Multiple ingredient black sesame seed paste

Resourceful treatment method of BOE waste liquid

The invention relates to the technical field of water treatment, in particular to a BOE waste liquid resourceful treatment method which is characterized by comprising the following steps: S1, adding a sodium salt solution into BOE waste liquid for reaction to obtain sodium fluosilicate and first waste liquid; s2, adding an aluminum salt solution into the first waste liquid, and adjusting the pH value to 4-7 to obtain cryolite and second waste liquid; s3, a fluorine removal agent and a recapturing agent are added into the second waste liquid, and first waste residues and third waste liquid are obtained; s4, adjusting the pH value of the third waste liquid to 2-4, and carrying out evaporative crystallization to obtain evaporated condensate water and a concentrated solution; s5, the concentrated solution is pumped into a cooling crystallization tank to be cooled, centrifugal separation is conducted, and ammonium salt and final mother liquor are obtained; and S6, returning the third waste liquid ...

Forming method for metal silicide blocking area and method for producing semiconductor device

Recovery device with solid-liquid separation function

The invention relates to the technical field of solid-liquid separation, in particular to a recovery device with a solid-liquid separation function, which comprises a box body shell, the box body shell comprises a box front plate, a box top plate and a box bottom plate, the box front plate is provided with a material input port, and the bottom of the box top plate is fixedly provided with a crushing device; a mechanical device is fixedly connected to the smashing device, the mechanical device is movably connected with the box top plate, an extrusion device is movably installed on the mechanical device, a rotary separation device is fixedly installed on the extrusion device, and the rotary separation device is fixedly connected with the box bottom plate; the recovery device comprises a box front plate and a box bottom plate, two box side plates which are symmetrically arranged are fixedly installed between the box front plate and the box bottom plate, fixing blocks are fixedly connected ...

Vibration-resistant high-strength storage battery terminal, battery cover and storage battery

The vibration-resistant high-strength storage battery terminal comprises a lead sleeve, a shifting plate and a terminal body, and the lead sleeve is in a cylinder shape with an upper opening and a lower opening; the shifting plate is formed by extending from the side wall of the lead sleeve, and the shifting plate and the lead sleeve are integrally formed. The terminal is fixed on the shifting plate, and the terminal and the lead sleeve are arranged in a staggered mode. According to the invention, the size of the joint of the terminal and the pole is increased, the diameter of the pole of the storage battery is increased, the connection area of the pole and the storage battery terminal is increased, and the connection strength is improved.

Method for repairing and etching polysilicon

The invention discloses a method for repairing and etching polysilicon, which belongs to the technical field of microelectronics manufacturing. The method provided by the invention is used for repairing and etching the polysilicon forming a control grid in an EEPROM and is characterized by only adopting a mixed chemical gas of O2 and CF4 for plasma etching. The etching method is a chemical etchingand has a extremely low substrate silicon etching speed, thereby avoiding damaging a pn junction between a source electrode and a substrate and a pn junction between a drain electrode and the substrate and consequently ensuring the reliability of the EEPEOM device and improving the yield of product.

CD driver integrated LED display module

The invention provides a CD-ROM integrated LED display module. The CD-ROM integrated LED display module comprises a substrate, a plastic package body, an RGBC chip and a driving IC. The substrate comprises a substrate front surface and a substrate back surface, the substrate front surface is provided with a metal base island area used for bearing an RGBC chip and a driving IC and a bonding wire area used for bonding, and the substrate back surface is provided with a bonding pad, solder resist ink and direction identification ink; the RGBC chip and the driving IC are fixed on the metal base island area through solid crystal glue or solder paste, the solid crystal glue comprises insulating epoxy glue and conductive silver glue, and the RGBC chip, the bonding wire area and the driving IC are electrically connected with the substrate through metal bonding wires respectively; the plastic package body is made of epoxy resin materials and wraps the front face of the substrate to seal and protect ...