MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

After forming a ring-shaped trench penetrating through a semiconductor substrate from a rear surface side thereof and forming an insulating film inside the trench and on the rear surface of the semiconductor substrate, a through hole is formed in the insulating film and semiconductor substrate on an inner side of the ring-shaped trench from the rear surface side, thereby exposing a surface protection insulating film formed on a front surface of the semiconductor substrate at a bottom of the through hole. After removing the surface protection insulating film at the bottom of the through hole to form an opening to expose an element surface electrode, a contact electrode connected to the element surface electrode is formed on inner walls of the through hole and opening, and a pad electrode made of the same layer as the contact electrode is formed on the rear surface of the semiconductor substrate.

Semiconductor device and method of manufacturing thereof

In order to implement a high-density high-performance semiconductor system small in size, there is provided a method for implementing three-dimensional connection between a plurality of semiconductor chips differing from each other with the shortest metal interconnect length, using penetration electrodes, thereby enabling a fast operation at a low noise level, the method being a three-dimensional connection method very low in cost, and short in TAT in comparison with the known example, capable of bonding at an ordinary temperature, and excellent in connection reliability.

Inkjet head and a method of manufacturing the same

The disclosure is concerned with an inkjet head comprising; a chamber substrate for forming an ink flow passage; a diaphragm substrate including a diaphragm for pressurizing a pressure chamber disposed in the chamber substrate; and a nozzle substrate for jetting ink pressurized by the diaphragm, wherein the diaphragm substrate is made of silicon, the diaphragm is made of a material selected from the group of silicon oxide film and metal film, and the diaphragm is formed in the diaphragm substrate. The disclosure is also directed to a method of manufacturing the inkjet head.

VEHICLE BUMPER BEAM

A vehicle bumper beam including: a resin beam having an elongate body extending along a vehicle-width direction, two tubular shock-absorbing portions disposed at the beam body's opposite longitudinal end portions extending in front-rear direction, the beam body and shock-absorbing portions being formed with each other; a metal beam disposed outside the resin beam in the front-rear direction, fixedly fitted to the resin beam. Further, flat attachment portions, formed with inner end portions of the shock-absorbing portions in front-rear direction; bent portions bent in a crank extending from attachment portions outward in front-rear direction, the beam body being to attachment portions via bent portions, the metal beam fixedly fitted to an outer surface of the beam body's intermediate portion; metal beam's opposite end portions extending beyond bent portions covering the right and left sides, fixedly fitted to distal end portions; each space defined by shock-absorbing portion, metal beam and bent portion. 1. A vehicle bumper beam of a hybrid type including:a resin beam having an elongate beam body disposed so as to extend along a vehicle-width direction, and a pair of tubular shock absorbing portions respectively disposed at opposite longitudinal end portions of the beam body so as to extend in a vehicle front-rear direction, the beam body and the shock absorbing portions being formed integrally with each other; anda metal beam disposed on an outside of the resin beam in the vehicle front-rear direction and fixedly fitted to the resin beam, the vehicle bumper beam further comprising flat attachment portions to be attached to a vehicle body, and bent portions bent in a form of a crank so as to extend from the attachment portions outward in the vehicle front-rear direction,the flat attachment portions being formed integrally with inner end portions of the shock absorbing portions in the vehicle front-rear direction,the beam body being integrally coupled to the ...

Magnetic hard disk drive and process for producing the same

A magnetic hard disk drive comprising a magnetic disk and a magnetic head slider, characterized in that said magnetic head slider is coated with a layer having a contact angle of 50° or more when measured by using a lubricant coated on the magnetic disk, is free from start failure due to stiction caused by adhesion of the lubricant to the slider surface.

Image processing apparatus, control method, and storage medium for print control using metadata

An information processing apparatus includes a specification unit configured to specify a layer of a record level from print data of a hierarchical structure having metadata, a display control unit configured to display the metadata contained in the layer specified by the specification unit, a receiving unit configured to receive selection of specific metadata for filter printing from the metadata displayed by the display control unit, and a determination unit configured to determine a record in which the specific metadata received by the receiving unit is set to be a print target.

ULTRASONIC PROBE AND ULTRASONIC MEASUREMENT APPARATUS USING THE SAME

An ultrasonic probe includes a semiconductor chip 101 in which a CMUT 102 is formed and an electrode pad 101a electrically connected to an upper electrode or a lower electrode of the CMUT 102 is provided and a flexible substrate 100 in which a bump 100b electrically connected to the electrode pad 101a is provided and the bump 100b is disposed in a portion overlapping with a stepped portion 101e of the semiconductor chip 101. Further, a height of a connection surface 101aa of the electrode pad 101a of the semiconductor chip 101 connected to the bump 100b is lower than a height of a lower surface of the lower electrode.

Ultrasound probe and ultrasound diagnostic device using same

In order to obtain a high-resolution ultrasound diagnostic image while reducing the back side reflection of a ultrasound irradiated to the side opposite to the ultrasound transmission direction of an ultrasound transmission/reception device, disclosed is an ultrasound probe, wherein a substrate is provided thereon with a cavity, insulation layers having the cavity therebetween, and an upper layer electrode and a lower layer electrode having the cavity and the insulation layers therebetween, so as to form an ultrasound vibration element, the substrate is held by a backing with a low-modulus member therebetween, and a direct voltage and a alternating voltage are applied between the electrodes to vibrate the ultrasound vibration element, and wherein a mechanical impedance by the substrate and the low-modulus member has a substantially equal value as an acoustic impedance of the backing.

Information processing apparatus, information processing method, and storage medium for transforming path

An information processing apparatus including an acquisition unit configured to acquire a plurality of vertices forming a one path included in a glyph path, a calculation unit configured to calculate a winding value relating to the one path, a determination unit configured to determine a shift direction of the one path based on the calculated winding value, and a movement unit configured to move positions of the plurality of vertices based on the determined shift direction.

Heating apparatus

In a widthwise direction of a heating roller perpendicular to a sheet conveyance direction, an amount of magnetic flux acting on the heating roller in the neighborhood of an end portion of the heating roller is larger than that at a center portion of the eating roller, so that it is possible to prevent a lowering in temperature at the heating roller end portion. Further, in a temperature range in which a temperature of the heating roller is higher than a fixation temperature and is lower than a heat-resistant temperature of a heating apparatus, the heating roller has a temperature area in which a resistance thereof is lowered, so that it is possible to reduce temperature rise in a differential area between a large-sized sheet passing area and a small-sized sheet passing area when a sheet having a size smaller than a maximum size (non-sheet passing portion temperature rise).

IMAGE HEATING APPARATUS

An image heating apparatus includes a coil for generating a magnetic flux by a current flowing therethrough; an image heating member having an electroconductive layer in which an eddy current is produced by the magnetic flux by which heat is generated, to heat an image on a recording material; an electroconductive magnetic flux adjusting member movable from a first position and a second position to decrease the eddy current produced in the image heating member by the magnetic flux; a sensor for sensing the temperature of the image heating member; and a controller for controlling electric power supplied to the coil on the basis of an output of the sensor. The controller changes an electric power condition to be supplied to the coil before start of the movement from the first position to the second position of magnetic flux adjusting member.

Heating apparatus with target temperature control and means for changing target temperature

Information on a temperature of a heat generation member at a position which is in the neighborhood of an end portion of a conveyance area of a material, to be heated, having a maximum size and in the neighborhood of a non-conveyance area of a material, to be heated, having a size smaller than the maximum size is detected by temperature information detector, and a changer lowers a target temperature of the heat generation member depending on a detection result of the temperature information detector. Thereafter, when the detection result of the temperature information detector reaches a predetermined temperature, a magnetic flux adjusting member is started to be moved by a moving device.

Semiconductor device and method of manufacturing thereof

A connection method is disclosed for a high-performance semiconductor system. The connection method enables high-speed operation with low noise, so as to obtain reliable and excellent connection in a short TAT at low costs. Semiconductor chips and the interposer chips are polished by grinding at their rear surfaces, holes are formed at rear surface positions corresponding to external electrode parts on the device side (front surface side) so that the holes extend to front surface electrodes, and metal plating films are applied to the side walls of the holes and rear surface side. Metal bumps of another semiconductor chip laminated at an upper stage being press-fitted into the holes applied with the metal plating films through deformation and being geometrically calked in the through holes formed in the semiconductor chip so as to electrically connected thereto.

Information processing apparatus, PDL data conversion method, and storage medium

An information processing apparatus includes a control unit configured to receive first PDL data including a first bookmark and a second bookmark from a user, create a first node mapped to a page which is the reference of the first bookmark and a second node mapped to a page which is the reference of the second bookmark, and create second PDL data having a hierarchical structure for the pages by including the first node and the second node. The first bookmark is different from the second bookmark, the first node is different from the second node, and the first PDL data is different from the second PDL data wherein the second PDL data includes the page which is the reference of the first bookmark and the page which is the reference of the second bookmark.

Image forming apparatus with magnetic flux shields and recovery operation

An image heating apparatus has a coil for generating magnetic flux, a rotatable heat generation member which generates heat by magnetic flux, a temperature detecting member for detecting a temperature of the heat generation member, an energization controller portion for controlling energization to the coil on the basis of an output of the temperature detecting member, a first magnetic flux shielding portion for blocking, in a first magnetic flux adjustment position, the magnetic flux directed toward a central portion of heat generation member, while permitting the magnetic flux directed to an end portion, and a second magnetic flux shielding portion for blocking, in a second magnetic flux adjustment position, the magnetic flux directed toward an end portion of the heat generation member, a moving unit for moving the first magnetic flux shielding portion and the second magnetic flux shielding portion, and a recovery operation controller portion for retracting the second magnetic flux shielding portion from the second magnetic flux adjustment position and moving the first magnetic flux shielding portion to the first magnetic flux adjustment position after completion of an image formation job on recording materials having widths smaller than a maximum width of a recording material which can be fed are continuously fed, and executing energization control of the energization controller portion.

Ultrasound probe and ultrasound equipment using same

Provided are: an ultrasound probe with excellent characteristic stability; and ultrasound equipment that uses the ultrasound probe. The ultrasound probe has an ultrasonic transmitting and receiving element provided with a substrate, an insulating film formed on the substrate, a cavity formed between the substrate and the insulating film, and a pair of electrodes disposed parallel to the substrate so as to sandwich the cavity. The ultrasound probe is characterized in that the ultrasonic transmitting and receiving element has a beam part with a multilayer structure formed by laminating films made of materials different in stress, the beam part being disposed on the electrode distant from the substrate out of the pair of electrodes, and the beam part is formed by laminating a film that applies tensile stress and a film that applies compressive stress.

Semiconductor device and method of manufacturing thereof

A connection method for materializing a high-performance semiconductor system which is small-sized and high dense, is capable to three-dimensionally connecting a plurality of different kinds of semiconductor chips through piercing electrodes with shortest wiring lengths. The connection method enables high-speed operation with low noise, so as to obtain reliable and excellent connection in a short TAT at low costs. In a three-dimensional chip lamination composed of different kinds of semiconductor chips laminated one upon another with an interpose chip being interposed therebetween for connecting the upper and lower semiconductor chips, the semiconductor chips and the interposer chips are polished by grinding or the like at their rear surfaces so as to have thin thickness, holes are formed at rear surface positions corresponding to external electrode parts on the device side (front surface side) so that the holes extend to front surface electrodes, by dry etching or the like, and metal plating films are applied to the side walls of the holes and rear surface side, metal bumps of another semiconductor chip laminated at an upper stage being press-fitted into the holes applied with the metal plating films through deformation and being geometrically calked in the through holes formed in the semiconductor chip so as to electrically connected thereto.

Magnetic hard disk drive and process for producing the same

A magnetic hard disk drive comprising a magnetic disk and a magnetic head slider, characterized in that said magnetic head slider is coated with a layer having a contact angle of 50° or more when measured by using a lubricant coated on the magnetic disk, is free from start failure due to stiction caused by adhesion of the lubricant to the slider surface.

Vehicle bumper beam

A vehicle bumper beam including: a resin beam having an elongate body extending along a vehicle-width direction, two tubular shock-absorbing portions disposed at the beam body's opposite longitudinal end portions extending in front-rear direction, the beam body and shock-absorbing portions being formed with each other; a metal beam disposed outside the resin beam in the front-rear direction, fixedly fitted to the resin beam. Further, flat attachment portions, formed with inner end portions of the shock-absorbing portions in front-rear direction; bent portions bent in a crank extending from attachment portions outward in front-rear direction, the beam body being to attachment portions via bent portions, the metal beam fixedly fitted to an outer surface of the beam body's intermediate portion; metal beam's opposite end portions extending beyond bent portions covering the right and left sides, fixedly fitted to distal end portions; each space defined by shock-absorbing portion, metal beam ...

Semiconductor device and method of manufacturing same

In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a first semiconductor substrate having a first surface and a second surface opposite the first surface, a first insulating film formed on the first surface, a first hole formed in the first insulating film and partially extending into the first semiconductor substrate, a second hole formed in the second surface, a first electrode entirely filling the first hole, and a conductive film conformally formed in the second hole. The conductive film is electrically connected to a bottom surface of the first electrode and leaves a third hole in the first semiconductor substrate open. The third hole is configured to receive a second electrode of a second semiconductor substrate.

Image forming apparatus

The present invention aims to reduce the time period of the start up operation of an image forming apparatus corresponding to an image forming apparatus operating environment. The present invention provides an image forming apparatus includes an image bearing member; a toner image forming unit for forming a toner image on the image bearing member; an image condition detection member for detecting an image condition of the image bearing member; a setting unit for setting a plurality of toner image forming conditions determined based on the output of the image condition detection member; an environment detection member for detecting an environment condition of outside air of the image forming apparatus; and a selection unit for selecting the toner image forming conditions set by the setting unit based on the output of the environment detection device from when the power is turned on to when transitioned to an image formable state.

