phillip V. Mann
Принадлежит: International Business Machines Corp

An apparatus for cooling a heat-producing electronic device is disclosed. The apparatus may include a thermally conductive vessel to mate with and contain a working fluid in contact with the heat-producing electronic device. A bottom side of the thermally conductive vessel may include a sealing surface defining an aperture and configured to mate with, and inside a perimeter of, a top surface of the heat-producing electronic device. The thermally conductive vessel may also include an evaporative cavity formed by mating the thermally conductive vessel with the heat-producing electronic device, and having a wall that is the top surface of the heat-producing electronic device and a wall that is an interior surface of the thermally conductive vessel. The thermally conductive vessel may also include a condensing cavity adjoining the evaporative cavity, to receive heat by condensing the working fluid from a vapor state to a liquid state.

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Номер записи: 29
05-04-2018 дата публикации

Dynamic Keying Assembly

Номер: US20180097329A1
Автор: Arvind K. Sinha, Mark D. Plucinski, Phillip V. Mann, Sandra J. Shirk/Heath
Принадлежит: International Business Machines Corp

A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

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Номер записи: 30
05-04-2018 дата публикации

Dynamic Keying Assembly

Номер: US20180097330A1
Автор: Mann Phillip V., Plucinski Mark D., Shirk/Heath Sandra J., SINHA Arvind K.
Принадлежит:

A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting. 1. A dynamic keying system comprising:a male connector device having a circular perimeter including one or more key features which may be set in a first plurality of settings by revolving around the perimeter of the mail connector device; anda female connector device having circular perimeter including a receptacle configured to be substantially deformable in an initial mode and substantially non-deformable in a subsequent mode, whereinin the initial mode the female connector device is configured to, in response to the introduction of the male connector device, correspond the receptacle to a first setting of the first plurality of settings; andin the subsequent mode the female connector device is configured to permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a setting different than the first setting.2. The system of claim 1 , wherein the one or more key features include one or more ridges protruding from the male connector device claim 1 , the ridges configured to revolve around the perimeter of the ...

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Номер записи: 31
13-04-2017 дата публикации

DEMAND-BASED CHARGING OF A HEAT PIPE

Номер: US20170102187A1
Автор: Anderl William J., Elison Bret P., Mann Phillip V., SINHA Arvind K.
Принадлежит:

A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature. 1. A heat pipe comprising:an interface for thermally coupling a heat source to the heat pipe;a substantially horizontal portion charged with a first quantity of liquid and coupled to the interface;a reservoir in a lower portion of the substantially horizontal portion that contains a second quantity of the liquid; anda temperature-actuated valve overlying the reservoir, wherein the temperature-actuated valve seals the second quantity of the liquid in the reservoir when the temperature is below an actuation temperature and unseals the second quantity of liquid in the reservoir when the temperature is above the actuation temperature.2. The heat pipe of wherein claim 1 , when the temperature is above the actuation temperature claim 1 , the first and second quantities of the liquid combine to form a third quantity of the liquid that comprises a sum of the first and second quantities of the liquid.3. The heat pipe of wherein the temperature-actuated valve comprises a bi-metal valve.4. The heat pipe of wherein the bi-metal valve has a first end fixedly attached to an edge of the reservoir with an opposing second end free to move from a first position that seals the reservoir to a second position that unseals the reservoir.5. The heat pipe of wherein the reservoir comprises a valve seat the temperature-actuated ...

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Номер записи: 32
13-04-2017 дата публикации

DEMAND-BASED CHARGING OF A HEAT PIPE

Номер: US20170102188A1
Автор: Anderl William J., Elison Bret P., Mann Phillip V., SINHA Arvind K.
Принадлежит:

A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level. 1. A heat pipe comprising:an interface for thermally coupling a heat source to the heat pipe;a substantially horizontal portion charged with a first quantity of liquid and coupled to the interface;a reservoir that contains a second quantity of the liquid;a capillary connection that connects the reservoir to the substantially horizontal portion;a heater thermally coupled to the reservoir;a temperature sensor in proximity to the interface; anda controller coupled to the heater and the temperature sensor, wherein the controller detects when temperature detected by the temperature sensor exceeds a predetermined threshold, and in response, turns on the heater.2. The heat pipe of wherein turning on the heater by the controller heats the second quantity of liquid in the reservoir and causes at least a portion of the second quantity of liquid in the reservoir to pass from the reservoir through the capillary connection into the substantially horizontal portion.3. The heat pipe of wherein turning off the heater by the controller causes the liquid in the reservoir to cool and causes at ...

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Номер записи: 33
13-04-2017 дата публикации

DEMAND-BASED CHARGING OF A HEAT PIPE

Номер: US20170102189A1
Автор: Anderl William J., Elison Bret P., Mann Phillip V., SINHA Arvind K.
Принадлежит:

A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature. 1. A method for transferring heat from a heat source using a heat pipe , the method comprising: an interface for thermally coupling the heat source to the heat pipe;', 'a substantially horizontal portion overlying the interface;', 'a reservoir in a lower portion of the substantially horizontal portion that contains liquid; and', 'a temperature-actuated valve overlying the reservoir, wherein the temperature-actuated valve seals the liquid in the reservoir when the temperature is below an actuation temperature and unseals the liquid in the reservoir when the temperature is above the actuation temperature;, 'thermally coupling the heat pipe to the heat source, the heat pipe comprisingthe heat source heating the heat pipe, causing the temperature in the substantially horizontal portion to rise to the actuation temperature;in response to reaching the actuation temperature, the temperature-actuated valve unseals the reservoir, allowing the liquid to pass into the substantially horizontal portion; andas temperature in the substantially horizontal portion falls, the liquid condenses and flows by the force of gravity through the temperature-actuated valve into the reservoir, and when the temperature falls to the actuation temperature, the temperature-actuated valve seals the liquid in the reservoir.2. A method ...

