DETERMINISTIC ASSEMBLY OF COMPLEX, THREE-DIMENSIONAL ARCHITECTURES BY COMPRESSIVE BUCKLING

Origami- and Kirigami-inspired assembly of predetermined three-dimensional forms is presented in comprehensive theoretical and experimental studies, with examples of a broad range of topologies and material compositions. The resulting engineering options in the construction of functional 3D structures have important implications for advanced microsystem technologies. 1. A structure comprising:a thin film structure having a complex shape held under strain by at least partial contact with a supporting material.23.-. (canceled)5. A structure comprising:a thin film structure characterized by a plurality of cut-outs configured to allow said thin film structure to form a predetermined three-dimensional shape upon application of a compressive force; wherein said predetermined three-dimensional shape is a rigid structure characterized by at least one region with a mode ratio greater than or equal to 0.1.6. The structure of further comprising:an encapsulation layer at least partially encapsulating said predetermined three-dimensional form.7. The structure of claim 6 , wherein said encapsulation layer is rigid.8. The structure of claim 6 , wherein said deformable substrate is rigid.9. A structure comprising:a deformable substrate having a surface; anda thin film structure supported by said surface; wherein said thin film structure is bound to said surface at a plurality of bonding regions and not bound to said surface at a plurality of non-bonding regions; wherein relaxation of said deformable substrate provides a compressive force that generates a predetermined three-dimensional form of said thin film structure; wherein said predetermined three-dimensional form is characterized by at least one region with a mode ratio greater than or equal to 0.1.1011.-. (canceled)12. The structure of claim 9 , wherein said thin film structure is an insulator.13. A structure comprising:a deformable substrate having a surface; anda thin film structure supported by said surface; wherein said ...

Brtcp24 gene useful for controlling growth of cabbage and application thereof

A BrTCP24 gene for controlling the growth of Chinese cabbage and its applications. The BrTCP24 gene has the nucleotide sequence shown in SEQ ID No. 1, the whole length of which is 1221 bp. The gene is useful for improving the production of economic crop. As indicated by experimental results, the gene serves as a controlling gene for plant growth and has the function of down-regulating the plant growth. Through overexpressing the gene, a transgenic plant smaller than the wild one can be obtained. The gene of the invention can provide theory basis and gene source for breeding new varieties of crops.

STRETCHABLE ELECTRONIC SYSTEMS WITH CONTAINMENT CHAMBERS

The present invention provides electronic systems, including device arrays, comprising functional device(s) and/or device component(s) at least partially enclosed via one or more containment chambers, such that the device(s) and/or device component(s) are at least partially, and optionally entirely, immersed in a containment fluid. Useful containment fluids for use in containment chambers of electronic devices of the invention include lubricants, electrolytes and/or electronically resistive fluids. In some embodiments, for example, electronic systems of the invention comprise one or more electronic devices and/or device components provided in free-standing and/or tethered configurations that decouple forces originating upon deformation, stretching or compression of a supporting substrate from the free standing or tethered device or device component. 1. An electronic system comprising:i. a substrate;ii. an electronic device or device component supported by said substrate; wherein said electronic device or device component is free standing or tethered to said substrate; andiii. a containment chamber at least partially enclosing said electronic device or device component; wherein said containment chamber is at least partially filled with a containment fluid or a low modulus solid.2. An electronic system comprising:i. an ultra low modulus layer;ii. a substrate supported by said ultra low modulus layer;iii. an electronic device or device component supported by said substrate; wherein said electronic device or device component is free standing or tethered to said substrate; andiv. a containment chamber, comprising a plurality of side walls and a top wall, at least partially enclosing said electronic device or device component; wherein said containment chamber is at least partially filled with a containment fluid or a low modulus solid;v. wherein said substrate has a Young's modulus greater than a Young's modulus of said ultra low modulus layer and said top wall has a ...