Image forming apparatus

An image forming apparatus includes image forming means for forming an image on a recording material; a heating rotatable member for heating the heating nip on the upper in a heating nip; magnetic flux generating means for generating a magnetic flux for induction heat generation in the heating rotatable member; control means for controlling a temperature of the heating rotatable member; temperature detecting means for detecting a temperature of the heating rotatable member at a predetermined region; magnetic flux confining means for confining the magnetic flux directed toward the predetermined region of the heating rotatable member from the magnetic flux generating means in accordance with an output of the temperature detecting means; and moving means for movement the magnetic flux confining means between a magnetic-flux-confinement position and a non-magnetic-flux-confinement position, wherein when the output of the temperature detecting means indicates a temperature outside a predetermined ...

Ultrasonic transducer device and ultrasonic wave probe using same

The present invention provides an ultrasonic transducer device to send and receive ultrasonic waves, comprising a semiconductor substrate, a lower electrode disposed on the semiconductor substrate, a gap disposed on the lower electrode, a third insulation film disposed on the gap, an upper electrode disposed on the third insulation film, a fourth insulation film disposed on the upper electrode, a wiring layer disposed on the fourth insulation film, and a fifth insulation film disposed on the wiring layer. The upper electrode is electrically connected to the wiring layer with penetrating wires.

Process for producing a magnetic head slider

A magnetic hard disk drive comprising a magnetic disk and a magnetic head slider, characterized in that said magnetic head slider is coated with a layer having a contact angle of 50° or more when measured by using a lubricant coated on the magnetic disk, is free from start failure due to stiction caused by adhesion of the lubricant to the slider surface.

Heating apparatus

An electromagnetic induction heating apparatus capable of uniformize a temperature distribution in a longitudinal direction of an induction heating member includes: an exciting coil (magnetic flux generation means); a fixation roller (induction heating member) for generating heat by electromagnetic induction heating by action of magnetic flux generated by the exciting coil the induction heating member heating a material to be heated through heat generation thereof by introducing the material to be heated into a heating portion and conveying the material to be heated in contact with the fixation roller; and magnetic flux shielding plate (magnetic flux adjusting means) for changing a distribution of a density of an effective magnetic flux which is the magnetic flux generated by the exciting coil and actable on the fixation roller, in a longitudinal direction of the heating portion perpendicular to a conveyance direction of the material to be heated. The magnetic flux shielding plate adjusts the effective magnetic flux so that the effective magnetic flux at a central portion of the fixation roller in the longitudinal direction of the heating portion is less than that at an end portion of the induction heating member in the longitudinal direction.

Capacitive micromachined ultrasonic transducer and ultrasonic imaging apparatus using the same

A capacitive micromachined ultrasonic transducer 111A includes: a silicon substrate 101; an insulating film 102 formed over the silicon substrate 101; a lower electrode 103; insulating films 104 and 106; a cavity 105 constituted by a void formed in a portion of the insulating film 106; an upper electrode 107; insulating films 108 and 114; and a protective film 109. In addition, the insulating film 106, upper electrode 107, insulating film 108 and insulating film 114 above the cavity 105 configure a vibration film 110, and the protective film 109 above the vibration film 110 is divided into a plurality of isolated patterns regularly arranged with a gap 115 having a constant spacing formed therebetween.

Ultrasonic probe and ultrasonic measurement apparatus using the same

An ultrasonic probe includes a semiconductor chip in which an ultrasonic transducer is formed and an electrode pad electrically connected to an upper electrode or a lower electrode of the ultrasonic transducer is provided and a flexible substrate in which a bump electrically connected to the electrode pad is provided and the bump is disposed in a portion overlapping with a stepped portion of the semiconductor chip. Further, a height of a connection surface of the electrode pad of the semiconductor chip connected to the bump is lower than a height of a lower surface of the lower electrode.

Image heating apparatus

An image heating apparatus includes a coil for generating a magnetic flux by a current flowing therethrough; an image heating member having an electroconductive layer in which an eddy current is produced by the magnetic flux by which heat is generated, the image heating member being effective to heat an image on a recording material; an electroconductive magnetic flux adjusting member movable from a first position and a second position to decrease the eddy current produced in the image heating member by the magnetic flux; a temperature sensor for sensing a temperature of image heating member; electric power control means for control electric power supplied to the coil on the basis of an output of the temperature sensor, wherein the electric power control means changes an electric power condition to be supplied to the coil before start of the movement from the first position to the second position of magnetic flux adjusting member.

Micro pump and method of producing the same

A micro pump is made compact and can prevent members constituting the micro pump from being chemically reacted with a working fluid, and a method of producing the same. After each of substrates constituting the micro pump is formed by a member containing a silicone as a main composition and a plurality of metal membranes are formed on a whole of a bonding surface of each of the substrates so as to form bonding surfaces, the bonding surfaces are cleaned, and the bonding surfaces are opposed to each other under a vacuum condition, overlapped, heated and pressed so as to be bonded. The valve portion has a beam and a protrusion for sealing as provided in the valve side, whereby a pressure applied to the protrusion becomes smaller than the bonding pressure.

Chemical analyzing apparatus

A chemical analyzing apparatus comprises a reaction cell holder which holds a plurality of reaction cells that are supplied with samples and reagents at a predetermined position, a measurer for measuring characteristics of the sample, a plurality of reagent containers, a liquid deliverer provided below each of the plurality of reagent containers, one or more sound wave generators provided outside the reaction cells, and storage containers for storing cleansing liquid with different contamination states. The cleansing liquid with different contamination states is reused according to the contamination levels of the reaction cells.

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode.

Semiconductor device and method of manufacturing the same

In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface-electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode.

Semiconductor device and method of manufacturing same

In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a first semiconductor substrate having a first surface and a second surface opposite the first surface, a first insulating film formed on the first surface, a first hole formed in the first insulating film and partially extending into the first semiconductor substrate, a second hole formed in the second surface, a first electrode entirely filling the first hole, and a conductive film conformally formed in the second hole. The conductive film is electrically connected to a bottom surface of the first electrode and leaves a third hole in the first semiconductor substrate open. The third hole is configured to receive a second electrode of a second semiconductor substrate.

MANUFACTURING PROCESS AND STRUCTURE OF THROUGH SILICON VIA

A through silicon via reaching a pad from a second surface of a semiconductor substrate is formed. A penetration space in the through silicon via is formed of a first hole and a second hole with a diameter smaller than that of the first hole. The first hole is formed from the second surface of the semiconductor substrate to the middle of the interlayer insulating film. Further, the second hole reaching the pad from the bottom of the first hole is formed. Then, the interlayer insulating film formed on the first surface of the semiconductor substrate has a step shape reflecting a step difference between the bottom surface of the first hole and the first surface of the semiconductor substrate. More specifically, the thickness of the interlayer insulating film between the bottom surface of the first hole and the pad is smaller than that in other portions.

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a first semiconductor substrate having a first surface and a second surface opposite the first surface, a first insulating film formed on the first surface, a first hole formed in the first insulating film and partially extending into the first semiconductor substrate, a second hole formed in the second surface, a first electrode entirely filling the first hole, and a conductive film conformally formed in the second hole. The conductive film is electrically connected to a bottom surface of the first electrode and leaves a third hole in the first semiconductor substrate open. The third hole is configured to receive a second electrode of a second semiconductor substrate. 1. A semiconductor device comprising:a first semiconductor substrate having a first surface and a second surface opposite the first surface;a first insulating film formed on the first surface;a first hole formed in the first insulating film and partially extending into the first semiconductor substrate;a second hole formed in the second surface;a first electrode entirely filling the first hole; anda conductive film conformally formed in the second hole, the conductive film being electrically connected to a bottom surface of the first electrode and leaving a third hole in the first semiconductor substrate open, the third hole being configured to receive a second electrode of a second semiconductor substrate.2. The semiconductor device according to claim 1 , wherein the first electrode and the first semiconductor substrate are electrically insulated from each other by a protective insulating film formed at a boundary portion between the first electrode and the first semiconductor substrate.3. The semiconductor device according to claim 1 , wherein the conductive file and the first semiconductor substrate are electrically insulated ...

Image heating apparatus with control means for controlling power to the coil that generates magnetic flux

An image heating apparatus includes a coil for generating a magnetic flux by a current flowing therethrough; an image heating member having an electroconductive layer in which an eddy current is produced by the magnetic flux by which heat is generated, the image heating member being effective to heat an image on a recording material; an electroconductive magnetic flux adjusting member movable from a first position and a second position to decrease the eddy current produced in the image heating member by the magnetic flux; a temperature sensor for sensing a temperature of image heating member; electric power control means for control electric power supplied to the coil on the basis of an output of the temperature sensor, wherein the electric power control means changes an electric power condition to be supplied to the coil before start of the movement from the first position to the second position of magnetic flux adjusting member.

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a first semiconductor substrate having a first surface and a second surface opposite the first surface, a first insulating film formed on the first surface, a first hole formed in the first insulating film and partially extending into the first semiconductor substrate, a second hole formed in the second surface, a first electrode entirely filling the first hole, and a conductive film conformally formed in the second hole. The conductive film is electrically connected to a bottom surface of the first electrode and leaves a third hole in the first semiconductor substrate open. The third hole is configured to receive a second electrode of a second semiconductor substrate. 1. A semiconductor device comprising: a first semiconductor substrate having a first surface and a second surface opposite the first surface;', 'a first insulating film formed on the first surface;', 'a first hole formed in the first insulating film and partially extending into the first semiconductor substrate;', 'a second hole formed in the second surface;', 'a single-piece first electrode entirely filling the first hole and comprising a portion that extends above the first insulating film; and', 'a first conductive film conformally formed in the second hole, the first conductive film being electrically connected to a bottom surface of the first electrode and leaving a third hole in the first semiconductor substrate open; and, 'a first chip comprisinga second chip comprising a third electrode;wherein the third electrode is inserted into the third hole and makes electrical contact with the first conductive film.2. The semiconductor device of claim 1 , wherein the first chip further comprises a protective insulating film formed at a boundary portion between the first electrode and the first semiconductor substrate claim 1 , the ...

ULTRASONIC PROBE, AND ULTRASONIC TRANSMITTER-RECEIVER SYSTEM USING THE SAME

Provided is an ultrasonic probe having ultrasonic elements and a printed-circuit board that establishes connection between the ultrasonic elements and external wiring, achieving strong connection between the ultrasonic elements and the printed-circuit board mechanically and electrically, and thereby improving performance in examination and diagnosis using the ultrasonic probe. The printed-circuit board with pads each having a via-hole to be bonded to electrode pads of a chip equipped with the ultrasonic elements, is provided with a reinforcement, in an area of the base material where the pad having the via-hole is not formed. The reinforcement is formed simultaneously with forming the pads and wiring on the printed-circuit board, having the same thickness as the pads. With the reinforcement, pressure is evenly applied to the printed-circuit board when the electrode pad is press-fitted into the pad having the via-hole, thereby preventing warping and deforming of the board.

ULTRASOUND PROBE AND ULTRASOUND DIAGNOSTIC DEVICE USING SAME

In order to obtain a high-resolution ultrasound diagnostic image while reducing the back side reflection of a ultrasound irradiated to the side opposite to the ultrasound transmission direction of an ultrasound transmission/reception device, disclosed is an ultrasound probe, wherein a substrate is provided thereon with a cavity, insulation layers having the cavity therebetween, and an upper layer electrode and a lower layer electrode having the cavity and the insulation layers therebetween, so as to form an ultrasound vibration element, the substrate is held by a backing with a low-modulus member therebetween, and a direct voltage and a alternating voltage are applied between the electrodes to vibrate the ultrasound vibration element, and wherein a mechanical impedance by the substrate and the low-modulus member has a substantially equal value as an acoustic impedance of the backing. 1. An ultrasound probe comprising an ultrasound vibration element constituted on a substrate by a cavity , by insulation layers with the cavity interposed therebetween , and by an upper layer electrode and a lower layer electrode with the cavity and the insulation layers interposed therebetween , the substrate being supported by a backing with a low-modulus member interposed therebetween , the ultrasound vibration element being vibrated by application of a direct-current voltage and an alternate-current voltage between the electrodes;{'sup': 6', '2, 'wherein the backing has an acoustic impedance falling within ±1 MRayls (10kg/ms) of a mechanical impedance formed by the substrate and the low-modulus member.'}2. The ultrasound probe according to claim 1 , wherein the mechanical impedance is formed by the mass of the substrate and by a spring constant of the low-modulus member.3. The ultrasound probe according to claim 1 , wherein the mechanical impedance formed by the substrate and the low-modulus member is made to have substantially the same value as the acoustic impedance of the backing ...

Induction heating for image flexing with means for adjusting magnetic flux

A heating apparatus of an electromagnetic induction heating type includes a coil and a roller which generates heat by the action of magnetic flux generated from the coil. A recording material is heated by the roller. The heating apparatus further includes a movable magnetic flux decreasing member for decreasing magnetic flux, generated from the coil, acting on the roller. In the heating apparatus, a shutter is moved toward an effective position at which a temperature in a non-conveyance area is lowered when a recording material having a size lower than a maximum conveyable size is conveyed, and is moved away from the effective position depending on the temperature in the non-conveyance area, irrespective of the size of the recording material to be conveyed.

