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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 37438. Отображено 100.
05-01-2012 дата публикации

Hybrid laser arc welding process and apparatus

Номер: US20120000892A1
Принадлежит: General Electric Co

A welding method and apparatus for welding workpieces together by conducting a laser beam welding process on a joint region that includes a weld seam defined by and between faying surfaces of the workpieces, and then conducting a hybrid laser arc welding process on the joint region. The laser beam welding process entails causing a first laser beam to travel along the joint region, penetrate the weld seam and form a weldment. The hybrid laser arc welding process remelts the weldment by simultaneously causing an electric arc and a second laser beam to overlap and travel along the joint region and form a weld pool in the weldment. On cooling, a weld joint is formed within the joint region and its weld seam.

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05-01-2012 дата публикации

MPO Type Connector with Reduced Off-Center Loading

Номер: US20120002926A1
Автор: Joel D. Kwasny
Принадлежит: Panduit Corp

This application describes an MPO type connector with an internal assembly having a pin clamp, ferrule, and fiber array. The pin clamp that has a pair of contact surfaces abutting the ferrule. The contact surfaces are located along the mid-point of the height of the ferrule on either side of and proximate to the fiber array.

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05-01-2012 дата публикации

High Throughput Solar Cell Ablation System

Номер: US20120003788A1
Принадлежит: Individual

A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

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28-02-2017 дата публикации

Установка для лазерной обработки кольцевым пучком

Номер: RU0000168922U1

Полезная модель относится к оборудованию для лазерной обработки и может быть использована для изготовления шайб из тугоплавких металлических или изоляционных неметаллических пластин.Техническим результатом полезной модели, совпадающим с задачей, на решение которой она направлена, является повышение производительности установки для лазерной обработки при изготовлении шайб.Технический результат достигается тем, что в установке для лазерной обработки кольцевым пучком, содержащей лазер и расположенные на оси лазерного пучка телескопический преобразователь диаметра лазерного пучка, состоящий из отрицательной линзы и положительной линзы, коническую линзу и фокусирующую линзу, коническая линза выполнена монолитной, состоящей из конуса с углом при его основании, рассчитываемом по уравнению, связывающему фокусное расстояние фокусирующей линзы, показатель преломления материала конической линзы и внутренний диаметр получаемой в результате обработки шайбы, и усеченного конуса с углом при его большем основании, рассчитываемом по уравнению, связывающему фокусное расстояние фокусирующей линзы, показатель преломления материала конической линзы и внешний диаметр получаемой в результате обработки шайбы, радиус меньшего основания усеченного конуса равен радиусу основания конуса, радиус большего основания усеченного конуса выполняют не менее радиуса пучка лазерного излучения после телескопического преобразователя, который рассчитывают по формуле, связывающей радиус конуса, внешний и внутренний диаметр получаемой шайбы. 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 168 922 U1 (51) МПК B23K 26/00 (2014.01) B23K 26/064 (2014.01) B23K 26/073 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ФОРМУЛА ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21)(22) Заявка: 2016125274, 24.06.2016 (24) Дата начала отсчета срока действия патента: 24.06.2016 (72) Автор(ы): Коваленко Александр Фёдорович (RU) Дата регистрации: 28.02.2017 Приоритет(ы): (22) Дата подачи заявки: 24.06.2016 ...

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24-03-2017 дата публикации

Герметичный корпус

Номер: RU0000169601U1

Полезная модель представляет собой герметичный корпус и может быть использована при изготовлении герметичного ввода лазерного излучения в рабочий объем технологических установок, осуществляющих обработку материалов в вакууме или в среде инертных газов. Стенка герметичного корпуса через прокладку с двухсторонней отбортовкой, выполненную из титана, с обеих сторон которой расположена алюминиевая фольга, соединена по всему периметру с входным окном. Окно выполнено из прозрачного в заданном оптическом диапазоне материала и имеет конусоцилиндросферическую форму, коническая поверхность входного окна обращена навстречу лазерному пучку, а сферическая поверхность - внутрь герметичного корпуса. Техническим результатом является расширение функциональных возможностей корпуса за счет фокусировки лазерного излучения в кольцо. 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 169 601 U1 (51) МПК B23K 26/067 (2006.01) H01J 17/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ФОРМУЛА ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21)(22) Заявка: 2016120886, 27.05.2016 (24) Дата начала отсчета срока действия патента: 27.05.2016 24.03.2017 Приоритет(ы): (22) Дата подачи заявки: 27.05.2016 Адрес для переписки: 101000, Москва, Моспочтамт, а/я 918, ФГУП "ВНИИА", начальнику отдела 36, С.В. Жмайло (56) Список документов, цитированных в отчете о поиске: RU156784U1, 20.11.2015. RU119935U1, 27.08.2012. RU156783U1, 20.11.2015. RU155777U1, 20.10.2015. 1 6 9 6 0 1 (45) Опубликовано: 24.03.2017 Бюл. № 9 (73) Патентообладатель(и): Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА") (RU) R U Дата регистрации: (72) Автор(ы): Вышинский Павел Николаевич (RU), Коваленко Александр Фёдорович (RU), Федорищев Олег Николаевич (RU), Осипов Геннадий Станиславович (RU) 1 6 9 6 0 1 R U (57) Формула полезной модели Герметичный корпус с входным окном для ввода лазерного излучения в установку для обработки ...

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11-10-2017 дата публикации

Устройство одновременного сканирования двумя лазерными пучками

Номер: RU0000174390U1

Устройство одновременного сканирования двумя лазерными пучками включает в себя два механических сканирующих устройства, которые установлены рядом так, чтобы области сканирования каждого полностью перекрывали ростовую зону установки. Оба сканирующих устройства оснащены вариофокальными объективами, фокусирующими лазерные пучки на всей плоскости ростовой зоны. Технический результат заключается в расширении технологических возможностей обработки и изготовления деталей при обеспечении их высокого качества и точности обработки за счет обеспечения полного перекрытия рабочей зоны. 3 з.п. ф-лы. Ц 1 174390 ко РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) (2 за зао 0 (51) МПК В23К 26/08 (2014.01) СО2В 26/10 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21)(22) Заявка: 2016144179, 10.11.2016 (24) Дата начала отсчета срока действия патента: 10.11.2016 Дата регистрации: 11.10.2017 Приоритет(ы): (22) Дата подачи заявки: 10.11.2016 (45) Опубликовано: 11.10.2017 Бюл. № 29 Адрес для переписки: 197046, Санкт-Петербург, пр-кт Каменноостровский, 1-3, пом. 30, ООО "Юридическая фирма Городисский и Партнеры" (72) Автор(ы): Орлов Андрей Евгеньевич (КО), Смоленцев Сергей Сергеевич (КО), Тимофеев Владимир Андреевич (КО), Ксенофонтов Алексей Олегович (КП) (73) Патентообладатель(и): Российская Федерация в лице Министерства промышленности и торговли Российской Федерации (Минпромторг России) (КП) (56) Список документов, цитированных в отчете о поиске: У\О 2016128287 А1, 18.08.2016. ГР 2001075039 А, 23.03.2001. 0$ 20040129685 АТ, 08.07.2004. \УО 2013061587 А1, 02.05.2013. (54) УСТРОЙСТВО ОДНОВРЕМЕННОГО СКАНИРОВАНИЯ ДВУМЯ ЛАЗЕРНЫМИ ПУЧКАМИ (57) Реферат: Устройство одновременного сканирования двумя лазерными пучками включает в себя два механических сканирующих устройства, которые установлены рядом так, чтобы области сканирования каждого полностью перекрывали ростовую зону установки. Оба сканирующих устройства оснащены вариофокальными объективами, фокусирующими ...

