POWER MODULE OPERABLE IN A HAZARDOUS ENVIRONMENT

A power module and method of forming the same. The power module includes an extruded tube with internal and external fins, first and second opposing surfaces defining ends thereof, and an internal slot for housing a power converter. The power module includes a bottom plate having a first depression to receive a first O-ring to provide a first liquid-tight fluid seal at the first opposing surface for an electrically insulting oil encapsulating the power converter. The power module includes a cable interface plate having a second depression to receive a second O-ring to provide a second liquid-type fluid seal at the second opposing surface for the electrically insulting oil encapsulating the power converter. The power module includes an end cap to mate with the cable interface plate and accept a conduit fitting to enable an electrical cable to be routed from within the end cap to an external connection point. 1. A power module , comprising:an extruded tube formed with an internal fin and an external fin and a first opposing surface and a second opposing surface defining ends of said extruded tube, said extruded tube including an internal slot for housing a power converter;a bottom plate formed with a first depression configured to receive a first O-ring disposed between said first opposing surface and said first depression to provide a first liquid-tight fluid seal at said first opposing surface for an electrically insulting oil encapsulating said power converter within said internal slot; anda cable interface plate formed with a second depression configured to receive a second O-ring disposed between said second opposing surface and said second depression to provide a second liquid-type fluid seal at said second opposing surface for said electrically insulting oil encapsulating said power converter within said internal slot.2. The power module as recited in further comprising an end cap configured to mate with said cable interface plate and accept a conduit fitting ...

ADVANCED HEAT SINKS AND THERMAL SPREADERS

A heat sink assembly for an electronic device or a heat generating device(s) is constructed from an ultra-thin graphite layer. The ultra-thin graphite layer exhibits thermal conductivity which is anisotropic in nature and is greater than 500 W/m° C. in at least one plane and comprises at least a graphene layer. The ultra-thin graphite layer is structurally supported by a layer comprising at least one of a metal, a polymeric resin, a ceramic, and a mixture thereof, which is disposed on at least one surface of the graphite layer.

Method and apparatus for removing heat from electronic devices using synthetic jets

An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.

Lighting system with thermal management system

Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.

LIGHTING SYSTEM WITH THERMAL MANAGEMENT SYSTEM

Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system. 1. A lighting system , comprising:a housing structure;an array of light emitting diodes (LEDs) configured to provide illumination visible through an opening in the housing structure; a heat sink; and', 'one or more synthetic jet devices configured to generate and project a series of fluid vortices toward the heat sink; and, 'a thermal management system configured to provide cooling for the array of LEDs, the thermal management system comprisingdriver electronics configured to provide power to each of the array of LEDs and the one or more synthetic jet devices, wherein the driver electronics drive the array of LEDs such that the lighting system has an efficiency of greater than 90%.2. The lighting system claim 1 , as set forth in claim 1 , wherein the array of LEDs are driven at 500 mA and 59.5 V.3. The lighting system claim 1 , as set forth in claim 1 , wherein the driver electronics drive the array of LEDs such that the lighting system has a power factor greater than or equal to 0.9 claim 1 , galvanic isolation between input AC voltage and output voltage claim 1 , and an input voltage of 120 V RMS at 60 Hz.4. The lighting system claim 1 , as set forth in claim 1 , wherein the driver electronics drive the one or more synthetic jets with less than 200 Hz and 64 V peak-to-peak.5. The lighting system claim 1 , as set forth in claim 1 , where the array of LEDs provide a ...

Folded gradient terminal board end connector

A folded gradient terminal board end connector includes a multi-layer terminal connection board having a plurality of connection paths and vias configured to provide intercrossing between a plurality of folded gradient coils and further to provide symmetry between the plurality of folded gradient coils without spatial interference between folded portions of the plurality of folded gradient coils to optimize the folded gradient coil efficiency.

FOLDED GRADIENT TERMINAL BOARD END CONNECTOR

A folded gradient terminal board end connector includes a multi-layer terminal connection board having a plurality of connection paths and vias configured to provide intercrossing between a plurality of folded gradient coils and further to provide symmetry between the plurality of folded gradient coils without spatial interference between folded portions of the plurality of folded gradient coils to optimize the folded gradient coil efficiency.

