Method for cutting brittle materials by laser and device

The invention relates to a method for cutting brittle materials by laser, comprising the following steps: providing a first laser beam; filtering and shaping the first laser beam into a second laser beam with a predetermined energy density profile by a space filter; modulating and shaping the second laser beam into a third laser beam of elongated light spot shape; and heating the brittle materials by the third laser beam and applying a coolant on the brittle materials to ensure that the brittle materials undergo crack growth along the moving direction of the third laser beam; wherein, the third laser beam is provided with a leading end and a trailing end; the average gradient of the energy density profile of third laser beam at the leading end is less than that at the trailing end. The invention also provides a device adopting the method for cutting brittle materials by laser.

Method for cutting brittle materials by laser and device

The present invention relates to a method for cutting brittle materials by laser, comprising the following steps: providing a first laser beam; filtering and shaping the first laser beam into a second laser beam with a predetermined energy density profile by a space filter; modulating and shaping the second laser beam into a third laser beam of elongated light spot shape; and heating the brittle materials by the third laser beam and applying a coolant on a location of the brittle materials having a predetermined distance from the trailing end of the third laser to ensure that the brittle materials undergo crack growth along the moving direction of the third laser beam; wherein, the third laser beam is provided with a leading end and a trailing end; the average gradient of the energy density profile of third laser beam at the leading end is less than that at the trailing end. The present invention also provides a device adopting the method for cutting brittle materials by laser.

Liquid crystal panel

The invention relates to a liquid crystal panel which comprises a film transistor glass plate, first frame glue and a color light filter glass plate which is positioned on one side of the film transistor glass plate, wherein the film transistor glass plate comprises a plurality of film transistor units which are arrayed along a first direction and a second direction which is different from the first direction in an array shape; and the film transistor units are mutually spaced and respectively comprise a central area and a line area which is positioned on one side of the central area. In any two adjacent film transistor units in the first direction, the line area of one film transistor unit is arranged adjacent to the line area of the other film transistor unit, or the central area of one film transistor unit is arranged adjacent to the central area of the other film transistor unit, and boundaries of the central areas are bonded with the color light filter glass plate through the first ...

Brittle substrate and laser cutting method therefor

The invention relates to a laser cutting method for a brittle substrate, which comprises the following steps that: a brittle substrate is provided; a first cutting line extending along a first direction at the position adjacent to one edge of the brittle substrate is formed by a laser cutting process; an initiate crack starting from the edge and crossing the first cutting line at the position adjacent to the starting end of the first cutting line on the brittle substrate is formed, and the initial crack extends along a second direction different from the first direction; and a second cutting line extending along the second direction is formed along the initial crack on the brittle substrate by the laser cutting process. The invention also provides a brittle substrate manufactured by the method.

Liquid crystal panel

The invention relates to a liquid crystal panel which comprises a film transistor glass plate, first frame glue and a color light filter glass plate which is positioned on one side of the film transistor glass plate, wherein the film transistor glass plate comprises a plurality of film transistor units which are arrayed along a first direction and a second direction which is different from the first direction in an array shape; and the film transistor units are mutually spaced and respectively comprise a central area and a line area which is positioned on one side of the central area. In any two adjacent film transistor units in the first direction, the line area of one film transistor unit is arranged adjacent to the line area of the other film transistor unit, or the central area of onefilm transistor unit is arranged adjacent to the central area of the other film transistor unit, and boundaries of the central areas are bonded with the color light filter glass plate through the first ...

Method for separating fragile material

The invention relates to a method for separating fragile materials, which comprises the steps: providing a fragile material with a cut surface, forming at least one of first cutting lines on the cut surface by a laser cutting process, extending at least one of the first cutting lines in the first direction, forming at least one of second cutting lines on the cut surface with at least one of the first cutting lines by the laser cutting process, extending at least one of the second cutting lines in the second direction which intersects with the first direction, separating the fragile material along at least one of the second cutting lines so as to obtain a plurality of sub-fragile materials, and separating at least one of the sub-fragile materials along at least one of the first cutting lines. The method for separating fragile materials has the advantages of simple process, high splinter yield, and the like through the splinter modes of coplanar bi-directional cutting, cutting after the first ...

