25-08-2023 дата публикации
Номер: CN116647988A
Принадлежит:
The invention discloses a bus control microcircuit integration module which comprises a PCB substrate, a bare chip, a finished product BGA device and a surface-mounted component. A cavity is formed in the PCB substrate, the bare chip is embedded in the cavity of the PCB substrate, pins are arranged on the periphery of the lower surface of the PCB substrate, and the bare chip is in bonding connection with the pins; a plurality of layers of conduction bands are arranged in the PCB substrate, and the pad on the bare chip is connected with the conduction bands on the PCB substrate through a bonding process; and the finished BGA device and the surface-mounted component are welded on the upper surface of the PCB substrate. According to the BGA device, the problems of high integration difficulty, low heat dissipation efficiency and low reliability of a multi-pin and high-power-consumption BGA device and a plurality of large-scale IC chips are effectively solved, small size and high density are ...
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