Semiconductor device and method of manufacturing thereof

In order to implement a high-density high-performance semiconductor system small in size, there is provided a method for implementing three-dimensional connection between a plurality of semiconductor chips differing from each other with the shortest metal interconnect length, using penetration electrodes, thereby enabling a fast operation at a low noise level, the method being a three-dimensional connection method very low in cost, and short in TAT in comparison with the known example, capable of bonding at an ordinary temperature, and excellent in connection reliability. For example, in a three-dimensional chip laminate structure with a metal interconnect substrate for effecting connection between upper and lower semiconductor chips, disposed in between the upper and lower chips differing from each other, through-holes reaching respective electrodes on the surface layer side are formed on the respective backside face sides of the semiconductor chip and the metal interconnect substrate, a metal plating film is applied to the sidewalls of the respective through-holes and peripheries thereof, on the backside face side, and metal bumps of the semiconductor chip stacked on the upper tier side are pressed into contact with the interiors of the respective through-holes with the metal plated film applied thereto to be thereby inserted therein, due to portions of the respective metal bumps, undergoing deformation, causing the metal bumps to be geometrically caulked inside the respective through-holes formed in the semiconductor chip and the metal interconnect substrate, thereby implementing electrical connection.

Image forming apparatus with heating rotatable member and reset control means for interrupting a currently executing image formation job

An image forming apparatus has an image forming unit; a heating rotatable member; a magnetic flux generator for generating a magnetic flux for induction heat generation in the heating rotatable member; a controller for controlling a temperature of the heating rotatable member; a temperature detector for detecting a temperature of the heating rotatable member at a predetermined region; magnetic flux confinor for confining the magnetic flux from the magnetic flux generator in accordance with an output of the temperature detector; and a moving unit for movement the magnetic flux confinor between a magnetic-flux-confinement position and a n on-magnetic-flux-confinement position, wherein when the output of the temperature detector indicates a temperature outside a predetermined temperature range, an image forming operation is interrupted, and executes operation of the moving unit to move the magnetic flux confinor to the non-magnetic-flux-confinement position and restoring operation to restore the temperature of the heating rotatable member.

Manufacturing process and structure of through silicon via

A through silicon via reaching a pad from a second surface of a semiconductor substrate is formed. A penetration space in the through silicon via is formed of a first hole and a second hole with a diameter smaller than that of the first hole. The first hole is formed from the second surface of the semiconductor substrate to the middle of the interlayer insulating film. Further, the second hole reaching the pad from the bottom of the first hole is formed. Then, the interlayer insulating film formed on the first surface of the semiconductor substrate has a step shape reflecting a step difference between the bottom surface of the first hole and the first surface of the semiconductor substrate. More specifically, the thickness of the interlayer insulating film between the bottom surface of the first hole and the pad is smaller than that in other portions.

Manufacturing process of semiconductor device and semiconductor device

After forming a ring-shaped trench penetrating through a semiconductor substrate from a rear surface side thereof and forming an insulating film inside the trench and on the rear surface of the semiconductor substrate, a through hole is formed in the insulating film and semiconductor substrate on an inner side of the ring-shaped trench from the rear surface side, thereby exposing a surface protection insulating film formed on a front surface of the semiconductor substrate at a bottom of the through hole. After removing the surface protection insulating film at the bottom of the through hole to form an opening to expose an element surface electrode, a contact electrode connected to the element surface electrode is formed on inner walls of the through hole and opening, and a pad electrode made of the same layer as the contact electrode is formed on the rear surface of the semiconductor substrate.

Magnetic flux image heating apparatus with control of movement of magnetic flux shield

An image heating apparatus includes a heating rotatable member for heating an image on a recording material in a heating nip; a magnetic flux generator for generating a magnetic flux for induction heat generation in the heating rotatable member; a magnetic flux confining device for confining the magnetic flux directed toward a predetermined region of the heating rotatable member from the magnetic flux generator; and a moving device for repeatedly moving the magnetic flux confining device during a heating operation between the operating position and a retracted position retracted from the operation position, when the recording material which has a predetermined width overlapping with a part of the predetermined region is continuously heated by the apparatus.

Semiconductor device and method of manufacturing same

In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode.

Ultrasound probe and ultrasound diagnostic device using same

In order to obtain a high-resolution ultrasound diagnostic image while reducing the back side reflection of a ultrasound irradiated to the side opposite to the ultrasound transmission direction of an ultrasound transmission/reception device, disclosed is an ultrasound probe, wherein a substrate is provided thereon with a cavity, insulation layers having the cavity therebetween, and an upper layer electrode and a lower layer electrode having the cavity and the insulation layers therebetween, so as to form an ultrasound vibration element, the substrate is held by a backing with a low-modulus member therebetween, and a direct voltage and a alternating voltage are applied between the electrodes to vibrate the ultrasound vibration element, and wherein a mechanical impedance by the substrate and the low-modulus member has a substantially equal value as an acoustic impedance of the backing.

Image forming apparatus capable of switching image adjustment process according to an environment condition

The present invention aims to reduce the time period of the start up operation of an image forming apparatus corresponding to an image forming apparatus operating environment. The present invention provides an image forming apparatus includes an image bearing member; a toner image forming unit for forming a toner image on the image bearing member; an image condition detection member for detecting an image condition of the image bearing member; a setting unit for setting a plurality of toner image forming conditions determined based on the output of the image condition detection member; an environment detection member for detecting an environment condition of outside air of the image forming apparatus; and a selection unit for selecting the toner image forming conditions set by the setting unit based on the output of the environment detection device from when the power is turned on to when transitioned to an image formable state.

Image heating apparatus heating a toner image on a sheet by the magnetic flux from an excitation coil and controlling the electric power supply to the coil

An image heating apparatus includes a coil for generating a magnetic flux by a current flowing therethrough; an image heating member having an electroconductive layer in which an eddy current is produced by the magnetic flux by which heat is generated, the image heating member being effective to heat an image on a recording material; an electroconductive magnetic flux adjusting member movable from a first position and a second position to decrease the eddy current produced in the image heating member by the magnetic flux; a temperature sensor for sensing a temperature of image heating member; electric power control means for control electric power supplied to the coil on the basis of an output of the temperature sensor, wherein the electric power control means changes an electric power condition to be supplied to the coil before start of the movement from the first position to the second position of magnetic flux adjusting member.

Heating apparatus

Information on a temperature of a heat generation member 7 at a position which is in the neighborhood of an end portion of a conveyance area of a material S, to be heated, having a maximum size and in the neighborhood of a non-conveyance area of a material, to be heated, having a size smaller than the maximum size is detected by temperature information detection means 22 and 23, and a change means 171 lowers a target temperature of the heat generation member 7 depending on a detection result of the temperature information detection means. Thereafter, when the detection result of the temperature information detection means reaches a predetermined temperature, a magnetic flux adjusting member 18 is started to be moved by a moving means 21.

Battery case

A battery case enables a battery cell to be placed in a continuously pressured state without increasing the complexity of the battery module manufacturing process. Specifically, the battery case has: a plastic first accommodation unit and second accommodation unit in which a laminated body of a battery cell is accommodated; a UD tape integrally positioned on a first side wall, a second side wall, and a third side wall, which form the first accommodation unit; and a UD tape integrally positioned on the first side wall, which form the second accommodation unit. The UD tapes are configured, in particular, to be positioned straddling the third side walls from the second side walls across the first side wall.

Manufacturing process and structure of through silicon via

A through silicon via reaching a pad from a second surface of a semiconductor substrate is formed. A penetration space in the through silicon via is formed of a first hole and a second hole with a diameter smaller than that of the first hole. The first hole is formed from the second surface of the semiconductor substrate to the middle of the interlayer insulating film. Further, the second hole reaching the pad from the bottom of the first hole is formed. Then, the interlayer insulating film formed on the first surface of the semiconductor substrate has a step shape reflecting a step difference between the bottom surface of the first hole and the first surface of the semiconductor substrate. More specifically, the thickness of the interlayer insulating film between the bottom surface of the first hole and the pad is smaller than that in other portions.

MANUFACTURING PROCESS AND STRUCTURE OF THROUGH SILICON VIA

A through silicon via reaching a pad from a second surface of a semiconductor substrate is formed. A penetration space in the through silicon via is formed of a first hole and a second hole with a diameter smaller than that of the first hole. The first hole is formed from the second surface of the semiconductor substrate to the middle of the interlayer insulating film. Further, the second hole reaching the pad from the bottom of the first hole is formed. Then, the interlayer insulating film formed on the first surface of the semiconductor substrate has a step shape reflecting a step difference between the bottom surface of the first hole and the first surface of the semiconductor substrate. More specifically, the thickness of the interlayer insulating film between the bottom surface of the first hole and the pad is smaller than that in other portions.

Semiconductor sensor chip, semiconductor sensor chip array, and ultrasound diagnostic apparatus

The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip (2a) that has drive electrodes (3e)-(3j), etc., arranged in a grid-like configuration on a rectangular CMUT element section (21); and a CMUT chip (2b) that has drive electrodes (3p)-(3u), etc., arranged in a grid-like configuration on the rectangular CMUT element section (21), that is adjacent to the CMUT chip (2a), and in which the drive electrodes (3e)-(3j) of the adjacent CMUT chip (2a) are electrically connected to the respective drive electrodes (3p)-(3u) via bonding wires (4f)-(4i), etc.

Optical module and scanning-type image display device

In an optical module and a scanning-type image display device, a reduction in heat insulating effect due to a natural convection generated between the optical module and a case is suppressed to alleviate laser overheating and thermal expansion or contraction of each component and obtain a stable projection image quality. In an optical module that couples laser beams from a plurality of laser beam sources 1a, 1b, 1c and irradiates the laser beams to a desired position, a cover that covers the optical module is provided, a second cover is provided in a space between the optical module and the cover, and a projecting part is provided on a surface of the second cover facing the optical module.

INFORMATION PROCESSING APPARATUS, PDL DATA CONVERSION METHOD, AND STORAGE MEDIUM

An information processing apparatus includes a control unit configured to receive first PDL data including a first bookmark and a second bookmark from a user, create a first node mapped to a page which is the reference of the first bookmark and a second node mapped to a page which is the reference of the second bookmark, and create second PDL data having a hierarchical structure for the pages by including the first node and the second node. The first bookmark is different from the second bookmark, the first node is different from the second node, and the first PDL data is different from the second PDL data wherein the second PDL data includes the page which is the reference of the first bookmark and the page which is the reference of the second bookmark. 1. An information processing apparatus comprising:a control unit configured to receive first PDL data including a first bookmark and a second bookmark from a user, create a first node mapped to a page which is the reference of the first bookmark and a second node mapped to a page which is the reference of the second bookmark, and create second PDL data having a hierarchical structure for the pages by including the first node and the second node,wherein the first bookmark is different from the second bookmark, the first node is different from the second node, and the first PDL data is different from the second PDL data;wherein the second PDL data includes the page which is the reference of the first bookmark and the page which is the reference of the second bookmark.2. The information processing apparatus according to claim 1 , wherein the first PDL data includes a third bookmark which is an upper-level bookmark of the first bookmark and the second bookmark claim 1 ,wherein the control unit creates a third node, which is an upper-level node of the first node and the second node, mapped to a page which is the reference of the third bookmark and creates second PDL data having the hierarchical structure for the pages by ...

INFORMATION PROCESSING APPARATUS AND INFORMATION PROCESSING METHOD

Provided is an information processing apparatus including: a PDL analysis unit that acquires an output resolution of input PDL data when a tile drawing instruction is included in the PDL data, and calculates a drawing size of a tile drawing based on the tile drawing instruction and the output resolution; an average color calculation unit that calculates an average color of the tile drawing based on the tile drawing instruction when the calculated drawing size is smaller than a predetermined value; and a rendering unit that renders the tile drawing instruction based on the calculated average color. The average color calculation unit calculates the average color based on a transparency level of a unit tile included in the tile drawing instruction. 1. An information processing apparatus , comprising:a PDL analysis unit configured to acquire an output resolution of input PDL data when a tile drawing instruction is included in the PDL data, and to calculate a drawing size of a tile drawing based on the tile drawing instruction and the output resolution;an average color calculation unit configured to calculate an average color of the tile drawing based on the tile drawing instruction when the calculated drawing size is smaller than a predetermined value; anda rendering unit configured to render the tile drawing instruction based on the calculated average color,wherein the average color calculation unit is configured to calculate the average color based on a transparency level of a unit tile included in the tile drawing instruction.2. The apparatus according to claim 1 , wherein the average color calculation unit is configured to switch a calculation method for the average color based on a value of the transparency level.3. The apparatus according to claim 1 , wherein the average color calculation unit is configured to switch a calculation method for the average color based on whether or not the transparency level is uniform.4. The apparatus according to claim 1 , wherein ...

INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND STORAGE MEDIUM FOR TRANSFORMING PATH

An information processing apparatus including an acquisition unit configured to acquire a plurality of vertices forming a one path included in a glyph path, a calculation unit configured to calculate a winding value relating to the one path, a determination unit configured to determine a shift direction of the one path based on the calculated winding value, and a movement unit configured to move positions of the plurality of vertices based on the determined shift direction. 1. An information processing apparatus comprising:an acquisition unit configured to acquire a plurality of vertices forming a one path included in a glyph path;a calculation unit configured to calculate a winding value relating to the one path;a determination unit configured to determine a shift direction of the one path based on the calculated winding value; anda movement unit configured to move positions of the plurality of vertices based on the determined shift direction.2. The information processing apparatus according to claim 1 , wherein the calculation unit calculates a winding value on a line passing through a leftmost vertex among the plurality of vertices.3. The information processing apparatus according to claim 2 , wherein the calculation unit associates the calculated winding value with the one path.4. The information processing apparatus according to claim 3 , wherein claim 3 , when the leftmost vertex is a leftmost vertex among vertices forming the glyph path claim 3 , the calculation unit sets the winding value to be associated with the path as a specific value claim 3 , andwherein, when the winding value associated with the path is the specific value, the determination unit determines a specific direction as the shift direction of the path.5. The information processing apparatus according to claim 3 , wherein claim 3 , based on a manner of intersection of the line with another path that exists on the left side of the leftmost vertex and is included in the glyph path claim 3 , the ...

