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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 24. Отображено 24.
03-11-2015 дата публикации

System and method for apodization in a semiconductor device inspection system

Номер: US0009176069B2

An inspection system with selectable apodization includes an illumination source configured to illuminate a surface of a sample, a detector configured to detect at least a portion of light emanating from the surface of the sample, the illumination source and the detector being optically coupled via an optical pathway of an optical system, a selectably configurable apodization device disposed along the optical pathway, wherein the apodization device includes one or more apodization elements operatively coupled to one or more actuation stages configured to selectably actuate the one or more apodization elements along one or more directions, and a control system communicatively coupled to the one or more actuation and configured to selectably control apodization of illumination transmitted along the optical pathway by controlling an actuation state of the one or more apodization elements.

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12-07-2016 дата публикации

Enhanced high-speed logarithmic photo-detector for spot scanning system

Номер: US0009389166B2

Disclosed are apparatus and methods for inspecting or measuring a specimen. An incident beam is directed across a plurality of consecutive scan portions of a specimen so that an output beam profile from each scan portion is consecutively collected by a photomultiplier tube (PMT), and the scan portions include at least one or more first scan portions and a next scan portion that is scanned after the one or more first scan portions. After or while the incident beam is directed to the one or more first scan portions of the specimen, an output signal for each first scan portion is obtained based on the output beam profile that is collected by the PMT for each first scan portion. An expected output beam profile for the next scan portion is determined based on the output signal that is obtained for each one or more first scan portions. As the incident beam is directed towards the next scan portion, a gain input to the PMT for the next scan portion is set based on the expected output beam profile ...

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14-03-2006 дата публикации

Apparatus and methods for optically inspecting a sample for anomalies

Номер: US0007012683B2

Disclosed are methods and apparatus for detecting a relatively wide dynamic range of intensity values from a beam (e.g., scattered light, reflected light, or secondary electrons) originating from a sample, such as a semiconductor wafer. In other words, the inspection system provides detected output signals having wide dynamic ranges. The detected output signals may then be analyzed to determine whether defects are present on the sample. For example, the intensity values from a target die are compared to the intensity values from a corresponding portion of a reference die, where a significant intensity difference may be defined as a defect. In a specific embodiment, an inspection system for detecting defects on a sample is disclosed. The system includes a beam generator for directing an incident beam towards a sample surface and a detector positioned to detect a detected beam originating from the sample surface in response to the incident beam. The detector has a sensor for detecting the detected beam and generating a detected signal based on the detected beam and a non-linear component coupled to the sensor. The non-linear component is arranged to generate a non-linear detected signal based on the detected signal. The detector further includes a first analog-to-digital converter (ADC) coupled to the non-linear component. The first ADC is arranged to digitize the non-linear detected signal into a digitized detected signal.

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18-09-2014 дата публикации

IMAGE SYNCHRONIZATION OF SCANNING WAFER INSPECTION SYSTEM

Номер: US2014270471A1
Принадлежит:

An inspection system comprises a beam generator module for deflecting spots across scan portions of a specimen. The system also includes detection channels for sensing light emanating from a specimen in response to an incident beam directed towards such specimen and generating a detected image for each scan portion. The system comprises a synchronization system comprising clock generator modules for generating timing signals for deflectors of the beam generator module to scan the spots across the scan portions at a specified frequency and each of the detection channels to generate the corresponding detected image at a specified sampling rate. The timing signals are generated based on a common system clock and cause the deflectors to scan the spots and the detection channels to generate a detected image at a synchronized timing so as to minimize jitter between the scan portions in the response image.

