Showerhead having cooling system and substrate processing apparatus including the showerhead

Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber body having an opened upper side, the chamber body providing an inner space in which processes with respect to a substrate are performed, a chamber lid disposed on an upper portion of the chamber body to close the opened upper side of the chamber body, and a showerhead disposed on a lower portion of the chamber lid to supply a reaction gas into the inner space. The showerhead includes a flange contacting the chamber lid, the flange having a passage recessed from a top surface of the flange to allow a refrigerant to flow therein, and a flat plate disposed inside the flange, the flat plate having at least one injection hole for injecting the reaction gas in a thickness direction thereof.

Apparatus for processing substrate for supplying reaction gas having phase difference

Provided is a substrate processing apparatus. The substrate processing apparatus in which processes with respect to substrates are performed includes a lower chamber having an opened upper side, the lower chamber including a passage allowing the substrates to pass therethrough in a side thereof, an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed, a substrate holder on which the one ore more substrates are vertically stacked, the substrate holder being movable between a stacking position in which the substrates are stacked within the substrate holder and a process position in which the processes with respect to the substrates are performed, and a gas supply unit disposed inside the external reaction tube to supply a reaction gas into the process space, the gas supply unit forming a flow of the reaction gas having different phase differences in a vertical direction.

Substrate processing apparatus including processing unit

Provided is a substrate processing apparatus. The substrate processing apparatus in which a process with respect to substrates is performed includes a lower chamber having an opened upper portion, the lower chamber having a passage, through which the substrates are accessible, in a side thereof, an external reaction tube closing the opened upper portion of the lower chamber to provide a process space in which the process is performed, a substrate holder on which the one or more substrates are vertically stacked, the substrate holder being movable between a stacking position at which the substrates are stacked within the substrate holder and a process position at which the process with respect to the substrates is performed, a gas supply unit supplying a reaction gas into the process space, and a processing unit disposed outside the external reaction tube to activate the reaction gas, thereby performing the process with respect to the substrates.

Substrate processing apparatus including auxiliary gas supply port

Provided is a substrate processing apparatus. The substrate processing apparatus in which processes with respect to substrates are performed, the substrate processing apparatus includes a lower chamber having an opened upper side, the lower chamber including a passage allowing the substrates to pass therethrough in a side thereof, an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed, an internal reaction tube disposed within the external reaction tube, the internal reaction tube being disposed around a substrate holder placed in the process position to define a reaction region with respect to the substrates, the substrate holder on which the one or more substrates are vertically stacked, the substrate holder being movable between a stacking position in which the substrates are stacked within the substrate holder and a process position in which the processes with respect to the substrates are performed, at least one supply nozzle disposed along an inner wall of the external reaction tube, the at least one supply nozzle having a supply hole for discharging a reaction gas, and at least one exhaust nozzle disposed along the inner wall of the external reaction tube, the at least one exhaust nozzle having an exhaust hole for suctioning an non-reaction gas and byproducts within the process space. The lower chamber includes an auxiliary gas supply port connected to the stacking space defined inside the lower chamber.

Substrate processing apparatus including exhaust ports and substrate processing method

Provided is a substrate processing apparatus. The substrate processing apparatus in which processes with respect to substrates are performed includes a lower chamber having an opened upper side, the lower chamber including a passage allowing the substrates to pass therethrough in a side thereof, an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed, a substrate holder on which the one or more substrates are vertically stacked, the substrate holder being movable between a stacking position in which the substrates are stacked within the substrate holder and a process position in which the processes with respect to the substrates are performed, at least one supply nozzle disposed along an inner wall of the external reaction tube, the at least one supply nozzle having a supply hole for discharging a reaction gas, at least one exhaust nozzle disposed along the inner wall of the external reaction tube, the at least one exhaust nozzle having an exhaust hole for suctioning an non-reaction gas and byproducts within the process space, and a rear exhaust line connected to the exhaust nozzle to discharge the non-reaction gas and the byproducts which are suctioned through the exhaust hole. The lower chamber includes an exhaust port connecting the exhaust nozzle to the rear exhaust line and an auxiliary exhaust port connecting a stacking space defined within the lower chamber to the rear exhaust line.

Heater moving type substrate processing apparatus

Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber providing an inner space in which a process with respect to a substrate is performed, a heating plate on which the substrate is placed, the heating plate being fixedly disposed within the chamber, a heater spaced from a lower portion of the heating plate to heat the heating plate, and a lift module lifting the heater.

SUBSTRATE PROCESSING APPARATUS INCLUDING AUXILIARY GAS SUPPLY PORT

Provided is a substrate processing apparatus. The substrate processing apparatus in which processes with respect to substrates are performed, the substrate processing apparatus includes a lower chamber having an opened upper side, the lower chamber including a passage allowing the substrates to pass therethrough in a side thereof, an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed, an internal reaction tube disposed within the external reaction tube, the internal reaction tube being disposed around a substrate holder placed in the process position to define a reaction region with respect to the substrates, the substrate holder on which the one or more substrates are vertically stacked, the substrate holder being movable between a stacking position in which the substrates are stacked within the substrate holder and a process position in which the processes with respect to the substrates are performed, at least one supply nozzle disposed along an inner wall of the external reaction tube, the at least one supply nozzle having a supply hole for discharging a reaction gas, and at least one exhaust nozzle disposed along the inner wall of the external reaction tube, the at least one exhaust nozzle having an exhaust hole for suctioning an non-reaction gas and byproducts within the process space. The lower chamber includes an auxiliary gas supply port connected to the stacking space defined inside the lower chamber. 1. A substrate processing apparatus in which processes with respect to substrates are performed , the substrate processing apparatus comprising:a lower chamber having an opened upper side, the lower chamber comprising a passage allowing the substrates to pass therethrough in a side thereof;an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed;an internal reaction tube disposed within the ...