Inkjet head and a method of manufacturing the same

An inkjet head is provided and includes: a chamber substrate for forming an ink flow passage; a diaphragm substrate including a diaphragm for pressurizing a pressure chamber disposed in the chamber substrate; and a nozzle substrate for jetting ink pressurized by the diaphragm, wherein the diaphragm substrate is made of silicon, the diaphragm is made of a material selected from the group of silicon oxide film and metal film, and the diaphragm is formed in the diaphragm substrate. A method of manufacturing the inkjet head is also provided.

Semiconductor device and method of manufacturing the same

In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode.

Image heating apparatus generating heat by magnetic flux having a member reducing the amount of heat generation by the magnetic flux by movement thereof

An image heating apparatus includes a coil for generating a magnetic flux by a current flowing therethrough; an image heating member having an electroconductive layer in which an eddy current is produced by the magnetic flux by which heat is generated, to heat an image on a recording material; an electroconductive magnetic flux adjusting member movable from a first position and a second position to decrease the eddy current produced in the image heating member by the magnetic flux; a sensor for sensing the temperature of the image heating member; and a controller for controlling electric power supplied to the coil on the basis of an output of the sensor. The controller changes an electric power condition to be supplied to the coil before start of the movement from the first position to the second position of magnetic flux adjusting member.

Ink jet head and method of production thereof

An ink jet head including nozzles, ink chambers, and an ink channel in fluid communication with each other. A diaphragm defines one portion of each of the ink chambers. Piezoelectric actuators are disposed in confrontation with the diaphragm in a one-to-one correspondence with the ink chambers. A relay member is provided between each piezoelectric actuator and the diaphragm. Each relay member has a first abutment surface and a second abutment surface on opposite sides thereof. Each first abutment surface abuts the diaphragm across a width that extends in the nozzle alignment direction. The width of each first abutment surface is shorter than the width of the corresponding ink chamber. Each second abutment surface is coupled to the corresponding piezoelectric actuator and has a width that extends in the nozzle alignment direction. The width of each second abutment surface is equal to or shorter than the width of the corresponding piezoelectric actuator. The width of each first abutment surface ...

Induction heating apparatus for image fixing

In an electromagnetic induction heating-type heating apparatus for moving a temperature decreasing member toward or apart from an effective position where a temperature in a predetermined area is decreased in order to take countermeasure against temperature rise at a non-sheet passing portion of a heating roller, a Curie temperature of the heating roller is not less than a predetermined image heating temperature and is less than a heat-resistant temperature of the heating apparatus.

Ink jet head and method of production thereof

An ink jet head including nozzles, ink chambers, and an ink channel in fluid communication with each other. A diaphragm defines one portion of each of the ink chambers. Piezoelectric actuators are disposed in confrontation with the diaphragm in a one-to-one correspondence with the ink chambers. A relay member is provided between each piezoelectric actuator and the diaphragm. Each relay member has a first abutment surface and a second abutment surface on opposite sides thereof. Each first abutment surface abuts the diaphragm across a width that extends in the nozzle alignment direction. The width of each first abutment surface is shorter than the width of the corresponding ink chamber. Each second abutment surface is coupled to the corresponding piezoelectric actuator and has a width that extends in the nozzle alignment direction. The width of each second abutment surface is equal to or shorter than the width of the corresponding piezoelectric actuator. The width of each first abutment surface ...

Ultrasonic transducer, method for making same, ultrasonic transducer array, and ultrasonic test apparatus

A structure that prevents a substrate from being warped is provided on a region or a location other than a membrane that determines the characteristics of a CMUT. In a CMUT in a structure in which a first conductive layer and a second conductive layer are provided sandwiching a cavity on a substrate, for example, as a warpage prevention structure, a warpage prevention layer that prevents the substrate from being warped is provided between the substrate and the first conductive film. When the insulating film disposed between the cavity and the first conductive film and the insulating film disposed between the cavity and the second conductive film are silicon oxide films, the warpage prevention layer includes a silicon nitride film.

Heating apparatus

A heating apparatus of an electromagnetic induction heating type includes a coil and a roller which generates heat by the action of magnetic flux generated from the coil. A recording material is heated by the roller. The heating apparatus further includes a movable magnetic flux decreasing member for decreasing magnetic flux, generated from the coil, acting on the roller. In the heating apparatus, a shutter is moved toward an effective position at which a temperature in a non-conveyance area is lowered when a recording material having a size lower than a maximum conveyable size is conveyed, and is moved away from the effective position depending on the temperature in the non-conveyance area, irrespective of the size of the recording material to be conveyed.

Heating apparatus

In an electromagnetic induction heating-type heating apparatus for moving a temperature decreasing member toward or apart from an effective position where a temperature in a predetermined area is decreased in order to take countermeasure against temperature rise at a non-sheet passing portion of a heating roller, a Curie temperature of the heating roller is not less than a predetermined image heating temperature and is less than a heat-resistant temperature of the heating apparatus.

Image forming apparatus

An image heating apparatus includes a coil for generating a magnetic flux by current flowing therethrough; an image heating member for heating an image on a recording material which is fed therethrough, the image heating member producing heat by eddy current generated by the magnetic flux; electric power supply control means for controlling electric power supply to the coil so as to provide the image heating member with a predetermined temperature; magnetic flux adjusting means for adjusting a magnetic flux in a direction perpendicular to a feeding direction of the recording material, the magnetic flux adjusting means having a first magnetic flux adjusting portion for reducing, by relative movement thereof relative to the coil, a magnetic flux directing toward an end of the image heating member adjacent to a sheet feedable range with respect to the direction, and a second magnetic flux adjusting portion for reducing, by relative movement thereof relative to the coil, a magnetic flux directing ...

Magnetic flux driven heat generation member with magnetic flux adjusting means

An electromagnetic induction heating apparatus capable of uniformizing a temperature distribution in a longitudinal direction of an induction heating member includes: an exciting coil (magnetic flux generation means); a fixation roller (induction heating member) for generating heat by electromagnetic induction heating by action of magnetic flux generated by the exciting coil the induction heating member heating a material to be heated through heat generation thereof by introducing the material to be heated into a heating portion and conveying the material to be heated in contact with the fixation roller; and magnetic flux shielding plate (magnetic flux adjusting means) for changing a distribution of a density of an effective magnetic flux which is the magnetic flux generated by the exciting coil and actable on the fixation roller, in a longitudinal direction of the heating portion perpendicular to a conveyance direction of the material to be heated. The magnetic flux shielding plate adjusts ...

Information processing apparatus capable of communicating with a terminal apparatus, terminal apparatus, and control method thereof

The communication unit of an information processing apparatus can perform a wireless communication with a terminal apparatus. A state identifier indicating the state of the information processing apparatus is obtained, and a device identifier for identifying the information processing apparatus and the state identifier are transmitted to the terminal apparatus through the communication unit. The terminal apparatus holds additional information corresponding to a state of an information processing apparatus which can be identified by the device identifier, and can display the additional information.

Disk drive with unbalance correcting mechanism

A disk drive is realized, which omits running-in for stabilizing a change in a correcting function produced by sliding between balls and a rolling groove in an unbalance correcting mechanism, and prevents immobility and straying of balls, and which comprises a unit mechanism assembled by using 12 balls subjected to surface treatment with heptadecafluorodecyltrimethoxysilane and a turntable plated with a chemical nickel plating containing phosphorus and boron to have a thickness of 5 mum and by injecting 1 microliter of ester oil into the rolling groove, and further comprises a recess formed in a sidewall of the rolling groove of the unbalance correcting mechanism to prolong the service life of the correcting function.

Semiconductor device and method of manufacturing the same

When a through-hole electrode and a rear-surface wire are formed on a rear surface of a chip, a convex portion is formed on the rear surface of the chip due to a rear-surface wiring pad which is a part of the through-hole electrode and the rear-surface wire. This causes the air leakage when the chip is sucked, and therefore, the reduction of the sucking force of the chip occurs. A concave portion is formed in advance in a region where a rear-surface wiring pad and a rear-surface wire are formed. The rear-surface wiring pad and the rear-surface wire are provided inside the concave portion. Thus, a flatness of the rear surface of the chip is ensured by a convex portion caused by thicknesses of the rear-surface wiring pad and the rear-surface wire, so that the reduction of the sucking force does not occur when the chip is handled.

Ultrasonic transmitting and receiving element, and ultrasonic examination device, smartphone, and tablet including the same

According to one embodiment, an ultrasonic probe includes: an oscillator; a base on which the oscillator is provided; a base conductive wire portion connected to the oscillator; a bump electrode portion supplying a signal to the oscillator via the base conductive wire portion; a pad portion engaging with the bump electrode portion; and an acoustic lens provided such that a force toward the bump electrode portion is applied to the pad portion.

IMAGE PROCESSING APPARATUS, CONTROL METHOD, AND STORAGE MEDIUM

An information processing apparatus includes a specification unit configured to specify a layer of a record level from print data of a hierarchical structure having metadata, a display control unit configured to display the metadata contained in the layer specified by the specification unit, a receiving unit configured to receive selection of specific metadata for filter printing from the metadata displayed by the display control unit, and a determination unit configured to determine a record in which the specific metadata received by the receiving unit is set to be a print target.

Image heating apparatus

An image heating apparatus includes a heating rotatable member for heating an image on a recording material in a heating nip; magnetic flux generating means for generating a magnetic flux for induction heat generation in the heating rotatable member; magnetic flux confining means for confining the magnetic flux directed toward a predetermined region of the heating rotatable member from the magnetic flux generating means; and moving means for repeatedly moving the magnetic flux confining means during a heating operation between the operating position and a retracted position retracted from the operation position, when the recording material which has a predetermined width overlapping with a part of the predetermined region is continuously heated by the apparatus.

ULTRASONIC PROBE, METHOD FOR MANUFACTURING THE SAME AND ULTRASONIC DIAGNOSTIC APPARATUS

An ultrasonic probe is provided with a CMUT chip having a plurality of transducer elements that change electromechanical coupling coefficients or sensitivities in accordance with a bias voltage to transmit and receive ultrasonic waves, an electric conducting layer formed on the ultrasonic irradiation side of the CMUT chip, an acoustic lens arranged on the ultrasonic irradiation side of the CMUT chip, an insulating layer formed in the direction opposite to the ultrasonic irradiation side of the acoustic lens, a housing unit that stores the CMUT chip in which the electric conducting layer and the insulating layer are fixed with an adhesive and the acoustic lens, wherein the insulating layer is formed by the material that includes at least either silicon oxide or paraxylene to prevent a solvent of the adhesive from soaking into the adhered portion.

MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

After forming a ring-shaped trench penetrating through a semiconductor substrate from a rear surface side thereof and forming an insulating film inside the trench and on the rear surface of the semiconductor substrate, a through hole is formed in the insulating film and semiconductor substrate on an inner side of the ring-shaped trench from the rear surface side, thereby exposing a surface protection insulating film formed on a front surface of the semiconductor substrate at a bottom of the through hole. After removing the surface protection insulating film at the bottom of the through hole to form an opening to expose an element surface electrode, a contact electrode connected to the element surface electrode is formed on inner walls of the through hole and opening, and a pad electrode made of the same layer as the contact electrode is formed on the rear surface of the semiconductor substrate. 1. A manufacturing process of a semiconductor device comprising the steps of:(a) forming a semiconductor element on a first surface of a semiconductor substrate, forming a first insulating film on the semiconductor element, and then forming a first electrode on the first insulating film;(b) forming a ring-shaped trench penetrating through the semiconductor substrate from a side of a second surface of the semiconductor substrate opposite to the first surface;(c) forming a second insulating film on the second surface of the semiconductor substrate including an inside of the ring-shaped trench;(d) forming a through hole in the second insulating film and the semiconductor substrate on an inner side of the ring-shaped trench, from the side of the second surface of the semiconductor substrate;(e) removing the first insulating film exposed on a bottom surface of the through hole, thereby forming an opening which exposes the first electrode;(f) forming a seed layer in contact with the first electrode on the second surface of the semiconductor substrate including inner walls of the ...