SELF-SIMILAR AND FRACTAL DESIGN FOR STRETCHABLE ELECTRONICS

The present invention provides electronic circuits, devices and device components including one or more stretchable components, such as stretchable electrical interconnects, electrodes and/or semiconductor components. Stretchability of some of the present systems is achieved via a materials level integration of stretchable metallic or semiconducting structures with soft, elastomeric materials in a configuration allowing for elastic deformations to occur in a repeatable and well-defined way. The stretchable device geometries and hard-soft materials integration approaches of the invention provide a combination of advance electronic function and compliant mechanics supporting a broad range of device applications including sensing, actuation, power storage and communications. 1. A electronic circuit comprising:an elastic substrate; anda stretchable metallic or semiconducting device component supported by said elastic substrate; said stretchable metallic or semiconducting device component comprising a plurality of electrically conductive elements each having a primary unit cell shape, said electrically conductive elements connected in a sequence having a secondary shape providing an overall two-dimensional spatial geometry characterized by a plurality of spatial frequencies, wherein said two-dimensional spatial geometry is a self-similar two-dimensional geometry;wherein said two-dimensional spatial geometry of said metallic or semiconducting device component allows for accommodation of elastic strain along one or more in-plane or out of plane dimensions, thereby providing stretchability of said electronic circuit, andwherein a said two-dimensional spatial geometry of said stretchable metallic or semiconducting device component provides a fill factor between first and second device components or provided over an active area of said electronic circuit greater than or equal to 20%.2. The electronic circuit of claim 1 , wherein said two-dimensional spatial geometry allows ...

SELF-SIMILAR AND FRACTAL DESIGN FOR STRETCHABLE ELECTRONICS

The present invention provides electronic circuits, devices and device components including one or more stretchable components, such as stretchable electrical interconnects, electrodes and/or semiconductor components. Stretchability of some of the present systems is achieved via a materials level integration of stretchable metallic or semiconducting structures with soft, elastomeric materials in a configuration allowing for elastic deformations to occur in a repeatable and well-defined way. The stretchable device geometries and hard-soft materials integration approaches of the invention provide a combination of advance electronic function and compliant mechanics supporting a broad range of device applications including sensing, actuation, power storage and communications. 1. A electronic circuit comprising:an elastic substrate; anda stretchable metallic or semiconducting device component supported by said elastic substrate; said stretchable metallic or semiconducting device component comprising a plurality of electrically conductive elements each having a primary unit cell shape, said electrically conductive elements connected in a sequence having a secondary shape providing an overall two-dimensional spatial geometry characterized by a plurality of spatial frequencies;wherein said two-dimensional spatial geometry of said metallic or semiconducting device component allows for accommodation of elastic strain along one or more in-plane or out of plane dimensions, thereby providing stretchability of said electronic circuit.2. The electronic circuit of claim 1 , wherein said two-dimensional spatial geometry allows said metallic or semiconducting device component to undergo elastic deformation.32. The electronic circuit of any of - claims 1 , wherein said two-dimensional spatial geometry allows said metallic or semiconducting device component to undergo biaxial deformation claims 1 , radial deformation or both.43. The electronic circuit of any of - claims 1 , wherein ...

Stretchable electronic systems with containment chambers

The present invention provides electronic systems, including device arrays, comprising functional device(s) and/or device component(s) at least partially enclosed via one or more containment chambers, such that the device(s) and/or device component(s) are at least partially, and optionally entirely, immersed in a containment fluid. Useful containment fluids for use in containment chambers of electronic devices of the invention include lubricants, electrolytes and/or electronically resistive fluids. In some embodiments, for example, electronic systems of the invention comprise one or more electronic devices and/or device components provided in free-standing and/or tethered configurations that decouple forces originating upon deformation, stretching or compression of a supporting substrate from the free standing or tethered device or device component.

Stretchable electronic systems with containment chambers

Robotic cleaner

A robotic cleaning system (200) may include a docking station (202), a robotic cleaner (100) that includes at least one of a first set of robot charging contacts (112) or a second set of robot charging contacts (114), the first and second sets of robot charging contacts (112, 114) being configured to electrically couple the robotic cleaner (100) to the docking station (202), a dust cup (104) configured to removably couple to the robotic cleaner (100), and a mop module (118) configured to removably couple to the robotic cleaner (100). When the mop module (118) is coupled to the robotic cleaner (100), the robotic cleaner (100) may be configured to electrically couple to the docking station (202) using the first set of robot charging contacts (112). When the mop module (118) is not coupled to the robotic cleaner (100), the robotic cleaner (100) may be configured to electrically couple to the docking station (202) using the second set of robot charging contacts (114).