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Номер записи: 34
13-04-2017 дата публикации

DEMAND-BASED CHARGING OF A HEAT PIPE

Номер: US20170102190A1
Автор: Anderl William J., Elison Bret P., Mann Phillip V., SINHA Arvind K.
Принадлежит:

A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level. 1. A method for dynamically charging a heat pipe with a liquid , the method comprising: an interface for thermally coupling a heat source to the heat pipe;', 'a substantially horizontal portion charged with a first quantity of liquid and coupled to the interface;', 'a reservoir that contains a second quantity of the liquid;', 'a capillary connection that connects the reservoir to the substantially horizontal portion;', 'a heater thermally coupled to the reservoir;', 'a temperature sensor in proximity to the interface; and', 'a controller coupled to the heater and the temperature sensor;, 'providing the heat pipe comprisingdetecting when the temperature detected by the temperature sensor exceeds a predetermined threshold; andin response to the detecting when the temperature detected by the temperature sensor exceeds the predetermined threshold, turning on the heater to cause at least a portion of the second quantity of liquid in the reservoir to pass from the reservoir through the capillary connection into the substantially horizontal portion.2. The method of further comprising: ...

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Номер записи: 35
13-04-2017 дата публикации

PIN ATTACH CONVERTER

Номер: US20170104284A1
Автор: Mann Phillip V., Plucinski Mark D., Shirk/Heath Sandra J., SINHA Arvind K.
Принадлежит:

A pin attach converter for coupling an electrical contact to a printed circuit board may include a compliant region having a first length adapted to traverse an aperture in a printed circuit board and provide mechanical and electrical registry with at least one wall of the aperture. The pin attach converter may also include an adapter region coupled to the compliant region, and having a cavity with a second length and adapted to receive the electrical contact, where the second length extends along a same longitudinal axis as the first length, and the cavity is adapted to provide mechanical and electrical registry with the electrical contact. 1a compliant region having a first length adapted to traverse an aperture in a printed circuit board and provide mechanical and electrical registry with at least one wall of a cylindrical void formed by the aperture;a tip region coupled to the compliant region at a first end of the first length along a longitudinal axis parallel to the first length, wherein the tip region is flat;a conical shoulder region having a first base with a circular cross section with a first diameter and a second base with a second circular cross section with a second diameter, wherein the first diameter is smaller than the second diameter and the first base is coupled to the compliant region at a second end of the first length along the longitudinal axis; and wherein the second length extends along a same longitudinal axis as the first length and the cavity is adapted to provide mechanical and electrical registry with the electrical contact, and', 'wherein the conical tip region extends along the longitudinal axis into the conical shoulder region., 'an adapter region coupled to the second base and having a cavity with a second length, the cavity having a conical tip region and a cylindrical portion, the cylindrical portion having a plurality of teeth radially extending from at least one wall of the cavity towards the longitudinal axis for engagement ...

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Номер записи: 36
31-07-2014 дата публикации

HORIZONTALLY ALIGNED GRAPHITE NANOFIBERS IN ETCHED SILICON WAFER TROUGHS FOR ENHANCED THERMAL PERFORMANCE

Номер: US20140210068A1
Автор: Bartley Gerald K., III John E., Johnson Charles L., Kelly, Kuczynski Joseph, Motschman David R., SINHA Arvind K., Splittstoesser Kevin A., Tofil Timothy A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip, and a heat removal device thermally connected to the thermal interface material pad. 1. A method for enhancing the cooling of a chip stack of semiconductor chips , comprising:creating a first chip with circuitry on a first side;creating a second chip with circuitry on a first side that is electrically and mechanically coupled to the first chip by a grid of connectors;placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip; andcreating a heat removal device thermally connected to the thermal interface material pad.2. The method of claim 1 , wherein the heat removal device comprises a heat sink.3. The method of claim 2 , wherein the heat sink is on one side of the chip stack.4. The method of claim 3 , wherein the heat sink is on top of the chip stack.5. The method of claim 1 , wherein the nanofibers aligned parallel to mating surfaces of the first chip and the second chip draw heat from the first chip and the second chip to the edges of the thermal interface material pad and to the heat removal device and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip creates a vertical heat transmission channel between the mating surfaces of the first chip and the second chip to the heat removal device.6. The method of claim 5 , wherein the vertical heat transmission block is created by cutting into pieces a thermal ...