IMAGE HEATING APPARATUS

An image heating apparatus includes a coil for generating a magnetic flux by a current flowing therethrough; an image heating member having an electroconductive layer in which an eddy current is produced by the magnetic flux by which heat is generated, the image heating member being effective to heat an image on a recording material; an electroconductive magnetic flux adjusting member movable from a first position and a second position to decrease the eddy current produced in the image heating member by the magnetic flux; a temperature sensor for sensing a temperature of image heating member; electric power control means for control electric power supplied to the coil on the basis of an output of the temperature sensor, wherein the electric power control means changes an electric power condition to be supplied to the coil before start of the movement from the first position to the second position of magnetic flux adjusting member. 1. An image heating apparatus comprising:a coil for generating a magnetic flux by a current flowing therethrough;an image heating member having an electroconductive layer in which an eddy current is produced by the magnetic flux by which heat is generated, said image heating member being effective to heat an image on a recording material;an electroconductive magnetic flux adjusting member movable from a first position and a second position to decrease the eddy current produced in said image heating member by the magnetic flux;a temperature sensor for sensing a temperature of image heating member;electric power control means for control electric power supplied to said coil on the basis of an output of said temperature sensor,wherein said electric power control means changes an electric power condition to be supplied to said coil before start of the movement from the first position to the second position of magnetic flux adjusting member.219-. (canceled) This is a divisional of application Ser. No. 13/323,175, filed on Dec. 12, 2011, now ...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode. 1. A semiconductor device comprising:a semiconductor substrate having a main surface and a back surface positioned on an opposite side to the main surface;a first insulating film formed on the main surface of the semiconductor substrate;a first hole formed in the first insulating film;a second hole formed in the back surface of the semiconductor substrate;an electrode having a first portion which is formed at least in and entirely fills the first hole and a protruding portion which extends from the semiconductor substrate; anda conductive film conformally formed in the second hole and electrically connected to a bottom surface of the electrode.2. The semiconductor device according to claim 1 , wherein a protective insulating film is formed at a boundary portion between the electrode and the semiconductor substrate so that the electrode and the semiconductor substrate are electrically insulated from each other.3. The semiconductor device according to claim 1 , further comprising a second insulating film formed at a ...

Optical module and scan-type image projection display device

To provide an optical module and a scan-type image projection display device at low power consumption in a configuration of enhancing a heat radiation property with excellent assembly performance. An optical module for coupling and irradiating laser beams from a plurality of laser diodes, and onto a desired position is characterized in that a first protruded part corresponding to a first laser holder for holding a first laser diode 1 a and a second protruded part corresponding to a second laser holder for holding a second laser diode are provided on a base for placing the optical module thereon, and heat conductive materials are provided between the first protruded part and the first laser holder and between the second protruded part and the second laser holder, respectively.

Ultrasound probe and ultrasound equipment using same

Provided are: an ultrasound probe with excellent characteristic stability; and ultrasound equipment that uses the ultrasound probe. The ultrasound probe has an ultrasonic transmitting and receiving element provided with a substrate, an insulating film formed on the substrate, a cavity formed between the substrate and the insulating film, and a pair of electrodes disposed parallel to the substrate so as to sandwich the cavity. The ultrasound probe is characterized in that the ultrasonic transmitting and receiving element has a beam part with a multilayer structure formed by laminating films made of materials different in stress, the beam part being disposed on the electrode distant from the substrate out of the pair of electrodes, and the beam part is formed by laminating a film that applies tensile stress and a film that applies compressive stress.

Automatic Analyzer

Provided is an automatic analyzer provided with a liquid level sensing function in which liquid levels in sample containers having various heights can be precisely detected using ultrasonic waves. This device is provided with: a conveyance rack for conveying a sample container which contains a sample and is loaded thereon; a fixed ultrasonic distance sensor for measuring the liquid level position in the sample container loaded on the conveyance rack; sound wave guides for suppressing diffusion of sound waves transmitted from the ultrasonic distance sensor, the sound wave guides being disposed between the sample container and the ultrasonic distance sensor; and a sound wave guide control unit for adjusting the length or switching the length of the sound wave guides in accordance with the distance between the ultrasonic distance sensor and the sample container. 1. An automatic analyzer , comprising:a conveyance rack for conveying a sample container which contains a sample and is loaded thereon;a fixed ultrasonic distance sensor for measuring a liquid level position in the sample container loaded on the conveyance rack;sound wave guides for suppressing diffusion of sound waves transmitted from the ultrasonic distance sensor, the sound wave guides being disposed between the sample container and the ultrasonic distance sensor; anda sound wave guide control unit for adjusting a length or switching a length of the sound wave guides in accordance with a distance between the ultrasonic distance sensor and the sample container.2. The automatic analyzer according to claim 1 , wherein the sound wave guide is multistage and extendable.3. The automatic analyzer according to claim 1 , comprising:a plurality of sound wave guides each having a different length as the sound wave guide, whereinthe sound wave guide control unit disposes one sound wave guide selected from the plurality of sound wave guides having different lengths between the sample container and the ultrasonic distance ...

Semiconductor sensor chip, semiconductor sensor chip array, and ultrasound diagnostic apparatus

The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip ( 2 a ) that has drive electrodes ( 3 e )-( 3 j ), etc., arranged in a grid-like configuration on a rectangular CMUT element section ( 21 ); and a CMUT chip ( 2 b ) that has drive electrodes ( 3 p )-( 3 u ), etc., arranged in a grid-like configuration on the rectangular CMUT element section ( 21 ), that is adjacent to the CMUT chip ( 2 a ), and in which the drive electrodes ( 3 e )-( 3 j ) of the adjacent CMUT chip ( 2 a ) are electrically connected to the respective drive electrodes ( 3 p )-( 3 u ) via bonding wires ( 4 f )-( 4 i ), etc.

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER AND ULTRASONIC IMAGING APPARATUS USING THE SAME

A capacitive micromachined ultrasonic transducer A includes: a silicon substrate an insulating film formed over the silicon substrate a lower electrode ; insulating films and a cavity constituted by a void formed in a portion of the insulating film an upper electrode insulating films and and a protective film In addition, the insulating film upper electrode insulating film and insulating film above the cavity configure a vibration film and the protective film above the vibration film is divided into a plurality of isolated patterns regularly arranged with a gap having a constant spacing formed therebetween. 1. A capacitive micromachined ultrasonic transducer comprising:a substrate;a lower electrode formed on the substrate;a cavity formed in a portion of a first insulating film formed over the lower electrode;an upper electrode formed on the first insulating film;a second insulating film formed over the upper electrode;a protective film formed over the second insulating film; anda vibration film constituted by the first insulating film, upper electrode and second insulating film above the cavity,wherein the protective film above the vibration film is divided into a plurality of patterns arranged with a gap having a predetermined spacing formed therebetween.2. The capacitive micromachined ultrasonic transducer according to claim 1 ,wherein a pattern density of the protective film above a peripheral portion of the vibration film is lower than a pattern density of the protective film above a center portion of the vibration film.3. The capacitive micromachined ultrasonic transducer according to claim 2 ,wherein a planar size of the protective film above the peripheral portion of the vibration film is smaller than a planar size of the protective film above the center portion of the vibration film.4. The capacitive micromachined ultrasonic transducer according to claim 2 ,wherein the spacing of the gap in the protective film above the peripheral portion of the vibration ...

INFORMATION PROCESSING APPARATUS, TERMINAL APPARATUS, AND CONTROL METHOD THEREOF

The communication unit of an information processing apparatus can perform a wireless communication with a terminal apparatus. A state identifier indicating the state of the information processing apparatus is obtained, and a device identifier for identifying the information processing apparatus and the state identifier are transmitted to the terminal apparatus through the communication unit. The terminal apparatus holds additional information corresponding to a state of an information processing apparatus which can be identified by the device identifier, and can display the additional information. 1. An information processing apparatus comprising:a communication unit configured to perform a wireless communication with a terminal apparatus;an obtaining unit configured to obtain a state identifier indicating a state of the information processing apparatus; anda transmission unit configured to transmit a device identifier for identifying the information processing apparatus and the state identifier to the terminal apparatus through the communication unit,wherein the terminal apparatus holds additional information corresponding to a state of an information processing apparatus which can be identified by the device identifier, and can display the additional information.2. The apparatus according to claim 1 , further comprising:a control panel; anda control unit configured to display an operation screen of the information processing apparatus on the control panel,wherein the state identifier can indicate an operation screen displayed on the control panel.3. The apparatus according to claim 2 , wherein the additional information comprises at least one of a content explaining an operation method for an information processing apparatus claim 2 , or a content explaining a setting method for an information processing apparatus.4. The apparatus according to claim 1 , wherein the state identifier can indicate an operation state of the information processing apparatus.5. The ...

ULTRASONIC TRANSDUCER, METHOD FOR MAKING SAME, ULTRASONIC TRANSDUCER ARRAY, AND ULTRASONIC TEST APPARATUS

A structure that prevents a substrate from being warped is provided on a region or a location other than a membrane that determines the characteristics of a CMUT. In a CMUT in a structure in which a first conductive layer and a second conductive layer are provided sandwiching a cavity on a substrate, for example, as a warpage prevention structure, a warpage prevention layer that prevents the substrate from being warped is provided between the substrate and the first conductive film. When the insulating film disposed between the cavity and the first conductive film and the insulating film disposed between the cavity and the second conductive film are silicon oxide films, the warpage prevention layer includes a silicon nitride film. 1. An ultrasound transducer comprising:a substrate;a first conductive film formed on the substrate;a first insulating film and a second insulating film formed on the first conductive film;a cavity provided between the first insulating film and the second insulating film;a second insulating film formed on the second conductive film; anda third insulating film covering the second conductive film,wherein a warpage prevention layer that prevents the substrate from being warped is provided between the substrate and the first conductive film.2. The ultrasound transducer according to claim 1 ,wherein when the substrate side is a lower side and the third insulating film side is an upper side,the warpage prevention layer includes a film formed of a material that generates stress in a direction in which residual stress of a membrane configured of layers on the upper side of the first insulating film is cancelled.3. The ultrasound transducer according to or claim 1 ,wherein the first insulating film and the second insulating film are formed of a silicon oxide film; andthe warpage prevention layer includes a silicon nitride film.4. The ultrasound transducer according to or claim 1 ,wherein a fourth insulating film is provided between the first ...

ULTRASOUND PROBE AND ULTRASOUND DIAGNOSTIC DEVICE USING SAME

In order to obtain a high-resolution ultrasound diagnostic image while reducing the back side reflection of a ultrasound irradiated to the side opposite to the ultrasound transmission direction of an ultrasound transmission/reception device, disclosed is an ultrasound probe, wherein a substrate is provided thereon with a cavity, insulation layers having the cavity therebetween, and an upper layer electrode and a lower layer electrode having the cavity and the insulation layers therebetween, so as to form an ultrasound vibration element, the substrate is held by a backing with a low-modulus member therebetween, and a direct voltage and a alternating voltage are applied between the electrodes to vibrate the ultrasound vibration element, and wherein a mechanical impedance by the substrate and the low-modulus member has a substantially equal value as an acoustic impedance of the backing. 12127. An ultrasound probe comprising an ultrasound vibration element composing a plurality of cells () and a rim () disposed between each of the cells , each of the cells constituted on a substrate by a cavity , by insulation layers with the cavity interposed therebetween , and by an upper layer electrode and a lower layer electrode with the cavity and the insulation layers interposed therebetween , the substrate being supported by a backing with a low-modulus member interposed therebetween , the ultrasound vibration element being vibrated by application of a direct-current voltage and an alternate-current voltage between the electrodes;{'sup': 6', '2, 'wherein the backing has an acoustic impedance falling within ±1 MRayls (10kg/ms) of a mechanical impedance per unit area formed by the substrate and the low-modulus member.'}2. The ultrasound probe according to claim 1 , wherein the rim is formed as a part of the insulation layers.3. The ultrasound probe according to claim 2 , wherein portions of the insulation layers forming the rims protrude toward the substrate and are disposed above ...

PRODUCTION METHOD FOR ULTRASONIC PROBE, ULTRASONIC PROBE, AND ULTRASONIC DIAGNOSIS DEVICE

Both controlling damage when assembling an ultrasonic probe using a chip formed with a capacitive ultrasonic transducer and securing operational reliability are achieved. In a semiconductor substrate on which the capacitive ultrasonic transducer (CMUT) is formed on a first primary surface, a protective film is formed on the surface of the ultrasonic transducer which is formed on the first primary surface of the semiconductor substrate which is then thinned by polishing a second primary surface opposite to the first primary surface of the semiconductor substrate, an ultrasonic transducer chip is cutout of the semiconductor substrate, a sound absorbing material is provided on the surface opposite to the surface formed with the ultrasonic transducer, and the protective film formed on the surface of the ultrasonic transducer is removed. 1. A production method for an ultrasonic probe which uses a capacitive ultrasonic transducer formed on a first primary surface of a substrate , comprising:a step of forming a protective film on the surface of the ultrasonic transducer which is formed on the first primary surface of the substrate;a step of thinning a second primary surface side opposite to the first primary surface of the substrate, after the step of forming a protective film;a step of cutting an ultrasonic transducer chip out of the substrate after the step of thinning;a step of providing a sound absorbing material on the surface of the ultrasonic transducer chip which is opposite to the surface formed with the ultrasonic transducer, after the cutting step; anda first removal step of removing the protective film which is formed on the surface of the ultrasonic transducer, after the step of providing a sound absorbing material.2. The production method for an ultrasonic probe according to claim 1 ,wherein the ultrasonic transducer includes a first electrode; a first insulation film which is formed on the first electrode; a hollow portion which is formed on the first ...

