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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Применить Всего найдено 4. Отображено 3.
11-01-2018 дата публикации

Electronic Device With Wireless Charging and Battery Heating

Номер: US20180013311A1
Принадлежит:

A wireless power transmitting device may transmit wireless power signals to a wireless power receiving electronic device. The electronic device may have a coil that receives the transmitted wireless power signals and may have a power receiving circuit that rectifies the received wireless power signals to produce a corresponding direct-current voltage signal. The direct-current signal may be used to power circuitry in the electronic device and may be used to charge a battery in the electronic device. Control circuitry in the electronic device may use a temperature sensor to make temperature measurements. In response to detecting that the device is below a given threshold temperature and based on other information such as information on which applications are running on a controller in device, the device may supply drive current signals to the coil to heat the battery and improve battery performance. 1. An electronic device configured to receive wirelessly transmitted power signals from a power transmitting device , comprising:a battery;a coil configured to receive the wirelessly transmitted power signals;a wireless power receiving circuit coupled to the coil, wherein the wireless power receiving circuit is configured to produce direct-current signals from the received wirelessly transmitted power signals that charge the battery;a controller; anda drive circuit coupled to the coil, wherein the controller is configured to apply a signal to the coil with the drive circuit that heats the battery.2. The electronic device defined in further comprising:a housing; anda printed circuit having loops of metal traces that form the coil, wherein the printed circuit is interposed between the battery and the housing.3. The electronic device defined in further comprising at least one temperature sensor claim 2 , wherein the controller is configured to gather temperature information with the at least one temperature sensor and is configured to apply the signal to the coil based at ...

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22-03-2018 дата публикации

Stacked circuit board architecture in an electronic device

Номер: US20180084636A1
Принадлежит: Apple Inc

A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

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29-03-2018 дата публикации

Stacked printed circuit board packages

Номер: US20180092213A1
Принадлежит: Apple Inc

The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.

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