29-10-2014 дата публикации
Номер: CN104118028A
Принадлежит:
The invention relates to the technical field of manufacturing of non-wood based panels in the range of artificial chipboards and fiber boards, in particular to a technology for preparing bagasse low-density environment-friendly flexible boards. The technology comprises the following steps that S1, bagasse is dried, S2, bagasse is crushed and screened, S3, gluing is carried out, S4, board blanks are laid, S5, board blanks are pre-pressed, S6, hot-pressing is carried out, S7, edges are sawn, and S8, thermal refining is carried out. The technology can achieve the purpose of even horizontal density of laying of the board blanks, the deviation of the horizontal density is within 3%, an improved practical low-urea-formaldehyde resin adhesive formula is adopted, and parameters of drying and hot-pressing technologies are improved, so that the low-density flexible boards have demanded physical (mechanical) performance and also can meet the standard that the formaldehyde emission is higher than the ...
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