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Номер записи: 37
21-05-2015 дата публикации

COOLING APPARATUS WITH DYNAMIC LOAD ADJUSTMENT

Номер: US20150136365A1
Автор: "OConnell Kevin M.", Mann Phillip V., SINHA Arvind K.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A cooling apparatus is disclosed, which may include multiple heat producing units. The cooling apparatus may also have a thermal interface material (TIM) to facilitate heat transfer away from the heat producing units. The cooling apparatus may also have multiple heat sink columns located above, and designed to conduct heat away from, corresponding heat producing units, through thermally conductive contact with corresponding portions of the TIM layer. The cooling apparatus may also have a load plate located above the heat sink columns, designed to hold the heat sink columns in a relatively fixed position above the heat producing units. The TIM layer may have an initial compressed state between the heat sink columns and the corresponding heat producing units. Each of the heat sink columns may be designed so that, in operation, the corresponding portion of the TIM layer may have a further compressed state. 1using a device having:a first thermal interface material (TIM) layer on a top surface of at least one heat producing unit of a plurality of heat producing units, to facilitate heat transfer away from the at least one heat producing unit;a plurality of heat sink columns above corresponding heat producing units and above the first TIM layer; and exerting a compressive force on each heat sink column, by moving the load plate into a latched position;', 'conducting heat away from the first TIM layer with at least one of the plurality of heat sink columns;', 'adjusting, in response to a first level of heat produced by a first heat producing unit, compression of a first portion the first TIM layer that is above the first heat producing unit by a first amount; and', 'adjusting, in response to a second level of heat produced by a second heat producing unit, compression of a second portion of the first TIM layer that is above a second heat producing unit by a second amount that is different than the first amount., 'a load plate above the heat sink columns, by. A method for ...

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Номер записи: 38
21-05-2015 дата публикации

COOLING APPARATUS WITH DYNAMIC LOAD ADJUSTMENT

Номер: US20150138731A1
Автор: "OConnell Kevin M.", Mann Phillip V., SINHA Arvind K.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A cooling apparatus is disclosed, which may include multiple heat producing units. The cooling apparatus may also have a thermal interface material (TIM) to facilitate heat transfer away from the heat producing units. The cooling apparatus may also have multiple heat sink columns located above, and designed to conduct heat away from, corresponding heat producing units, through thermally conductive contact with corresponding portions of the TIM layer. The cooling apparatus may also have a load plate located above the heat sink columns, designed to hold the heat sink columns in a relatively fixed position above the heat producing units. The TIM layer may have an initial compressed state between the heat sink columns and the corresponding heat producing units. Each of the heat sink columns may be designed so that, in operation, the corresponding portion of the TIM layer may have a further compressed state. 1. A cooling apparatus comprising:a plurality of heat producing units, each having a top surface; a top surface; and', 'a bottom surface adjacent to, and in thermally conductive contact with, the top surfaces of the heat producing units, to facilitate heat transfer away from the heat producing units;, 'a first thermal interface material (TIM) layer, having a top surface; and', 'a bottom surface located above a corresponding heat producing unit that is above and in thermally conductive contact with, the top surface of a corresponding portion of the first TIM layer, each heat sink column designed to conduct heat away from the corresponding portion of the first TIM layer; and', the first TIM layer has an initial compressed state between the heat sink columns and the corresponding heat producing units; and', 'each of the plurality of heat sink columns is designed so that, in operation, the corresponding portion of the first TIM layer has a further compressed state., 'a load plate located above the top surfaces of the heat sink columns and designed to, in a latched state, ...

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Номер записи: 39
12-05-2016 дата публикации

THERMAL SPREADING FOR AN EXTERNALLY PLUGGABLE ELECTRONIC MODULE

Номер: US20160135327A1
Автор: "OConnell Kevin M.", Mann Phillip V., SINHA Arvind K., Stathakis Karl
Принадлежит:

A cooling apparatus for dissipating heat from an electronic module is disclosed. The cooling apparatus may include a thermally conductive shell having a surface in contact with, and configured to conduct heat away from, the module. The apparatus may also include an electrically insulative layer positioned between, and configured to conduct heat from, the module to the shell. The apparatus may also include an electrical cord, attached to the module that contains a thermally conductive layer in thermally conductive contact with the shell that is configured to conduct heat away from the shell. The apparatus may also include an electrically insulative layer between the thermally conductive layer and an electrical conductor within the electrical cord. The apparatus may also include an electrically insulative layer, positioned between the thermally conductive layer and an electrical cord outer surface, configured to convectively dissipate heat from the thermally conductive layer. 1. A method for assembling a cooling apparatus for dissipating heat from a heat-producing electronic module , the method comprising:attaching an electrically insulative layer to at least one interior surface of a thermally conductive shell;attaching a thermally conductive layer of a thermally conductive electrical cord to the thermally conductive shell; andinserting, to form a thermally conductive interface between an outer surface of the heat-producing electronic module and an interior surface of the thermally conductive shell, the heat-producing electronic module into the thermally conductive shell.2. The method of claim 1 , further comprising inserting the heat-producing electronic module and the thermally conductive shell into a thermally conductive housing.3. The method of claim 1 , wherein attaching a thermally conductive layer of a thermally conductive electrical cord to the thermally conductive shell includes a soldering process.4. The method of claim 1 , wherein attaching a thermally ...

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Номер записи: 40
12-05-2016 дата публикации

Thermal spreading for an externally pluggable electronic module

Номер: US20160135332A1
Автор: Arvind K. Sinha, Karl Stathakis, Kevin M. O'Connell, Phillip V. Mann
Принадлежит: International Business Machines Corp

A cooling apparatus for dissipating heat from an electronic module is disclosed. The cooling apparatus may include a thermally conductive shell having a surface in contact with, and configured to conduct heat away from, the module. The apparatus may also include an electrically insulative layer positioned between, and configured to conduct heat from, the module to the shell. The apparatus may also include an electrical cord, attached to the module that contains a thermally conductive layer in thermally conductive contact with the shell that is configured to conduct heat away from the shell. The apparatus may also include an electrically insulative layer between the thermally conductive layer and an electrical conductor within the electrical cord. The apparatus may also include an electrically insulative layer, positioned between the thermally conductive layer and an electrical cord outer surface, configured to convectively dissipate heat from the thermally conductive layer.