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31-07-2019 дата публикации

Лазерная оптическая головка

Номер: RU0000191258U1

Полезная модель относится к области обработки материалов лазерным лучом, а именно к процессам лазерной сварки, резки, сверления отверстий. При выполнении технологического режима - лазерной резки или сверлении отверстий движение внутреннего подвижного корпуса (3) с внутренним соплом (4) вниз осуществляется ручным штурвалом (5). При выполнении технологического режима - лазерной резки или сверлении отверстий движение внутреннего подвижного корпуса (3) с внутренним соплом (4) вверх происходит аналогичным образом. Перемещение осуществляется по рейке (13), установленной на внутреннем подвижном корпусе (3), где шестерня (12) закреплена на валу (10). Длина хода рейки (13) достигает до 10±0,025 мм, которая получена опытным путем. Для обеспечения резки или сверления отверстий металлов толщиной от 1 мм до 20 мм длина хода рейки (13) равна 5÷10 мм, при этом расстояние между срезом внутреннего сопла (4) и зоной обработки равно диаметру съемной насадки (17) 0,2±0,02 мм. Для обеспечения резки металлов толщиной от 20 мм до 40 мм длина хода рейки (13) равной 1÷5 мм, при этом расстояние между срезом внутреннего сопла 4 и зоной обработки равно диаметру съемной насадки (17) 0,5±0,02 мм. Для обеспечения сварки металлов толщиной от 1 мм до 20 мм расстояние между срезом внутреннего сопла (4) и зоной сварки равно двойному диаметру съемной насадки (17) 0,4±0,02 мм. Уменьшая или увеличивая размер фокусного пятна можно добиться высокого качества обрабатываемых деталей, выполненных резкой, сверлением отверстий или сваркой. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 191 258 U1 (51) МПК B23K 26/14 (2014.01) B23K 26/064 (2014.01) B23K 26/70 (2014.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B23K 26/14 (2019.05); B23K 26/064 (2019.05); B23K 26/70 (2019.05) (21)(22) Заявка: 2019113412, 29.04.2019 (24) Дата начала отсчета срока действия патента: 31.07.2019 Приоритет(ы): (22) Дата подачи заявки: 29.04.2019 (45) Опубликовано: 31.07.2019 Бюл. № ...

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19-01-2012 дата публикации

Method for Cutting C-Mn Steel with a Fiber Laser

Номер: US20120012570A1

The invention relates to a laser cutting method for cutting a C—Mn steel workpiece, characterized in that laser beam generation means comprising at least one silica fiber with an ytterbium-doped core is used to generate the laser beam. Preferably, the ytterbium-based fiber has a wavelength between 1.07 and 1.1 μ m, preferably 1.07 μ m, the quality factor of the laser beam is between 0.33 and 8 mm.mrad, and the laser beam has a power of between 0.1 and 25 kW. The assistance gas for the laser beam is chosen from nitrogen, helium, argon, oxygen, CO 2 and mixtures thereof, and, optionally, it further contains one or more additional compounds chosen from H 2 and CH 4 .

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19-01-2012 дата публикации

Automated beam marker

Номер: US20120013661A1
Автор: James M. Smelser
Принадлежит: Individual

A beam marking system is disclosed for marking on beams with a marking device. The beam marking system includes a beam marking device configured to mark on the surface of a beam. A movable arm is coupled to the marking device. The movable arm has at least three movable components that collectively move the beam marking device along or about at least three axes. A controller is in electronic communication with the movable arm and the marking device. The controller controlling the movement of the at least three movable components of the movable arm and controlling the operation of the marking device. In some instances, the beam marking system can automatically mark beams, such as metal beams used in heavy construction projects in a rapid and accurate manner.

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26-01-2012 дата публикации

Optical device and laser beam machining apparatus having optical device

Номер: US20120018412A1
Автор: Yusaku Ito
Принадлежит: Disco Corp

An optical device includes: a beam splitter by which a laser beam oscillated from an oscillator is branched into a first branch beam going ahead through transmission and a second branch beam going ahead through reflection; a first mirror by which the first branch beam going out of the beam splitter is reflected to go again toward the beam splitter; a second mirror by which the second branch beam going out of the beam splitter is reflected to go again toward the beam splitter; and a circular disk-like rotating unit for integrally rotating the first mirror and a second mirror, with a laser beam branch point in the beam splitter as a center of rotation.

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23-02-2012 дата публикации

Laser processing method and laser processing apparatus

Номер: US20120043474A1
Принадлежит: Qmc Co Ltd

The present disclosure relates to laser processing and a laser processing apparatus for processing materials using laser. Processing performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer.

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01-03-2012 дата публикации

Apparatus and method for laser scribing

Номер: US20120052605A1
Автор: Yu Sung JANG
Принадлежит: JANG Yu Sung

Provided is an apparatus for laser scribing. The laser scribing apparatus may include: a first laser emitter to emit a laser for a thickness measurement while moving towards a first axial direction of a substrate where a plurality of light emitting devices is formed; a laser receiver to receive a reflected laser when the laser emitted from the first laser emitter is reflected from the substrate; a thickness measurement unit to measure a thickness of the substrate based on a strength of the leaser received by the laser receiver; and a second laser emitter to generate a scribing line on the substrate by emitting a laser towards a first axial direction and a second axial direction of the substrate while adjusting a laser emission location based on the measured thickness.

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22-03-2012 дата публикации

A method and a device for the electrical treatment of a plurality of containers

Номер: US20120067639A1
Принадлежит: LONZA COLOGNE GMBH

The invention relates to a method for the application of at least one voltage pulse to at least two containers fitted with electrodes, by means of which at least one voltage pulse is applied to at least one container, while at least one other container is subjected to a preparation or a post-processing. According to the invention the method comprises mutual exchange of the respective positions of the container to which a voltage pulse has already been applied and the further container. Furthermore, the invention relates to a device ( 1 ) for making electrical contact with at least one container fitted with electrodes, with at least one receptacle ( 3, 7 ) upon which at least one container can be set, and with at least one contact appliance ( 8 ) for making contact with the electrodes of the container. According to the invention at least two receptacles ( 3, 7 ) are provided, wherein one receptacle ( 7 ) is located at or inside the contact appliance ( 8 ), and wherein both receptacles ( 3, 7 ) and/or the contact appliance ( 8 ) can be moved such that after completion of the movement the other receptacle ( 3 ) is located at or inside the contact appliance ( 8 ).

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22-03-2012 дата публикации

Laser irradiation apparatus, laser irradiation method, fabrication method for thin film semiconductor device and fabrication method for display apparatus

Номер: US20120067856A1
Принадлежит: Sony Corp

A laser irradiation apparatus, including: an optical system configured to form laser light of a linear cross section to be irradiated on an irradiation object; and a cutting member having a light blocking portion configured to block the laser light formed in the linear cross section by the optical system to cut the laser light so as to have a predetermined length along a line longitudinal direction; the light blocking portion having a plurality of fins provided on the light blocking portion thereof so as to fetch and absorb the laser light.

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22-03-2012 дата публикации

Defect correcting apparatus and defect correcting method

Номер: US20120071056A1
Принадлежит: Sony Corp

The present disclosure provides a defect correcting apparatus including a defect detecting device configured to detect a defect within a repetitive pattern in a multilayer substrate a defect correcting device configured to correct the defect in the multilayer substrate by a specified defect correcting method, and a control device configured to, when the defect detected by the defect detecting device is detected overlapping a region in which occurrence of an interlayer short-circuit defect is assumed, generate an object corresponding to the defect correcting method for the interlayer short-circuit defect, and controlling the defect correcting device for correcting the defect using the generated object.

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12-04-2012 дата публикации

Device for simultaneously processing the circumference of a workpiece with laser beams

Номер: US20120085740A1
Принадлежит: JENOPTIK Automatisierungstechnik GmbH

A device for simultaneously processing a circumference of a workpiece includes a plurality of laser-lens modules and a waveguide. The modules each include a diode laser and a lens system and is configured to emit a laser beam radially in a shared radiation plane. The waveguide includes a lower part and an upper part that together form a cavity enclosing the radiation plane. The laser-lens modules are configured so that the laser is reflected repeatedly between a bottom surface and a cover surface and propagates in an unaffected manner within the radiation plane so as to form a beam spot that strikes the workpiece with a homogeneous energy distribution. The beam spot has a height based on a distance between the surfaces and a width based on a divergence angle in the radiation plane and a distance of the module from the workpiece surface.

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12-04-2012 дата публикации

Method of detecting pattern formed on non-exposed surface of workpiece

Номер: US20120086797A1
Автор: Kenji Furuta
Принадлежит: Disco Corp

A method of detecting an object of detection formed in the inside of or on a non-exposed surface of a workpiece having a rugged exposed surface, the detection being made on the exposed surface side of the workpiece by use of an imaging unit. The detecting method includes: a flattening step of coating the exposed surface of the workpiece with a liquid resin transmissive to the wavelength of light to be detected by the imaging unit so as to flatten the exposed surface of the workpiece; and a detecting step of detecting the object of detection formed in the inside of or on the non-exposed surface of the workpiece by use of the imaging unit on the exposed surface side of the workpiece coated with the liquid resin, after the flattening step.