METHOD AND APPARATUS FOR REMOVING HEAT FROM ELECTRONIC DEVICES USING SYNTHETIC JETS

An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.

System and method for actively cooling an ultrasound probe

An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.

Thermal management system for cooling a heat generating component of a magnetic resonance imaging apparatus

A thermal management system for cooling a heat generating component of a Magnetic Resonance Imaging (MRI) apparatus includes at least one heat pipe having a portion disposed proximate the heat generating component, such as a gradient coil and/or RF coil. When heat is removed from the component, a working fluid in a relatively hotter end of the heat pipe vaporizes and travels toward a relatively colder end of the heat pipe. The colder end may be operatively coupled to a heat sink for removing the heat from the colder end and increase the overall efficiency of the system. The heat pipe may be disposed along a horizontal, a vertical direction and/or along a diagonal of the heat generating component.

Sealed enclosure for power electronics incorporating a heat exchanger

A functional heat exchanger structure provides a hermetic seal for the power electronics. The heat exchanger includes one or more features built into the design. The features include a closed loop liquid circuit, air, or extended surfaces built-in to the design to transfer heat from the heat generating devices, spring clips snapped in built-in slots to mount heat-generating devices, preformed threaded rails to mount the printed circuit board (PCB), electrical isolation between the heat sink/cold plate and the electrical components, a sealed enclosure to provide environmental protection for the electronic components, a mounting feature to mount the sealed enclosure onto an external surface, an opening to accept a snap-in style cover, a stackable design, and an easily manifoldable configuration.

Power module operable in a hazardous environment

A power module and method of forming the same. The power module includes an extruded tube with internal and external fins, first and second opposing surfaces defining ends thereof, and an internal slot for housing a power converter. The power module includes a bottom plate having a first depression to receive a first O-ring to provide a first liquid-tight fluid seal at the first opposing surface for an electrically insulting oil encapsulating the power converter. The power module includes a cable interface plate having a second depression to receive a second O-ring to provide a second liquid-type fluid seal at the second opposing surface for the electrically insulting oil encapsulating the power converter. The power module includes an end cap to mate with the cable interface plate and accept a conduit fitting to enable an electrical cable to be routed from within the end cap to an external connection point.

LIGHTING SYSTEM WITH THERMAL MANAGEMENT SYSTEM

Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system. 1. A lighting system , comprising:a housing structure;a light source configured to provide illumination visible through an opening in the housing structure; and a heat sink having a base and a plurality of fins extending from the base; and', 'one or more synthetic jet devices configured to generate and project a series of fluid vortices toward the plurality of fins of the heat sink;, 'a thermal management system configured to provide cooling for the light source, the thermal management system comprisingwherein the housing structure includes an inlet air port and an outlet air port formed therein, with the one or more synthetic jet devices being positioned adjacent the inlet air port such that ambient air is entrained into the housing structure through the inlet air port, flows across the fins of the heat sink, and is ejected out through the outlet air port.2. The lighting system claim 1 , as set forth in claim 1 , wherein the base defines a lower plane of the heat sink and an upper edge of the plurality of fins that is distal from the base defines an upper plane of the heat sink; andwherein the one or more synthetic jet devices are positioned so as to be between the lower and upper planes of the heat sink.3. The lighting system claim 1 , as set forth in claim 1 , wherein the base is coupled to the light source and wherein the plurality of fins extending from the base ...

Method and apparatus for removing heat from electronic devices using synthetic jets

An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.

Modular scalable liquid cooled power system

A scalable liquid cooled power system using a number of modularized, hot-plug, hot-swap, and scalable liquid-cooled power conversion modules mounted on mating mounting assemblies. A modularized, scalable liquid coolant manifolds and liquid cooling management system provides coolant circulation through the power conversion modules. The system optionally includes a highly scalable system control and administration system, and optionally provides the facility for on-board liquid-to-air heat exchanger system, or off-board cooling using an external heat exchanger system.