SUBSTRATE PROCESSING DEVICE

Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber providing a stacking space in which a substrate is stacked and a process space in which a process with respect to the substrate is performed, a boat including at least one boat frame that vertically stands up, the boat being elevated to move into the stacking space and the process space, a plurality of susceptors disposed on the boat frame and spaced apart from each other along a longitudinal direction of the boat frame, wherein, as the boat moves into the process space, the substrate is successively loaded on a top surface of each of the plurality of susceptors, and at least holder including a vertical rod disposed parallel to the boat frame and a substrate support tip protruding from an inner surface of the vertical rod to support the substrate, wherein, when the boat moves into the process space, the vertical rod relatively moves along the longitudinal direction of the boat frame. 1. A substrate processing apparatus comprising:a chamber providing a stacking space in which a substrate is stacked and a process space in which a process with respect to the substrate is performed;a boat comprising at least one boat frame that vertically stands up, the boat being elevated to move into the stacking space and the process space;a plurality of susceptors disposed on the boat frame and spaced apart from each other along a longitudinal direction of the boat frame, wherein, as the boat moves into the process space, the substrate is successively loaded on a top surface of each of the plurality of susceptors; andat least holder comprising a vertical rod disposed parallel to the boat frame and a substrate support tip protruding from an inner surface of the vertical rod to support the substrate, wherein, when the boat moves into the process space, the vertical rod relatively moves along the longitudinal direction of the boat frame.2. The substrate processing apparatus of claim 1 , ...

HEATER MOVING TYPE SUBSTRATE PROCESSING APPARATUS

Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber providing an inner space in which a process with respect to a substrate is performed, a heating plate on which the substrate is placed, the heating plate being fixedly disposed within the chamber, a heater spaced from a lower portion of the heating plate to heat the heating plate, and a lift module lifting the heater. 1. A substrate processing apparatus comprising:a chamber providing an inner space in which a process with respect to a substrate is performed;a heating plate on which the substrate is placed, the heating plate being fixedly disposed within the chamber;a heater spaced from a lower portion of the heating plate to heat the heating plate; anda lift module lifting the heater.2. The substrate processing apparatus of claim 1 , further comprising a discharge plate disposed around the heating plate claim 1 ,wherein the discharge plate is disposed under a substrate entrance passage defined in the chamber.3. The substrate processing apparatus of claim 2 , further comprising a plurality of support bars disposed under the discharge plate to support the discharge plate.4. The substrate processing apparatus of claim 2 , wherein the discharge plate is fixedly disposed on an inner wall of the chamber to support the heating plate.5. The substrate processing apparatus of claim 2 , further comprising an auxiliary discharge plate spaced from a lower portion of the discharge plate claim 2 , the auxiliary discharge plate being fixedly disposed on the inner wall of the chamber.6. The substrate processing apparatus of claim 1 , further comprising:a support shaft connected to a lower portion of the heater to support the heater;a lower fixing ring fixedly disposed on a lower portion of the support shaft; anda driving part lifting the lower fixing ring.7. The substrate processing apparatus of claim 6 , further comprising:an upper fixing ring fixedly disposed on a lower wall of the ...

SUBSTRATE PROCESSING APPARATUS

The present invention may include: a tube providing an interior space in which substrates are processed; a substrate support portion stacking a plurality of substrates in the interior space of the tube in multi-level; a gas supply portion supplying a process gas to the plurality of substrates; an exhaust portion disposed to face the gas supply portion to absorb the process gas; and a flowage adjustment portion having spray openings formed along a circumference of the tube between the gas supply portion and the exhaust portion to spray an adjusting gas, and may be capable of controlling the amount of process gas supplied to an upper surface of the substrate by adjusting the flowage of process gas. 1. A substrate processing apparatus , comprising:a tube providing an interior space in which substrates are processed;a substrate support portion stacking a plurality of substrates in the interior space of the tube in multi-level;a gas supply portion supplying a process gas to the plurality of substrates;an exhaust portion disposed to face the gas supply portion to absorb the process gas; anda flowage adjustment portion having spray openings formed along a circumference of the tube between the gas supply portion and the exhaust portion to spray an adjusting gas.2. The substrate processing apparatus according to claim 1 , further comprising claim 1 ,an exterior tube accommodating the tube therein,wherein the flowage adjustment portion is disposed between the tube and the exterior tube.3. The substrate processing apparatus according to claim 1 , whereinthe substrate support portion further comprises:a plurality of isolation plates each disposed between the substrates along a loaded direction of the substrates to divide the processing spaces for processing each of the plurality of substrates; anda plurality of spray openings are formed on the tube at different heights corresponding to each of the processing spaces.4. The substrate processing apparatus according to claim 1 , ...

SUBSTRATE PROCESSING APPARATUS

Provided is a substrate processing apparatus including a tube having an inner space therein, a substrate supporting unit including a plurality of isolation plates configured to vertically stack a plurality of substrates thereon and divide a processing space, in which the plurality of substrates are processed, into a plurality of processing spaces in the tube, a gas supply unit configured to supply a processing gas to the plurality of substrates, and an exhaust unit disposed to face the gas supply unit to exhaust a gas inside the tube. A plurality of through-holes are defined in each of the isolation plates. 1. A substrate processing apparatus comprising:a tube having an inner space therein;a substrate supporting unit comprising a plurality of isolation plates configured to vertically stack a plurality of substrates thereon and divide a processing space, in which the plurality of substrates are processed, into a plurality of processing spaces in the tube;a gas supply unit configured to supply a processing gas to the plurality of substrates; andan exhaust unit disposed to face the gas supply unit to exhaust a gas inside the tube,wherein a plurality of through-holes are provided in each of the isolation plates.2. The substrate processing apparatus of claim 1 , wherein the plurality of isolation plates are vertically spaced apart from each other claim 1 , andthe plurality of substrates are spaced apart from the plurality of isolation plates and stacked between the plurality of isolation plates, respectively.3. The substrate processing apparatus of claim 1 , wherein the gas supply unit comprises a plurality of injection nozzles installed at heights different from each other to respectively correspond to the processing spaces at one side of the tube claim 1 , andthe exhaust unit comprises a plurality of exhaust ports vertically installed to correspond to the injection nozzle on the other side of the tube.4. The substrate processing apparatus of claim 3 , wherein at least ...