Method for calculating oscillation damping ratio of power grid

The present invention disclosed a method for calculating an oscillation damping ratio of a power grid, and relates to the field of power system operation and control. When a power system oscillates, an oscillation period, two oscillation extreme points, and an oscillation direct current component start to be detected. Then an oscillation decay time constant is calculated according to the two oscillation extreme points and the oscillation direct current component. The oscillation damping ratio is calculated through the oscillation decay time constant and the oscillation period. Compared with a conventional fitting method, the conventional fitting method cannot calculate and analyze the oscillation damping ratio in a cast that a complete oscillation waveform is not obtained. The method proposed by the present inventive patent may complete the calculation of the oscillation damping ratio in a case of obtaining 2 pieces of data, so as to accelerate the speed of calculation.

Integrated method for clearance, collection and capture of internal pollutants and algae in a surface layer of the lake bottom

An integrated method for clearance, collection and capture of internal pollutants and algae at the bottom of a lake include the following steps: selecting areas where the pollution level is high, and organic or inorganic particulate matter is prone to accumulation and carrying out trenching operations at the bottom of the lake to form a plurality of traps; and removing the sludge and algae inside the traps and clearing the sediment inside the traps, for subsequent internal pollution control when the surface-layer sludge on both sides of the traps almost fills up the traps. This method makes use of the hydrodynamic disturbances of waves formed by natural wind energy and lake currents to continuously transport sludge with a high pollution level and a small specific gravity and algae in the surface layer of the lake bottom, which are rich in organic debris, to artificially built traps.

BRTCP24 gene useful for controlling growth of cabbage and application thereof

A BrTCP24 gene for controlling the growth of Chinese cabbage and its applications. The BrTCP24 gene has the nucleotide sequence shown in SEQ ID No. 1, the whole length of which is 1221 bp. The gene is useful for improving the production of economic crop. As indicated by experimental results, the gene serves as a controlling gene for plant growth and has the function of down-regulating the plant growth. Through overexpressing the gene, a transgenic plant smaller than the wild one can be obtained. The gene of the invention can provide theory basis and gene source for breeding new varieties of crops.

Method for calculating oscillation damping ratio of power grid

The present invention disclosed a method for calculating an oscillation damping ratio of a power grid, and relates to the field of power system operation and control. When a power system oscillates, an oscillation period, two oscillation extreme points, and an oscillation direct current component start to be detected. Then an oscillation decay time constant is calculated according to the two oscillation extreme points and the oscillation direct current component. The oscillation damping ratio is calculated through the oscillation decay time constant and the oscillation period. Compared with a conventional fitting method, the conventional fitting method cannot calculate and analyze the oscillation damping ratio in a cast that a complete oscillation waveform is not obtained. The method proposed by the present inventive patent may complete the calculation of the oscillation damping ratio in a case of obtaining 2 pieces of data, so as to accelerate the speed of calculation.

Integrated method for clearance, collection and capture of internal pollutants and algae in a surface layer of the lake bottom

An integrated method for clearance, collection and capture of internal pollutants and algae at the bottom of a lake include the following steps: selecting areas where the pollution level is high, and organic or inorganic particulate matter is prone to accumulation and carrying out trenching operations at the bottom of the lake to form a plurality of traps; and removing the sludge and algae inside the traps and clearing the sediment inside the traps, for subsequent internal pollution control when the surface-layer sludge on both sides of the traps almost fills up the traps. This method makes use of the hydrodynamic disturbances of waves formed by natural wind energy and lake currents to continuously transport sludge with a high pollution level and a small specific gravity and algae in the surface layer of the lake bottom, which are rich in organic debris, to artificially built traps.

Self-similar and fractal design for stretchable electronics

The present invention provides electronic circuits, devices and device components including one or more stretchable components, such as stretchable electrical interconnects, electrodes and/or semiconductor components. Stretchability of some of the present systems is achieved via a materials level integration of stretchable metallic or semiconducting structures with soft, elastomeric materials in a configuration allowing for elastic deformations to occur in a repeatable and well-defined way. The stretchable device geometries and hard-soft materials integration approaches of the invention provide a combination of advance electronic function and compliant mechanics supporting a broad range of device applications including sensing, actuation, power storage and communications.