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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 31. Отображено 31.
01-03-2005 дата публикации

Switchable-bandwidth optical receiver

Номер: US0006862322B1

A switchable bandwidth optical receiver is implemented in a front-end of the receiver in at least one of three ways. A switchable impedance may be provided at the input to a preamplifier of the front end, the preamplifier of the front-end may have a switchable impedance therein, and/or a switchable filter may be provided at an output of the preamplifier.

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13-01-2009 дата публикации

Compact optical sub-assembly with ceramic package

Номер: US0007476040B2

The present invention relates to an optical sub-assembly, i.e. a receiver optical subassembly or a transmitter optical sub-assembly, for use in an optical transceiver device. The optical sub-assembly according to the present invention includes a hermetic ceramic package with a multi-layer ceramic structure providing a unique RF signal and ground structure providing a controlled signal impedance to achieve high signal transmission quality.

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26-08-2003 дата публикации

Removable small form factor fiber optic transceiver module chassis

Номер: US0006609838B1

An easily removable modular optical signal transceiver unit for conversion between modulated light signal transmission and electronic data signals and which conforms to the Small Form Factor standard for transceiver interfaces is disclosed. The structural details of its chassis include aspects which insure the proper positioning of electronic circuit boards of a transmitter optical subassembly and a receiver optical subassembly as well as the positioning of electromagnetic radiation shielding on the chassis. In conjunction with an interface device on an electronic circuit board of a host device, the chassis supports electromagnetic radiation shielding which substantially encloses the sources of electromagnetic radiation within the module and suppresses the escape of electromagnetic radiation, thereby preventing electromagnetic interference with sensitive components and devices in proximity to the module. During assembly, the chassis side walls are deflected, so that electronic or electro-optic ...

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11-02-2003 дата публикации

Pull type latch mechanism for removable small form factor electronic modules

Номер: US0006519160B1

A latch is controlled to latch and unlatch a device by using a portion of the insertion and extraction movement of the device being latched. The latch incorporates a pair of tongs. The ends or latching extensions of the tongs are positionable behind a latch bar, preventing the extraction of the latched device. The tongs are positioned under the control of an actuator or latch control member which is moved to latch or unlatch the latch. The actuator member is pushed into the host device once the device being latched is positioned in the desired position. The tongs respond to the pushing of the actuator member by spreading the input ends under the influence of connecting input links moreover, the latching extensions are pivoted toward each other, positioning the latching extensions in a latched position. The latch extensions are spread to release the latch and the latched device by pulling the actuator member, pulling the input links as well as the input ends of the tongs, and thereby pivoting ...

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28-09-2004 дата публикации

Guides lithographically fabricated on semiconductor devices

Номер: US0006798953B1

A structure that includes a substrate, typically a semiconductor chip such as a VCSEL or photodetector chip, and a guide for aligning a signal conveying device, typically an optical fiber, to a transducer such as an optoelectronic device on the semiconductor chip. The guide is formed, in a preferred embodiment, by lithographically exposing and developing a thick layer of photoresist. The structure is assembled by placing and securing the signal conveying device into a cavity-like region of the guide.

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02-12-2008 дата публикации

Compact optical transceivers including thermal distributing and electromagnetic shielding systems and methods therefor

Номер: US0007458733B2

A method of cooling an optical transceiver that is mountable in a wall opening and a method of cooling a data transfer system in combination with an optical transceiver is described. An optical transceiver is provided that has a form factor and one end portion that is insertable within a wall opening in a wall. Ambient air is ventilated over a major surface portion of the optical transceiver by mounting said end portion to the wall opening so that at least one vent is formed within confines of the wall opening. The vent allows air to pass between the exterior and interior of the enclosure, and over the major surface portion of the optical transceiver.

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18-06-2002 дата публикации

Electromagnetic interference shield and ground cage

Номер: US0006407932B1

An electrical component is provided that has a plurality of electrical leads. Further, an electromagnetic interference shield and ground cage is provided which has a plurality of conductive walls connected together to form an enclosure having an open bottom. One of the walls has a plurality of openings formed therein to allow the plurality of leads to be passed into the enclosure. The electromagnetic interference shield and ground cage further has at least two ground connection pins attached to a lower edge of the walls. One of the leads is a ground lead that is electrically coupled to the electromagnetic interference shield and ground cage at one of the openings, thus reducing the length, inductance and impedance of the ground lead.