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Номер записи: 41
04-06-2015 дата публикации

ELECTRONIC DEVICE COOLING

Номер: US20150156922A1
Автор: Elison Bret P., Mann Phillip V., Moore Arden L., SINHA Arvind K.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing. 110-. (canceled)11. An apparatus for cooling an electronic device , the apparatus comprising:a thermally conductive material forming a continuous loop configured to be partially in frictional contact with a casing of an electronic device and partially located within a cooling region; anda driving device, the driving device configured to advance portions of the loop between the casing and the cooling region.12. The apparatus of claim 11 , further comprising:rolling pins supporting the loop.13. The apparatus of claim 11 , wherein airflow is provided through the cooling region.14. The apparatus of claim 11 , wherein the thermally conductive material is made of copper.15. The apparatus of claim 11 , wherein the casing is made of steel.16. The apparatus of claim 11 , wherein the thermally conductive material is made of copper and the casing is made of steel.17. The apparatus of claim 11 , wherein the electronic device is a direct access storage device.18. The apparatus of claim 11 , wherein the driving device is a gear and wherein the loop comprises teeth which associate with the gear.19. The apparatus of claim 11 , wherein the driving device is a frictional roller. The present disclosure relates generally to the field of computers and more particularly to cooling of computer components.Direct access storage devices (DASDs) are increasing in power and as a result are emitting more electromagnetic interference. In order to pass electromagnetic compatibility these DASDs require additional protection which drastically decreases airflow to the DASDs.Disclosed herein are embodiments of a method for cooling an electronic device. The ...

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Номер записи: 42
04-06-2015 дата публикации

ELECTRONIC DEVICE COOLING

Номер: US20150156923A1
Автор: Elison Bret P., Mann Phillip V., Moore Arden L., SINHA Arvind K.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing. 1. A method for cooling an electronic device , the method comprising:providing a continuous loop of thermally conductive material in a first position, a first portion of the loop in the first position in frictional contact with a casing of the electronic device and a second portion of the loop in the first position located within a cooling region; andadvancing the loop to a second position, the first portion of the loop in the second position located within the cooling region and the second portion of the loop in the second position in frictional contact with the casing of the electronic device.2. The method of claim 1 , wherein rolling pins support the loop.3. The method of claim 1 , wherein airflow is provided through the cooling region.4. The method of claim 1 , wherein the thermally conductive material is made of copper.5. The method of claim 1 , wherein the casing is made of steel.6. The method of claim 1 , wherein the thermally conductive material is made of copper and the casing is made of steel.7. The method of claim 1 , wherein the electronic device is a direct access storage device.8. The method of claim 1 , wherein the advancing the loop to the second position comprises:rotating an object in contact with the loop.9. The method of claim 8 , wherein the object is a gear and wherein the loop comprises teeth which associate with the gear.10. The method of claim 8 , wherein the object is a friction roller. This application is a continuation of co-pending U.S. patent application Ser. No. 14/096,653, filed Dec.The present disclosure relates generally to the field of computers and more particularly to cooling of computer ...

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Номер записи: 43
16-06-2016 дата публикации

Alignment of three dimensional integrated circuit components

Номер: US20160172252A1
Автор: Arvind K. Sinha, Joseph Kuczynski, Karl Stathakis, Kevin M. O'Connell, Phillip V. Mann
Принадлежит: International Business Machines Corp

A method for aligning a chip onto a substrate is disclosed. The method includes, depositing a ferrofluid, onto a substrate that has one or more pads that electrically couple to a semiconductor layer. The method can include a chip with solder balls electrically coupled to the logic elements of the chip, which can be placed onto the deposited ferrofluid, where the chip is supported on the ferrofluid, in a substantially coplanar orientation to the substrate. The method can include determining if the chip is misaligned from a desired location on the substrate. The method can include adjusting the current location of the chip in response to determining that the solder balls of the chip are misaligned from the desired location on the pads of the substrate, until the chip is aligned in the desired location.

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Номер записи: 44
16-06-2016 дата публикации

Alignment of three dimensional integrated circuit components

Номер: US20160172324A1
Автор: Arvind K. Sinha, Joseph Kuczynski, Karl Stathakis, Kevin M. O'Connell, Phillip V. Mann
Принадлежит: International Business Machines Corp

A method for aligning a chip onto a substrate is disclosed. The method includes, depositing a ferrofluid, onto a substrate that has one or more pads that electrically couple to a semiconductor layer. The method can include a chip with solder balls electrically coupled to the logic elements of the chip, which can be placed onto the deposited ferrofluid, where the chip is supported on the ferrofluid, in a substantially coplanar orientation to the substrate. The method can include determining if the chip is misaligned from a desired location on the substrate. The method can include adjusting the current location of the chip in response to determining that the solder balls of the chip are misaligned from the desired location on the pads of the substrate, until the chip is aligned in the desired location.