APPARATUS FOR PROCESSING SUBSTRATE

Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber having an opened upper side, the chamber having a passage, through which a substrate is accessible, in a side thereof, a chamber cover covering the opened upper side of the chamber to provide an inner space in which a process with respect to the substrate is performed, the chamber cover having a gas supply hole passing through a ceiling wall thereof, an upper antenna disposed on an upper central portion of the chamber cover to generate an electric field in a central portion of the inner space, the upper antenna generating plasma by using a source gas supplied into the inner space, a side antenna disposed to surround a side portion of the chamber cover to generate an electric field in an edge portion of the inner space, the side antenna generating plasma by using the source gas supplied into the inner space, and a gas supply tube connected to the gas supply hole to supply the source gas into the inner space. The gas supply hole is disposed outside the upper antenna. 1. A substrate processing apparatus comprising:a chamber having an opened upper side, the chamber having a passage, through which a substrate is accessible, in a side thereof;a chamber cover covering the opened upper side of the chamber to provide an inner space in which a process with respect to the substrate is performed, the chamber cover having a gas supply hole passing through a ceiling wall thereof;an upper antenna disposed on an upper central portion of the chamber cover to generate an electric field in a central portion of the inner space, the upper antenna generating plasma by using a source gas supplied into the inner space;a side antenna disposed to surround a side portion of the chamber cover to generate an electric field in an edge portion of the inner space, the side antenna generating plasma by using the source gas supplied into the inner space; anda gas supply tube connected to the gas ...

APPARATUS FOR PROCESSING SUBSTRATE

Provided is a substrate processing apparatus. The substrate processing apparatus in which a process with respect to a substrate is performed includes a main chamber having a passage that is defined in one sidewall thereof to load or unload the substrate and upper and lower openings that are respectively defined in upper and lower portions thereof, a chamber cover closing the upper opening of the main chamber to provide a process space that is blocked from the outside to perform the process, a showerhead disposed in the process space, the showerhead having a plurality of spray holes that spray a process gas, a lower heating block on which the substrate is placed on an upper portion thereof, the lower heating block being fixed to the lower opening and having a lower installation space separated from the process space, and a plurality of lower heaters disposed in the lower installation space in a direction parallel to the substrate to heat the lower heating block. 1. A substrate processing apparatus in which a process with respect to a substrate is performed , the substrate processing apparatus comprising:a main chamber having a passage that is defined in one sidewall thereof to load or unload the substrate and upper and lower openings that are respectively defined in upper and lower portions thereof;a chamber cover closing the upper opening of the main chamber to provide a process space that is blocked from the outside to perform the process;a showerhead disposed in the process space, the showerhead having a plurality of spray holes that spray a process gas;a lower heating block on which the substrate is placed on an upper portion thereof, the lower heating block being fixed to the lower opening and having a lower installation space separated from the process space; anda plurality of lower heaters disposed in the lower installation space in a direction parallel to the substrate to heat the lower heating block.2. The substrate processing apparatus of claim 1 , further ...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME

The present disclosure relates to a substrate processing apparatus and a substrate processing method using the same, and more particularly, to a substrate processing apparatus that is capable of improving a flow of a process gas that is participated in a substrate processing process and a substrate processing method using the same. The substrate processing apparatus in accordance with an exemplary embodiment includes a pre-chamber into a substrate is carried, a process chamber communicating with the pre-chamber and in which a substrate processing process is performed, a substrate boat including a plurality of partition plates that partition a loading space into which the substrate is loaded and to elevate, a gas supply unit configured to supply a process gas to the substrate through a plurality of injection nozzles provided in the process chamber, an exhaust unit configured to exhaust a gas through a plurality of suction holes defined in the process chamber, and a swap guide member provided in the pre-chamber and configured to place the substrate carried into the pre-chamber in the loading space that is partitioned by the plurality of partition plates. 1. A substrate processing apparatus comprising:a pre-chamber into which a substrate is carried;a process chamber communicating with the pre-chamber and in which a substrate processing process is performed;a substrate boat comprising a plurality of partition plates to partition a loading space into which the substrate is loaded and to elevate;a gas supply unit configured to supply a process gas to the substrate through a plurality of injection nozzles provided in the process chamber;an exhaust unit configured to exhaust a gas through a plurality of suction holes provided in the process chamber; anda swap guide member provided in the pre-chamber and configured to place the substrate carried into the pre-chamber in the loading space that is partitioned by the plurality of partition plates.2. The substrate processing ...

SUBSTRATE PROCESSING APPARATUS INCLUDING EXHAUST PORTS AND SUBSTRATE PROCESSING METHOD

A substrate processing method in which processes with respect to substrates are performed comprises: stacking the substrates on a substrate holder disposed in a staking space formed within a lower chamber through a passage formed in a side of the lower chamber, exhausting the stacking space through an auxiliary exhaust port connected to the stacking space, moving the substrate holder into an external reaction tube closing an opened upper side of the lower chamber to provide a process space in which the processes are performed, and supplying a reaction gas into the process space using a supply nozzle connected to the process space and exhausting the process space using an exhaust nozzle connected to the process space and an exhaust port connected to the exhaust nozzle. 1. A substrate processing method in which processes with respect to substrates are performed , the substrate processing method comprising:stacking the substrates on a substrate holder disposed in a staking space formed within a lower chamber through a passage formed in a side of the lower chamber;exhausting the stacking space through an auxiliary exhaust port connected to the stacking space;moving the substrate holder into an external reaction tube closing an opened upper side of the lower chamber to provide a process space in which the processes are performed; andsupplying a reaction gas into the process space using a supply nozzle connected to the process space and exhausting the process space using an exhaust nozzle connected to the process space and an exhaust port connected to the exhaust nozzle.2. The substrate processing method of claim 1 , wherein the lower chamber comprises the exhaust port and the auxiliary exhaust port.3. The substrate processing method of claim 1 , further comprising exhausting the stacking space through the auxiliary exhaust port while the reaction gas is supplied into the process space.4. The substrate processing method of claim 3 , wherein the stacking space has a ...