Brittle substrate and laser cutting method therefor

The invention relates to a laser cutting method for a brittle substrate, which comprises the following steps that: a brittle substrate is provided; a first cutting line extending along a first direction at the position adjacent to one edge of the brittle substrate is formed by a laser cutting process; an initiate crack starting from the edge and crossing the first cutting line at the position adjacent to the starting end of the first cutting line on the brittle substrate is formed, and the initial crack extends along a second direction different from the first direction; and a second cutting line extending along the second direction is formed along the initial crack on the brittle substrate by the laser cutting process. The invention also provides a brittle substrate manufactured by the method.

Single-chip integrated circuit

The invention relates to a single-chip integrated circuit which comprises a device body. A terminal ring structure wraps the periphery of the device body. A metal electrode is fixed at the bottom end of the device body. The device body comprises a first metal oxide semiconductor field effect tube, a second metal oxide semiconductor field effect tube and a diode, wherein the first metal oxide semiconductor field effect tube and the second metal oxide semiconductor field effect tube are parallel, the diode is integrated in the first metal oxide semiconductor field effect tube or the second metal oxide semiconductor field effect tube, and the first metal oxide semiconductor field effect tube and the second metal oxide semiconductor field effect tube are connected with the metal electrode. By the single-chip integrated circuit, encapsulation cost can be lowered, and circuit stability and reliability can be increased.

Sodium complex fertilizer, uses and employing method thereof

The invention relates to sodium composite fertilizer which can promote the growth of desert plants and increase the drought resistance performance of the desert plants, as well as the application and the fertilizing method thereof. The sodium composite fertilizer is characterized in that the fertilizer consists of the raw materials as follow in weight percent: 0 to 85 percent of sodium nitrate, 0to 22 percent of monobasic sodium phosphate, 0 to 99 percent of sodium silicate, and 0 to 90 percent of sodium chloride. The application of sodium composite fertilizer is that the sodium composite fertilizer can be directly fertilized in plants grown in desert areas or can be used for seeding the desert plants or can be used in the sand cultivation or water cultivation of the desert plants. The sodium composite fertilizer has the fertilizing method that the sodium composite fertilizer is fertilized into the desert soil with 6 kg to 60 kg for one acre, or 0.2 to 3 g of fertilizer is directly fertilized ...

Laser cutting method

The invention relates to a laser cutting method, including the following steps: a laser beam is utilized for irradiating an object to be processed along a first direction so as to form a first heating region on the object be to processed; the first heating region is cooled so as to result in the object to be processed to generate a first crackle along the first direction, and the first crackle is provided with a first depth; the laser beam is utilized for irradiating the object to be processed along a second direction which is crossed with the first direction so as to form a second heating region on the object to be processed; and the second heating region is cooled so as to result in the object to process to generate a second crackle along the second direction, the second crackle is provided with a second depth, and the second depth is larger than the first depth.

Laser cutting device and laser cutting method

The invention relates to a laser cutting device which comprises a laser generating unit, a cooling nozzle, a first image pick-up unit, a second image pick-up unit and an image processing unit. The laser generating unit is used for generating a laser beam. The cooling nozzle is used for generating a cooling medium. The first image pick-up unit comprises a first light source and a first image sensor, and the second image pick-up unit comprises a second light source and a second image sensor. The first light source and the second light source can selectively emit light beams, the light beams emitted by the first light source and the second light source are respectively irradiated on a blind crack from both opposite sides of the blind crack, and the first image sensor and the second image sensor are used for correspondingly sensing the light beams emitted by the first light source or the second light source and reflected on the blind crack to obtain the image of the blind crack. The imageprocessing ...

Sodium complex fertilizer, uses and employing method thereof

Continuous vibration control method for structural member and controller thereof

The invention provides a continuous vibration control method for a construction, concretely connecting a strip mass block with multiple springs and dampings and continuously arranging them on the construction so as to make vibration control on the construction. And the invention also provides a continuous vibration controller with a structure: adopting a mass block, where the side of the mass block is at least equipped with two staggered elastic damping components spaced uniformly, and the other end of the elastic damping component is connected with the construction; the bottom of the mass block is at least equipped with two pairs of trolleys or rollers or stacked rubbers, which actively contact with the bottom surface of the construction. As compared with the existing TMD and MTMD controllers, it has wider vibration control range, more controlled vibration types, better integrity, better working harmony, better effect, able to maximumly protect the construction, and having a simple structure ...