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12-04-2012 дата публикации

Container with a plurality of reaction spaces and electrodes

Номер: US20120087841A1
Принадлежит: LONZA COLOGNE GMBH

The invention relates to a container ( 1 ) with at least three reaction spaces ( 2 ) which in each case have at least one electrode pair for applying an electric voltage for generating an electric field within the reaction space ( 2 ) and which are arranged geometrically in at least one row and/or electrically connected in at least one row, wherein at least one electrode ( 3, 4 ) of a reaction space ( 2 ) is a common electrode ( 3, 4 ) with at least one other reaction space ( 2 ). According to the invention n+x electrodes ( 3, 4, 5 ) are provided, wherein n is the number of reaction spaces ( 2 ), with n≧3 and x is the number of rows, with x≧1.

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19-04-2012 дата публикации

Optical channel tap assembly

Номер: US20120093459A1
Принадлежит: Hewlett Packard Development Co LP

An optical channel tap assembly comprises a first N by M waveguide array including a first set of optical channels to convey optical signals along a first set of conveyance paths. The optical channel tap assembly also comprises a second N by M waveguide array including a second set of optical channels to convey the optical signals along a second set of conveyance paths, the optical signals received from the first set of conveyance paths. Additionally, the optical channel tap assembly comprises a beam splitter, disposed between the first N by M waveguide array and the second N by M waveguide array, to divert a first portion of power from the optical signals away from the second N by M waveguide array while allowing a second portion of power from the optical signals to propagate into the second N by M waveguide array.

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19-04-2012 дата публикации

Niobium based superconducting radio frequency(scrf) cavities comprising niobium components joined by laser welding, method and apparatus for manufacturing such cavities

Номер: US20120094839A1
Принадлежит: India Atomic Energy Department of

Niobium or its alloy based Superconducting Radio Frequency (SCRF) Cavities involving atleast one laser beam welded components in the SCRF cavity welded from inside surface of the wall of cavity directed to achieving more than half the thickness to full depth penetration with minimum HAZ, minimizing distortion and shrinkage. The method ensures improved weld quality and surface finish substantially free of any weld defects. Also disclosed is the welding nozzle system and welding rigs adapted to facilitate such laser welding of the Niobium or its alloy based Superconducting Radio Frequency (SCRF) Cavities. The invention is thus directed to enhancing productivity, ensuring consistent quality and reliability, enhanced weld penetration with minimum HAZ, smooth finish of weld joints at possible reduced costs.

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17-05-2012 дата публикации

3d optoelectronic packaging

Номер: US20120120978A1
Принадлежит: International Business Machines Corp

An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board.

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31-05-2012 дата публикации

Orthogonal integrated cleaving device

Номер: US20120132628A1
Принадлежит: Electro Scientific Industries Inc

An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.

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07-06-2012 дата публикации

Holding arrangement for an optical element

Номер: US20120140341A1

A holding arrangement for an optical element includes a basic structure surrounding an optical element and a mounting device by which the optical element can be supported on the basic structure with two degrees of freedom for a rotational movement about an optical axis and a translational movement along a first axis which extends perpendicularly to the optical axis and intersects the optical axis in a center. The mounting device includes four joint locations arranged point-symmetrically with respect to the center and at least one parallel rocker which is displaceable parallel to the first axis. A manipulator unit includes a holding arrangement.

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07-06-2012 дата публикации

Optical communication module

Номер: US20120141143A1

It is expected to provide an optical communication module that does not require making a conductive plate, such as a leadframe, become thinner in response to the downsizing of the photoelectric conversion device, such as a laser diode or a photodiode, and does not require downsizing a lens. A laser diode is connected and fixed to a conductive plate on the top surface of a transparent light-passing board. The light-passing board is connected and fixed to a conductive plate on the top surface of a transparent base. A first lens and a second lens are integrally formed on the top and the bottom surfaces of the base, respectively. The laser diode performs transmission of optical signals through the gap of conductive plate, the transparent light-passing board, the opening portion of a conductive plate, the opening portion of conductive plate, the first lens, the transparent base and the second lens.

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14-06-2012 дата публикации

On-The-Fly Manipulation Of Spot Size And Cutting Speed For Real-Time Control Of Trench Depth And Width In Laser Operations

Номер: US20120145686A1
Принадлежит: Electro Scientific Industries Inc

Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.

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19-07-2012 дата публикации

Method and System for Mitigation of Particulate Inclusions in Optical Materials

Номер: US20120180527A1

A method of fabricating an optical material includes providing input materials having a material softening temperature, melting the input materials, and flowing the melted input materials into a laser inclusion mitigation system. The melted input materials comprise one or more inclusions. The method also includes irradiating the input materials using a laser beam, fragmenting the one or more inclusions in response to the irradiating, and reducing a temperature of the input materials to less than the material softening temperature. The method further includes forming an optical material and annealing the optical material.

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26-07-2012 дата публикации

Laser engraver capable of automatic defocusing

Номер: US20120187097A1
Автор: Jang-Yie WU, Po-Hung Lin
Принадлежит: Great Computer Corp

A laser engraver capable of automatic defocusing is provided, which includes a control end and a device end. The control end includes a data processing module, in which the data processing module is used for a user to set a defocusing distance and select a processing mode by a user, so as to define and set parameters, and form an operation signal. The device end includes a control module and a laser output module, in which the control module is used for receiving the operation signal and controlling the laser output module to change a focal distance according to the operation signal, so as to form the automatic defocusing.

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26-07-2012 дата публикации

Multi-laser transmitter optical subassembly

Номер: US20120189323A1
Автор: Bernd Huebner, Xiaojie Xu
Принадлежит: Finisar Corp

Multi-laser transmitter optical subassembly (TOSAs) for an optoelectronic module. In one example embodiment, a method of fabricating a multi-laser TOSA includes various acts. First, first and second optical signals are transmitted from first and second lasers, respectively. Next, the angle of a first minor actively adjusted to reflect the first optical signal toward a first filter that reflects the first optical signal and transmits the second optical signal such that the first and second optical signals are aligned and combined.

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09-08-2012 дата публикации

Method and apparatus for forming the separating lines of a photovoltaic module with series-connected cells

Номер: US20120202313A1
Автор: Walter Psyk
Принадлежит: SCHOTT SOLAR AG

For forming the separating lines, ( 5, 6, 7 ) which are produced in the functional layers ( 2, 3, 4 ) deposited on a transparent substrate ( 1 ) during manufacture of a photovoltaic module with series-connected cells (C 1 , C 2 , . . . ), there are used laser scanners ( 8 ) whose laser beam ( 14 ) produces in the field ( 17 ) scanned thereby a plurality of adjacent separating line sections ( 18 ) in the functional layer ( 2, 3, 4 ). The laser scanners ( 8 ) are then moved relative to the coated substrate ( 1 ) in the direction (Y) of the separating lines ( 5, 6, 7 ) by a distance corresponding at the most to the length (L) of the scanned field ( 17 ) to thereby form continuous separating lines ( 5, 6, 7 ) through mutually flush separating line sections ( 18 ).

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16-08-2012 дата публикации

Scanned laser light source

Номер: US20120205347A1
Принадлежит: Applied Materials Inc

The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

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16-08-2012 дата публикации

Method and device for welding parts with spot contact or short line contact in the joining region and joining device

Номер: US20120205350A1
Автор: Uwe Stadtmueller
Принадлежит: Individual

Parts are welded by way of a laser beam, wherein the parts are oriented and fixed relative to each other, a laser beam is introduced into an upper part from above and centered relative to a joint point and fuses only the inner region directly above the joint point, while the upper part and the lower part are pressed against each other and therefore move toward one another, wherein the fused region of the upper part penetrates the material of the particular lower part, which has likewise fused in the meantime. Laser welding makes it possible to weld the parts so as to form products having nearly any type of geometry with much less effort than with resistance welding or capacitor discharge welding. The welding device needs only hold and fix the parts to be welded, and apply the slight surface pressure required.

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16-08-2012 дата публикации

Laser machining apparatus with switchable laser system and laser machining method

Номер: US20120205356A1
Автор: Christoph Plüss
Принадлежит: Individual

A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.