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Номер записи: 45
16-06-2016 дата публикации

ELECTRONIC MODULE WITH LATERALLY-CONDUCTING HEAT DISTRIBUTOR LAYER

Номер: US20160174416A1
Автор: SINHA Arvind K., WECKMAN Kory W.
Принадлежит:

An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure. 1. An electronic module comprising:a first component disposed over a second component;a plurality of electrical connect structures disposed between and electrically connecting the first component and the second component; anda heat distributor disposed between the first component and the second component, the heat distributor comprising a thermally conductive material and extending laterally beyond an edge of at least the first component to facilitate conduction of heat laterally out from between the first component and the second component past the edge of the first component, the heat distributor comprising a plurality of openings sized and positioned to allow the plurality of electrical connect structures to pass therethrough without electrically contacting the heat distributor, the heat distributor being electrically isolated from the plurality of electrical connect structures.2. The electronic module of claim 1 , further comprising a thermally conductive enclosure sized and configured to facilitate ...

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Номер записи: 46
23-06-2016 дата публикации

Computer system component bay

Номер: US20160179146A1
Автор: Arden L. Moore, Arvind K. Sinha, Bret P. Elison, Phillip V. Mann
Принадлежит: International Business Machines Corp

An apparatus includes a component bay having an operational height and an expanded height. The component bay is moveable between the operational height and the expanded height. A thermal element divides the component bay into one or more compartments, each compartment configured to receive a system component. The component bay at the operational height provides thermal contact between the received system component and the thermal element.

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Номер записи: 47
18-09-2014 дата публикации

Area array device connection structures with complimentary warp characteristics

Номер: US20140268603A1
Автор: Amanda E. Mikhail, Arvind K. Sinha, Mark K. Hoffmeyer
Принадлежит: International Business Machines Corp

A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component.

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Номер записи: 48
30-06-2016 дата публикации

Dual optical and electrical lga contact

Номер: US20160187601A1
Автор: Arvind K. Sinha, Karl Stathakis, Kevin M. O'Connell, Phillip V. Mann
Принадлежит: International Business Machines Corp

A method and structure are provided for implementing a dual optical and electrical land grid array (LGA) contact. A contact for electrical and optical connection between a module and a printed circuit board (PCB) includes material providing electrical connection and an integrated material providing an optical connection; and the contact is used in a land grid array (LGA) arrangement.

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Номер записи: 49
30-06-2016 дата публикации

Dual optical and electrical lga contact

Номер: US20160187602A1
Автор: Arvind K. Sinha, Karl Stathakis, Kevin M. O'Connell, Phillip V. Mann
Принадлежит: International Business Machines Corp

A method and structure are provided for implementing a dual optical and electrical land grid array (LGA) contact. A contact for electrical and optical connection between a module and a printed circuit board (PCB) includes material providing electrical connection and an integrated material providing an optical connection; and the contact is used in a land grid array (LGA) arrangement.

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Номер записи: 50
09-07-2015 дата публикации

Air valve for electronics enclosures

Номер: US20150192219A1
Автор: Arden L. Moore, Arvind K. Sinha, Bret P. Elison, Phillip V. Mann, William J. Anderl
Принадлежит: International Business Machines Corp

An air valve includes a frame and a sheet of thin material. The frame may have an outlet-side member configured mounted on a fan housing and an inlet-side member rotatably coupled to the outlet-side member. The material may have top and bottom edges, and a plurality of folds perpendicular to the top and bottom side edges that divide the sheet into a plurality of sections. The material may be attached to the outlet-side member and the inlet-side member, and configurable between folded and expanded positions. An attraction between a magnetic component on the inlet-side member and a magnetic component on a rotating fan blade may cause the inlet-side member to rotate, moving the material into the folded configuration. When the fan blade is not rotating, a spring attached at a pivot point may cause the inlet-side member to rotate in an opposite direction, moving the material into the expanded position.

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Номер записи: 51
09-07-2015 дата публикации

Area array device connection structures with complimentary warp characteristics

Номер: US20150195901A1
Автор: Amanda E. Mikhail, Arvind K. Sinha, Mark K. Hoffmeyer
Принадлежит: International Business Machines Corp

A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component.

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Номер записи: 52
07-07-2016 дата публикации

Ball Grid Array Rework

Номер: US20160197053A1
Автор: Arvind K. Sinha, Eric V. Kline
Принадлежит: International Business Machines Corp

Embodiments relate to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

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Номер записи: 53
05-07-2018 дата публикации

Ball Grid Array Rework

Номер: US20180190609A1
Автор: Kline Eric V., SINHA Arvind K.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Embodiments relate to an apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components. 1. An apparatus comprising:a ball grid array (BGA) package assembled on to a printed circuit board; anda material placed between the BGA package and the printed circuit board, wherein exposure of the material to a stimulation changes a shape of the material.2. The apparatus of claim 1 , wherein the material is placed interstitially with respect to a matrix of solder joints between the BGA package and the printed circuit board.3. The apparatus of claim 1 , further comprising an applicator in communication with the material claim 1 , the applicator to apply a tensile force between the BGA package and the printed circuit board.4. The apparatus of claim 3 , wherein the tensile force is controlled by a regulator in communication with the applicator.5. The apparatus of claim 1 , wherein the material is placed around a perimeter of a matrix of solder joints between the BGA package and the printed circuit board.6. The apparatus of claim 1 , wherein the stimulation is by an electrical stimulus.7. The apparatus of claim 1 , wherein the stimulation is by a thermal stimulus.8. The apparatus of claim 1 , wherein the stimulation is by a chemical stimulus.9. The apparatus of claim 1 , further comprising the stimulation to elongate and separate the solder joints claim 1 , including a first part of the solder to remain in communication with the BGA package and a second part of the solder to remain in communication with ...