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08-12-2015 дата публикации

Image synchronization of scanning wafer inspection system

Номер: US0009208553B2

An inspection system comprises a beam generator module for deflecting spots across scan portions of a specimen. The system also includes detection channels for sensing light emanating from a specimen in response to an incident beam directed towards such specimen and generating a detected image for each scan portion. The system comprises a synchronization system comprising clock generator modules for generating timing signals for deflectors of the beam generator module to scan the spots across the scan portions at a specified frequency and each of the detection channels to generate the corresponding detected image at a specified sampling rate. The timing signals are generated based on a common system clock and cause the deflectors to scan the spots and the detection channels to generate a detected image at a synchronized timing so as to minimize jitter between the scan portions in the response image.

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21-12-2004 дата публикации

Apparatus and methods for optically inspecting a sample for anomalies

Номер: US0006833913B1

Disclosed are methods and apparatus for detecting a relatively wide dynamic range of intensity values from a beam (e.g., scattered light, reflected light, or secondary electrons) originating from a sample, such as a semiconductor wafer. In other words, the inspection system provides detected output signals having wide dynamic ranges. The detected output signals may then be analyzed to determine whether defects are present on the sample. For example, the intensity values from a target die are compared to the intensity values from a corresponding portion of a reference die, where a significant intensity difference may be defined as a defect. In a specific embodiment, an inspection system for detecting defects on a sample is disclosed. The system includes a beam generator for directing an incident beam towards a sample surface and a detector positioned to detect a detected beam originating from the sample surface in response to the incident beam. The detector has a sensor for detecting the ...

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03-02-2004 дата публикации

UV compatible programmable spatial filter

Номер: US0006686994B2

Disclosed are mechanisms for selectively filtering spatial portions of light emanating from a sample under inspection within an optical system. In one embodiment, a programmable spatial filter (PSF) is constructed from materials that are compatible with light in a portion of the UV wavelength range. In a specific implementation, the PSF is constructed from a UV compatible material, such as a polymer stabilized liquid crystal material. In a further aspect, the PSF also includes a pair of plates that are formed from a UV grade glass. The PSF may also include a relatively thin first and second ITO layer that results in a sheet resistance between about 100 and about 300 Omega per square.

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05-05-2005 дата публикации

Apparatus and methods for optically inspecting a sample for anomalies

Номер: US2005092899A1
Принадлежит:

Disclosed are methods and apparatus for detecting a relatively wide dynamic range of intensity values from a beam (e.g., scattered light, reflected light, or secondary electrons) originating from a sample, such as a semiconductor wafer. In other words, the inspection system provides detected output signals having wide dynamic ranges. The detected output signals may then be analyzed to determine whether defects are present on the sample. For example, the intensity values from a target die are compared to the intensity values from a corresponding portion of a reference die, where a significant intensity difference may be defined as a defect. In a specific embodiment, an inspection system for detecting defects on a sample is disclosed. The system includes a beam generator for directing an incident beam towards a sample surface and a detector positioned to detect a detected beam originating from the sample surface in response to the incident beam. The detector has a sensor for detecting the ...

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16-01-2014 дата публикации

System and Method for Apodization in a Semiconductor Device Inspection System

Номер: US20140016125A1
Принадлежит: KLA-TENCOR CORPORATION

An inspection system with selectable apodization includes an illumination source configured to illuminate a surface of a sample, a detector configured to detect at least a portion of light emanating from the surface of the sample, the illumination source and the detector being optically coupled via an optical pathway of an optical system, a selectably configurable apodization device disposed along the optical pathway, wherein the apodization device includes one or more apodization elements operatively coupled to one or more actuation stages configured to selectably actuate the one or more apodization elements along one or more directions, and a control system communicatively coupled to the one or more actuation and configured to selectably control apodization of illumination transmitted along the optical pathway by controlling an actuation state of the one or more apodization elements.

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31-03-2015 дата публикации

Image synchronization of scanning wafer inspection system

Номер: US0008995746B2

An inspection system comprises a beam generator module for deflecting spots across scan portions of a specimen. The system also includes detection channels for sensing light emanating from a specimen in response to an incident beam directed towards such specimen and generating a detected image for each scan portion. The system comprises a synchronization system comprising clock generator modules for generating timing signals for deflectors of the beam generator module to scan the spots across the scan portions at a specified frequency and each of the detection channels to generate the corresponding detected image at a specified sampling rate. The timing signals are generated based on a common system clock and cause the deflectors to scan the spots and the detection channels to generate a detected image at a synchronized timing so as to minimize jitter between the scan portions in the response image.