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23-08-2012 дата публикации

Optical receiving device and communication system

Номер: US20120213528A1
Принадлежит: Fujitsu Ltd

An optical receiving device includes multiple input ports to which light is input; multiple amplifiers that are arrayed and provided corresponding to the input ports, respectively, each of the amplifiers amplifying and outputting light input from a corresponding input port among of the input ports; a photo diode that converts light into an electrical signal; and a lens that inputs to the photo diode light output from the amplifiers.

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30-08-2012 дата публикации

Laser processing method and apparatus

Номер: US20120219031A1
Автор: Tadashi TOKIWA
Принадлежит: NHK Spring Co Ltd

A laser processing method processes spots on an object in a scan area with a laser beam emitted from a laser emitter. The method includes steps of covering the scan area in such a way as to transmit the laser beam and define a closed space over the scan area, jetting an inert gas into the closed space so that the jetted inert gas forms a gas curtain sweeping along the scan area in the closed space, and discharging the inert gas from the closed space while maintaining a positive pressure in the closed space, thereby removing plumes from the spots processed with the laser beam and preventing the spots from oxidizing. The method is capable of stably laser-processing the object without changing the color of the processed spots.

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06-09-2012 дата публикации

Laser processing method and laser processing device

Номер: US20120223061A1
Принадлежит: Aisin Seiki Co Ltd

A laser processing method for forming a modification region serving as a starting point of cutting inside a member to be cut along a planned cutting line by relatively moving an optical axis of a condenser lens along the planned cutting line of the member and by irradiating the member with focused laser light, wherein a plurality of cross-sectional focused spots is simultaneously formed on a section which is perpendicular to the optical axis of the condenser lens at positions having a predetermined depth from a surface of the member and which is parallel to the surface and, at that time, at least one cross-sectional focused spot of the plurality of cross-sectional focused spots is formed on a projection line of the planned cutting line onto the cross section to form one or more inside modification regions having a desired shape.

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06-09-2012 дата публикации

Annealing method and annealing apparatus

Номер: US20120225568A1
Принадлежит: Tokyo Electron Ltd

An annealing method irradiates a target object, having a film formed on its surface, with a laser beam to perform an annealing process to the target object. The surface of the target object is irradiated with the laser beam obliquely at an incident angle that is determined to achieve an improved laser absorptance of the film.

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27-09-2012 дата публикации

Wafer dividing method

Номер: US20120244682A1
Автор: Kei Tanaka
Принадлежит: Disco Corp

In a wafer dividing method, a wafer is held by a chuck table of a laser beam processing apparatus. A modified layer is formed by radiating a laser beam having a wavelength that transmits the laser beam through the wafer, while adjusting the beam convergence point to a position inside of the wafer, so as to form a pair of modified layers the interval of which is greater than the width of a cutting edge of a cutting blade and smaller than the width of planned dividing lines, on the back side of the wafer at both sides of each of the planned dividing lines. The wafer is adhered to a dicing tape and divided into individual devices by cutting along the dividing lines.

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18-10-2012 дата публикации

Method for Printing a Substrate Using an Anilox Roll, an Anilox Roll for a Printing Method and a Printing Apparatus

Номер: US20120260812A1
Принадлежит: Apex Europe BV

The invention relates to an anilox roll for a printing apparatus. The anilox roll comprises a cylinder having a surface. The surface comprises a fluid distribution structure for receiving, distributing and transferring a fluid such as an ink. The fluid distribution structure comprises a channel formed in the surface having channel walls. This channel is arranged for distributing the fluid over the fluid distribution structure. The channel comprises channel parts, wherein the courses of connected channel parts are at an angle with respect to each other for preventing a linear distribution of the fluids to be received in a course direction of the channel, allowing a meandering distribution of the fluid to be received in the channel. Side walls of the channel are arranged for allowing a meandering flow of the fluid throughout the fluid distribution surface.

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18-10-2012 дата публикации

Method and Apparatus for Forming an Anilox Roll

Номер: US20120261394A1
Принадлежит: Apex Europe BV

The invention relates to a method and apparatus for forming an anilox roll. The method includes supplying a cylinder of the anilox roll that has an outer surface to be tooled, supplying at least a laser source and laser engraving the outer surface of the anilox roll with a laser spot that is formed by a laser source for obtaining a tooled anilox roll, and applying an optical guide in the light path of the laser for enabling the laser spot to move reciprocally on the outer surface to be tooled.

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18-10-2012 дата публикации

Annealing apparatus using two wavelengths of continuous wave laser radiation

Номер: US20120261395A1
Принадлежит: Individual

A thermal processing apparatus and method in which a first laser source, for example, a CO 2 emitting at 10.6 μm is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO 2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

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18-10-2012 дата публикации

Monolithic Optical Coupling Module Based On Total Internal Reflection Surfaces

Номер: US20120261559A1
Принадлежит: SiFotonics Technologies USA Inc

A low-cost monolithic optical module for splitting one or more input optical beams to two or more output optical beams is provided. The one or more input optical beams are reflected by two or more total internal reflection (TIR) surfaces of the monolithic optical module. A light splitting ratio between the two or more output optical beams is predetermined by one or more physical features of the two or more TIR surfaces.

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01-11-2012 дата публикации

Laser match honing system and method

Номер: US20120273471A1
Принадлежит: ROBERT BOSCH GMBH

A laser match honing system and method are provided for processing one of a pair of mechanically matching components ( 1, 2 ) having matching portions ( 12, 22, 16, 26 ) that will be fitted with each other. A dimension of the matching portion ( 12, 16 ) of the first component ( 1 ) is measured and is then used for calculating the desired dimension of the corresponding matching portion ( 22, 26 ) of the second component ( 2 ). An actual dimension of the matching portion ( 22, 26 ) of the second component ( 2 ) is also measured. Then, the matching portion ( 22, 26 ) of the second component ( 2 ) is honed by laser beam in the condition that the actual dimension is not equal to the desired dimension.

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01-11-2012 дата публикации

Laser processing systems and methods for beam dithering and skiving

Номер: US20120273472A1
Принадлежит: Electro Scientific Industries Inc

A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

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29-11-2012 дата публикации

Printing Method With a Printing Apparatus Provided With an Anilox Roll

Номер: US20120298002A1
Принадлежит: Apex Europe BV

A printing apparatus has a printing device having a supply for a substrate to be printed and a supply for ink. The printing device has a printing roll with an image and an anilox roll mounted in a bearing. The anilox roll comprising a cylinder having a surface with a fluid distribution structure for receiving the fluid. The fluid distribution structure has a channel formed in the surface for distributing the fluid over the fluid distribution structure. The channel having a course and opposite channel walls positioned next to each other in a relative parallel oscillating fashion. Printing in a first operational mode, heavy layers of ink on said substrate with relatively large fluid droplets and Printing in a second operational mode, details on said substrate with relatively small fluid droplets.

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29-11-2012 дата публикации

Apparatus and method for repair of defects in an electronic energy control or display device

Номер: US20120302122A1
Принадлежит: Sage Electrochromics Inc

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

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06-12-2012 дата публикации

Assembly for Precision Datum Alignment and Method of Use

Номер: US20120305807A1
Принадлежит: US Conec Ltd

A calibration assembly has a base and mounting elements to mount the base to a laser. The base has a front, middle and rear portions that are used to align the calibration assembly to the laser to cleave optical fibers with the laser. The front portion has a channel to receive the optical fibers, the middle portion has openings to confirm alignment of the laser; and the rear portion has a rear opening used to adjust the pitch and roll of the laser.

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06-12-2012 дата публикации

Pulsed light generation method

Номер: US20120307850A1
Принадлежит: Sumitomo Electric Industries Ltd

The present invention relates to a method of enabling generation of pulsed lights each having a narrow pulse width and high effective pulse energys. A pulse light source has a MOPA structure, and comprises a single semiconductor laser, a bandpass filter and an optical fiber amplifier. The single semiconductor laser outputs two or more pulsed lights separated by a predetermined interval, for each period given according to a predetermined repetition frequency. The bandpass filter attenuates one of the shorter wavelength side and the longer wavelength side, in the wavelength band of input pulsed lights.