Substrate Processing Apparatus

There is provided a substrate processing apparatus including: a chamber providing an internal space, in which a substrate is transferred through a passage and a process is performed on the substrate, and having a supply port supplying a gas to the substrate; and a susceptor installed in the internal space and including a heating region heating the substrate and a pre-heating region pre-heating the gas supplied from the supply port. 1. A substrate processing apparatus , comprising:a chamber providing an internal space, in which a substrate is transferred through a passage and a process is performed on the substrate, and having a supply port supplying a gas to the substrate; anda susceptor installed in the internal space and including a heating region heating the substrate and a pre-heating region pre-heating the gas supplied from the supply port.2. The substrate processing apparatus of claim 1 , wherein a temperature of the pre-heating region is higher than a temperature of the heating region.3. The substrate processing apparatus of claim 1 , wherein a shape of the heating region corresponds to that of the substrate claim 1 , anda length of the pre-heating region in a direction perpendicular to a direction of a gas flow is greater than a diameter of the substrate.4. The substrate processing apparatus of claim 1 , wherein a center of the heating region is deviated from a center of the susceptor to be disposed nearer to the passage than to the supply port.5. The substrate processing apparatus of claim 1 , wherein the susceptor includes:a sub-susceptor having a rectangular parallelepiped shape, including an opening which is deviated from the center of the susceptor, and providing the pre-heating region; anda main susceptor inserted into the opening and providing the heating region.6. The substrate processing apparatus of claim 5 , wherein a coefficient of thermal expansion of the sub-susceptor is lower than a coefficient of thermal expansion of the main susceptor.7. The ...

Substrate Processing Module, Substrate Processing Apparatus Including the same, and Substrate Transferring Method

There are provided a substrate processing module, and substrate processing apparatus including the same, and a substrate transferring method. The substrate processing module includes: a chamber having a passage formed on one side thereof and allowing a substrate to enter or exit therethrough; a first susceptor installed within the chamber, having at least one through hole formed in an upper surface thereof, and allowing the substrate to be placed thereon; a second susceptor installed within the chamber and allowing the substrate to be placed thereon; a rotary member provided within the chamber and rotating, based on a preset position; a holder connected to the rotary member and having a mounting surface allowing the substrate to be placed thereon; and a holder driving module driving the rotary member to move the holder to a standby position corresponding to the first susceptor or to a delivery position corresponding to the second susceptor.

SUBSTRATE PROCESSING DEVICE

Provided is a substrate processing apparatus. The substrate processing apparatus in which a process with respect to a substrate is performed includes a chamber body having an opened upper side, the chamber body including a passage defined in a side thereof so that the substrate is loaded or unloaded through the passage, a chamber cover disposed on the chamber body to cover the opened upper side of the chamber body, the chamber cover providing a process space in which the process with respect to the substrate is performed, a susceptor disposed within the process space to heat the substrate, and a heating block disposed on an upper or lower portion of the passage to preliminarily heat the substrate loaded through the passage. 1. A substrate processing apparatus comprising:a chamber body having an opened upper side, the chamber body comprising a passage defined in a side thereof so that a substrate is loaded or unloaded through the passage;a chamber cover disposed on the opened upper side of the chamber body to cover the opened upper side of the chamber body, the chamber cover providing a process space in which the process with respect to the substrate is performed;a susceptor disposed within the process space to heat the substrate disposed on a upper surface of the susceptor;a heating block disposed on an upper or lower portion of the passage to preliminarily heat the substrate loaded through the passage; andan end effector moving with the substrate through the passage and loading the substrate on the upper surface of the susceptor.2. The substrate processing apparatus of claim 1 , wherein the chamber body has upper and lower openings that are respectively defined in the upper and lower portions of the passage claim 1 , and an upper heating block fixed to the upper opening, the upper heating block having an upper installation space separated from the process space; and', 'a lower heating block fixed to the lower opening, the lower heating block having a lower ...

Substrate treatment apparatus

Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber body having a passage, through which substrates are transferred, in one side thereof, the chamber body having opened upper and lower portions, an inner reaction tube disposed above the chamber body to provide a process space in which a process with respect to the substrates is performed, the inner reaction tube having an opened lower portion, a substrate holder disposed in the opened lower portion of the chamber to move between a stacking position at which the substrates transferred through the passage are vertically stacked and a process position at which the substrate holder ascends toward the process space to perform the process with respect to the stacked substrates, a blocking plate connected to a lower portion of the substrate holder to ascend or descend together with the substrate holder, the blocking plate closing the opened lower portion of the inner reaction tube at the process position, a connection cylinder vertically disposed on a lower portion of the blocking plate to ascend or descend together with the blocking plate, and a blocking member connected between the opened lower portion of the chamber body and the connection cylinder to isolate the opened lower portion of the chamber body from the outside.

Substrate processing device

Provided is a substrate processing apparatus. The substrate processing apparatus in which a process with respect to a substrate is performed includes a main chamber having an opened upper side, the main chamber including a passage defined in a side thereof so that the substrate is loaded or unloaded through the passage, a susceptor disposed within the main chamber to allow the substrate to be placed thereon, a chamber cover disposed on the opened upper side of the main chamber, the chamber cover including an upper installation space defined above the susceptor and a gas supply passage disposed outside the upper installation space, a heating block disposed in the upper installation space to heat the substrate, and a gas supply port connected to the gas supply passage to supply a process gas into the process space.

Substrate Transfer Robot and Substrate Processing Apparatus Using The Same

A substrate processing apparatus may include: a loadlock chamber in which a substrate transferred from the outside is disposed, and an internal state thereof is changed to a vacuum state and an atmospheric pressure state; a substrate processing module in which a process is performed on the substrate; a transfer chamber in which the substrate is transferred, the transfer chamber being disposed between the loadlock chamber and the substrate processing module; and a substrate transfer robot installed within the transfer chamber and transferring the substrate. 1. A substrate processing apparatus comprising:a loadlock chamber in which a substrate transferred from the outside is disposed, and an internal state thereof is changed to a vacuum state and an atmospheric pressure state;a substrate processing module in which a process is performed on the substrate;a transfer chamber in which the substrate is transferred, the transfer chamber being disposed between the loadlock chamber and the substrate processing module; anda substrate transfer robot installed within the transfer chamber and transferring the substrate,wherein the substrate transfer robot includes:a base frame part rotatably installed on a lower portion of the transfer chamber;a first rotating frame part having one end rotatably connected to the base frame part;a second rotating frame part having one end rotatably connected to the other end of the first rotating frame part; anda transfer frame part including an arm portion having one end rotatably connected to the other end of the second rotating frame part and a holder portion connected to the other end of the arm portion and allowing the substrate to be disposed on the holder portion.2. The substrate processing apparatus of claim 1 , wherein the transfer chamber has an internal space having a circular horizontal cross-section claim 1 ,the first rotating frame part has a linear form and a length less than a radius of the internal space, andthe one end of the ...