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Номер записи: 54
30-07-2015 дата публикации

Dynamic keying assembly

Номер: US20150214664A1
Автор: Arvind K. Sinha, Mark D. Plucinski, Phillip V. Mann, Sandra J. Shirk/Heath
Принадлежит: International Business Machines Corp

A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

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Номер записи: 55
30-07-2015 дата публикации

Dynamic keying assembly

Номер: US20150214675A1
Автор: Arvind K. Sinha, Mark D. Plucinski, Phillip V. Mann, Sandra J. Shirk/Heath
Принадлежит: International Business Machines Corp

A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

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Номер записи: 56
23-10-2014 дата публикации

Computer system component bay

Номер: US20140312750A1
Автор: Arden L. Moore, Arvind K. Sinha, Bret P. Elison, Phillip V. Mann
Принадлежит: International Business Machines Corp

An apparatus includes a component bay having an operational height and an expanded height. The component bay is moveable between the operational height and the expanded height. A thermal element divides the component bay into one or more compartments, each compartment configured to receive a system component. The component bay at the operational height provides thermal contact between the received system component and the thermal element.

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Номер записи: 57
05-11-2015 дата публикации

DUPLEX FLEXIBLE HEAT EXCHANGER

Номер: US20150318231A1
Автор: Holahan Maurice F., Kline Eric V., Krystek Paul N., Rasmussen Michael R., SINHA Arvind K., Zins Stephen M.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

An apparatus for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow. 1. An apparatus comprising:a first rotational element housed within a first chamber and having a first magnet;a second rotational element housed within a second chamber and having a second magnet;the first rotational element in magnetic communication with the second rotational element;the first chamber having a fluid inlet and a fluid outlet;a first viscous fluid to enter the first chamber via the inlet with a first flow, and the first flow to rotate said first rotational element; andmagnetic properties to communicate with the second magnet of the second chamber in response to a rotation of the first rotational element and to rotate the second rotational element.2. The apparatus of claim 1 , further comprising rotation of the second rotational element to create a fluid flow with a second fluid in the second chamber.3. The apparatus of claim 2 , further comprising rotation of the second fluid to remove heat from a heat source adjacent to the second chamber.4. The apparatus of claim 3 , further comprising said second chamber in thermal communication with said first chamber claim 3 , and said second chamber to transfer heat removed from the heat ...

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Номер записи: 58
08-12-2016 дата публикации

Pin attach converter

Номер: US20160359246A1
Автор: Arvind K. Sinha, Mark D. Plucinski, Phillip V. Mann, Sandra J. Shirk/Heath
Принадлежит: International Business Machines Corp

A pin attach converter for coupling an electrical contact to a printed circuit board may include a compliant region having a first length adapted to traverse an aperture in a printed circuit board and provide mechanical and electrical registry with at least one wall of the aperture. The pin attach converter may also include an adapter region coupled to the compliant region, and having a cavity with a second length and adapted to receive the electrical contact, where the second length extends along a same longitudinal axis as the first length, and the cavity is adapted to provide mechanical and electrical registry with the electrical contact.

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Номер записи: 59
24-12-2009 дата публикации

Method and apparatus of changing pcb pad structure to increase solder volume and strength

Номер: US20090316376A1
Автор: Arvind K. Sinha, Thomas S. Thompson
Принадлежит: International Business Machines Corp

The present disclosure is directed at an apparatus for changing printed circuit board pad structure to increase solder volume and strength. The invention provides increased end row pad and lead size and utilizes a plurality of lead-to-pad and pad-to-lead conforming geometric structures to form a joint providing additional solder surface adhesion area.

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Номер записи: 60
19-04-2011 дата публикации

Method and apparatus of changing PCB pad structure to increase solder volume and strength

Номер: US7929314B2
Автор: Arvind K. Sinha, Thomas S. Thompson
Принадлежит: International Business Machines Corp

The present disclosure is directed at an apparatus for changing printed circuit board pad structure to increase solder volume and strength. The invention provides increased end row pad and lead size and utilizes a plurality of lead-to-pad and pad-to-lead conforming geometric structures to form a joint providing additional solder surface adhesion area.

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Номер записи: 61
01-11-2016 дата публикации

Light pipe connector apparatus

Номер: US9482833B1
Автор: Arvind K. Sinha, Karl Stathakis, Kevin M. O'Connell, Kory W. WECKMAN, Phillip V. Mann
Принадлежит: International Business Machines Corp

Light can be transmitted between a light source and a light detector or target by using at least two mating connector sections of a light pipe connector. A protrusion of one of the connector sections is designed to be received within a receptacle of another of the connector sections, which can make the light pipe connector mechanically compliant. The two connector sections are fabricated from an optically transmissive material, and have optically reflective surfaces in orthogonal orientations to optically transmissive surfaces adjacent to the light source and the light detector. When the protrusion of one of the connector sections is engaged within the receptacle of another connector section, light can be transmitted through optically transmissive surfaces adjacent to a light source and a light detector, while the orthogonally oriented optically reflective surfaces direct light towards the light detector.

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Номер записи: 62
05-12-2017 дата публикации

Demand-based charging of a heat pipe

Номер: US9835384B2
Автор: Arvind K. Sinha, Bret P. Elison, Phillip V. Mann, William J. Anderl
Принадлежит: International Business Machines Corp

A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature.

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Номер записи: 63
16-02-2016 дата публикации

Continuous loop cooling for an electronic device

Номер: US9265179B2
Автор: Arden L. Moore, Arvind K. Sinha, Bret P. Elison, Phillip V. Mann
Принадлежит: International Business Machines Corp

A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing.

