29-12-2022 дата публикации
Номер: US20220415748A1
A semiconductor device includes a semiconductor element, a joint material, a heat spreader, and a sealing resin. The semiconductor element includes a main surface. The main surface has a first outer periphery. The sealing resin seals the semiconductor element, the joint material, and the heat spreader. The heat spreader includes a main body and a protrusion. The protrusion is joined to the main surface by the joint material. The main surface has an exposed surface. The exposed surface is located between the first outer periphery and the joint material. The first outer periphery and the exposed surface are exposed from the joint material. The first outer periphery and the exposed surface are sealed with the sealing resin. 1. A semiconductor device comprising:a semiconductor element including a main surface having a first outer periphery;a joint material disposed on the main surface;a heat spreader joined to the main surface by the joint material; anda sealing resin sealing the semiconductor element, the joint material, and the heat spreader, wherein a main body disposed opposite to the semiconductor element with respect to the joint material, and', 'a protrusion located inside the first outer periphery and protruding from the main body toward the main surface,, 'the heat spreader includes'}the protrusion includes a protrusion surface and is joined to the main surface by the joint material,the semiconductor element includes a first electrode joined to the protrusion by the joint material,the main surface has an exposed surface located between the first outer periphery and the joint material,the first outer periphery and the exposed surface are exposed from the joint material and sealed with the sealing resin,the first electrode includes the main surface having the exposed surface,the joint material includes a first joint portion and a second joint portion that contact each other at a position of an extension from the protrusion surface,the first joint portion is ...
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