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04-07-2013 дата публикации

ENHANCED HIGH-SPEED LOGARITHMIC PHOTO-DETECTOR FOR SPOT SCANNING SYSTEM

Номер: US20130169957A1
Принадлежит: KLA-TENCOR CORPORATION

Disclosed are apparatus and methods for inspecting or measuring a specimen. An incident beam is directed across a plurality of consecutive scan portions of a specimen so that an output beam profile from each scan portion is consecutively collected by a photomultiplier tube (PMT), and the scan portions include at least one or more first scan portions and a next scan portion that is scanned after the one or more first scan portions. After or while the incident beam is directed to the one or more first scan portions of the specimen, an output signal for each first scan portion is obtained based on the output beam profile that is collected by the PMT for each first scan portion. An expected output beam profile for the next scan portion is determined based on the output signal that is obtained for each one or more first scan portions. As the incident beam is directed towards the next scan portion, a gain input to the PMT for the next scan portion is set based on the expected output beam profile so that the gain for such next scan portion results in a measured signal at the PMT that is within a predefined specification of the PMT or other hardware components that receive a measured signal from the PMT. 1. A method of inspecting or measuring a specimen , the method comprising:directing an incident beam across a plurality of consecutive scan portions of a specimen so that an output beam profile from each scan portion is consecutively collected by a photomultiplier tube (PMT), wherein the scan portions include one or more first scan portions and a next scan portion that is scanned after the one or more first scan portions;after or while the incident beam is directed to the one or more first scan portions of the specimen, obtaining an output signal for each first scan portion based on the output beam profile that is collected by the PMT for each first scan portion;determining an expected output beam profile for the next scan portion based on the output signal that is obtained ...

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25-02-2016 дата публикации

System and Method for Apodization in a Semiconductor Device Inspection System

Номер: US20160054232A1
Принадлежит:

An inspection system with selectable apodization includes a selectably configurable apodization device disposed along an optical pathway of an optical system. The apodization device includes one or more apodization elements operatively coupled to one or more actuation stages. The one or more actuation stages are configured to selectably actuate the one or more apodization elements along one or more directions. The inspection system includes a control system communicatively coupled to the one or more actuation stages. The control system is configured to selectably control an actuation state of at the one or more apodization elements so as to apply a selected apodization profile formed with the one or more apodization elements. 1. An inspection system with selectable apodization , comprising:an illumination source configured to illuminate a surface of a sample disposed on a sample stage;a detector configured to detect at least a portion of light emanating from the surface of the sample, the illumination source and the detector being optically coupled via an optical pathway of an optical system including an illumination arm and a collection arm; anda selectably configurable apodization device disposed along the optical pathway of the optical system, wherein the apodization device includes one or more apodization elements operatively coupled to one or more actuation stages, the one or more actuation stages configured to selectably actuate the one or more apodization elements along one or more directions in order to apply a selected apodization profile.2. The inspection system of claim 1 , wherein the illumination source comprises:at least one broad band illumination source.3. The inspection system of claim 1 , wherein the illumination source comprises:at least one narrow band illumination source.4. The inspection system of claim 1 , wherein the inspection system is configured as a bright-field inspection system.5. The inspection system of claim 1 , wherein the ...