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Номер записи: 64
20-04-2010 дата публикации

Electronic assembly and techniques for installing a heatsink in an electronic assembly

Номер: US7701720B2
Автор: Arvind K. Sinha, Christopher L. Tuma, Jason R. Eagle, John L. Colbert, John S. Corbin, Jr.
Принадлежит: International Business Machines Corp

A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.

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Номер записи: 65
01-11-2016 дата публикации

Air valve for electronics enclosures

Номер: US9482349B2
Автор: Arden L. Moore, Arvind K. Sinha, Bret P. Elison, Phillip V. Mann, William J. Anderl
Принадлежит: International Business Machines Corp

An air valve includes a frame and a sheet of thin material. The frame may have an outlet-side member configured mounted on a fan housing and an inlet-side member rotatably coupled to the outlet-side member. The material may have top and bottom edges, and a plurality of folds perpendicular to the top and bottom side edges that divide the sheet into a plurality of sections. The material may be attached to the outlet-side member and the inlet-side member, and configurable between folded and expanded positions. An attraction between a magnetic component on the inlet-side member and a magnetic component on a rotating fan blade may cause the inlet-side member to rotate, moving the material into the folded configuration. When the fan blade is not rotating, a spring attached at a pivot point may cause the inlet-side member to rotate in an opposite direction, moving the material into the expanded position.

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Номер записи: 66
15-07-2014 дата публикации

Implementing enhanced thermal conductivity in stacked modules

Номер: US8779585B2
Автор: Arvind K. Sinha, II Kory W. Weckman, Kevin M. O'Connell
Принадлежит: International Business Machines Corp

A method and structures are provided for implementing enhanced thermal conductivity between a lid and heat sink for stacked modules. A chip lid and lateral heat distributor includes cooperating features for implementing enhanced thermal conductivity. The chip lid includes a groove along an inner side wall including a flat wall surface and a curved edge surface. The lateral heat distributor includes a mating edge portion received within the groove. The mating edge portion includes a bent arm for engaging the curved edge surface groove and a flat portion. The lateral heat distributor is assembled into place with the chip lid, the mating edge portion of the lateral heat distributor bends and snaps into the groove of the chip lid. The bent arm portion presses on the curved surface of the groove, and provides an upward force to push the flat portion against the flat wall surface of the groove.

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Номер записи: 67
02-04-2009 дата публикации

Electronic Assembly and Techniques for Installing a Heatsink in an Electronic Assembly

Номер: US20090083972A1
Автор: Arvind K. Sinha, Christopher L. Tuma, Jason R. Eagle, John L. Colbert, John S. Corbin, Jr.
Принадлежит: International Business Machines Corp

A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.

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Номер записи: 68
30-08-2012 дата публикации

Heat spreader flatness detection

Номер: US20120217983A1
Автор: Arvind K. Sinha, Kory W. WECKMAN
Принадлежит: International Business Machines Corp

A heat spreader includes a plurality of sensors that indicate that the heat spreader is flat against and in thermal contact with a plurality of chips when the heat spreader is loaded upon a chip stack. One or more nodes within the sensors are connected by electric conductors. The resistances of the conductors may be compared to determine if the nodes within the sensors are relatively flat. Sensor flatness may be indicated to a higher level electronic device such as a visual display. The display may ultimately be viewed by a user to determine whether the heat spreader is flat and in thermal contact with the plurality of chips when the heat spreader is loaded upon the chip stack.

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Номер записи: 69
07-06-2012 дата публикации

Duplex flexible heat exchanger

Номер: US20120138269A1
Автор: Arvind K. Sinha, Eric V. Kline, Maurice F. Holahan, Michael R. Rasmussen, Paul N. Krystek, Stephen M. Zins
Принадлежит: International Business Machines Corp

A method and system for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.

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Номер записи: 70
28-07-2011 дата публикации

Implementing reduced signal degradation for fiber optic modules

Номер: US20110182575A1
Автор: Arvind K. Sinha, Joseph Kuczynski
Принадлежит: International Business Machines Corp

A method and circuit are provided for implementing reduced signal degradation for fiber optic modules, and a design structure on which the subject circuit resides. Responsive to a detected signal input, an optical misalignment calculation is performed. A voltage potential for a lens shape control is selected responsive to the optical misalignment calculation. An optical signal loss calculation and threshold compare are performed. Responsive to the optical signal loss calculation less than the threshold, the lens shape and voltage potential are fixed. A fluidic lens provides variable lens shape responsive to the selected voltage potential being applied to the fluidic lens,

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Номер записи: 71
30-09-2010 дата публикации

Enhanced Connector Cradle Having a Cooling Shell for Preferential Cooling of Wafers

Номер: US20100243716A1
Автор: Arvind K. Sinha, Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil
Принадлежит: International Business Machines Corp

A method, system and apparatus for preferential cooling of an electrical circuit board via a cradle having a cooling shell. An enhanced connector cradle enables the secure and precise placement of a connector on a circuit board by using a cooling component which selectively enables only the connector leads to reach reflow temperature levels. The cradle aligns and securely connects the circuit board to the connector via a comb structure of the cradle to form a single connector unit. Heat is applied to the single connector unit to initiate bond formation. The cradle selectively minimizes the heat to the circuit board and other board components by enabling the circulation of de-ionized water through the cooling component during the heating process. As a result, the cradle restricts reflow temperature levels to the connector leads. The cradle mechanism is removed from the board after the connector is securely bonded to the board.