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20-12-2012 дата публикации

Optical measuring device for monitoring a joint seam, joining head and laser welding head with same

Номер: US20120318775A1
Автор: Joachim Schwarz
Принадлежит: Precitec KG

An optical measuring device for monitoring a joint seam, joining head and laser welding head. The optical measuring device monitors a joining region in a workpiece and has at least one light-section device with a first light source for casting a light fan in the direction of the workpiece to be joined, making a triangulation light line within the joining region which intersects a joint seam. An illumination device with a second light source homogeneously illuminates the joining region. A first optical sensor with a first observation beam path for spatially resolved imaging of the triangulation light line is projected onto the joint seam. A second optical sensor with a second observation beam path for spatially resolved imaging of the joint seam is coaxially coupled with the first observation beam path. The readout rate of the first and second optical sensors is >1 kHz and <500 Hz, respectively.

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03-01-2013 дата публикации

Laser ablation tooling via distributed patterned masks

Номер: US20130003030A1
Автор: Thomas R.J. Corrigan
Принадлежит: 3M Innovative Properties Co

A distributed patterned mask for use in a laser ablation process to image a complete pattern onto a substrate. The mask has a plurality of apertures for transmission of light and non-transmissive areas around the apertures. When the apertures for the distributed pattern are repeatedly imaged on a substrate, structures within the distributed pattern merge within different areas of the imaged pattern to create the complete pattern with distributed stitch lines in order to reduce or eliminate the stitching effect in laser ablation. The mask can also form a sparse and distributed pattern including apertures that individually form merging portions of the complete pattern and collectively form a distributed pattern.

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17-01-2013 дата публикации

Laser processing machine

Номер: US20130015166A1
Автор: Chun-Hao Li
Принадлежит: Individual

A laser processing machine includes a cavity, a laser system, at least one processing platform, and at least one upper motion platform. The laser system is disposed at a lower part inside the cavity, and used for outputting a laser beam. A traveling direction of the laser beam is opposite to the gravity direction. The processing platform is disposed at an upper part inside the cavity, and includes an adsorption surface and a connection surface facing each other. The adsorption surface is located below the connection surface, and is used for adsorbing a workpiece. The upper motion platform is disposed at the upper part inside the cavity, and is correspondingly connected to the connection surface of the processing platform, in order to cause the processing platform to move.

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31-01-2013 дата публикации

Multiple Optical Beam Folding Apparatus and Method

Номер: US20130027793A1

A multiple optical beam folding apparatus for directing optical energy includes two or more radiation collectors configured to direct radiant energy through two or more independent optical paths to a shared focal plan array (FPA). The radiation collectors may include one or more gas cells or vacuum cells. One or more of the two or more optical paths may include a Galilean telescope. First and second reflecting surfaces are positioned in each of the two or more independent optical paths. The first reflecting surfaces are distinct reflecting surfaces from the second reflecting surfaces and the first and second reflecting surfaces are configured to direct the radiant energy of their respective independent optical paths to the FPA. The two or more second reflecting surfaces may be distinct surfaces of a pyramidal mirror.

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07-02-2013 дата публикации

Laser Processing Machines

Номер: US20130032583A1
Принадлежит: TRUMPF MASCHINEN GRUESCH AG

A laser processing machine includes a workpiece support, a movement unit that is movable relative to the workpiece support, the movement unit being configured to move a laser processing head over the workpiece support, and a switch cabinet in which one or more control components of the laser processing machine are provided. An arrangement of the switch cabinet provides a free movement space disposed underneath at least a portion of the switch cabinet, wherein at least a portion of the movement unit is disposed within the free movement space.

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21-02-2013 дата публикации

Serial irradiation of a substrate by multiple radiation sources

Номер: US20130043412A1
Принадлежит: International Business Machines Corp

A system for configuring and utilizing J electromagnetic radiation sources (J≧2) to serially irradiate a substrate. Each source has a different function of wavelength and angular distribution of emitted radiation. The substrate includes a base layer and I stacks (I≧2; J≦I) thereon. P j denotes a normally incident energy flux on each stack from source j. In each of I independent exposure steps, the I stacks are concurrently exposed to radiation from the J sources. V i and S i respectively denote an actual and target energy flux transmitted into the substrate via stack i in exposure step i (i=1, . . . , I). t(i) and P t(i) are computed such that: V i is maximal through deployment of source t(i) as compared with deployment of any other source for i=1, . . . , I; and an error E being a function of |V 1 −S 1 |, |V 2 −S 2 |, . . . , |V I −S I | is about minimized with respect to P i (i=1, . . . , I).

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14-03-2013 дата публикации

Method of Verifying Seam Quality during a Laser Welding Process

Номер: US20130062324A1
Принадлежит: Trumpf Werkzeugmaschinen SE and Co KG

This disclosure relates to verifying a seam quality during a laser welding process. In certain aspects, a method includes detecting, in a spatially resolved manner, a first amount of radiation emerging from a workpiece in a first wavelength range, determining a first geometric parameter of a seam characteristic based on the first amount of radiation detected in the first wavelength range, detecting, in a spatially resolved manner, a second amount of radiation emerging from the workpiece in a second wavelength range, the second wavelength range being different than the first wavelength range, determining a second geometric parameter of the seam characteristic based on the second amount of radiation detected in the second wavelength range, comparing the first and second geometric parameters to respective reference values or to respective tolerance intervals to provide respective comparison results, and logically combining the respective comparison results to verify the seam quality.

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21-03-2013 дата публикации

Laser machining device and laser machining method

Номер: US20130068742A1
Принадлежит: Hamamatsu Photonics KK

A laser machining device 1 comprises a laser light source 10 , a spatial light modulator 20 , a controller 22 , a converging optical system 30 , and a shielding member 40 . The phase-modulating spatial light modulator 20 inputs a laser beam outputted from the laser light source 10 , displays a hologram modulating a phase of the laser beam at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated laser beam. The controller 22 causes the spatial light modulator 20 to display a plurality of holograms sequentially, lets the converging optical system 30 converge the laser beam outputted from the spatial light modulator 20 at converging positions having a fixed number of M, selectively places N converging positions out of the M converging positions into a machining region 91 , and machines an object to be machined 90.

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28-03-2013 дата публикации

Optical-electrical connector having a resilient member for urging ferrule against lens member

Номер: US20130077921A1
Принадлежит: Hon Hai Precision Industry Co Ltd

An optical-electrical connector ( 100 ) includes a housing ( 11 ), a circuit board ( 3 ) received in the housing and having a transducer for bidirectional optical-electrical signal conversion, a lens member ( 42 ) mounted on the circuit board, a ferrule ( 43 ) receiving a number of optical channels and having a resisting face ( 431 ), a supporting portion ( 51 ) having a base wall ( 511 ), and a resilient member. The ferrule is situated behind the lens member within the housing and aligned with the lens member along a front-to-back direction. The resilient member is permanently maintained an invariable compressed state between the base wall and the resisting face of the ferrule to provide an invariable forward resilient force to the ferrule for fixing the ferrule to the lens member, when the optical-electrical connector is used and unused.

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04-04-2013 дата публикации

Method and apparatus for irradiating a semiconductor material surface by laser energy

Номер: US20130082195A1
Принадлежит: EXCICO FRANCE

An apparatus for irradiating semiconductor material is disclosed having, a laser generating a primary laser beam, an optical system and a means for shaping the primary laser beam, comprising a plurality of apertures for shaping the primary laser beam into a plurality of secondary laser beams. Wherein the shape and/or size of the individual apertures corresponds to that of a common region of a semiconductor material layer to be irradiated. The optical system is adapted for superposing the secondary laser beams to irradiate said common region. Further, the use of such an apparatus in semiconductor device manufacturing is disclosed.

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11-04-2013 дата публикации

METHOD AND DEVICE FOR LASER-JOINING SHEET METAL PARTS

Номер: US20130087538A1
Принадлежит: SCANSONIC MI GMBH

The invention relates to a device and to an associated method for joining sheet metal parts, each with a flange, by laser, wherein the flanges of the sheet metal parts () are joined into one connecting flange. The device has a clamping device () for clamping the sheet metal parts () to be joined in a main clamping direction running transversely to the connecting flange and a beam guidance system for a laser beam (). Moreover, the device has a compensation shaft () which tracks the laser beam () according to a relative movement between the connecting flange and a guidance apparatus. 1. A device for joining sheet metal parts each with a flange , by laser , wherein the flanges of the sheet metal parts are joined into one connecting flange , in which the flanges of the sheets to be joined abut flat against each other and thus form a joint with a flange planewherein the device has clamping device to clamp the sheet metal parts to be joined in a main clamping direction running transversely to the connecting flange and a beam guidance system for a laser beam which is designed to route a laser beam substantially parallel to the connecting flange and transverse to the clamping direction to a front side of at least one of the flanges of the sheet metal parts to be joined,whereinthe device further comprises a compensation shaft which, when the device is connected to a guidance apparatus, tracks the laser beam according to a relative motion between the connecting flange and the guidance apparatuscharacterized in that the beam guidance system has at least one optical element with which a beam angle at which the laser beam runs on a plane perpendicular to the main clamping direction is to be influenced in such a way that switching between different beam angles is possible in the area of a possible processing point such that in each instance a lateral angle is produced away from a sheet part projecting beyond the joint andthat the device has an apparatus for monitoring the ...