SHOWERHEAD HAVING COOLING SYSTEM AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SHOWERHEAD

Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber body having an opened upper side, the chamber body providing an inner space in which processes with respect to a substrate are performed, a chamber lid disposed on an upper portion of the chamber body to close the opened upper side of the chamber body, and a showerhead disposed on a lower portion of the chamber lid to supply a reaction gas into the inner space. The showerhead includes a flange contacting the chamber lid, the flange having a passage recessed from a top surface of the flange to allow a refrigerant to flow therein, and a flat plate disposed inside the flange, the flat plate having at least one injection hole for injecting the reaction gas in a thickness direction thereof. 1. A substrate processing apparatus comprising:a chamber body having an opened upper side, the chamber body providing an inner space in which processes with respect to a substrate are performed;a chamber lid disposed on an upper portion of the chamber body to close the opened upper side of the chamber body; anda showerhead disposed on a lower portion of the chamber lid to supply a reaction gas into the inner space,wherein the showerhead comprises:a flange contacting the chamber lid, the flange having a passage recessed from a top surface of the flange to allow a refrigerant to flow therein; anda flat plate disposed inside the flange, the flat plate having at least one injection hole for injecting the reaction gas in a thickness direction thereof.2. The substrate processing apparatus of claim 1 , further comprising a sealing member disposed between the chamber lid and the flange and inside the passage.3. The substrate processing apparatus of claim 1 , wherein the showerhead further comprises a passage cover coupled to the flange to close an upper portion of the passage.4. The substrate processing apparatus of claim 1 , wherein the passage is disposed inside the chamber body to correspond ...

SUBSTRATE PROCESSING APPARATUS INCLUDING EXHAUST PORTS AND SUBSTRATE PROCESSING METHOD

Provided is a substrate processing apparatus. The substrate processing apparatus in which processes with respect to substrates are performed includes a lower chamber having an opened upper side, the lower chamber including a passage allowing the substrates to pass therethrough in a side thereof, an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed, a substrate holder on which the one or more substrates are vertically stacked, the substrate holder being movable between a stacking position in which the substrates are stacked within the substrate holder and a process position in which the processes with respect to the substrates are performed, at least one supply nozzle disposed along an inner wall of the external reaction tube, the at least one supply nozzle having a supply hole for discharging a reaction gas, at least one exhaust nozzle disposed along the inner wall of the external reaction tube, the at least one exhaust nozzle having an exhaust hole for suctioning an non-reaction gas and byproducts within the process space, and a rear exhaust line connected to the exhaust nozzle to discharge the non-reaction gas and the byproducts which are suctioned through the exhaust hole. The lower chamber includes an exhaust port connecting the exhaust nozzle to the rear exhaust line and an auxiliary exhaust port connecting a stacking space defined within the lower chamber to the rear exhaust line. 1. A substrate processing apparatus in which processes with respect to substrates are performed , the substrate processing apparatus comprising:a lower chamber having an opened upper side, the lower chamber comprising a passage allowing the substrates to pass therethrough in a side thereof;an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed;a substrate holder on which the one or more substrates are vertically ...

APPARATUS FOR PROCESSING APPARATUS HAVING SIDE PUMPING TYPE

Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber body having an opened upper side, the chamber body providing an inner space in which a process with respect to a substrate is performed, a chamber lid disposed on an upper portion of the chamber body to close the opened upper side of the chamber body, and a showerhead disposed on a lower portion of the chamber lid to supply a process gas toward the inner space. The chamber body includes at least one convergent port disposed along the inside of a sidewall of the chamber body to allow the process gas within the inner space to converge, a plurality of inner exhaust holes defined in along the sidewall of the chamber body to communicate with the convergent port and the inner space, and a plurality of inner exhaust ports connected to the convergent port. 1. A substrate processing apparatus comprising:a chamber body having an opened upper side, the chamber body providing an inner space in which a process with respect to a substrate is performed;a chamber lid disposed on an upper portion of the chamber body to close the opened upper side of the chamber body; anda showerhead disposed on a lower portion of the chamber lid to supply a process gas toward the inner space,wherein the chamber body comprises:at least one convergent port disposed along the inside of a sidewall of the chamber body to allow the process gas within the inner space to converge;a plurality of inner exhaust holes defined in along the sidewall of the chamber body to communicate with the convergent port and the inner space; anda plurality of inner exhaust ports connected to the convergent port.2. The substrate processing apparatus of claim 1 , further comprising a susceptor on which the substrate is loaded on a top surface thereof claim 1 , the susceptor being changeable in position through elevation thereof between a loading position at which the substrate is loaded and a process position at which the process ...

SUBSTRATE PROCESSING APPARATUS

Provided is a substrate processing apparatus. The substrate processing apparatus in which a process with respect to a substrate is performed includes a main chamber having an opened upper portion, the main chamber having a passage that is defined in a sidewall thereof so that a substrate is accessible, a chamber cover disposed on the opened upper portion of the main chamber to provide a process space, which is sealed from the outside, in which the process is performed, a susceptor plate on which the substrate is placed, the susceptor plate having an inner space with an opened lower portion, and a main heater rotatably disposed in the inner space, the main heater being spaced apart from the susceptor plate to heat the susceptor plate. 1. A substrate processing apparatus in which a process with respect to a substrate is performed , the substrate processing apparatus comprising:a main chamber having an opened upper portion, the main chamber having a passage that is defined in a sidewall thereof so that a substrate is accessible;a chamber cover disposed on the opened upper portion of the main chamber to provide a process space, which is sealed from the outside, in which the process is performed;a susceptor plate on which the substrate is placed, the susceptor plate having an inner space with an opened lower portion; anda main heater rotatably disposed in the inner space, the main heater being spaced apart from the susceptor plate to heat the susceptor plate.2. The substrate processing apparatus of claim 1 , further comprising a support member disposed on the opened lower portion of the susceptor plate to prevent heat within the inner space from being diffused into the outside.3. The substrate processing apparatus of claim 2 , further comprising a rotation shaft disposed on a lower portion of the main heater to support the main heater claim 2 , the rotation shaft being rotatable together with the main heater claim 2 ,wherein the main heater comprises:a heating plate ...