LIGHTING SYSTEM WITH THERMAL MANAGEMENT SYSTEM

Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system. 1. A lighting system , comprising:a housing structure;a light source configured to provide illumination visible through an opening in the housing structure;a thermal management system configured to provide a unidirectional air flow through the housing structure; anddriver electronics configured to provide power to each of the light source and the thermal management system.2. The lighting system claim 1 , as set forth in claim 1 , wherein the housing structure comprises:a cage having slots therein and configured to contain the driver electronics;a thermal management system housing configured to contain the thermal management system, and having a plurality of air ports, wherein at least one of the plurality of air ports is configured to entrain ambient air, and at least another of the plurality of air ports is configured to reject warmed air from the lighting system into the ambient air; anda face plate having the opening formed therethrough.3. The lighting system claim 1 , as set forth in claim 1 , wherein the light source comprises at least one light emitting diode (LED).4. The lighting system claim 1 , as set forth in claim 1 , wherein the light source comprises 19 blue light emitting diodes arranged in an array.5. The lighting system claim 1 , as set forth in claim 1 , comprising:a heat sink;a plurality of synthetic jet devices; anda duct system comprising ducts ...

LIGHTING SYSTEM WITH THERMAL MANAGEMENT SYSTEM

Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.

Transverse gradient coil for MRI systems and method for manufacturing the same

A transverse gradient coil for an MRI system is provided. The transverse gradient coil comprises a first coil layer; and an insulation layer made of thermoplastic insulation resin which has a thermal conductivity greater than 1.5 W/m·K, the insulation layer having one side bonded to the first coil layer. A method for manufacturing the transverse gradient coil by injection molding or compression molding is also provided.

System and method for actively cooling an ultrasound probe

An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.

METHOD AND APPARATUS FOR REMOVING HEAT FROM ELECTRONIC DEVICES USING SYNTHETIC JETS

An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected. 1. A cooling apparatus comprising: a pair of opposing piezoelectric active members;', 'a wall positioned between the pair of opposing piezoelectric active members, wherein the wall has formed therein at least one orifice to eject fluid; and', 'at least one support member extending outwardly from the wall of the synthetic jet and having an opening therein;, 'a synthetic jet stack comprising a plurality of synthetic jets, each synthetic jet includingat least one rod extending through the support member openings of the synthetic jets; andat least one spacer disposed between each adjacent pair of synthetic jets to separate the synthetic jets in the synthetic jet stack from one another.2. The cooling apparatus of wherein the at least one support member is mechanically coupled to the wall of the synthetic jet.3. The cooling apparatus of wherein the wall protrudes horizontally outwards from a periphery of the piezoelectric active members.4. The cooling apparatus of wherein the wall protrudes vertically outwards from a periphery of the piezoelectric active members.5. The cooling apparatus of wherein the at least one rod is oriented so as not to obstruct the at least one orifice of each synthetic jet.6. The cooling apparatus of wherein the at least one spacer is slidable over the at least one rod.7. The cooling apparatus of further comprising a heat sink having a base claim 1 , wherein each of the at least one rod is secured to the base of the heat sink.8. The cooling apparatus of wherein a spacer is disposed between the synthetic jet stack and the base of the heat sink to separate ...

Blind-Mate Power Charging Station for Portable Electronic Devices

A blind-mate power charging station includes a receptacle, a base, and electrical circuitry. The receptacle includes a receptacle housing, an inner housing, and electrical contacts. The receptacle housing includes a pair of outer extensions, each outer extension tapering toward an outer extension tip. The inner housing is held within the receptacle housing and includes inner extensions forming parallel slots between pairs of inner extensions. Each electrical contact is held in one of the parallel slots by a pair of the inner extensions. The base receives the receptacle and mounts the receptacle to a stationary surface. The electrical circuitry couples the electrical contacts to an electricity source. The receptacle is shaped to receive a plug including a plug head and at least two prongs. Each prong engages one of the electrical contacts such that the receptacle provides electricity to the plug. 1. A blind-mate power charging station comprising: a receptacle housing comprising a pair of outer extensions, each outer extension tapering toward an outer extension tip;', 'an inner housing held within the receptacle housing and comprising a plurality of inner extensions forming a plurality of parallel slots between pairs of the plurality of inner extensions;', 'a plurality of electrical contacts, each electrical contact being held in one of the plurality of parallel slots by a pair of the plurality of inner extensions;, 'a receptacle comprisinga base receiving the receptacle and mounting the receptacle to a stationary surface; andelectrical circuitry coupling the plurality of electrical contacts to an electricity source;wherein the receptacle is shaped to receive a plug comprising a plug head and at least two prongs, each prong engaging one of the plurality of electrical contacts such that the receptacle provides electricity to the plug.2. The blind-mate power charging station of further comprising a bezel mounted around the receptacle to cover otherwise exposed ...