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18-04-2013 дата публикации

Laser crystallization apparatus and laser crystallization method using the same

Номер: US20130094534A1
Автор: Hiroshi Okumura
Принадлежит: Samsung Display Co Ltd

A laser crystallization device is provided, which includes a vibration device vibrating a laser beam along its long axis, wherein a vibration frequency at which the laser beam vibrates is satisfied by Equation 1 below. F<(P*f)/ (2*W)   Equation 1 where F is the mirror vibration frequency, W is the laser beam width, P is the laser scan pitch, and f is the laser pulse frequency.

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25-04-2013 дата публикации

HIGH-POWER LASER FOCUSING APPARATUS WITH PRESSURIZED HOUSING AND AERODYNAMIC WINDOW

Номер: US20130100979A1
Автор: REAM Stanley L.
Принадлежит: EDISON WELDING INSTITUTE, INC.

A high-powered laser beam focusing apparatus for use in laser welding applications that includes a laser having a beam delivery fiber for generating a laser beam and a housing adapted to receive the beam delivery fiber. The housing further includes a first internal chamber adapted to receive a flow of pressurized gas; a second internal chamber; and an aerodynamic window positioned between the first chamber and the second chamber. 1. A high-powered laser beam focusing apparatus , comprising;(a) a laser beam delivery fiber for transmitting a laser beam; (i) a first chamber, wherein the first chamber is adapted to receive a flow of pressurized gas;', '(ii) a second chamber; and', '(iii) an aerodynamic window positioned between the first chamber and the second chamber., '(b) a housing adapted to receive the beam delivery fiber, wherein the housing further includes2. The apparatus of claim 1 , further comprising a focusing optic connected to the housing and facing into the first chamber claim 1 , wherein the focusing optic is operative to receive claim 1 , focus claim 1 , and redirect the laser beam into the aerodynamic window.3. The apparatus of claim 2 , further comprising a reimaging optic connected to the housing and facing into the second chamber claim 2 , wherein the reimaging optic is operative to receive the laser beam exiting the aerodynamic window and reimage and redirect the laser beam onto a work surface.4. The apparatus of claim 3 , further comprising a source of pressurized gas connected to the first chamber claim 3 , wherein the flow of gas into the first chamber and the geometric characteristics of the aerodynamic window are operative to prevent debris generated at the work surface from passing through the aerodynamic window and entering the first chamber.5. The apparatus of claim 1 , wherein the laser is a high-power YAG laser claim 1 , fiber laser claim 1 , or disk laser.6. The apparatus of claim 2 , wherein the focusing optic is an asymmetric asphere ...

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02-05-2013 дата публикации

LASER CRYSTALLIZATION AND POLYCRYSTAL EFFICIENCY IMPROVEMENT FOR THIN FILM SOLAR

Номер: US20130109122A1
Автор: MOFFATT STEPHEN
Принадлежит:

Apparatus and methods of thermally processing semiconductor substrates are disclosed. Aspects of the apparatus include a source of intense radiation and a rotating energy distributor that distributes the intense radiation to a rectifier. The rectifier directs the radiation toward the substrate. Aspects of the method include using a rotating energy distributor to distribute pulsed energy to a substrate for processing. The rotational rate of the energy distributor is set based on the pulse repetition rate of the energy source. A substrate may be continuously translated with respect to the energy distributor at a rate set based on the pulse repetition rate of the energy source. 1. An apparatus for thermal processing of semiconductor substrates , comprising:a source of a rectangular laser light field;a rotating polygonal mirror disposed in an optical path of the rectangular laser light field and generating a plurality of reflected laser pulses having a rectangular shape and angularly distributed across a reflection field; anda rectifier disposed across the reflection field and above a work surface, and having one or more light-directing elements that direct the rectangular laser pulses from the reflection field toward the work surface.2. The apparatus of claim 1 , wherein the rectifier is a linear member disposed along an axis perpendicular to the optical path of the laser light field incident on the rotating polygonal mirror.3. The apparatus of claim 2 , wherein the rectifier comprises a plurality of optical elements.4. The apparatus of claim 2 , wherein the work surface comprises a conveyor movable in a direction substantially parallel to the optical path of the laser light incident on the rotating polygonal mirror.5. The apparatus of claim 3 , wherein the rectifier comprises a plurality of mirrors.6. The apparatus of claim 5 , wherein the rectifier further comprises a plurality of lenses.7. The apparatus of claim 6 , wherein each of the plurality of lenses has an ...

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16-05-2013 дата публикации

DEVICE FOR PROCESSING PIPES BY MEANS OF A LASER BEAM

Номер: US20130119028A1
Принадлежит:

The invention relates to a device for processing pipes or other elongated materials () by means of a laser beam () produced by a laser beam source (), comprising a retaining element for retaining a tool or cutting element, wherein said retaining element is mounted so as to be slidable and rotatable relative to a machine bed (). The material () to be processed passes through an opening () surrounded by the retaining element. Favorable and flexible processing of widely varying materials is enabled in that the rotatably and slidably mounted retaining element is an elongated rotational element, on the inside of which the laser beam source () for the laser beam () is arranged as the tool or cutting element. 1. A device for processing pipes or other elongate materials by means of a laser beam generated by a laser beam source , comprisinga machine bed,a holding element, mounted so as to be displaceable relative to said machine bed and rotatable, for holding a tool or cutting means,an opening surrounded by the holding element, through which opening the material to be machined passes during processing,wherein the rotatably and displaceably mounted holding element is an elongate, hollow rotational body, on which the laser beam source for the laser beam is arranged on the inside as the tool or the cutting means.2. A device according to claim 1 , wherein a tunnel for accommodating the material to be machined is provided in the longitudinal direction in the elongate claim 1 , hollow rotational body.3. A device according to claim 1 , wherein the elongate claim 1 , hollow rotational body is a drum claim 1 , the opening being a central opening of the drum.4. A device according to claim 1 , wherein the laser beam is supplied freely to the material to be machined.5. A device according to claim 1 , wherein the elongate claim 1 , hollow rotational body is mounted rotatably about the center axis of the material to be machined on a bearing block claim 1 , which is arranged displaceably ...

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16-05-2013 дата публикации

DEVICE AND METHOD FOR MATERIAL PROCESSING BY MEANS OF LASER RADIATION

Номер: US20130119029A1
Принадлежит: CARL ZEISS MEDITEC AG

A device for material processing by laser radiation, including a source of laser radiation emitting pulsed laser radiation for interaction with the material, optics focusing the pulsed processing laser radiation to a center of interaction in the material, and a scanning unit shifting the positions of the center of interaction within the material. Each processing laser pulse interacting with the material in a zone surrounding the center of interaction assigned to the laser pulse so that material is separated in the zones of interaction. A control unit controls the scanning unit and the source of laser radiation such that a cut surface is produced in the material by sequential arrangement of zones of interaction. The control unit controls the source of laser radiation and the scanning unit such that adjacent centers of interaction are located at a spatial distance a ≦10 μm from each other. 1. A device for material processing by laser radiation , said device comprising:a source of laser radiation emitting pulsed laser radiation for interaction with the material;optics focusing the pulsed laser radiation to a center of interaction in the material;a scanning unit shifting positions of the center of interaction within the material, wherein each laser pulse interacts with the material in a zone surrounding the center of interaction assigned to said laser pulse so that material is separated in the zones of interaction;and a control unit which controls the scanning unit and the source of laser radiation such that a cut surface is produced in the material by sequential arrangement of zones of interaction, wherein the spatial distance a of the centers of interaction of two subsequent laser pulses is smaller than a size d of the focus so that sequentially produced zones of interaction overlap in the material and the fluence F of each laser pulse is below a threshold value M, above which an optical breakthrough forms in the material.2. The device as claimed in claim 1 , wherein ...