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Номер записи: 72
22-05-2018 дата публикации

Ball grid array rework

Номер: US09978706B2
Автор: Arvind K. Sinha, Eric V. Kline
Принадлежит: International Business Machines Corp

Embodiments relate to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

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Номер записи: 73
22-05-2018 дата публикации

Dual magnetically coupled rotor heat exchanger

Номер: US09976812B2
Автор: Arvind K. Sinha, Eric V. Kline, Maurice F. Holahan, Michael R. Rasmussen, Paul N. Krystek, Stephen M. Zins
Принадлежит: International Business Machines Corp

An apparatus for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.

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Номер записи: 74
24-04-2018 дата публикации

Dynamic keying assembly

Номер: US09954338B2
Автор: Arvind K. Sinha, Mark D. Plucinski, Phillip V. Mann, Sandra J. Shirk/Heath
Принадлежит: International Business Machines Corp

A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

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Номер записи: 75
20-03-2018 дата публикации

Method for containing computer system components

Номер: US09921619B2
Автор: Arden L. Moore, Arvind K. Sinha, Bret P. Elison, Phillip V. Mann
Принадлежит: International Business Machines Corp

An apparatus includes a component bay having an operational height and an expanded height. The component bay is moveable between the operational height and the expanded height. A thermal element divides the component bay into one or more compartments, each compartment configured to receive a system component. The component bay at the operational height provides thermal contact between the received system component and the thermal element.

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Номер записи: 76
27-02-2018 дата публикации

Method of affixing a group of elastic filaments to an electronic component body

Номер: US09907185B2
Автор: Arvind K. Sinha, Mark D. Plucinski, Phillip V. Mann, Sandra J. Shirk/Heath
Принадлежит: International Business Machines Corp

According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include one or more elastic members affixed to the electronic component body. The electronic component assembly may also include a catch mechanism affixed to each elastic member adapted to allow insertion of the elastic member and the catch mechanism through a hole of a circuit board in an extended position, and upon release from the extended position, hold the electronic component body in a fixed position by the tension of the elastic member and the catch mechanism grasping an edge of a surface of the circuit board opposite a surface upon which the electronic component body rests.

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Номер записи: 77
09-01-2018 дата публикации

Demand-based charging of a heat pipe

Номер: US09863712B2
Автор: Arvind K. Sinha, Bret P. Elison, Phillip V. Mann, William J. Anderl
Принадлежит: International Business Machines Corp

A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level.

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Номер записи: 78
26-12-2017 дата публикации

Pin attach converter

Номер: US09853375B2
Автор: Arvind K. Sinha, Mark D. Plucinski, Phillip V. Mann, Sandra J. Shirk/Heath
Принадлежит: International Business Machines Corp

A pin attach converter for coupling an electrical contact to a printed circuit board may include a compliant region having a first length adapted to traverse an aperture in a printed circuit board and provide mechanical and electrical registry with at least one wall of the aperture. The pin attach converter may also include an adapter region coupled to the compliant region, and having a cavity with a second length and adapted to receive the electrical contact, where the second length extends along a same longitudinal axis as the first length, and the cavity is adapted to provide mechanical and electrical registry with the electrical contact.

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Номер записи: 79
12-12-2017 дата публикации

Dynamic keying assembly

Номер: US09843152B2
Автор: Arvind K. Sinha, Mark D. Plucinski, Phillip V. Mann, Sandra J. Shirk/Heath
Принадлежит: International Business Machines Corp

A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

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Номер записи: 80
08-08-2017 дата публикации

Light pipe connector apparatus

Номер: US09726837B2
Автор: Arvind K. Sinha, Karl Stathakis, Kevin M. O'Connell, Kory W. WECKMAN, Phillip V. Mann
Принадлежит: International Business Machines Corp

Light can be transmitted between a light source and a light detector or target by using at least two mating connector sections of a light pipe connector. A protrusion of one of the connector sections is designed to be received within a receptacle of another of the connector sections, which can make the light pipe connector mechanically compliant. The two connector sections are fabricated from an optically transmissive material, and have optically reflective surfaces in orthogonal orientations to optically transmissive surfaces adjacent to the light source and the light detector. When the protrusion of one of the connector sections is engaged within the receptacle of another connector section, light can be transmitted through optically transmissive surfaces adjacent to a light source and a light detector, while the orthogonally oriented optically reflective surfaces direct light towards the light detector.

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Номер записи: 81
01-08-2017 дата публикации

Alignment of three dimensional integrated circuit components

Номер: US09721855B2
Автор: Arvind K. Sinha, Joseph Kuczynski, Karl Stathakis, Kevin M. O'Connell, Phillip V. Mann
Принадлежит: International Business Machines Corp

A method for aligning a chip onto a substrate is disclosed. The method includes, depositing a ferrofluid, onto a substrate that has one or more pads that electrically couple to a semiconductor layer. The method can include a chip with solder balls electrically coupled to the logic elements of the chip, which can be placed onto the deposited ferrofluid, where the chip is supported on the ferrofluid, in a substantially coplanar orientation to the substrate. The method can include determining if the chip is misaligned from a desired location on the substrate. The method can include adjusting the current location of the chip in response to determining that the solder balls of the chip are misaligned from the desired location on the pads of the substrate, until the chip is aligned in the desired location.

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Номер записи: 82