Multi-variant united-row composite substrate, frequency device group and manufacturing method thereof

The invention relates to a substrate used for packaging a piece-type frequency device and a manufacturing method thereof. A multi-variant united-row composite substrate comprises a composite substrate with m*n concave pits; frequency pieces of the frequency device are placed in the concave pits; the composite substrate is formed by compositing an upper substrate and a lower substrate; the upper substrate is a porous substrate which is provided with m rows*n lines through holes in rectangular arrangement, wherein m is greater than 1 and n is greater than or equal to 1; the lower substrate is formed by horizontally bonding n rows of base strips with m depressions; one surface, provided with the depressions, of each row of the base strip is an inside surface and is provided with an inner electrode; the other surface is an outside surface and is provided with an outer electrode which is connected with the inner electrode; and the length of each depression is less than that of each frequency ...

Manufacturing method of ceramic packaged sheet type quartz crystal frequency device

The invention relates to a ceramic packaged sheet type quartz crystal frequency device and a manufacturing method thereof. The frequency device comprises an upper cover plate, a lower cover plate and a wafer, wherein the wafer is positioned in a concave pit of the lower cover plate, the length and width of the concave pit of the lower cover plate are greater than the length and width of the wafer, and the depth of the concave pit of the lower cover plate is greater than the thickness of the wafer; and the frequency device also comprises an inner electrode and an outer electrode. The manufacturing method comprises the following steps: firstly, manufacturing a lower ceramic cover plate with m*n array concave pits; secondly, dispensing conductive glue in the concave pits of the lower cover plate, bonding one end of the quartz wafer and the conductive glue and then fully dropping the quartz wafer in the concave pit of the lower cover plate, and bonding the wafers and the upper cover plateafter ...

Vibration ceramic resonance of independent flake thickness-changing and its production

The ceramic resonator comprises: a cover plate, an intermediate splint, a backboard and a piezoelectric ceramic. The manufacturing method comprises: 1) according to the requirement of product, making the cover plate, backboard and intermediate plate; 2) after binding the cover plate with the intermediate splint on the worktable by using dedicated sticking, the piezoelectric ceramic vibrator is placed in the hole of the intermediate splint, then it is putted on the dedicated sticking worktable to bind with the backboard; after heating, forming a laminate sheet; 3) according to the size requirement of the product, the laminate sheet is cut into the product units; 4) the product units are putted into the dedicated evaporation clamper to make evaporation of end-face electrode in order to make the electrode of piezoelectric ceramic on-state to the external electrode.

Ceramic packaged sheet type quartz crystal frequency device and manufacturing method thereof

The invention relates to a ceramic packaged sheet type quartz crystal frequency device and a manufacturing method thereof. The frequency device comprises an upper cover plate, a lower cover plate and a wafer, wherein the wafer is positioned in a concave pit of the lower cover plate, the length and width of the concave pit of the lower cover plate are greater than the length and width of the wafer, and the depth of the concave pit of the lower cover plate is greater than the thickness of the wafer; and the frequency device also comprises an inner electrode and an outer electrode. The manufacturing method comprises the following steps: firstly, manufacturing a lower ceramic cover plate with m*n array concave pits; secondly, dispensing conductive glue in the concave pits of the lower cover plate, bonding one end of the quartz wafer and the conductive glue and then fully dropping the quartz wafer in the concave pit of the lower cover plate, and bonding the wafers and the upper cover plate after ...

片式陶瓷频率器件的振动腔的制备方法及专用贴片工作台

This invention discloses a preparation method for an oscillating cavity of a sheet piezoelectric ceramic frequency device and a specific sheeting stand characterizing in taking sticking paper as the mask of a ceramic board and forming pits on it by sand to avoid influence to the pit accuracy due to the uneven contraction in the process of the ceramic board sintering. The preparation is carried out on a special working stand to ensure the accuracy of the pits and the bind accuracy of the ceramic board and piezoelectric vibrator ensures the accuracy of the oscillating cavity.

Shear vibration ceramic resonance of independent flake thickness and its production