SUBSTRATE PROCESSING APPARATUS INCLUDING PROCESSING UNIT

Provided is a substrate processing apparatus. The substrate processing apparatus in which a process with respect to substrates is performed includes a lower chamber having an opened upper portion, the lower chamber having a passage, through which the substrates are accessible, in a side thereof, an external reaction tube closing the opened upper portion of the lower chamber to provide a process space in which the process is performed, a substrate holder on which the one or more substrates are vertically stacked, the substrate holder being movable between a stacking position at which the substrates are stacked within the substrate holder and a process position at which the process with respect to the substrates is performed, a gas supply unit supplying a reaction gas into the process space, and a processing unit disposed outside the external reaction tube to activate the reaction gas, thereby performing the process with respect to the substrates. 1. A substrate processing apparatus in which a process with respect to substrates is performed , the substrate processing apparatus comprising:a lower chamber having an opened upper portion, the lower chamber having a passage, through which the substrates are accessible, in a side thereof;an external reaction tube closing the opened upper portion of the lower chamber to provide a process space in which the process is performed;a substrate holder on which the one or more substrates are vertically stacked, the substrate holder being movable between a stacking position at which the substrates are stacked within the substrate holder and a process position at which the process with respect to the substrates is performed;a gas supply unit supplying a reaction gas into the process space; anda processing unit disposed outside the external reaction tube to activate the reaction gas, thereby performing the process with respect to the substrates.2. The substrate processing apparatus of claim 1 , wherein the processing unit comprises:a ...

APPARATUS FOR PROCESSING SUBSTRATE FOR SUPPLYING REACTION GAS HAVING PHASE DIFFERENCE

Provided is a substrate processing apparatus. The substrate processing apparatus in which processes with respect to substrates are performed includes a lower chamber having an opened upper side, the lower chamber including a passage allowing the substrates to pass therethrough in a side thereof, an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed, a substrate holder on which the one ore more substrates are vertically stacked, the substrate holder being movable between a stacking position in which the substrates are stacked within the substrate holder and a process position in which the processes with respect to the substrates are performed, and a gas supply unit disposed inside the external reaction tube to supply a reaction gas into the process space, the gas supply unit forming a flow of the reaction gas having different phase differences in a vertical direction. 1. A substrate processing apparatus in which processes with respect to substrates are performed , the substrate processing apparatus comprising:a lower chamber having an opened upper side, the lower chamber comprising a passage allowing the substrates to pass therethrough in a side thereof;an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed;a substrate holder on which the one ore more substrates are vertically stacked, the substrate holder being movable between a stacking position in which the substrates are stacked and a process position in which the processes with respect to the substrates are performed; anda gas supply unit disposed inside the external reaction tube to supply a reaction gas into the process space, the gas supply unit forming a flow of the reaction gas having different phase differences in a vertical direction.2. The substrate processing apparatus of claim 1 , wherein the gas supply unit comprises:a plurality of ...

SUBSTRATE PROCESSING APPARATUS INCLUDING HEAT-SHIELD PLATE

Provided is a substrate processing apparatus. The substrate processing apparatus in which processes with respect to substrates are performed includes a lower chamber having an opened upper side, the lower chamber including a passage allowing the substrates to pass therethrough in a side thereof, an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed, an internal reaction tube disposed within the external reaction tube, the internal reaction tube being disposed around a substrate holder placed in the process position to define a reaction region with respect to the substrates, a heater disposed outside the external reaction tube to heat the process space, the substrate holder on which the one or more substrates are vertically stacked, the substrate holder being movable between a stacking position in which the substrates are stacked within the substrate holder and a process position in which the processes with respect to the substrates are performed, and a heat-shield plate disposed under the substrate holder to close an opened lower side of the internal reaction tube when the substrate holder is disposed at the process position. 1. A substrate processing apparatus in which processes with respect to substrates are performed , the substrate processing apparatus comprising:a lower chamber having an opened upper side, the lower chamber comprising a passage allowing the substrates to pass therethrough in a side thereof;an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed;an internal reaction tube disposed within the external reaction tube, the internal reaction tube being disposed around a substrate holder placed in the process position to define a reaction region with respect to the substrates;a heater disposed outside the external reaction tube to heat the process space;the substrate holder on which ...

Purge chamber, and substrate-processing apparatus including same

Provided is a substrate processing apparatus including a process chamber in which a process for processing a substrate are processed, a purge chamber removing contaminants existing on the substrate, and a transfer chamber connected to a side surface of each of the process chamber and the purge chamber, the transfer chamber including a substrate handler transferring the substrate, on which the process is performed, into the purge chamber between the process chamber and the purge chamber, wherein the purge chamber includes a chamber having an inner space and a passage through which the substrate is taken in or out of the inner space, a substrate holder on which the substrate is placed, the substrate holder being disposed in the chamber, a gas supply port disposed on a side surface with respect to the passage to supply a gas toward the inner space, and an exhaust port disposed on a side opposite to the gas supply port to discharge the gas within the inner space.