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27-04-2017 дата публикации

MULTI-SPOT SCANNING COLLECTION OPTICS

Номер: US20170115232A1
Принадлежит: KLA-TENCOR CORPORATION

Disclosed are apparatus and methods for inspecting or measuring a specimen. A system comprises an illumination channel for generating and deflecting a plurality of incident beams to form a plurality of spots that scan across a segmented line comprised of a plurality of scan portions of the specimen. The system also includes one or more detection channels for sensing light emanating from a specimen in response to the incident beams directed towards such specimen and collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion. The one or more detection channels include at least one longitudinal side channel for longitudinally collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion. 1. A system for inspecting or measuring a specimen , comprising:an illumination channel for generating and scanning a plurality of incident beams at an oblique angle to form a plurality of spots that scan across a segmented line comprised of a plurality of scan portions of the specimen; andone or more detection channels for sensing light emanating from a specimen in response to the incident beams directed towards such specimen and collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion, wherein the one or more detection channels include at least one longitudinal side channel for longitudinally collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion, wherein the at least one longitudinal side channel is arranged to have an optical axis along which the detected image is collected and which is also parallel and coincident with a plane of the specimen or an image plane of the specimen.2. The system of claim 1 , wherein the one or more detection channels include a first longitudinal side channel for longitudinally collecting a first plurality of detected images for the scan ...

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18-06-2015 дата публикации

IMAGE SYNCHRONIZATION OF SCANNING WAFER INSPECTION SYSTEM

Номер: US20150170357A1
Принадлежит: KLA-TENCOR CORPORATION

An inspection system comprises a beam generator module for deflecting spots across scan portions of a specimen. The system also includes detection channels for sensing light emanating from a specimen in response to an incident beam directed towards such specimen and generating a detected image for each scan portion. The system comprises a synchronization system comprising clock generator modules for generating timing signals for deflectors of the beam generator module to scan the spots across the scan portions at a specified frequency and each of the detection channels to generate the corresponding detected image at a specified sampling rate. The timing signals are generated based on a common system clock and cause the deflectors to scan the spots and the detection channels to generate a detected image at a synchronized timing so as to minimize jitter between the scan portions in the response image.

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18-09-2014 дата публикации

IMAGE SYNCHRONIZATION OF SCANNING WAFER INSPECTION SYSTEM

Номер: US20140270471A1
Принадлежит: KLA-TENCOR CORPORATION

An inspection system comprises a beam generator module for deflecting spots across scan portions of a specimen. The system also includes detection channels for sensing light emanating from a specimen in response to an incident beam directed towards such specimen and generating a detected image for each scan portion. The system comprises a synchronization system comprising clock generator modules for generating timing signals for deflectors of the beam generator module to scan the spots across the scan portions at a specified frequency and each of the detection channels to generate the corresponding detected image at a specified sampling rate. The timing signals are generated based on a common system clock and cause the deflectors to scan the spots and the detection channels to generate a detected image at a synchronized timing so as to minimize jitter between the scan portions in the response image. 1. A method of inspecting or measuring a specimen using an inspection system comprising a pre-scanner acousto-optic deflector (AOD) , a chirp AOD , and a plurality of detection channels , the method comprising:using a common trigger clock to generate a chirp clock and input a chirp frequency ramp signal into the chirp AOD based on the generated chirp clock;in response to the chirp frequency ramp signal input to the chirp AOD, propagating a chirp packet through the chirp AOD;using the common trigger clock to generate a pre-scanner clock and input a pre-scanner frequency ramp signal into the pre-scanner AOD based on the generated pre-scanner clock, wherein the pre-scanner AOD receives and deflects an incident beam onto the propagating chirp packet in the chirp AOD, causing one or more spots to be scanned in a plurality of lines across the specimen;using the common trigger clock to generate an acquisition clock for each detection channel and input a sampling frequency signal into such detection channel based on the generated acquisition clock for such detection channel; ...

