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Применить Всего найдено 4. Отображено 4.
23-01-2003 дата публикации

Grid array packaged integrated circuit

Номер: US20030015784A1
Автор: Yuang-Tsang Liaw, Wen-Yuan Chang, Hung-Yin Tsai
Принадлежит:

A grid array packaged integrated circuit includes a substrate and a chip with a core circuit. The chip is disposed on the substrate. The chip includes I/O devices, bonding pad arranged on the chip in a multi-tier manner surrounding the I/O devices, metal traces and vias on metal layers of the chip for electrically connecting each I/O device and each bonding pad, rings and fingers surrounding the chip on the substrate, and bonding wires for electrically connecting each bonding pad to a corresponding finger or to a corresponding ring. Bonding pads electrically connected to different voltage levels can share the same I/O device.

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Номер записи: 1
14-11-2002 дата публикации

Data comparator using non-inverting and inverting strobe signals as a dynamic reference voltage and input buffer using the same

Номер: US20020167339A1
Автор: Chi Chang, Yuang-Tsang Liaw
Принадлежит:

A data comparator using a dynamic reference voltage and an input buffer using the same. The data comparator comprises a comparator circuit for receiving a data signal and a pair of non-inverting/inverting signals, which are periodic and complementary. The output signal is generated by comparing twice the data signal with the sum of the non-inverting signal and the inverting signal. The non-inverting/inverting signals are used as a dynamic reference voltage in the data comparator.

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Номер записи: 2
28-09-2004 дата публикации

Grid array packaged integrated circuit

Номер: US0006798075B2
Автор: Yuang-Tsang Liaw, Wen-Yuan Chang, Hung-Yin Tsai, LIAW YUANG-TSANG, CHANG WEN-YUAN, TSAI HUNG-YIN
Принадлежит: VIA Technologies Inc., VIA TECH INC, VIA TECHNOLOGIES INC.

A grid array packaged integrated circuit includes a substrate and a chip with a core circuit. The chip is disposed on the substrate. The chip includes I/O devices, bonding pad arranged on the chip in a multi-tier manner surrounding the I/O devices, metal traces and vias on metal layers of the chip for electrically connecting each I/O device and each bonding pad, rings and fingers surrounding the chip on the substrate, and bonding wires for electrically connecting each bonding pad to a corresponding finger or to a corresponding ring. Bonding pads electrically connected to different voltage levels can share the same I/O device.

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Номер записи: 3
02-03-2004 дата публикации

Data comparator using non-inverting and inverting strobe signals as a dynamic reference voltage and input buffer using the same

Номер: US0006700438B2
Автор: Chi Chang, Yuang-Tsang Liaw, CHANG CHI, LIAW YUANG-TSANG
Принадлежит: Via Technologies, Inc., VIA TECH INC, VIA TECHNOLOGIES, INC.

A data comparator using a dynamic reference voltage and an input buffer using the same. The data comparator comprises a comparator circuit for receiving a data signal and a pair of non-inverting/inverting signals, which are periodic and complementary. The output signal is generated by comparing twice the data signal with the sum of the non-inverting signal and the inverting signal. The non-inverting/inverting signals are used as a dynamic reference voltage in the data comparator.

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Номер записи: 4