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06-01-2004 дата публикации

Method and apparatus for a monolithic integrated mesfet and p-i-n optical receiver

Номер: US0006673645B2

Disclosed is a semiconductor structure and manufacturing process for making an integrated FET and photodetector optical receiver on a semiconductor substrate. A FET is formed by forming at least one p channel in a p-well of the substrate and forming at least one n channel in the p-well of the substrate. A p-i-n photodetector is formed in the substrate by forming at least one p channel in an absorption region of the substrate when forming the at least one p channel in the p well of the FET and forming at least one n channel in the absorption region of the substrate when forming the at least one n channel in the p-well of the FET.

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01-06-2004 дата публикации

Internal electromagnetic radiation shield with ground connection for removable small form factor transceivers

Номер: US0006744639B1

An electromagnetic radiation shield useful to attenuate or prevent the escape of electromagnetic radiation from the front of transceiver opto-electronic subassemblies resident in an opening or port in the housing of an electronic system is formed with both an aperture for each barrel of the opto-electronic subassemblies and a plurality of extensions projecting outwardly from the shield. The distal ends of the extensions are bent or shaped to form smoothly curved contact surfaces that project outside the transceiver module to make contact with a grounded member of the housing or other electrically grounded portion of the electronic system of which the transceiver module is a part. The electromagnetic radiation shield is assembled with the transceiver subassemblies and disposed within a transceiver module to be inserted into a communications port of a computer or server. The transceiver module contains elements that may generate and radiate electromagnetic energy. The electromagnetic energy ...

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18-06-2009 дата публикации

ELECTRONIC DEVICE PACKAGE AND METHOD OF FORMATION

Номер: US20090154872A1
Принадлежит:

Provided are electronic device packages and their methods of formation. The electronic device packages include a sealed volume enclosing an electronic device and a feedthrough into the sealed volume for electrical connection of the electronic device. Provided are optoelectronic device packages and their methods of formation. The optoelectronic device packages include a first substrate and lid attached to the first substrate forming an enclosed volume. An optoelectronic device is disposed within the enclosed volume and a wick stop for preventing solder flow is provided. Provided are prism-coupled optical assemblies which allow for the coupling of light between an optical component, such as a laser, and an integrated optical waveguide through a prism.

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04-03-2003 дата публикации

Light emitter control system

Номер: US0006527460B2

A fiber optic arrangement includes a chip, and a first light emitter and a second light emitter formed on the chip. A guide is formed on the chip and in registration with an active region of the second light emitter. An optical fiber is coupled to the second light emitter for transmitting light from the second light emitter. The guide aligns the optical fiber relative to the active region of the second light emitter. A light-sensing device is provided. An optical element transmits light emitted from the first light emitter to the light-sensing device for controlling an output optical power of at least the second light emitter.

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20-12-2005 дата публикации

Optical fiber space transformation

Номер: US0006976792B1

Methods and arrangements for providing compact optical paths between an optical connector, such as an MTRJ connector, and optoelectronic chips contained in TO cans. The methods and arrangements employed for creating the optical paths include the use of fibers that are not prone to fail from bending stresses, or waveguides.

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07-01-2003 дата публикации

Opto-electronic transceiver module and hermetically sealed housing therefore

Номер: US0006502999B1

An opto-electronic module is housed in a hermetically sealed housing which is fabricated on a base member of solderable material to which a side wall structure is soldered. A cover is similarly provided that either is soldered to the top open end of the housing at the edge of the housing wall structure or is a cup-shaped member that slides over the wall structure and is soldered at the juxtaposed faces of the walls of the cover and the wall structure. Overlapping slots co-align to form a passage through which optical fibers may pass through the walls. The hermetic seal of the housing prevents the internal contamination of the module by water vapor, particulate matter or other contaminants.