SUBSTRATE-PROCESSING DEVICE

Provided is a substrate processing apparatus. The substrate processing apparatus includes a process chamber in which a process with respect to a substrate is performed, a preliminary chamber connected to the process chamber, the preliminary chamber having a passage through which the substrate is accessed, a blocking plate partitioning the inside of the preliminary chamber into a holding region and a transfer region, a substrate holder on which at least one substrate is loaded, the substrate holder being switchable into a loading position in which the substrate holder is disposed on the holding region and a process position in which the substrate holder is disposed on the process chamber, a substrate transfer unit transferring the substrate holder from the loading position to the process position, the substrate transfer unit including a transfer arm connected to the substrate holder and a driver operating the transfer arm, a gas supply port supplying an inert gas into the preliminary chamber, and a lower exhaust port connected to the transfer region and disposed above the gas supply port to exhaust the inside of the preliminary chamber. The lower exhaust port is disposed closer to a bottom surface of the preliminary chamber than a top surface of the preliminary chamber. 1. A substrate processing apparatus comprising:a process chamber in which a process with respect to a substrate is performed;a preliminary chamber connected to the process chamber, the preliminary chamber having a passage through which the substrate is accessed;a blocking plate partitioning the inside of the preliminary chamber into a holding region and a transfer region;a substrate holder on which at least one substrate is loaded, the substrate holder being switchable into a loading position in which the substrate holder is disposed on the holding region and a process position in which the substrate holder is disposed on the process chamber;a substrate transfer unit transferring the substrate holder ...

Apparatus for processing substrate

Provided is a substrate processing apparatus. The substrate processing apparatus includes a process chamber having an inner space in which a substrate transferred from the outside is accommodated, and a process with respect to the substrate is performed and a tube type heater disposed around the inner space in a sidewall of the process chamber, the tube type heater having a passage through which a refrigerant supplied from the outside flows.

APPARATUS FOR PROCESSING SUBSTRATE

Provided is a substrate processing apparatus. The substrate processing apparatus includes a process chamber having an inner space in which a substrate transferred from the outside is accommodated, and a process with respect to the substrate is performed, hot-wire heaters disposed in a sidewall of the process chamber, the hot-wire heaters being disposed around the inner space to heat the substrate, and a cooling tube in which a refrigerant supplied from the outside flows, the cooling tube being disposed between the hot-wire heaters along the sidewall of the process chamber. 1. A substrate processing apparatus comprising:a process chamber having an inner space in which a substrate is accommodated, and a process with respect to the substrate is performed;hot-wire heaters disposed in a sidewall of the process chamber, the hot-wire heaters being disposed around the inner space to heat the substrate; anda cooling tube in which a refrigerant supplied from the outside flows, the cooling tube being disposed between the hot-wire heaters along the sidewall of the process chamber.2. The substrate processing apparatus of claim 1 , wherein the process chamber comprises an inlet port disposed on one side of the process chamber claim 1 , and the cooling tube is taken into the inlet port claim 1 , andthe substrate processing apparatus further comprises a supply line connected to the cooling tube disposed on the inlet port to supply the refrigerant.3. The substrate processing apparatus of claim 2 , further comprising an internal reaction tube disposed in the inner space to partition the inner space into the inside and the outside claim 2 , the internal reaction tube having a process space in which the process with respect to the substrate is performed claim 2 , andthe cooling tube has a plurality of injection holes for injecting the refrigerant toward the outside of the internal reaction tube.4. The substrate processing apparatus of claim 3 , further comprising an exhaust port ...

Apparatus for processing substrate

本發明揭示一種基板處理裝置。該基板處理設備包含：一腔室本體，其具有一通道，透過其一側輸送基板，該腔室本體具有開放式上半部與下半部；一內部反應管，其設置於該腔室本體之上來提供一處理空間，其中執行有關該等基板的一處理，該內部反應管具有一開放式下半部；一基板固定器，設置於該腔室的該開放式下半部內，以便在輸送通過該通道的該等基板垂直堆疊之一堆疊位置與該基板固定器朝向該處理空間上升之一處理位置之間移動，來執行與該等堆疊基板有關的該處理；一阻擋板，其連接至該基板固定器的下半部，以便與該基板固定器一起上升或下降，該阻擋板在該處理位置上封閉該內部反應管的該開放式下半部；一連接圓筒，其垂直設置於該阻擋板的下半部上，隨著該阻擋板一起上升或下降；以及一阻擋構件，其連接在該腔室本體的該開放式下半部與該連接圓筒之間，將該腔室本體的該開放式下半部與外界隔離。

Substrate processing apparatus

A substrate processing apparatus includes a chamber defining an inner space where a process is carried out with respect to a substrate, a support member disposed in the chamber for supporting the substrate, and a guide tube disposed above the support member for guiding plasma generated in the inner space to the substrate on the support member. The guide tube is configured in the shape of a cylinder having a sectional shape substantially corresponding to the shape of the substrate, and the guide tube discharges the plasma introduced through one end thereof to the support member through the other end thereof. The chamber includes a process chamber in which the support member is disposed and a generation chamber disposed above the process chamber. The process is carried out by the plasma in the process chamber, and the plasma is generated by a coil in the generation chamber.

Substrate processing apparatus having side pumping type

Substrate processing apparatus

A substrate processing apparatus includes a chamber defining an inner space where a process is carried out with respect to a substrate, a support member disposed in the chamber for supporting the substrate, and a guide tube disposed above the support member for guiding plasma generated in the inner space to the substrate on the support member. The guide tube is configured in the shape of a cylinder having a sectional shape substantially corresponding to the shape of the substrate, and the guide tube discharges the plasma introduced through one end thereof to the support member through the other end thereof. The chamber includes a process chamber in which the support member is disposed and a generation chamber disposed above the process chamber. The process is carried out by the plasma in the process chamber, and the plasma is generated by a coil in the generation chamber.