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13-08-2015 дата публикации

Multi-spot scanning collection optics

Номер: US20150226677A1
Принадлежит: KLA Tencor Corp

Disclosed are apparatus and methods for inspecting or measuring a specimen. A system comprises an illumination channel for generating and deflecting a plurality of incident beams to form a plurality of spots that scan across a segmented line comprised of a plurality of scan portions of the specimen. The system also includes one or more detection channels for sensing light emanating from a specimen in response to the incident beams directed towards such specimen and collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion. The one or more detection channels include at least one longitudinal side channel for longitudinally collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion.

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27-10-2016 дата публикации

Systems and Methods for Run-Time Alignment of a Spot Scanning Wafer Inspection System

Номер: US20160313256A1
Принадлежит:

A spot scanning imaging system with run-time alignment includes a beam scanning device configured to linearly scan a focused beam of illumination across a sample, one or more detectors positioned to receive light from the sample, and a controller communicatively coupled to the beam scanning apparatus, the sample stage, and the one or more detectors. The controller is configured to store a first image, transmit a set of drive signals to at least one of the beam scanning device, the sample stage, or the one or more detectors, compare at least a portion of the second sampling grid to at least a portion of the first sampling grid to determine one or more offset errors, and adjust at least one drive signal in the set of drive signals based on the one or more offset errors such that the second sample grid overlaps the first sample grid. 1. A spot scanning imaging system with run-time alignment , comprising:a beam scanning device configured to linearly scan a beam of illumination across a sample positioned on a sample stage;one or more detectors positioned to receive light from the sample; and store a first image, wherein center positions of pixels on the first image define a first sampling grid;', 'transmit a set of drive signals to at least one of the beam scanning device, the sample stage, or the one or more detectors such that the beam is linearly scanned across at least a portion of the sample along one or more linear scan lines, wherein the sample is sampled at one or more sampled locations along the one or more linear scan lines based on the set of drive signals to generate a second image, wherein the one or more sampled locations define a second sampling grid, wherein data associated with the one or more sampled locations correspond to one or more pixels of the second image,', 'compare at least a portion of the second sampling grid to at least a portion of the first sampling grid to determine one or more offset errors,', 'adjust at least one drive signal in the set ...

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10-11-2016 дата публикации

System and Method for Oblique Incidence Scanning with 2D Array of Spots

Номер: US20160327493A1
Принадлежит:

A system to generate multiple beam lines in an oblique angle multi-beam spot scanning wafer inspection system includes a beam scanning device configured to scan a beam of illumination, an objective lens oriented at an oblique angle relative to the surface of a sample and with an optical axis perpendicular to a first scanning direction on the sample, and one or more optical elements positioned between the objective lens and the beam scanning device. The one or more optical elements split the beam into two or more offset beams such that the two or more offset beams are separated in a least a second direction perpendicular to the first direction. The one or more optical elements further modify the phase characteristics of the two or more offset beams such that the two or more offset beams are simultaneously in focus on the sample during a scan. 1. A system to generate multiple beam lines in an oblique angle multi-beam spot scanning wafer inspection system , comprising:a beam scanning device configured to scan a beam of illumination;an objective lens positioned to direct the beam to a surface of a sample such that the beam is scanned along a first direction, wherein an optical axis of the objective lens is oriented perpendicular to the first direction and is further oriented at an oblique incidence angle relative to a surface of the sample; and split the beam into two or more offset beams, wherein the two or more offset beams are separated in at least a second direction, wherein the second direction is perpendicular to the first direction, and', 'modify one or more phase characteristics of at least one of the two or more offset beams such that the two or more offset beams are simultaneously in focus on the sample during a scan., 'one or more optical elements positioned between the objective lens and the beam scanning device configured to2. The system of claim 1 , wherein the two or more offset beams comprise:a two-dimensional array of offset beams with two or more ...

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17-01-2017 дата публикации

Multi-spot scanning collection optics

Номер: US9546962B2
Принадлежит: KLA Tencor Corp

Disclosed are apparatus and methods for inspecting or measuring a specimen. A system comprises an illumination channel for generating and deflecting a plurality of incident beams to form a plurality of spots that scan across a segmented line comprised of a plurality of scan portions of the specimen. The system also includes one or more detection channels for sensing light emanating from a specimen in response to the incident beams directed towards such specimen and collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion. The one or more detection channels include at least one longitudinal side channel for longitudinally collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion.