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16-10-2001 дата публикации

Small form factor optoelectronic transceivers

Номер: US0006302596B1

An optical subassembly (OSA), in accordance with the present invention, includes a housing, which may be substantially rectangular, the OSA includes a first end portion and a second end portion oppositely disposed from the first end portion. The first end portion forms a bore configured and dimensioned to receive a ferrule having an optical fiber therein. The bore is adjacent to a ferrule stop which is integrally formed in the housing. A lens is integrally formed with the housing. The lens has a planar surface and a convex surface opposite the planar surface. The planar surface of the lens is substantially parallel to and set in from the ferrule stop to prevent contact between the ferrule and the planar surface. The optical device, the lens, and the bore which accepts the ferrule are all in optical alignment.

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16-04-2002 дата публикации

Pull-to-release type latch mechanism for removable small form factor electronic modules

Номер: US0006371787B1

A latch mechanism using a natural unlatching, releasing, pull movement has a slidable latch release which is carried on a device being latched, such as an electronic module. This slidable latch release has a pair of recesses or cavities at least partially defining cams that engage and displace a latch member from engagement with a latching surface on the device being latched. A latch release member is provided with a pair of wing members that are resilient and are deformed as a result of movement of the latch release relative to the latched device. Deformation provides a bias to restore the latch release member to a position capable of permitting latching upon the reinsertion of the device into a host device, such as a computer or the like.

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01-01-2002 дата публикации

Removable small form factor fiber optic transceiver module and electromagnetic radiation shield

Номер: US0006335869B1

An easily removable modular optical signal transceiver unit for conversion between modulated light signal transmission and electronic data signals and which conforms to the Small Form Factor standard for transceiver interfaces is disclosed. The structural details of its chassis include aspects which insure the proper positioning of electronic circuit boards of a transmitter optical subassembly and a receiver optical subassembly as well as the positioning of electromagnetic radiation shielding on the chassis. In conjunction with an interface device on an electronic circuit board of a host device, the chassis supports electromagnetic radiation shielding which substantially encloses the sources of electromagnetic radiation within the module and suppresses the escape of electromagnetic radiation, thereby preventing electromagnetic interference with sensitive components and devices in proximity to the module.

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02-04-2009 дата публикации

Compact Optical Transceivers Including Thermal Distributing and Electromagnetic Shielding Systems and Methods Therefor

Номер: US20090087188A1

An optical transceiver includes structures that define an electrical connector port for allowing connection of an electrical connector to an optical subassembly of the transceiver, and structures that define a vent surrounding at least portions of the connector port, whereby the vent allows bidirectional passage of air therethrough. Included in the transceiver are structures that define electromagnetic interference shielding and selectively transfer heat of heat generating electronic components by conduction to a transceiver housing. Methods of cooling the transceiver by ventilation and internal heat conduction are present.

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26-11-2002 дата публикации

Removable latch and bezel EMI grounding feature for fiber-optic transceivers

Номер: US0006485322B1

An electrical connector system has two connectors, one of which is included in a module mateable with the other connector in a pluggable manner. The other connector includes an elongated guide rail and a connector block in which are retained two or more electrical contacts. The guide rail by use of snap projections and recesses (11) may extend through an opening in a computer enclosure. A latch member is attached to the end of the guide rail in a manner that releases the latch member from the guide rail if the latch member is bumped or jarred to minimize the likelihood of damaging it. A grounding strip embedded in the guide rail makes electrical contact with the bezel through which it extends to protect against EMI. The ground strip includes raised contact portions (41) that engage a conductive bottom cover (39) of the module (72) and lower contact portions (53) for surface mount to a system circuit board (26).

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26-02-2002 дата публикации

Optoelectronic packaging submount arrangement providing 90 degree electrical conductor turns and method of forming thereof

Номер: US0006350625B1

A novel optoelectronic packaging submount arrangement which incorporates a 90° C. electrical conductor turn, and more specifically methods of producing optoelectronic packaging submount arrangement incorporating 90° C. electrical conductor turns.

