Connecting pad structure and mfg. method thereof

A connectino pad suitable for the semiconductor substrate with surficial dielectric layer is composed of a metallic top pad above the dielectric layer and several metallic supporters inlaid in said dielectric layer and formed on the bottom of said top pad. Its preparing process is also disclosed. Its advantages are high adhesion and low parasitic capacitance.

Connecting pad structure and mfg. method thereof

Method for manufacturing cuprum-cover-silver as well as silver alloy three composite rivet contact

Disclosed is a process for preparing copper three composite rivet contacts of bonding sliver and silver alloy, an additional eccentric tube and a set of additional wire-feeders are disposed at one side of a bed die of a 30 type dual composite cold holder, an S lead rail of the 30 type dual composite cold holder is changed to a three-step lead rail to realize the process that one of cutting knives cuts two-section materials. One of cutting knives cuts two-section materials, a first draw stick sends the three composite materials to the bed die, and the three composite materials are continuously upset and deformed in the bed die, thereby completing bonding sliver on the foot portions of the three composite rivet contacts. The method is simple and feasible, and can complete the preparation of copper bonding sliver and three composite rivet contacts of sliver alloy, further, the invention is high in productivity effect and in material utilization.

Oscillation signal producing method and apparatus