09-07-2014 дата публикации
Номер: CN103909147A
Принадлежит:
The invention relates to a precise wire clamp plastic dipping technique. The precise wire clamp plastic dipping technique includes that: stamping through a stamping die to obtain a metal body of a processing wire clamp, placing the metal body in plastic dipping liquid to carry out hot plastic dipping technique, coating an insulated buffer layer at the surface layer of the middle of the metal body, and bending the metal body to form the product. Compared with the prior art, the precision of the precise wire clamp plastic dipping technique is higher, to be specific, the precise plastic insulated layer can be less than 0.2 millimeters; the diameter of a wire cover hole can be smaller, and in addition, the use range is broader, the lower limiting value which can be realized through a wire clamp hole is reduced, it means that the wire harness fixing range is expanded, the wire clamp can adapt to different wire harnesses with small diameters, and moreover, the size is stable, the reject ratio ...
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