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08-06-2004 дата публикации

Pull type latch mechanism for removable small form factor electronic modules

Номер: US0006746264B1

A latch is controlled to latch and unlatch a device by using a portion of the insertion and extraction movement of the device being latched. The latch incorporates a pivoted latching member carried on the device being latched. The end or latching surface is positionable behind a latch bar, preventing the extraction of the latched device. The latch member is displaced to latch or release by a spring disposed between the frame of the device being latched and the latch member. When the actuator member is withdrawn from its ineffective position and if the latch arm occupies a latched position, the actuator member engages surfaces on the latch member and the module frame which are too closely spaced to permit free passage of the engaging portion of the actuator. This engagement with the surfaces results in spreading the engaged portions of the module frame and the latch member, thereby pivoting the latch member to unlatch the latching end of the latch member from a retaining surface.

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29-03-2005 дата публикации

Optical subassembly for optical communications

Номер: US0006873799B2

An optical signal transceiver subassembly is mounted on a lead frame for further attachment to an electronic printed circuit board. The optical subassembly is comprised of a solid-state laser, a pair of photo-detectors, an over-mold of transparent material having shapes forming the exposed surface thereof, the surface and a selective silvering of a portion thereof defining a beam-splitter mirror and an interior reflective focusing surface, preferably in the shape of a partial cylindrical surface. The beam-splitter mirror is lightly silvered and the cylindrical surface is silvered to enhance the reflection of the laser beam. The optical subassembly is further enclosed with a housing incorporating a pair of lenses and alignment pins. The lenses focus the data stream of optical light signals onto the end of the outgoing optical fiber and the data stream of optical light signals from the incoming optical fiber onto and through the beam-splitter and onto a first photo-detector. The beam-splitter ...

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29-01-2008 дата публикации

Compact optical sub-assembly

Номер: US0007322754B2

The invention relates to a compact transmitter optical sub-assembly (OSA), which can be used in small form factor optical transceivers. To limit back reflections from entering the laser cavity, the laser is disposed on a silicon optical bench (SiOB) at an acute angle to the longitudinal axis of the OSA. A portion of the light from the laser cavity passes through the back end of the laser cavity for measuring by a monitor photodiode. A rear beam steering lens redirects the portion of light into a v-groove in the SiOB and off of a reflective surface formed in the end thereof to the monitor photodiode, which is positioned face down over the v-groove.

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01-01-2008 дата публикации

Compact optical transceivers including thermal distributing and electromagnetic shielding systems and methods thereof

Номер: US0007314318B2

An optical transceiver includes structures that define an electrical connector port for allowing connection of an electrical connector to an optical subassembly of the transceiver, and structures that define a vent surrounding at least portions of the connector port, whereby the vent allows bidirectional passage of air therethrough. Included in the transceiver are structures that define electromagnetic interference shielding and selectively transfer heat of heat generating electronic components by conduction to a transceiver housing. Methods of cooling the transceiver by ventilation and internal heat conduction are present.

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16-10-2001 дата публикации

Connector system with outwardly opening door for a removable transceiver module

Номер: US0006304436B1

A connector system for a removable transceiver module that interfaces with an electronic device, such as a computer, switch, subsystem, peripheral device, disk drive, tape drive and other input/output devices. The electronic device includes an enclosure having a bezel that has an opening for receiving the module. A circuit board is mounted within the enclosure. A guide member is mounted on the circuit board and is elongated between first and second ends along a first axis. A connector block is located at the first end of the guide member, while a door is pivotally mounted at the second end of the guide member. The module is slidably engageable with the guide member in a direction along the first axis. The module also includes electrical contacts electrically connectable with corresponding electrical contacts in the connector block. The door is pivotable between an open position exposing the opening in the bezel and a closed position where a portion of the door outside the enclosure covers ...

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23-12-2003 дата публикации

Pivoting type latch for removable electronic devices

Номер: US0006666484B1

A push-to-release latching mechanism for retaining a transceiver module in a communication port of a computer or server is provided with a beam spring structure for positional restoration of the latch member, and the latch is supported and moveable relative to the host transceiver module. The latch member may be formed to include camming surfaces that facilitate the insertion of the transceiver module into a communication port and mate with a guide rail and connector resident in a communication port. The latch member may be adapted to latch with a rigid latch bar or a cantilevered spring. Additionally, the latch may be formed with a camming surface which insures that the latch is displaced to a latching position whenever network cables are connected to the transceiver module by camming the latch into the secure, latched position and subsequently preventing the latch from moving to an insecure or unlatched position. The latch member is pivotally supported on the transceiver module in a shaft/journal arrangement and thus is removed from the communication port whenever the transceiver module is removed, thereby preventing the latch from projecting from the communication port and being subject to damage. The latch member may be formed with a living hinge to provide a pivot axis and one end of the living hinge may be attached to a electronic module chassis or to a support structure which may be mated with a electronic module chassis for easy replaceability.

