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Применить Всего найдено 2. Отображено 2.
07-07-2023 дата публикации

Optical film cutting and attaching equipment capable of inhibiting edge burrs

Номер: CN116394318A
Автор: LIU KUN, GU XIAOLEI, LIAO YUCHENG, LIANG CHANGPING, ZHANG ZHILIANG, YUE QIAOPING
Принадлежит:

The invention discloses optical film cutting and attaching equipment capable of inhibiting edge burrs, and relates to the technical field of optical film processing equipment.The optical film cutting and attaching equipment comprises mobile equipment, an operation table is installed on the top of the mobile equipment, and a fixed table is installed between the mobile equipment and the operation table; the device has the beneficial effects that the device is provided with the fixing table and the buffer protection assembly, and a third spring is extruded to one side under the action of a first roller when a second roller acts on the surface of a push block, so that third-time buffering is carried out, and therefore, the protection of the whole device is realized, and the overall service life is prolonged; when the optical film needs to be positioned, the rotating plate is driven to rotate downwards, the optical film is positioned through the protective pad, the flexibility in use is improved ...

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Номер записи: 1
14-07-2023 дата публикации

Heat-resistant organic silicon conductive adhesive material and preparation method thereof

Номер: CN116426129A
Автор: LI BINGZHANG, FAN JINFENG, LI JING, ZHANG XIAOGANG, ZHANG GUIEN, YUE QIAOPING
Принадлежит:

The invention relates to the technical field of organic silicon conductive materials, in particular to a heat-resistant organic silicon conductive adhesive material and a preparation method thereof. The conductive adhesive material is prepared from the following raw materials: 20 to 40 parts of modified heat-resistant organic silicon resin, 45 to 70 parts of conductive powder, 0.62 to 2.8 parts of a cross-linking agent, 0.2 to 1.5 parts of a dispersing agent, 0.5 to 2 parts of a reinforcing agent, 0.1 to 0.7 part of a catalyst, 0.05 to 0.1 part of an auxiliary agent, 0.2 to 0.6 part of an accelerant and 10 to 20 parts of a solvent. The conductive adhesive prepared from the modified heat-resistant organic silicon resin can be cured at normal temperature, and the cured conductive adhesive material overcomes the defect of insufficient high temperature resistance of the current organic silicon conductive adhesive and can bear the high temperature of 600 DEG C; the reliability problem of the ...

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Номер записи: 2