Lighting system with thermal management system

Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.

Heat sinks with distributed and integrated jet cooling

A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.

Lighting system with thermal management system

Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.

Power module operable in a hazardous environment

A power module and method of forming the same. The power module includes an extruded tube with internal and external fins, first and second opposing surfaces defining ends thereof, and an internal slot for housing a power converter. The power module includes a bottom plate having a first depression to receive a first O-ring to provide a first liquid-tight fluid seal at the first opposing surface for an electrically insulting oil encapsulating the power converter. The power module includes a cable interface plate having a second depression to receive a second O-ring to provide a second liquid-type fluid seal at the second opposing surface for the electrically insulting oil encapsulating the power converter. The power module includes an end cap to mate with the cable interface plate and accept a conduit fitting to enable an electrical cable to be routed from within the end cap to an external connection point.

TRANSVERSE GRADIENT COIL FOR MRI SYSTEMS AND METHOD FOR MANUFACTURING THE SAME

A transverse gradient coil for an MRI system is provided. The transverse gradient coil comprises a first coil layer; and an insulation layer made of thermoplastic insulation resin which has a thermal conductivity greater than 1.5 W/m·K, the insulation layer having one side bonded to the first coil layer. A method for manufacturing the transverse gradient coil by injection molding or compression molding is also provided.

THERMAL MANAGEMENT SYSTEM FOR COOLING A HEAT GENERATING COMPONENT OF A MAGNETIC RESONANCE IMAGING APPARATUS

A thermal management system for cooling a heat generating component of a Magnetic Resonance Imaging (MRI) apparatus includes at least one heat pipe having a portion disposed proximate the heat generating component, such as a gradient coil and/or RF coil. When heat is removed from the component, a working fluid in a relatively hotter end of the heat pipe vaporizes and travels toward a relatively colder end of the heat pipe. The colder end may be operatively coupled to a heat sink for removing the heat from the colder end and increase the overall efficiency of the system. The heat pipe may be disposed along a horizontal, a vertical direction and/or along a diagonal of the heat generating component.

Lighting system with thermal management system

Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.

Lighting system with thermal management system

Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.

SURFACE HAVING A NANOPOROUS COATING, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME

Disclosed herein is an that includes a substrate; and a nanoporous coating disposed thereon; the nanoporous coating having a thickness of about 5 nanometers to about 10 micrometers; where an interface between the substrate and the nanoporous coating is disposed at an angle of about 60 degrees to about 120 degrees to a horizontal; the nanoporous coating being in contact with a liquid; the nanoporous coating being operative to improve the critical heat flux by an amount of about 20% to about 100% over a surface that does not have a nanoporous coating.

Modular Scalable Liquid Cooled Power System

A scalable liquid cooled power system using a number of modularized, hot-plug, hot-swap, and scalable liquid-cooled power conversion modules mounted on mating mounting assemblies. A modularized, scalable liquid coolant manifolds and liquid cooling management system provides coolant circulation through the power conversion modules. The system optionally includes a highly scalable system control and administration system, and optionally provides the facility for on-board liquid-to-air heat exchanger system, or off-board cooling using an external heat exchanger system. 1. A modular liquid-cooled power system , comprising: i) a shelf for supporting a power conversion module; and', 'ii) a back plane having a plurality of blind-mate connectors;', 'iii) the plurality of blind-mate connectors of each of the plurality of mounting assemblies comprising a power input connector, a power output connector, a liquid coolant input connector and a liquid coolant output connector;, 'a) a plurality of mounting assemblies, each mounting assembly comprising i) a module case having a back panel;', 'ii) a plurality of blind-mate connectors on the back panel, each of the plurality of blind-mate connectors on the back panel of the power conversion module being located to mate with one of the plurality of blind-mate connectors on the back plane of the mounting assembly on which the power conversion module is mounted;', 'iii) the plurality of blind-mate connectors of each of the plurality of power conversion modules comprising a power input connector mating with a power input connector on the back plane of the mounting assembly, a power output connector mating with a power output connector on the back plane of the mounting assembly, a liquid coolant input connector mating with a liquid coolant input connector on the back plane of the mounting assembly, and a liquid coolant output connector mating with a liquid coolant output connector on the back plane of the mounting assembly;, 'b) a ...