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18-11-2003 дата публикации

Guide rail and cam system with integrated lock-down and kick-out spring for SMT connector for pluggable modules

Номер: US0006648693B1

An electrical connector system has two connectors, one of which is included in a module mateable with the other connector in a pluggable manner. The other connector includes a body and two or more electrical contacts. The body of that electrical connector includes a spring that provides a combined lock-down force and kick-out force. The lock-down force biases the module against the other connector, thereby providing a secure electrical and mechanical connection. The kick-out force biases the module away from the other connector to separate or eject the module when a user actuates a release mechanism. The module also includes a slot that engages a projection on the other connector to promote alignment of the mating electrical contacts.

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17-06-2003 дата публикации

Optical fiber coupler and an optical fiber coupler incorporated within a transceiver module

Номер: US0006579013B2

A coupler to interconnect or couple optical fibers together and position ends of the optical fibers juxtaposed with each other, additionally includes a captive split tubular alignment sleeve to accept ferrules on ends of optical fibers to be aligned and coupled. The coupler may be incorporated into an opto-electronic module, captured, and then held against normal forces of connecting and disconnecting the optical fiber. A short optical fiber extends from the coupler through a wall of an enclosure and is terminated adjacent an opto-electronic device to carry optical signals for transmission or reception of optical signals. This coupler may be further used to splice or interconnect optical fibers, in temporary connections or splices, without fusing the glass of the fibers.

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06-08-2002 дата публикации

Method and apparatus for a monolithic integrated MESFET and p-i-n optical receiver

Номер: US0006429499B1

Disclosed is a semiconductor structure and manufacturing process for making an integrated FET and photodetector optical receiver on a semiconductor substrate. A FET is formed by forming at least one p region in a p-well of the substrate and forming at least one n region in the p-well of the substrate. A p-i-n photodetector is formed in the substrate by forming at least one p region in an absorption region of the substrate when forming the at least one p region in the p well of the FET and forming at least one n region in the absorption region of the substrate when forming the at least one n region in the p-well of the FET.

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09-01-2007 дата публикации

Compact optical sub-assembly with integrated flexible circuit

Номер: US0007160039B2

The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.

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11-07-2006 дата публикации

Compact optical transceivers including thermal distributing and electromagnetic shielding systems and methods thereof

Номер: US0007073960B2

An optical transceiver includes structures that define an electrical connector port for allowing connection of an electrical connector to an optical subassembly of the transceiver, and structures that define a vent surrounding at least portions of the connector port, whereby the vent allows bidirectional passage of air therethrough. Included in the transceiver are structures that define electromagnetic interference shielding and selectively transfer heat of heat generating electronic components by conduction to a transceiver housing. Methods of cooling the transceiver by ventilation and internal heat conduction are present.

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08-04-2003 дата публикации

Enhanced module kick-out spring mechanism for removable small form factor optical transceivers

Номер: US0006544055B1

A spring-to-spring engagement of a kick-out spring and a secondary spring is disposed intermediate a structure supporting an electrical connector and an insertable and latchable electronic module or the like to enhance the disconnection and ejection of the module from the connector to which the module is connected. The spring-to-spring engagement insures both that adequate spring force is stored upon insertion and connection of the module and that disconnection and ejection forces are applied to the module. The forces are applied over a sufficient distance to fully displace the module from its latched position to its position of disconnection from the connectors and still provide spring force travel of the module to eject at least partially the module from the receiver or port into which the module was inserted and connected. A side benefit of the arrangement is that a high force is exerted on the module once it is unlatched for removal, and this high force will displace the module adequately ...

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