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23-05-2013 дата публикации

Method and Device for Machining a Workpiece by Means of a Laser

Номер: US20130126491A1
Автор: Janssen Ruth, Veit Thomas
Принадлежит: OSRAM Opto Semiconductors GmbH

The invention relates to a method for machining a workpiece by means of a laser, wherein a laser beam of the laser irradiates the workpiece, the laser beam remains stationary and the workpiece is moved when a central region of the workpiece is irradiated, and the laser beam and the workpiece are moved at least intermittently when an edge region of the workpiece is irradiated. 113-. (canceled)14. A method for machining a workpiece , the method comprising:irradiating the workpiece with a laser beam of a laser;during irradiation of a central region of the workpiece, keeping the laser beam stationary and moving the workpiece; andduring irradiation of an edge region of the workpiece, moving the laser beam and the workpiece at least intermittently.15. The method according to claim 14 , wherein the relative velocity between laser beam and workpiece during the irradiation of the edge region is at least intermittently equal to the relative velocity between laser beam and workpiece during the irradiation of the central region.16. The method according to claim 14 , wherein the laser is operated in a pulsed fashion claim 14 , wherein the duration of the pulses is at most 100 ns.17. The method according to claim 14 , wherein the laser is operated in a pulsed fashion claim 14 , wherein the duration of the pulses is at most 100 ps.18. The method according to claim 14 , wherein material of the workpiece is removed in places during the machining of the workpiece.19. The method according to claim 14 , wherein claim 14 , during the machining of the workpiece claim 14 , the workpiece is severed into at least two parts along a line running along a relative movement between laser beam and workpiece.20. The method according to claim 14 , wherein claim 14 , during the machining of the workpiece claim 14 , the workpiece is severed into at least two parts along a plane that the laser beam intersects at least in the extension thereof.21. The method according to claim 14 , wherein the ...

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23-05-2013 дата публикации

Semiconductor Device and Method of Laser-Marking Laminate Layer Formed Over EWLB With Tape Applied to Opposite Surface

Номер: US20130127039A9
Принадлежит: Stats Chippac Pte Ltd

A semiconductor device has a semiconductor die with a plurality of bumps formed on contact pads disposed over its active surface. An encapsulant is formed over the semiconductor die. An interconnect structure is formed over the semiconductor die and encapsulant. The semiconductor die is mounted to a translucent tape with the bumps embedded in the translucent tape. The translucent tape has layers of polyolefin, acrylic, and polyethylene terephthalate. A back surface of the semiconductor die undergoes backgrinding to reduce die thickness. The tape undergoes UV curing. A laminate layer is formed over the back surface of the semiconductor die. The laminate layer undergoes oven curing. The laminate layer is laser-marked while the tape remains applied to the bumps. The tape is removed after laser-marking the laminate layer. Alternately, the tape can be removed prior to laser-marking. The tape reduces die warpage during laser-marking.

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30-05-2013 дата публикации

Optical irradiation device for a system for producing three-dimensional work pieces by irradiating powder layers of a powdered raw material using laser radiation

Номер: US20130134637A1
Принадлежит: SLM Solutions Group AG

An optical irradiation device is provided which includes a multimode optical fiber suitable for the central wavelength of a beam of light having a first beam profile which enters through an input connection for multimode guidance; a switching device, which can be switched between a first and second light conducting state and is configured to conduct the beam of light entering through the input connection in the first light conducting state to an output connection, such that the beam of light has the first beam profile on emerging from the output connection, and guides the beam of light entering the input connection to the output connection by the multimode optical fiber in the second light conducting state, so that the beam of light has a second beam profile different from the first beam profile on emerging from the output connection by the multimode guidance in the multimode optical fiber.

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20-06-2013 дата публикации

Fibre optic laser machining equipment for etching grooves forming incipient cracks

Номер: US20130153554A1
Принадлежит: Rofin Lasag AG

A laser machining equipment for etching grooves in a wall of a mechanical part, or in a connecting rod for a spark ignition engine, includes a fiber optic laser device arranged to supply laser pulses. The fiber optic laser device is controlled so that laser pulses have a peak power of more than 400 W and at least two times greater than maximum mean power of the laser device, and duration of the laser pulses is below or within the nanosecond range of 1 ns to 1000 ns. The fiber optic laser device can be controlled in a quasi continuous wave (QCW) mode, or can be controlled in a Q-switch mode. The selected operating modes increase machining efficiency and produce a groove with an optimum transverse profile, particularly with a small mean radius of curvature at a bottom of the groove which then allows precise subsequent fracturing of the mechanical part with less force.

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27-06-2013 дата публикации

LASER-IRRADIATED THIN FILMS HAVING VARIABLE THICKNESS

Номер: US20130161312A1
Автор: Im James S.

A crystalline film includes a first crystalline region having a first film thickness and a first crystalline grain structure; and a second crystalline region having a second film thickness and a second crystalline grain structure. The first film thickness is greater than the second film thickness and the first and second film thicknesses are selected to provide a crystalline region having the degree and orientation of crystallization that is desired for a device component. 1. A system for processing a film comprising:a laser source capable of producing a pulsed laser beam;one or more optical elements capable of generating a first laser beam and a second laser beam having different beam characteristics from the pulsed laser beam, wherein the first laser beam has a first energy density to melt a first region of a film to be crystallized to form a first crystalline region having a first grain structure and the second laser beam has a second energy density sufficient to melt a second region of the film to be crystallized to form a second crystallized region having a second grain structure, wherein the first energy density is greater than the second energy density;a stage configured to support and position a film to be crystallized such that the first laser beam is directed to and irradiates a first portion of the stage and a second laser beam is directed to and irradiates a second portion of the stage; anda computer for controlling the laser source, optical elements, and stage to facilitate the delivery of the first laser beam and the second laser beam to portions of the stage corresponding to first and second regions of a film to be crystallized..2. The system of claim 1 , comprising a film positioned on the stage.3. The system of claim 2 , wherein the first laser beam irradiates a first region of the film and the second laser beam irradiates a second region of the film.4. The system of claim 3 , wherein the irradiations of the first region of the film and the second ...

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04-07-2013 дата публикации

APPARATUS FOR WAVELENGTH-DIVISION MULTIPLEXING AND DEMULTIPLEXING

Номер: US20130168537A1
Автор: Shin Hyunee
Принадлежит: OPTICIS CO., LTD.

The present invention relates to an apparatus for wavelength-division multiplexing and demultiplexing, to an optical communication module, and to an optical device. The apparatus for wavelength-division multiplexing and demultiplexing comprises: a first lens block having a lens array at one side thereof; a second lens block having a lens surface corresponding to the lens array and combined with the other side of the first lens block; a receptacle having an optical fiber ferrule fixed at the center thereof and stacked on the second lens block; and a base combined with one side of the first lens block, wherein the first block is stacked on the base. 1. An apparatus for wavelength division multiplexing and demultiplexing , the apparatus comprising:a first lens block including a lens array at one side of the first lens block;a second lens block including a lens surface corresponding to the lens array and combined with another side of the first lens block;a receptacle having an optical fiber ferrule fixed at a center thereof and stacked on the second lens block; anda base combined with the one side of the first lens block,wherein the first lens block is stacked on the base.2. The apparatus of claim 1 , further comprising a plurality of thin film is filters arranged at the another side of the first lens block corresponding to the lens array and having different wavelength ranges.3. The apparatus of claim 2 , wherein the optical fiber ferrule is aligned to a focal length of the second lens block claim 2 , a light ray emitted from the optical fiber ferrule is converted to a parallel light by the second lens block claim 2 , the parallel light is converted to light rays having predetermined wavelength ranges by the thin film filters claim 2 , and the light rays having predetermined wavelength ranges are concentrated on focuses by the lens array.4. The apparatus of claim 1 , wherein the first lens block and the second lens block are insertion combined with each other claim 1 , ...

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11-07-2013 дата публикации

Method for closed-loop controlling a laser processing operation and laser material processing head using the same

Номер: US20130178952A1
Принадлежит: Precitec Itm Gmbh, Precitec KG

The present invention relates to a method for closed-loop controlling a processing operation of a workpiece, comprising the steps of: (a) recording a pixel image at an initial time point of an interaction zone by means of a camera, wherein the workpiece is processed using an actuator having an initial actuator value; (b) converting the pixel image into a pixel vector; (c) representing the pixel vector by a sum of predetermined pixel mappings each multiplied by a corresponding feature value; (d) classifying the set of feature values on the basis of learned feature values into at least two classes of a group of classes comprising a first class of a too high actuator value, a second class of a sufficient actuator value and a third class of a too low actuator value at the initial time point; (e) performing a control step for adapting the actuator value by minimizing the error e t between a quality indicator y e and a desired value; and (f) repeating the steps (a) to (e) for further time points to perform a closed-loop controlled processing operation.

