High-applicability reflow soldering furnace

The invention discloses a high-applicability reflow soldering furnace which comprises a rack, a lower conveying line body used for horizontally conveying a carrier seat is arranged on the rack, vertical conveying line bodies used for vertically conveying the carrier seat are arranged at the two ends of the lower conveying line body, and an upper conveying line body used for horizontally conveying the carrier seat is arranged between the top ends of the vertical conveying line bodies. The upper conveying line bodies located at the head end and the tail end are provided with stirring assemblies used for stirring the carrying bases to move. The lower conveying line bodies, the vertical conveying line bodies and the upper conveying line bodies are matched with one another to form a loop. The outer side of the vertical conveying line body is further provided with a storage line body used for containing and storing the carrying bases. The PCB conveying line is mainly characterized in that the ...