基板處理裝置

本發明揭示一種基板處理裝置。該基板處理設備包含：一腔室，透過其一側內定義的一通道傳輸基板至該腔室或從該腔室傳輸基板，該腔室具有一開放式上半部；一內部反應管，其連接至該腔室來提供一內部空間，其中執行有關該等基板的一處理，該內部反應管具有複數個支撐尖端，沿著其一內側表面突出；一晶舟，其包含一垂直框架，其中在其垂直方向內定義複數個支撐槽，該晶舟可在該內部空間之內升降；阻擋板，其位於該垂直框架上，如此該等阻擋板彼此相隔，該等阻擋板位於該等支撐槽、該最上方支撐槽的上半部以及該最下方支撐槽的下半部之間；阻擋環，其位於該等支撐尖端的上半部上，分別從該等支撐尖端朝向該內部反應管的內部突出；噴嘴，其插入該內部反應管的一側並且沿著該內部反應管的一垂直方向放置，該等噴嘴位於該等支撐尖端之間，以供應一處理氣體至該等基板上；以及排氣嘴，其插入該內部反應管的另一側並且沿著該內部反應管的該垂直方向放置，該等排氣嘴位於該等支撐尖端之間來排放該處理氣體。

基板處理模組、包括該基板處理模組之基板處理裝置以及基板轉移方法

一種基板處理模組、包括該基板處理模組之基板處理裝置、以及基板轉移方法。基板處理模組包括：腔室，該腔室在其一側上形成有通道且允許基板經由該通道進入或退出；第一基座，其安裝於該腔室內、在其一上表面中形成有至少一個通孔且允許該基板置放於其上；第二基座，其安裝於該腔室內且允許該基板置放於其上；旋轉構件，其提供於該腔室內且基於預設位置來旋轉；固持器，其連接至該旋轉構件且具有安裝表面，該安裝表面允許該基板置放於其上；以及固持器驅動模組，其驅動該旋轉構件以使該固持器移動至對應於該第一基座之備用位置或移動至對應於該第二基座之傳送位置。

基板搬送装置及びこれを備える基板処理装置

【課題】エンドエフェクター（ｅｎｄ－ｅｆｆｅｃｔｏｒ）の垂れ下がりを感知する基板搬送装置及びこれを備える基板処理装置を提供すること。【解決手段】第１の方向に延び、基板が支持されるエンドエフェクターと、前記エンドエフェクターの前記第１の方向の一方の側が連結されるエンドエフェクターハンドと、前記エンドエフェクターハンドに連結され、前記エンドエフェクターを前記第１の方向に移動させる水平移動部と、前記エンドエフェクターの移動経路の両側にそれぞれ配置される発光部及び受光部を有し、前記エンドエフェクターの垂れ下がりを感知する垂れ下がり感知部と、を備える基板搬送装置。【選択図】図１

Substrate transfer device and substrate processing apparatus having the same

The present disclosure relates to a substrate transfer device for sensing deflection of an end-effector and a substrate processing apparatus having the same. The substrate transfer device includes: an end-effector extending in a first direction and supporting a substrate; an end-effector hand connected with one side in the first direction of the end-effector; a horizontal movement unit connected with the end-effector hand and moving the end-effector in the first direction; and a deflection sensing unit including a light emitting part and a light receiving part, which are respectively disposed at both sides of a movement path of the end-effector, and sensing deflection of the end-effector.

包含處理單元的基板處理裝置

本發明揭示一種基板處理裝置。該基板處理裝置其中執行關於基板的處理，該裝置包含：一下方處理室，其具有一開放式上半部，該下方處理室具有一通道在其一側邊，通過該通道可存取該等基板；一外部反應管，其封閉該下室的該開放式上半部，以提供其中執行該等處理的一處理空間；一基板固定器，其上垂直堆疊一或多個基板，該基板固定器可在其中該等基板堆疊在該基板固定器內的一堆疊位置與其中執行關於該等基板的該等處理之一處理位置之間移動；一氣體供應單元，其供應一反應氣體進入該處理空間；以及一處理單元，其位於該外部反應管之外來啟用該反應氣體，藉此執行有關該等基板的該處理。

基板處理設備

一種基板處理設備，其包括：一腔室，該腔室提供一內部空間，一基板經由一通道轉移至該內部空間中，且在該內部空間中對該基板執行一製程，且該腔室具有向該基板供應一氣體之一供應埠；以及一基座，該基座安裝於該內部空間中且包括加熱該基板之一加熱區及預熱自該供應埠供應的該氣體之一預熱區。

基板處理裝置

本發明揭示一種基板處理裝置。該基板處理裝置其中執行關於基板的處理，該裝置包含：一主腔室，其具有一開放式上半部，該主腔室具有其一側壁內定義的一通道，如此讓一基板可進出；一腔室蓋，其位於該主腔室的該開放式上半部，提供從外界密封並且其中執行該處理的一處理空間；一承座板，其上放置該基板，該承座板具有含一開放式下半部的一內空間；以及一主加熱器，其旋轉放置在該內空間內，該主加熱器與該承座板相隔來加熱該承座板。

基板處理裝置

本發明揭示一種基板處理裝置。該基板處理裝置其中執行關於基板的處理，該裝置包含：一主腔室，其具有定義在其一側壁內的一通道，來載入或卸載該基板，以及具有分別定義在其上與下半部內的上方開口與下方開口；一腔室蓋，其關閉該主腔室的該上方開口，提供與外界分隔的一處理空間來執行該處理；一噴灑頭，其安置於該處理空間內，該噴灑頭具有複數個噴孔來噴出一處理氣體；一下方加熱區塊，其一上半部上放置該基板，該下方加熱區塊固定至該下方開口並且具有與該處理空間分隔的一下方安裝空間；以及複數個下方加熱器，其安置於該下方安裝空間內，方向於該基板平行，以加熱該下方加熱區塊。

Substrate processing apparatus including heat-shield plate

Provided is a substrate processing apparatus. The substrate processing apparatus in which processes with respect to substrates are performed includes a lower chamber having an opened upper side, the lower chamber including a passage allowing the substrates to pass therethrough in a side thereof, an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed, an internal reaction tube disposed within the external reaction tube, the internal reaction tube being disposed around a substrate holder placed in the process position to define a reaction region with respect to the substrates, a heater disposed outside the external reaction tube to heat the process space, the substrate holder on which the one or more substrates are vertically stacked, the substrate holder being movable between a stacking position in which the substrates are stacked within the substrate holder and a process position in which the processes with respect to the substrates are performed, and a heat-shield plate disposed under the substrate holder to close an opened lower side of the internal reaction tube when the substrate holder is disposed at the process position.