Ultrasonic Transmitting and Receiving Element, and Ultrasonic Examination Device, Smartphone, and Tablet Including the Same

According to one embodiment, an ultrasonic probe includes: an oscillator; a base on which the oscillator is provided; a base conductive wire portion connected to the oscillator; a bump electrode portion supplying a signal to the oscillator via the base conductive wire portion; a pad portion engaging with the bump electrode portion; and an acoustic lens provided such that a force toward the bump electrode portion is applied to the pad portion. 1. An ultrasonic probe comprising:an oscillator;a base on which the oscillator is provided;a base conductive wire portion connected to the oscillator;a bump electrode portion supplying a signal to the oscillator via the base conductive wire portion;a pad portion engaging with the bump electrode portion; andan acoustic lens provided such that a force toward the bump electrode portion is applied to the pad portion.2. An ultrasonic probe comprising:an acoustic lens;an oscillator;a base on which the oscillator is provided;a base conductive wire portion connected to the oscillator;a bump electrode portion supplying a signal to the oscillator via the base conductive wire portion; anda pad portion to which the bump electrode portion is press-fitted.3. The ultrasonic probe according to claim 1 , further comprising:a flexible substrate on which the pad portion is provided.4. An ultrasonic probe comprising:an acoustic lens;an oscillator;a base on which the oscillator is provided;a base conductive wire portion connected to the oscillator;a bump electrode portion supplying a signal to the oscillator via the base conductive wire portion;a pad portion facing the bump electrode portion and connected thereto; anda flexible substrate on which the pad portion or the bump electrode portion is provided.5. The ultrasonic probe according to claim 1 , whereinan initial shape of an arm portion provided on a periphery of a curved surface portion of the acoustic lens is formed so as to be inclined or curved toward an inner surface of the acoustic lens.6 ...

OPTICAL MODULE AND SCANNING-TYPE IMAGE DISPLAY DEVICE

In an optical module and a scanning-type image display device, a reduction in heat insulating effect due to a natural convection generated between the optical module and a case is suppressed to alleviate laser overheating and thermal expansion or contraction of each component and obtain a stable projection image quality. In an optical module that couples laser beams from a plurality of laser beam sources and irradiates the laser beams to a desired position, a cover that covers the optical module is provided, a second cover is provided in a space between the optical module and the cover, and a projecting part is provided on a surface of the second cover facing the optical module. 1. An optical module that couples laser beams from a plurality of laser beam sources and irradiates the laser beams to a desired position , the optical module comprising:a cover that covers the optical module;a second cover provided between the optical module and the cover; andat least one projecting part provided in a space between a first laser beam source and a second laser beam source on a surface of the second cover facing the optical module.2. An optical module that couples laser beams from a plurality of laser beam sources and irradiates the laser beams to a desired position , the optical module comprising:a cover that covers the optical module;a second cover provided between the optical module and the cover; anda projecting part provided on a surface of a corner part of the second cover facing the optical module.3. The optical module according to claim 1 , wherein the projecting part is formed on the surface facing the optical module in an area other than an area in which light is emitted from the optical module.4. The optical module according to claim 2 , wherein the projecting part has an L-shape.5. The optical module according to claim 1 , wherein the projecting part is structured to have two upper and lower stages.6. The optical module according to claim 1 , whereinthe cover ...

BATTERY CASE

A battery case enables a battery cell to be placed in a continuously pressured state without increasing the complexity of the battery module manufacturing process. Specifically, the battery case has: a plastic first accommodation unit and second accommodation unit in which a laminated body of a battery cell is accommodated; a UD tape integrally positioned on a first side wall, a second side wall, and a third side wall, which form the first accommodation unit; and a UD tape integrally positioned on the first side wall, which form the second accommodation unit. The UD tapes are configured, in particular, to be positioned straddling the third side walls from the second side walls across the first side wall. 1. A battery case comprising: a storage part made of resin for storing a laminate of battery cells; and a fiber tape arranged integrally with side walls forming the storage part and formed by impregnating fiber arranged in a longitudinal direction with resin , whereinthe side walls include a first side wall erected along a lamination direction of the battery cells, and a second side wall and a third side wall continued from the first side wall, erected in a direction intersecting with the lamination direction of the battery cells,the second side wall and the third side walls are holding the laminate of the battery cells at both ends in the lamination direction, andthe fiber tape is arranged from the second side wall to the third side wall through the first side wall.2. The battery case according to claim 1 , whereinthe storage part is formed integrally with the fiber tape by insert molding in which the resin is injected into a mold where the fiber tape is placed.3. The battery case according to claim 1 , whereinthe resin impregnated into the fiber tape and the resin forming the storage part are the same kind.4. The battery case according to claim 1 , whereinat least one direction of the storage part is open, andthe fiber tape is arranged along an opening end of the ...

METHOD AND APPARATUS FOR PRODUCING CHELATE RESIN, AND METHOD FOR PURIFYING TO-BE-TREATED LIQUID

Provided is a method for producing a chelate resin, wherein a highly pure treatment liquid can be obtained by reducing the amount of metal impurities in a to-be-treated liquid containing metal impurities. The method for producing a chelate resin comprises a purification step for purifying a to-be-purified chelate resin by bringing the chelate resin into contact with at least 5 wt % of a mineral acid solution containing 1 mg/L or less of metal impurities, wherein the total amount of metal impurities eluted when 3 wt % of hydrochloric acid is passed through the purified chelate resin in an amount equal to 25 times the amount of the chelate resin by volume ratio is 5 μm/mL-R or less. 1. A method for producing a chelate resin , comprising purifying a chelate resin that is to be purified by bringing a mineral acid solution having a metal impurities content of not more than 1 mg/L and a concentration of at least 5% by weight into contact with the chelate resin , whereina total amount of metal impurities eluted when hydrochloric acid having a concentration of 3% by weight is passed through the purified chelate resin in an amount equivalent to 25 times a volume of the chelate resin is not more than 5 μg/mL-R.2. The method for producing a chelate resin according to claim 1 , whereinamounts of sodium (Na), calcium (Ca), magnesium (Mg) and iron (Fe) in the mineral acid solution used during the purifying are each not more than 200 μg/L.3. The method for producing a chelate resin according to claim 1 ,further comprising, after the purifying, washing the chelate resin that has been brought into contact with the mineral acid solution with pure water or ultrapure water.4. The method for producing a chelate resin according to claim 1 , whereinthe chelate resin has aminomethyl phosphate groups or iminodiacetate groups as chelating groups.5. An apparatus for producing a chelate resin claim 1 , comprising a purification unit for purifying a chelate resin that is to be purified by ...

Manufacturing process of semiconductor device, and the semiconductor device

【課題】貫通電極を有する半導体装置の製造コストを低減することのできる技術を提供する。 【解決手段】半導体基板４を貫通するリング状の溝部１４を半導体基板４の裏面側から形成し、リング状の溝部１４の内部と半導体基板４の裏面に絶縁膜７を形成した後、リング状の溝部１４の内側の絶縁膜７および半導体基板４に、貫通孔５を半導体基板４の裏面側から形成し、半導体基板４の表面に形成された表面保護絶縁膜２を貫通孔５の底面に露出させる。続いて、貫通孔５の底面に露出する表面保護絶縁膜２を除去して開口部６を形成し、素子面電極３を露出させた後、素子面電極３に接続するコンタクト電極９を貫通孔５および開口部６の内壁に形成し、コンタクト電極９と同一層からなるパッド電極９ａを半導体基板４の裏面に形成する。 【選択図】図１

Outdoor heat exchanger unit and air conditioner using it

(57)【要約】 【課題】凝縮水滴のような微細水滴に対しても十分な撥 水性を示し、凝縮水の凍結による通風抵抗増加を防止し た屋外用熱交換器ユニットおよびそれに用いる熱交換器 の表面処理方法を提供することである。 【解決手段】熱交換器のアルミニウムフィンにミクロン オーダーの腐食孔１０８を生じさせながら、厚さ０．２ 〜１ミクロンの水和酸化物層１０６を形成させ、さらに その上に疎水基１０７を設ける。

Frame structure of saddle type vehicle

(57)【要約】 【課題】 内接歯車ポンプのポンプ効率を向上させる。 【解決手段】 アウター・ロータ121の軸方向両端面191 及びインナー・ロータ122の軸方向両端面192、インナー ・ロータ122とアウター・ロータ121の噛み合いにより形 成される空間の容積が増加する範囲のインナー・ロータ 122とアウター・ロータ121の軸方向端面に対向するケー ス111の内面193に撥水処理を行う。更に、インナー・ロ ータ122とアウター・ロータ121の噛み合いにより形成さ れる空間の容積が減少する範囲のインナー・ロータ122 とアウター・ロータ121の軸方向端面に対向するケース1 11の内面及びアウター・ロータの外周面に親水処理する ようにしてもよい。

Magnetic disk unit and external storage device using the same

(57)【要約】 【課題】 磁気ディスクに設けられた潤滑剤が、スライ ダに付着しにくく、スライダと磁気ディスクとの粘着を 防止し、かつスライダの浮上高さを低減し、記録密度を 増大した磁気ディスク装置及びそれを用いた外部記憶装 置を提供する。 【解決手段】 表面に潤滑剤層が形成された磁気ディス クと、磁気ディスクに対してデータの記録再生を行う磁 気ヘッドと、磁気ヘッドを搭載し磁気ディスクと対向す るスライダとを有する磁気ディスク装置において、スラ イダに形成され磁気ディスクと対向するレール面と、レ ール面より段差を持って凹部として形成され、段差より 小さい高低差を持つ凹凸が表面に設けられたブリード面 とを備える。

Battery case

Method of manufacturing device for multi-electron beam lithographic equipment

【課題】高アスペクト比の貫通孔に偏向電極を精度及び歩留まり良くしかも偏向電極及び配線の高信頼性を有して作製できるようにすること。 【解決手段】マルチ電子ビーム描画装置用デバイスの製造方法は、基板２１にアスペクト比４以上の貫通孔２３を多数形成し、基板２１の表面及び貫通孔２３に絶縁膜２２を形成し、基板２１及び貫通孔２３の内部にレジスト３７を形成し、レジスト３７を露光及び現像して、貫通孔２３、基板２１の表面にレジストパターン３８を形成し、レジストパターン３８を利用して貫通孔２３に偏向電極用金属膜２４ａを形成すると共に偏向電極用金属膜２４ａから基板２１の表面に延びる配線用金属膜２５ａを形成し、レジストパターン３８を除去し、偏向電極用金属膜２４ａ及び配線用金属膜１５ａ上にさらに金属膜２４ｂ、２５ｂをめっきして偏向電極２４及び配線２５とする方法である。 【選択図】図４

Ultrasonic transducer device and ultrasonic wave probe using same

The present invention provides an ultrasonic transducer device to send and receive ultrasonic waves, comprising a semiconductor substrate, a lower electrode disposed on the semiconductor substrate, a gap disposed on the lower electrode, a third insulation film disposed on the gap, an upper electrode disposed on the third insulation film, a fourth insulation film disposed on the upper electrode, a wiring layer disposed on the fourth insulation film, and a fifth insulation film disposed on the wiring layer. The upper electrode is electrically connected to the wiring layer with penetrating wires.

Ultrasonic transducer device and ultrasonic wave probe using same

The present invention provides an ultrasonic transducer device to send and receive ultrasonic waves, comprising a semiconductor substrate, a lower electrode disposed on the semiconductor substrate, a gap disposed on the lower electrode, a third insulation film disposed on the gap, an upper electrode disposed on the third insulation film, a fourth insulation film disposed on the upper electrode, a wiring layer disposed on the fourth insulation film, and a fifth insulation film disposed on the wiring layer. The upper electrode is electrically connected to the wiring layer with penetrating wires.

Patent JPS5761571B2

Water softening device

(57)【要約】 【課題】水道水中の硬質成分を電解処理することで容易 に軟水化する。 【解決手段】電解槽に電極１，２を配設しその電極の間 に液を二分するように隔壁を設ける。隔壁は少なくとも カルシウムのイオン半径の２倍以上で２００ミクロン以 下の微少な穴が存在し、隔壁における穴の開孔面積比が ５０％以下であり、隔壁の表面に水の表面エネルギーよ り小さい物質で処理あるいは物質そのもので構成し、流 水が常に隔壁に接するような構造とし、軟水を生成す る。

Chemical analyzer

Production of magnetic disk device

(57)【要約】 【課題】磁気ディスクに付着した潤滑剤やグリースが、 スライダに付着しにくく、スライダと磁気ディスクとの 粘着を防止し、かつスライダの浮上高さを低減し、記録 密度を増大した磁気ディスク装置の製造方法を提案す る。 【解決手段】スライダが少なくともフッ素を含む化合物 を被覆された後に紫外線を含む光を照射される工程を経 て製造される。

Mold for simultaneous molding and decorating

【課題】減圧吸引による加飾シートのキャビティ面への吸着工程において、減圧による空気漏れが発生することなく、加飾シートが適度に引き込まれる金型を得る。 【解決手段】金型間に送り込まれる加飾シート６３をＡ金型２に固定するクランプ装置４を有し、クランプ部材４１はバネ４４によりシート接触面４２が封止面２３に向かう方向に付勢されていて、封止面に装着溝２４を形成し、装着溝に弾性封止部材２５を装着している。シート接触面４２に、０．５ｍｍ以上０．７ｍｍ以下の距離突出する当り部材５０を取り付けて、シート接触面と封止面との最接近間隙ｄ５４を規制した。さらに、弾性封止部材２５は、硬度５°以上６０°以下の範囲にあるシリコンゴムの表面にフッ素をコーティングした材料からなる部材である。 【選択図】図１

Elevator device

(57)【要約】 【課題】ロープに経時伸び、あるいはシーブ溝に偏摩耗 が生じた状態でも、各ロープ間の張力を均一に保つエレ ベーター装置を提供する。 【解決手段】複数のロープ１をシーブ４に巻き掛けて摩 擦駆動させることにより、複数のロープ１に連結された 乗りかご２とカウンターウェイト３を交互に昇降させる エレベーター装置において、複数のロープ１に、それぞ れカウンターウェイト３を連結し、連結した各ロープ１ に各カウンターウェイト３の荷重がそれぞれ独立に作用 するように構成することにより、各ロープ１間の張力を 均一に保つことができる。

Vehicle bumper beam

A vehicle bumper beam which can be easily mounted to a vehicle body without requiring a separate support plate and which is configured so as to reduce the manufacturing cost of the vehicle bumper beam by simplifying the shape thereof while ensuring that the vehicle bumper beam has predetermined rigidity. Mounting sections (26) are integrally provided to impact absorbing sections (24). As a result, a vehicle bumper beam can be mounted to side members (12) without requiring a separate support plate. This improves mounting efficiency and reduces the number of parts, reducing manufacturing cost. The beam body (22) of a resin beam (20) is integrally connected to the mounting sections (26) through bent sections (32) which are bent in a crank shape, and a metallic beam (40) is provided so as to reach the impact absorbing sections (24) from the intermediate curve section (30) of the beam body (22) through the bent sections (32). The configuration allows the elimination of a reinforcement rib or the like for the resin beam (20) to simplify the shape of the vehicle bumper beam while ensuring that the vehicle bumper beam has predetermined rigidity, and as a result, the manufacturing cost is reduced.