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18-12-2003 дата публикации

Uv compatible programmable spatial filter

Номер: WO2003083560A3
Принадлежит: Kla Tencor Tech Corp

Disclosed are mechanisms for selectively filtering spatial portions of light emanating from a sample under inspection within an optical system. In one embodiment, a programmable spatial filter (PSF) is constructed from materials that are compatible with light in a portion of the UV wavelength range. In a specific implementation, the PSF is constructed from a UV compatible material, such as a polymer stabilized liquid crystal material. In a further aspect, the PSF also includes a pair of plates that are formed from a UV grade glass. The PSF may also include a relatively thin first and second ITO layer that results in a sheet resistance between about 100 and about 300 W per square. In a specific embodiment, the PSF provides selective filtering in two directions. In other words, the PSF provides two dimensional filtering.

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15-05-2018 дата публикации

Multi-spot scanning collection optics

Номер: US09970883B2
Принадлежит: KLA Tencor Corp

Disclosed are apparatus and methods for inspecting or measuring a specimen. A system comprises an illumination channel for generating and deflecting a plurality of incident beams to form a plurality of spots that scan across a segmented line comprised of a plurality of scan portions of the specimen. The system also includes one or more detection channels for sensing light emanating from a specimen in response to the incident beams directed towards such specimen and collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion. The one or more detection channels include at least one longitudinal side channel for longitudinally collecting a detected image for each scan portion as each incident beam's spot is scanned over its scan portion.

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13-02-2018 дата публикации

System and method for oblique incidence scanning with 2D array of spots

Номер: US09891175B2
Принадлежит: KLA Tencor Corp

A system to generate multiple beam lines in an oblique angle multi-beam spot scanning wafer inspection system includes a beam scanning device configured to scan a beam of illumination, an objective lens oriented at an oblique angle relative to the surface of a sample and with an optical axis perpendicular to a first scanning direction on the sample, and one or more optical elements positioned between the objective lens and the beam scanning device. The one or more optical elements split the beam into two or more offset beams such that the two or more offset beams are separated in a least a second direction perpendicular to the first direction. The one or more optical elements further modify the phase characteristics of the two or more offset beams such that the two or more offset beams are simultaneously in focus on the sample during a scan.

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09-01-2018 дата публикации

Systems and methods for run-time alignment of a spot scanning wafer inspection system

Номер: US09864173B2
Принадлежит: KLA Tencor Corp

A spot scanning imaging system with run-time alignment includes a beam scanning device configured to linearly scan a focused beam of illumination across a sample, one or more detectors positioned to receive light from the sample, and a controller communicatively coupled to the beam scanning apparatus, the sample stage, and the one or more detectors. The controller is configured to store a first image, transmit a set of drive signals to at least one of the beam scanning device, the sample stage, or the one or more detectors, compare at least a portion of the second sampling grid to at least a portion of the first sampling grid to determine one or more offset errors, and adjust at least one drive signal in the set of drive signals based on the one or more offset errors such that the second sample grid overlaps the first sample grid.

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09-05-2017 дата публикации

System and method for apodization in a semiconductor device inspection system

Номер: US09645093B2
Принадлежит: KLA Tencor Corp

An inspection system with selectable apodization includes a selectably configurable apodization device disposed along an optical pathway of an optical system. The apodization device includes one or more apodization elements operatively coupled to one or more actuation stages. The one or more actuation stages are configured to selectably actuate the one or more apodization elements along one or more directions. The inspection system includes a control system communicatively coupled to the one or more actuation stages. The control system is configured to selectably control an actuation state of at the one or more apodization elements so as to apply a selected apodization profile formed with the one or more apodization elements.

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