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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 7. Отображено 7.
27-05-2015 дата публикации

Spraying cooling system for asphalt concrete panel of reservoir

Номер: CN104652438A
Принадлежит:

The invention discloses a spraying cooling system for an asphalt concrete panel of a reservoir. The system comprises a temperature sensor, an electric valve, a spraying pressurizing pump, a spraying pool, a water filter, a spraying ring pipe and irrigating spray heads; the temperature sensor is arranged at the asphalt concrete panel and used for acquiring temperature of the asphalt concrete panel; the spraying pool, the spraying pressurizing pump, the electric valve, the water filter and the spraying ring pipe are sequentially connected; a plurality of irrigating spray heads are respectively arranged on the spraying ring pipe. With the adoption of the system, the problem of slope flowing of the asphalt concrete panel of the reservoir due to high temperature in summer can be solved; the thermal stability of the asphalt concrete panel is improved, and thus the safety of the panel is improved; the irrigating spray heads (for discontinuously spraying water) are adopted to overcome the problem ...

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25-08-2023 дата публикации

Bus control microcircuit integrated module

Номер: CN116647988A
Принадлежит:

The invention discloses a bus control microcircuit integration module which comprises a PCB substrate, a bare chip, a finished product BGA device and a surface-mounted component. A cavity is formed in the PCB substrate, the bare chip is embedded in the cavity of the PCB substrate, pins are arranged on the periphery of the lower surface of the PCB substrate, and the bare chip is in bonding connection with the pins; a plurality of layers of conduction bands are arranged in the PCB substrate, and the pad on the bare chip is connected with the conduction bands on the PCB substrate through a bonding process; and the finished BGA device and the surface-mounted component are welded on the upper surface of the PCB substrate. According to the BGA device, the problems of high integration difficulty, low heat dissipation efficiency and low reliability of a multi-pin and high-power-consumption BGA device and a plurality of large-scale IC chips are effectively solved, small size and high density are ...

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16-05-2023 дата публикации

Airtight high-reliability optical fiber and shell packaging method

Номер: CN116117311A
Принадлежит:

The invention discloses an airtight high-reliability packaging method for an optical fiber and a shell, which is different from the traditional processes of glue sealing, solder melt sealing and the like, performs matching design on materials, processes and structures of the optical fiber and the shell, realizes airtight packaging of the optical fiber and the shell through a six-degree-of-freedom laser melt sealing technology, and performs reliability evaluation. According to the invention, airtight packaging of the optical fiber and other cables and the tube shell can be realized, and the method can be widely applied to airtight high-reliability packaging of products with cables, such as high-quality-grade photoelectric modules. Derived products such as photoelectric modules with high air tightness and reliability have very wide application prospects in the aspects of optical fiber communication, high-speed data transmission and the like.

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07-04-2023 дата публикации

High-precision broadband three-port isolation amplifier based on mixing technology

Номер: CN115940851A
Принадлежит:

The invention discloses a high-precision broadband three-port isolation amplifier based on a mixing technology. The high-precision broadband three-port isolation amplifier is connected with the two ends of primary coils of a power transformer T2 and a power transformer T3 through the output end of an oscillator; two ends of a secondary coil of the power transformer T2 are connected with an input end of an input power supply; two ends of a secondary coil of the power transformer T3 are connected with an input end of an output power supply; the output end of the modulator is connected with the two ends of a primary coil of the signal transformer T1, the input end of the demodulator is connected with the two ends of a secondary coil of the signal transformer T1, the isolation amplifier has a three-port isolation design, input, output and a power source are independent, and isolation of the three ports is completed at the same time; signals and a power supply are completely isolated through ...

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22-08-2023 дата публикации

Over-current protection circuit of brushless direct current motor driver

Номер: CN116632783A
Принадлежит:

The invention provides an overcurrent protection circuit of a brushless direct current motor driver. The overcurrent protection circuit comprises a three-phase power bridge, an overcurrent protection circuit and a high-voltage driving circuit, the overcurrent protection circuit comprises a sampling circuit, an amplification part and a comparison part, one end of the sampling circuit is grounded, the other end of the sampling circuit is connected with a source electrode and the amplification part of the three-phase power bridge, the amplification part is connected with the comparison part, an input end of the comparison part is connected with an SD end of the high-voltage driving circuit, and an output end of the comparison part is connected with the three-phase power bridge; the overcurrent protection circuit has the characteristic of quick response, the response time from current sampling of the sampling resistor to overcurrent response turn-off output can be designed within 15 uS, short-circuit ...

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18-04-2023 дата публикации

Airtight high-thermal-conductivity photoelectric module shell and manufacturing method

Номер: CN115980938A
Принадлежит:

The invention provides an airtight high-heat-conduction photoelectric module shell and a manufacturing method. The airtight high-heat-conduction photoelectric module shell comprises a shell body. The shell body is made of silicon-aluminum alloy; a heat conduction boss is arranged in the shell body and is used for placing a power device and a chip; a plurality of leads are arranged on the two sides of the shell body, and insulators are arranged at the connecting parts of the leads and the shell body; the side wall of the housing body is provided with an optical fiber sealing tail tube. Airtight packaging is achieved through the laser sealing and welding technology, and the method can be widely applied to airtight packaging of products such as high-quality-grade photoelectric modules. The high-silicon aluminum alloy is used as the base material of the shell, so that the shell has the remarkable advantages of light weight, high heat conductivity, high strength, high long-term reliability and ...

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10-06-2015 дата публикации

Optical interconnection substrate applied to spacecraft and military computer and manufacturing method thereof

Номер: CN104698552A
Принадлежит:

The invention discloses an optical interconnection substrate applied to a spacecraft and a military computer and a manufacturing method thereof. The optical interconnection substrate comprises a transmitting component, a receiving component and an LTCC (Low Temperature Co Fired Ceramic) substrate provided with a cavity, the cavity of the LTCC substrate is internally provided with a single side polished silicon wafer, and a polishing surface of the silicon wafer is provided with a composite waveguide; one end of the composite waveguide is provided with a first reflector, and the other end of the composite waveguide is provided with a second reflector; another side of the LTCC substrate is assembled with a VCSEL (Vertical Cavity Surface Emitting Laser) device in the transmitting component and a PD (Potential Difference) device in the receiving component, a first micro-lens array is arranged between the VCSEL device and the first reflector, and a second micro-lens array is arranged between ...

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