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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 10. Отображено 10.
21-08-2001 дата публикации

Methods of forming integrated circuit packages

Номер: US0006277671B1
Автор: Tripard Jason, TRIPARD JASON E, TRIPARD JASON E.
Принадлежит: MICRON TECHNOLOGY, INC., MICRON TECHNOLOGY INC

In one aspect, the invention includes a method of forming integrated circuit packages. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins.In another aspect, ...

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Номер записи: 1
02-10-2007 дата публикации

Integrated circuit package separator methods

Номер: US0007276397B2
Автор: Jason E. Tripard, TRIPARD JASON E, TRIPARD JASON E.
Принадлежит: Micron Technology, Inc., MICRON TECHNOLOGY INC, MICRON TECHNOLOGY, INC.

An integrated circuit package separator method for separating integrated circuit packages from a board having a plurality of integrated circuits. The method includes providing a base having a plurality of pins, providing a support over the base and having a plurality of holes extending therethrough, the plurality of pins extending through the plurality of holes, vertically displacing the support off the pins using a pair of pneumatic actuators such that each of the pneumatic actuators lift respective opposing ends of the support substantially simultaneously and in unison, providing each of the pneumatic actuators with release valves to equilibrate a back-pressure to ambient during lifting of the support, and separating the integrated circuit packages from one another when the board is over the upper surface of the support.

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Номер записи: 2
13-04-2004 дата публикации

Integrated circuit package separators

Номер: US0006718858B2
Автор: Jason E. Tripard, TRIPARD JASON E, TRIPARD JASON E.
Принадлежит: Micron Technology, Inc., MICRON TECHNOLOGY INC, MICRON TECHNOLOGY, INC.

In one aspect, the invention includes a method of forming integrated circuit packages. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins. In another aspect ...

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Номер записи: 3
29-12-2005 дата публикации

Integrated circuit package separators

Номер: US2005284274A1
Автор: TRIPARD JASON E, TRIPARD JASON E.
Принадлежит:

In one aspect, the invention includes a method of forming integrated circuit packages. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins. In another aspect ...

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Номер записи: 4
20-09-2005 дата публикации

Integrated circuit package separators

Номер: US0006945151B1
Автор: Jason E. Tripard, TRIPARD JASON E, TRIPARD JASON E.
Принадлежит: Micron Technology, Inc., MICRON TECHNOLOGY INC, MICRON TECHNOLOGY, INC.

A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another.

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Номер записи: 5
26-07-2005 дата публикации

Integrated circuit package separators

Номер: US0006920815B2
Автор: Jason E. Tripard, TRIPARD JASON E, TRIPARD JASON E.
Принадлежит: Micron Technology, Inc., MICRON TECHNOLOGY INC, MICRON TECHNOLOGY, INC.

An integrated circuit package separator for separating integrated circuit packages from a board includes a base, a support over the base, and a pair of pneumatic actuators including first and second lift members laterally spaced from the base and beneath respective ends of a pair of opposing ends of the support. The first and second lift members are configured to vertically displace the support and lift the support off the base by contacting the support. Individual actuators of the pair include release valves configured to equilibrate a back-pressure of the individual actuators to ambient during lifting of the support. The separator includes a cutting mechanism configured to cut the board while the board is over the upper surface of the support to separate the integrated circuit packages from one another.

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Номер записи: 6
22-12-2005 дата публикации

Integrated circuit package separators

Номер: US2005278944A1
Автор: TRIPARD JASON E, TRIPARD JASON E.
Принадлежит:

In one aspect, the invention includes a method of forming integrated circuit packages. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins. In another aspect ...

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Номер записи: 7
06-05-2008 дата публикации

Integrated circuit package separators

Номер: US0007367252B2
Автор: Jason E. Tripard, TRIPARD JASON E, TRIPARD JASON E.
Принадлежит: Micron Technology, Inc., MICRON TECHNOLOGY INC, MICRON TECHNOLOGY, INC.

An integrated circuit package separator. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins.

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Номер записи: 8
21-01-2003 дата публикации

Integrated circuit package separators

Номер: US0006508154B1
Автор: Jason E. Tripard, TRIPARD JASON E, TRIPARD JASON E.
Принадлежит: Micron Technology, Inc., MICRON TECHNOLOGY INC, MICRON TECHNOLOGY, INC.

A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another.

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Номер записи: 9
07-04-2009 дата публикации

Integrated circuit package separators

Номер: US0007513182B2
Автор: Jason E. Tripard, TRIPARD JASON E, TRIPARD JASON E.
Принадлежит: Micron Technology, Inc., MICRON TECHNOLOGY INC, MICRON TECHNOLOGY, INC.

Integrated circuit package separator for separating integrated circuit packages from a board. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board and cut to separate the integrated circuit packages from one another. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins.

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Номер записи: 10