多層配線基板およびその製造方法

【課題】 多層配線基板の製造方法において、高集積化、高密度化された多数のマイクロマシニング構造体を独立して外部システムへ電気的に接続でき、マイクロマシニング構造体を高電圧駆動可能な配線材料とすること。 【解決手段】 多層配線基板の製造方法は、マイクロマシニング技術により基板１０上に多数のマイクロマシニング構造体１１を作製し、第１の犠牲層金属膜１２を用いたリフトオフによりマイクロマシニング構造体１１上に接続して下部配線１４を作製し、第１の犠牲層金属膜１２を用いて電気めっきにより下部配線１６上に接続してポスト１６を作製し、スパッタリングにより下部配線１４上およびポスト１６の周囲に層間絶縁膜１７を作製し、第２の犠牲層金属膜を用いたリフトオフによりポスト１６上に接続した上部配線１８と外部システムに接続されるパッド１９とを一体に作製する工程を備える。 【選択図】 図１

磁気ディスク装置およびその製造方法

(57)【要約】 【課題】磁気ディスクに塗布された潤滑剤がスライダに 付着蓄積することによって発生する磁気ディスク装置の 起動障害を防止する。 【解決手段】スライダ表面にフルオロアルキルシランの オリゴマー膜を形成することによって、スライダ表面 の、磁気ディスクに塗布された潤滑剤の接触角を50度以 上にする。

ビーム成形品およびそれを用いたバンパレインフォース

【課題】安価に衝撃エネルギ吸収性能を効率よく向上させることができるビーム成形品と、それを用いたバンパレインフォースを提供する。 【解決手段】横断面が底部両側にフランジ部を備えたハット形の熱可塑性樹脂成形品にシート状繊維強化樹脂成形体を貼り付けたビーム成形品であって、シート状繊維強化樹脂成形体を熱可塑性樹脂成形品のハット形の天面および底部の一部あるいは全面に貼り付け、ハット形の側面は非貼り付け面とすることを特徴とするビーム成形品、およびそれを用いたバンパレインフォース。 【選択図】図１

フレームの接合構造

【課題】手間のかかる処理を行うことなく内側突出片を外側突出片に対し面接触しており且つ押し付けられた状態とすることができるフレームの接合構造を提供する。【解決手段】このフレームの接合構造は、フレーム１の外側突出片５とフレーム２の内側突出片６とが別々の端部から挿入される四角筒状のジョイント部材３を備える。ジョイント部材３の内部では、フレーム１の外側突出片５よりも内側にフレーム２の内側突出片６が差し込まれており、その内側突出片６が外側突出片５に対し面接触しており且つ押し付けられた状態で接合されている。ジョイント部材３の内部には、フレーム２のジョイント部材３に対する差し込み動作に伴い、内側突出片６を外側突出片５に向けて面接触させつつ押し付ける押圧プレート７が、ジョイント部材３に対し一体に形成されている。【選択図】図１

自動分析装置

【課題】様々な高さのサンプル容器内の液面を、超音波を用いて精度よく検出できる液面検知機能を備えた自動分析装置を提供する。【解決手段】サンプルの入ったサンプル容器を載置して搬送する搬送ラック２２と、搬送ラックに載置されたサンプル容器内の液面位置を測定する固定の超音波距離センサ２００と、サンプル容器と超音波距離センサの間に配置され、超音波距離センサから発信された音波の拡散を抑制する音波ガイド２０４，２０５と、超音波距離センサとサンプル容器との間の距離に応じて音波ガイドの長さの調整あるいは長さの切り替えを行う音波ガイド制御部と、を備える。【選択図】図２

衝撃吸収装置、およびその製造方法

【課題】複数の筒体が軸方向に連なるように重ね合わされて一体的に連結されている衝撃吸収装置において、連結により十分な剛性を確保できるとともに、連結強度を容易に調整できるようにする。 【解決手段】樹脂製のアウター部材１８が複数のインナー部材（筒体）１２の外周面にそれぞれ融着されるように設けられ、そのアウター部材１８を介して複数のインナー部材１２が互いに一体的に連結されている。このため、複数のインナー部材１２の相互の横ずれ方向の荷重をアウター部材１８によって適切に受け止めることができ、クラッシュボックス１０全体の剛性を適切に確保することができる。また、アウター部材１８の肉厚やインナー部材１２の外周面との接触面積を変更することにより、横ずれ方向の連結強度すなわち複数のインナー部材１２が相互に相対変位（横ずれ）させられる荷重を容易に調整できるため、衝撃吸収特性の設定の自由度が高くなる。 【選択図】図２

Automatic analysis device

金属樹脂複合体の成形方法および金属樹脂複合体

【課題】繊維強化樹脂を金属板にしっかり接合することができる金属樹脂複合体の成形方法、および同成形方法によって成形される金属樹脂複合体を提供する。【解決手段】この成形方法では、鋼板２１に対して、接着シート２２Ａを介してＳＭＣが熱プレスされて骨格部材が成形される。先ず、熱プレス用の金型装置４０の型締めを通じて、金型装置４０のキャビティ４９の内部に、繊維強化樹脂材によって構成される樹脂層部２３を成形する。その後において、樹脂層部２３が半固化状態まで固化される。その後、樹脂層部２３とキャビティ４９の内面との間にガスを放出して同樹脂層部２３を接着シート２２Ａおよび鋼板２１に押し付けた状態にするとともに、その状態で樹脂層部２３を固化させる。【選択図】図１

画像形成装置

【課題】 加熱性能，利便性及び形成する画像の品質の向上を図った定着装置及び画像形成装置を提供する。 【解決手段】 電磁誘導加熱方式の定着装置において、適宜、磁界を遮る遮蔽板３０１と、搬送されるシートの幅方向の異なる位置でそれぞれ定着ローラ４の温度を検出する第１サーミスタ及び第２サーミスタと、これら第１サーミスタ及び第２サーミスタの検出結果に基づいて、遮蔽板３０１を移動させる遮蔽板駆動手段と、を備え、サーミスタによって検出される温度のうち少なくとも一つが所定の温度範囲外となった場合には、定着動作を中断し、遮蔽板３０１を非磁束遮蔽位置へ移動させる試みと、定着ローラ４の温度を所定の範囲内に復帰させる温度復帰処理と、を行う。 【選択図】 図２

Image processing apparatus, control method, and program

An information processing apparatus includes a specification unit configured to specify a layer of a record level from print data of a hierarchical structure having metadata, a display control unit configured to display the metadata contained in the layer specified by the specification unit, a receiving unit configured to receive selection of specific metadata for filter printing from the metadata displayed by the display control unit, and a determination unit configured to determine a record in which the specific metadata received by the receiving unit is set to be a print target.

光モジュール、及び走査型画像表示装置

【課題】自然対流による断熱効果の低減を抑制し、各部品の熱膨張や収縮を軽減して、安定した投影画質が得られる光モジュール及び走査型画像表示装置を提供する。 【解決手段】複数のレーザ光源１ａ、１ｂ、１ｃからレーザ光を結合し所望の位置に照射する光モジュール１０１において、光モジュールを包含するカバー１１１、光モジュール１０１とカバー１１１との間の空間に第二のカバー１２を設け、第二のカバー１２の光モジュール対向面に突出部１３１を設ける。 【選択図】図３

超音波探触子及びそれを用いた超音波送受信装置

【課題】超音波探触子において、超音波素子とそれを外部配線に接続するフレキシブル配線基板との機械的且つ電気的接続を強固なものとし、超音波探触子を用いた検査や診断の性能を向上する。【解決手段】超音波素子を搭載するチップの電極パッドと結合されるビア付きパッド部４２が形成されたフレキシブル配線基板４において、ビア付きパッド部４２が形成されていない基材の領域に、基材の剛性を補強する補強部を設ける。補強部は、フレキシブル配線基板４にパッド部４２や配線を形成する工程で同時に形成され、パッド部４２と同じ厚みを持つ部材であり、ビア付きパッド部４２に電極パッドをバンプ圧入する際に、フレキシブル配線基板４にかかる圧力を均一にし、フレキシブル配線基板４の撓みや変形を防止する。【選択図】図３

超音波探触子およびそれを用いた超音波計測装置

【課題】半導体チップとフレキシブル基板とをフリップチップボンディングする際の位置合わせを容易にし、超音波探触子と超音波計測装置における測定精度を高める。【解決手段】超音波探触子は、ＣＭＵＴ１０２が形成され、かつＣＭＵＴ１０２の上部電極または下部電極と電気的に接続された電極パッド１０１ａを備える半導体チップ１０１と、電極パッド１０１ａと電気的に接続されるバンプ１００ｂが設けられ、かつ半導体チップ１０１の段差部１０１ｅと重なる部分にバンプ１００ｂが配置されるフレキシブル基板１００と、を有している。さらに、半導体チップ１０１における電極パッド１０１ａのバンプ１００ｂと接続する接続面１０１ａａの高さは、上記下部電極の下面の高さより低い。【選択図】図７

Ultrasonic probe, and ultrasonic transmitter-receiver system using the same

Provided is an ultrasonic probe having ultrasonic elements and a printed-circuit board that establishes connection between the ultrasonic elements and external wiring, achieving strong connection between the ultrasonic elements and the printed-circuit board mechanically and electrically, and thereby improving performance in examination and diagnosis using the ultrasonic probe. The printed-circuit board with pads each having a via-hole to be bonded to electrode pads of a chip equipped with the ultrasonic elements, is provided with a reinforcement, in an area of the base material where the pad having the via-hole is not formed. The reinforcement is formed simultaneously with forming the pads and wiring on the printed-circuit board, having the same thickness as the pads. With the reinforcement, pressure is evenly applied to the printed-circuit board when the electrode pad is press-fitted into the pad having the via-hole, thereby preventing warping and deforming of the board.

電極基板の製造方法、該電極基板を用いた偏向器、ならびに該偏向器を用いた荷電粒子線露光装置

【課題】 荷電粒子線の偏向器のコストダウンおよび信頼性向上を図る。 【解決手段】 偏向器の少なくとも１対の電極の形状および配置に対応する開孔を有する基板の該開孔に金以外の金属を充填して前記電極となる少なくとも１対の金属体を形成し、対となる金属体間の基板部分を除去することにより対となる金属体の対向面を露出させ、該対向面に金などの複数層の酸化保護膜を形成する。 【選択図】 図２

バンパリインフォースメント

【課題】バンパリインフォースメントにおいて、通風可能なパイプによりバンパリインフォースメントを補強することにより、バンパリインフォースメントの通風を可能としながら衝突荷重に対する強度低下を抑制する。【解決手段】ハット断面部材１１及び板状部材１２には、閉断面構造体１０ａ内を衝突荷重方向に通風可能とするように開口１１ａ、１２ａがそれぞれ設けられており、ハット断面部材１１及び板状部材１２の間には、閉断面構造体１０ａ内でハット断面部材１１及び板状部材１２の各開口１１ａ、１２ａ間を連通させるパイプ１３を備え、パイプ１３は、繊維強化プラスチック製であり、繊維強化プラスチックの繊維が衝突荷重方向に沿って配向されている。【選択図】図１

情報処理装置、ｐｄｌデータ変換方法およびコンピュータプログラム

【課題】入力ＰＤＬデータの論理構造を解析し、この解析結果に基づいて、入力ＰＤＬデータを、解析された論理構造を正しく表現する階層構造を有するＰＤＬデータに変換して出力する情報処理装置を提供する。 【解決手段】情報処理装置１が、入力されたＰＤＦファイル論理構造を解析し、論理構造の解析結果に基づいて、論理構造を表現する階層構造であって、ノードを含む階層を有する第１の階層構造を生成する。情報処理装置１が、生成された第１の階層構造が含むノードと入力されたＰＤＦファイルが含むページとの対応関係に基づいて、第２の階層構造を生成する。そして、情報処理装置１が、第２の階層構造が有する階層が含むノードと入力されたＰＤＦファイルが含むページとの対応関係に基づいて、ＰＤＦ／ＶＴデータを生成して出力する。 【選択図】図１

Optical filtering device, method of controlling optical filtering device, and mems shutter

Provided is a highly reliable optical filtering device used as a spatial filter for an optical inspection apparatus and configured to prevent a shutter from sticking to a wall surface of a shutter opening. The optical filtering device includes the shutter openable and closeable by voltage control and a substrate having the shutter opening serving as a movable range of the shutter, in which the substrate includes a sticking prevention part configured to prevent the shutter from sticking to the wall surface of the shutter opening when the shutter is opened.