LIGHTING SYSTEM WITH THERMAL MANAGEMENT SYSTEM

Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system. 1. A thermal management system comprising: a base; and', 'a plurality of fins extending from the base; and, 'a heat sink includinga synthetic jet device attached to the heat sink, the synthetic jet device configured to generate and project a series of fluid vortices out therefrom and toward the plurality of fins of the heat sink;wherein the synthetic jet device is attached to one or more of the plurality of fins to secure the synthetic jet device to the heat sink.2. The thermal management system of wherein the synthetic jet device includes :a frame; anda diaphragm positioned on the frame such that the diaphragm and the frame form a cavity.3. The thermal management system of further comprising a power supply that drives the diaphragm so as to cause the diaphragm to move back and forth so as to generate and project the series of fluid vortices out from the synthetic jet device.4. The thermal management system of wherein the synthetic jet device includes a plurality of tabs that extend out past a perimieter of the frame claim 2 , each of the plurality of tabs including a pin hole formed therein; andwherein each of the plurality of fins includes a plurality of pin holes formed therein.5. The thermal management system of further comprising a number of pins insertable through the pin holes formed in the plurality of tabs and through the pin holes formed in the plurality of ...

HEAT SINKS WITH DISTRIBUTED AND INTEGRATED JET COOLING

A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.

Sealed Enclosure for Power Electronics Incorporating a Heat Exchanger

A functional heat exchanger structure provides a hermetic seal for the power electronics. The heat exchanger includes one or more features built into the design. The features include a closed loop liquid circuit, air, or extended surfaces built-in to the design to transfer heat from the heat generating devices, spring clips snapped in built-in slots to mount heat-generating devices, preformed threaded rails to mount the printed circuit board (PCB), electrical isolation between the heat sink/cold plate and the electrical components, a sealed enclosure to provide environmental protection for the electronic components, a mounting feature to mount the sealed enclosure onto an external surface, an opening to accept a snap-in style cover, a stackable design, and an easily manifoldable configuration. 1. An enclosure for electronic components comprising: i) a base having an upper surface, a lower surface, a first end and a second end, and two sides;', 'ii) a first side wall and a second side wall, each side wall having a first end adjacent the first end of the base and a second end adjacent the second end of the base, a lower edge joined to the upper surface of the base along a side of the base and an upper edge;', 'iii) at least one cooling channel extending through each side wall from the first end to the second end;', 'iv) a first end cap sealed to the first end of the base and the first end of each of the side walls, having an internal bore extending across the first end cap and having openings aligned with the at least one cooling channel in each of the two side walls, so that the cooling channels in the two side walls are connected through the internal bore in the first end cap; and', 'v) a second end cap sealed to the second end of the base and the second end of each of the side walls, the second end cap having a fluid passage through the end cap aligned with the at least one cooling channel in each side wall; and, 'a) a heat exchanger body for housing a printed ...

Heat sinks with distributed and integrated jet cooling

Heat sinks with distributed and integrated jet cooling

A heat sink (10) with distributed jet cooling is provided. The heat sink includes a base (12) for thermal connection to at least one heated object (20), an array of fins (14) thermally coupled to the base, and at least one multi-orifice synthetic jet (30) or multiple single orifice jets disposed on a side (15, 16) of the array of fins. A heat sink (100) with distributed and integrated jet cooling is also provided and includes a base (12) and an array of fins (114). Respective ones of at least a subset of the fins comprise a synthetic jet (102) configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink (200) with distributed and integrated jet cooling is provided and includes a base (12), an array of fins (214) and multiple synthetic jets (202) coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.