携帯端末

【課題】棒状部材がある場合でも、サイドキーを設けることができるようにする。 【解決手段】伸縮式アンテナ１０を収容する棒状部材収容部１１を正面側キャビネット３に設け、この棒状部材収容部１１よりも内側に押圧式スイッチ１２を収容する。棒状部材収容部１１の壁部に押圧式スイッチ１２に対応してスイッチ用貫通孔１３を形成する。防水パッキン１４に一体に、押圧式スイッチ１２を押圧する押し子１５を設ける。押し子１５の押込量よりも大きな隙間Ｃを有するように伸縮式アンテナ１０を被挿通部２０に挿通し、被挿通部２０を介してキートップ２１によって押し子１５を押圧する。 【選択図】図１

樹脂製ペダルアーム

【課題】更なる安全性の向上を図った樹脂製ペダルアームを提供すること。【解決手段】樹脂製ペダルアーム１０は、アーム本体２０と、アーム本体２０に設けられた踏面部２２とを備える。アーム本体２０は、第１リブ４４Ａと、第１リブ４４Ａに対向する第２リブ４４Ｂと、第１リブ４４Ａと第２リブ４４Ｂの間に設けられ、踏面部２２に所定値以上の荷重Ｆが作用したときに破壊することによって、第１リブ４４Ａが第２リブ４４Ｂに受けられた状態にする脆弱部４２Ａとを備える。【選択図】図２

車両骨格構造

【課題】閉じ断面形状として形成される車両骨格構造の内部に装填される衝撃吸収部材の長手方向両端部の外方への移動を規制することにより、衝撃吸収性能の向上を図る。【解決手段】バンパリインフォースメント（車両骨格構造）１４は、断面ハット型形状の第１の部材２０と、この第１の部材２０における開口部を閉鎖する第２の部材２２とで閉じ断面形状に形成されており、内部に衝撃吸収部材２４が装填されている。そして、衝撃吸収部材２４の長手方向の両端部には、衝撃吸収部材２４を挟んで拘束ブラケット２６が配設されており、この拘束ブラケット２６は閉じ断面形状の内面に直に接合されて固定されている。【選択図】図３

情報処理装置及び情報処理方法

【課題】タイル描画命令の描画サイズがデバイス座標系で１ピクセル未満となり、タイル描画に透過を含む場合に正確に出力するには、一度部分的に実出力解像度以上の解像度でレンダリングした後に平均色でタイル描画部を塗る必要があるが、背景色を考慮した合成処理が必要になり処理が複雑になる。【解決手段】情報処理装置は、入力したＰＤＬデータにタイル描画命令が含まれる場合に、ＰＤＬデータの出力解像度を取得し、タイル描画命令と出力解像度に基いて、タイル描画の描画サイズを算出するＰＤＬ解析手段と、算出された描画サイズが所定値より小さい場合に、タイル描画命令に基づいてタイル描画の平均色を算出する平均色算出手段と、算出された平均色に基づいて、タイル描画命令をレンダリングするレンダリング手段を有する。平均色算出手段は、タイル描画命令に含まれる単位タイルの透過度に基づいて、平均色を算出する。【選択図】 図９

パソコンケースのカバー固定具及びカバー

【課題】 筐体１の上面に排気孔２が設けられているパソコンケースの上方に、上部カバー３を容易かつ確実に固定するカバー固定具を提供するとともに、カバー及びカバー固定具を安価とすること、上部カバー３の固定中や使用中に筐体１を傷つけず、カバー固定具が筐体１の上面で移動しにくくすること並びにパソコンケースの見栄えを良くすること。【解決手段】 筐体１の上面に排気孔２が設けられているパソコンケースの上方に取り付けられるパソコンケースのカバーであって、上部カバー３となる透明なガラス板並びにカバー固定具を構成するネオジウム磁石よりなる４組の下段柱状体４及び上段柱状体５と、下段柱状体４の上面及び下面に貼付されるエラストマー製の透明粘着シール６を備え、下段柱状体４は高さが１５ｍｍ、断面形状が一辺１２ｍｍの正方形であり、上段柱状体５は高さが１２ｍｍ、断面形状が下段柱状体４と同じ形状であるパソコンケースのカバー。【選択図】 図１

半導体センサチップ、半導体センサチップアレイ、および超音波診断装置

【課題】超音波探触子のセンシング面積を大きくして高精細化する。【解決手段】超音波診断装置は、駆動電極３ｅ〜３ｊなどが矩形状のＣＭＵＴ素子部２１にグリッド状に配列されたＣＭＵＴチップ２ａと、駆動電極３ｐ〜３ｕなどが矩形状のＣＭＵＴ素子部２１にグリッド状に配列され、ＣＭＵＴチップ２ａに隣接し、かつ駆動電極３ｐ〜３ｕに隣接するＣＭＵＴチップ２ａの駆動電極３ｅ〜３ｊとの間がそれぞれボンディングワイヤ４ｆ〜４ｉなどで電気的に接続されたＣＭＵＴチップ２ｂとを含んで構成される超音波探触子を備える。【選択図】図７

防衛産業向け情報提供サービスシステム

(57)【要約】 【課題】品名又は品名コードや企業名又は企業コードな ど、同じ検索条件であっても、利用者に応じて利用しや すい検索画面を提供し、必要とする情報を利用しやすい 方法で表示させることができる情報提供サービスシステ ムを提供すること。 【解決手段】製造元が付与する製造番号の他に、政府が 付与する管理番号を有する物品に関する防衛産業向け情 報提供サービスシステムであって、製造番号から物品を 検索可能な第１の部品検索画面と、管理番号から物品を 検索可能な第２の部品検索画面と、それぞれ、検索結果 を表示する第１の検索結果一覧画面と第２の検索結果一 覧画面とを有し、第１の部品検索画面と第２の部品検索 画面とは、品名コードや企業コードなどの共通の検索条 件による検索入力を行え、それぞれの検索結果一覧画面 では異なる項目表示を行うことを特徴とする防衛産業向 け情報提供サービスシステム。

攝影裝置

本發明提供一種即使白天亦可獲得能順利地確認車內情況之攝影圖像的攝影裝置。攝影裝置1具備攝影元件40、使來自目標區域之光成像於攝影元件40之透鏡10、及相對於攝影元件40配置於目標區域側之液晶快門30。液晶快門30具備入射側偏光板301與出射側偏光板。以垂直於裝置本體101之上下方向的偏光方向之光成分透過透鏡10後被入射側偏光板301遮斷的方式，設定入射側偏光板301之偏光軸301a。

Optical filtering device, method of controlling optical filtering device, and mems shutter

Provided is a highly reliable optical filtering device used as a spatial filter for an optical inspection apparatus and configured to prevent a shutter from sticking to a wall surface of a shutter opening. The optical filtering device includes the shutter openable and closeable by voltage control and a substrate having the shutter opening serving as a movable range of the shutter, in which the substrate includes a sticking prevention part configured to prevent the shutter from sticking to the wall surface of the shutter opening when the shutter is opened.

磁気ヘッドスライダの製造方法及び磁気ヘッドスライダ及び磁気記憶装置

(57)【要約】 【課題】 記憶装置として用いられる磁気ディスク装置 における磁気ヘッドスライダの表面に、フルオロアルキ ル基が高密度に配列した低エネルギー被覆膜を設けるこ とにより、磁気ヘッドスライダの自己潤滑性、摺動信頼 性を確保することにある。 【解決手段】 磁気ヘッドを搭載したスライダに、ディ スク媒体と対向するスライダの表面にフルオロアルキル 基を有する金属アルコキシド化合物におけるアルコキシ ル基の少なくとも一部が水酸基に置換され、さらに一部 が加水分解し互いに重合形成したオリゴマーを溶剤に希 釈したコーティング溶液を塗布し、加熱被覆成膜し、撥 油性を形成している。図において、１は磁気ヘッドスラ イダ、２は磁気ヘッド素子群、３は炭素系保護膜（保護 膜）、４は撥油膜、５は磁気ディスクである。

携帯端末

【課題】コンパクトかつ簡単な構造で確実に接地を行う。 【解決手段】正面側キャビネットの金属プレートの正面側に表示ユニットを収容し、表示ユニットから延びるフレキシブル基板９を金属プレートの背面側に折り返し、このフレキシブル基板９の背面を基板ホルダ１０の板金部１１に当接させ、基板ホルダ１０の背面側にメイン基板７を支持する。板金部１１に板金部１１と金属プレートとを接地する板バネ１５を形成すると共に、板金部１１とメイン基板７とを接地する導電性ガスケットを設ける。 【選択図】図１

情報処理装置および制御方法およびプログラム

【課題】従来、PDLに含まれるメタデータを使ってレコードを選択するために、ジョブチケット（JDF）を生成してレコードを選択する技術もあったが、ジョブチケットを生成する負荷やジョブチケットを解釈する処理などが発生するおそれがあった。 【解決手段】ＰＤＬデータに含まれるメタデータの中で、レコードレベルの階層に設定されているメタデータを使って印刷対象となるレコードを決定する。 【選択図】図３(c)

Chip für die Nukleinsäuretrennung, strukturelles Element und Verfahren zu dessenBildung

Semiconductor device and manufacturing method thereof

磁気ディスク装置

(57)【要約】 【課題】磁気ディスクに付着した潤滑剤やグリースが、 スライダに設けられた二酸化チタンの光触媒機能により 分解されて除去され、スライダと磁気ディスクとの粘着 を防止した磁気ディスク装置を提供する。 【解決手段】表面に潤滑剤層が形成された磁気ディスク と、磁気ディスクに対してデータの記録再生を行う磁気 ヘッドと、磁気ヘッドを搭載し前記磁気ディスクと対向 するスライダとを有し、スライダの磁気ディスクに対向 する面とスライダの側面に少なくとも二酸化チタンを含 む物質を設けられたスライダと紫外線を発する光源を備 える。

光源モジュール

【課題】波長が異なる複数のレーザ光源から出射される複数のレーザ光を、進行方向と位置が略同一の光路上に揃えて射出する光源モジュールにおいて、環境温度の変化に伴って発生するレーザ光の進行方向の変化の波長間での差を低減する。【解決手段】レーザチップがヒートシンク上に設置されたレーザ光源と、レーザ光源を保持するレーザホルダとを有する光源モジュールであって、レーザホルダのレーザチップ側にある側壁の剛性がレーザホルダのヒートシンク側にある側壁の剛性と異なるように構成する。【選択図】図３

携帯用容器保持具

(57)【要約】 【課題】 リュックサックのショルダーベルト等に簡単 ・確実に取付けることができて取扱いの便がよいコンパ クト構造の携帯用容器保持具を提供すること 【解決手段】 本発明の携帯用容器保持具は、保持すべ き容器の上部を横方向に一周するように構成される帯状 の保持手段（11）、及び、保持手段（11）に方向が合わ せられ結合される帯状の横方向取付手段（21）を備えて いる。そして、横方向取付手段（21）の両端部には、重 合わされたときに相互に連結し合うための面ファスナー 機能（21c ，21d ）が施されているので、垂直に走る柔 軟性取付対象の任意且つ適切な位置に、簡単且つ確実に 取付けを行うことができる。保持手段（11）には、縦方 向及び横方向支持手段（12，13）が結合され、腰ベルト 取付用の縦方向取付手段（22）が着脱自在に装着され る。

携帯端末

【課題】画面の変色を起こすことなく、携帯端末内で効率よく熱の拡散を行えるようにする。 【解決手段】正面側キャビネットの金属プレートの正面側に表示ユニットを収容し、表示ユニットから延びるフレキシブル基板９を金属プレートの背面側に折り返し、金属プレートの背面及びフレキシブル基板９の背面側を連続して熱拡散シート１８で覆う。 【選択図】図１

像加熱装置

【課題】 本発明は、像加熱部材に到達する磁気を減らすための磁気遮蔽部材の移動中に、コイルに過電流が流れることを防止することを目的とする。 【解決手段】 コイルによる磁束により渦電流が発生し、渦電流により熱が生じ導電層を有する像加熱部材と、第一ポジションから第二ポジションへの移動によりコイルにより生じた磁束により像加熱部材で生ずる渦電流を減らすことができる移動可能な導電性の磁束調整部材とを有する誘導加熱方式の像加熱装置において、コイルへの通電を制御する電力制御手段は、磁束遮蔽部材が第一ポジションから第二ポジションへの移動を開始する前に前記コイルに印加する電力条件の切換えを行う。この構成により、磁束調整部材の移動中のコイルへの過電流が流れ込むことを防止できる。 【選択図】 図１

Method for purifying organic solvent and apparatus for purifying organic solvent

A method for purifying an organic solvent has a first treatment of bringing an organic solvent to be treated into contact with an H-type cation exchanger, and a second treatment of bringing a treated liquid from the first treatment into contact with an anion exchanger and an H-type strongly acidic cation exchanger. According to the present application, the provided method and an apparatus for purifying an organic solvent remove metal impurities of both metal species of monovalent and polyvalent metals in the organic solvent.

Production method for ultrasonic probe, ultrasonic probe, and ultrasonic diagnosis device

Both controlling damage when assembling an ultrasonic probe using a chip formed with a capacitive ultrasonic transducer and securing operational reliability are achieved. In a semiconductor substrate on which the capacitive ultrasonic transducer (CMUT) is formed on a first primary surface, a protective film is formed on the surface of the ultrasonic transducer which is formed on the first primary surface of the semiconductor substrate which is then thinned by polishing a second primary surface opposite to the first primary surface of the semiconductor substrate, an ultrasonic transducer chip is cutout of the semiconductor substrate, a sound absorbing material is provided on the surface opposite to the surface formed with the ultrasonic transducer, and the protective film formed on the surface of the ultrasonic transducer is removed.