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18-07-2013 дата публикации

LASER WELDING METHOD

Номер: US20130180965A1
Автор: KOMATSU Gakushi
Принадлежит: NISSAN MOTOR CO., LTD.

A laser welding method basically includes providing a robot that is moveably in accordance with predetermined movement data, and controlling the controlling a laser beam emitting section of the robot to emit a laser beam onto a predetermined irradiation position of a workpiece to conduct welding. The laser welding method further includes: measuring a current movement position of the robot with respect to a movement position specified in the predetermined movement data; operating of the robot to change the current movement position of the robot to a prescribed position based on the predetermined movement data; and adjusting a laser emission direction by controlling an emission changing section of the laser beam emitting section based on the current movement position of the robot and the predetermined movement data such that a laser beam is emitted from the laser beam emitting section and strikes the predetermined irradiation position of the workpiece. 1. A laser welding method comprising:providing a robot that is moveably in accordance with predetermined movement data, and that includes a laser beam emitting section;measuring a current movement position of the robot with respect to a movement position specified in the predetermined movement data;operating of the robot to change the current movement position of the robot to a prescribed position based on the predetermined movement data; andadjusting a laser emission direction by controlling an emission changing section of the laser beam emitting section based on the current movement position of the robot that was measured and the predetermined movement data such that a laser beam is emitted from the laser beam emitting section and strikes a predetermined irradiation position of a workpiece; andcontrolling the laser beam emitting section to emit the laser beam onto the predetermined irradiation position of the workpiece to conduct welding.2. The laser welding method as recited in claim 1 , whereinthe operating of the ...

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18-07-2013 дата публикации

LASER CUTTING SYSTEM AND METHODS FOR CREATING SELF-RETAINING SUTURES

Номер: US20130180966A1
Принадлежит:

A laser-machining system and method is disclosed for forming retainers on a suture thread. The laser system is preferably a femtosecond laser system which is capable of creating submicron features on the suture thread while preserving strength of the suture thread. The laser-machining system enables creation of retainers and self-retaining suture systems in configurations which are difficult and/or impossible to achieve using mechanical cutting technology. 1. A method for making a self-retaining suture comprising;(a) providing a suture thread having a surface;(b) identifying a first volume of suture material on the surface of the thread;(c) identifying a second volume of suture material from within the first volume of suture material;(d) directing a laser beam at the suture thread to ablate all of the suture material within the first volume of suture material with the exception of the second volume of suture material whereby the second volume of suture material forms a tissue retainer protruding from laser cut surface of the suture thread; and(e) repeating steps (b), (c) and (d) to generate a plurality of tissue retainers protruding from the suture thread.2. The method of claim 1 , wherein step (c) comprises identifying a second volume of suture material from within the first volume of suture material the second volume being less than 50% of the first volume.3. The method of claim 1 , wherein step (c) comprises identifying a second volume of suture material from within the first volume of suture material the second volume being less than 25% of the first volume.4. The method of claim 1 , wherein:step (c) comprises identifying a conical subvolume of suture material from within the volume of suture material wherein the subvolume of suture material; andstep (d) comprises directing a laser beam at the suture thread to ablate all of the suture material within the selected volume of suture material with the exception of the conical subvolume of suture material whereby the ...

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25-07-2013 дата публикации

LASER PROCESSING MACHINE

Номер: US20130186871A1
Принадлежит: KATAOKA CORPORATION

A processing machine includes mirrors and to reflect a beam L oscillated from a laser oscillator to a predetermined surface on which a workpiece is arranged, optical axis operating mechanisms and to position an optical axis of the beam L at a desired target irradiation position by changing directions of the mirrors and, a camera sensor to capture an image of the target irradiation position and its periphery reflected in the mirror, and an error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanisms and an actual position of the optical axis of the beam L in the predetermined surface by referring to the image captured by the camera sensor. A correction amount to the optical axis operating mechanisms and is determined based on the error to irradiate the target irradiation position with the beam L during processing. 1. A laser processing machine to apply processing by irradiating a workpiece with a laser beam , comprising:a mirror to reflect the laser beam oscillated from a laser oscillator to a predetermined surface on which the workpiece is arranged;an optical axis operating mechanism to position an optical axis of the laser beam at a desired target irradiation position in the predetermined surface by changing a direction of the mirror;a camera sensor to capture an image of the target irradiation position and its periphery in the predetermined surface reflected in the mirror; andan error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanism and an actual position of the optical axis of the laser beam in the predetermined surface, by referring to the image captured by the camera sensor,wherein a correction amount to be instructed to the optical axis operating mechanism can be determined based on the error in order to irradiate the target irradiation position with the laser beam during processing.2. A laser ...

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25-07-2013 дата публикации

METHOD OF AND MATERIAL PROCESSING APPARATUS FOR OPTIMISING THE FOCUS OF A FIBRE LASER; METHOD OF MEASURING CHANGES IN THE FOCUS OF A FIBRE LASER

Номер: US20130188178A1
Автор: Keen Steve
Принадлежит: GSI Group Limited

A method of optimising the focus of a fibre laser is described, which comprises positioning the output of a fibre laser relative to a workpiece; measuring at least a portion of back reflected radiation from the workpiece (step ); determining an integral of this; changing the relative position of the output and the workpiece one or more times (step ), each time determining an integral of values for the back-reflection, and using the integrals to determine optimum focus. 1. A method of optimising the focus of a fibre laser , comprising positioning the output of a fibre laser relative to a workpiece; measuring at least a portion of back reflected radiation from the workpiece; changing the relative position of the output and the workpiece one or more times and measuring at least a portion of back reflected radiation from the workpiece each time , and analysing the resulting measured back-reflected radiations to determine optimum focus.2. A method according to claim 1 , comprising generating pulses of laser radiation and measuring the waveform of back-reflected radiation resulting from the pulse.3. A method according to claim 1 , comprising determining an integral back-reflected radiation at each relative position and using the integrals to determine optimum focus.4. A method according to claim 2 , comprising generating pulses of laser radiation integrating a back-reflected waveform claim 2 , or part thereof claim 2 , resulting from each or a selection of pulses to generate a plurality of single integral values.5. A method according to claim 3 , including determining optimum focus by determining a minimum value of the integrals.6. A method according to claim 1 , including the step of using optimum focus to actively control the distance of the output from the workpiece.7. A method according to claim 1 , wherein the back-reflected radiation is transmitted in a cladding layer of the delivery fibre claim 1 , and removed therefrom.8. A method according to claim 1 , including ...

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25-07-2013 дата публикации

Fiber optic cable for very-short-distance networks

Номер: US20130188916A1
Принадлежит: CORNING OPTICAL COMMUNICATIONS LLC

A fiber optic cable includes a polymeric jacket defining an outer periphery and a cavity interior thereto, an optical fiber positioned within the cavity, and first and second longitudinal strength elements fully embedded in the jacket on opposite sides of the cavity from one another, where the strength elements define a bend axis of the cable passing there through that is orthogonal to the length of the cable, and the bend axis and the length of the cavity define a preferential plane for bending. The cable resists bending about a third axis that is orthogonal to the length of the cable and the bend axis, where the third axis and the length of the cable define a non-preferential plane for bending. The difference in flexural rigidity between the preferential and non-preferential planes limits formation of spontaneous knots in a coil of the cable while providing flexibility for ease of handling.

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01-08-2013 дата публикации

Laser machining head

Номер: US20130193119A1
Автор: David Broger
Принадлежит: BYSTRONIC LASER AG

The invention relates to a laser machining head for a laser machining machine, comprising a mount ( 2 ) for a sensor part ( 3 ) formed from electrically conductive material, an outer insulation part ( 4 ) made from electrically insulating material, preferably made from plastic, for electrical shielding and an inner insulation part ( 5 ) inserted within the outer insulation part ( 4 ) as radiation shield, wherein the inner insulation part ( 5 ) is formed from metal and is electrically insulated from the sensor part ( 3 ).

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01-08-2013 дата публикации

Laser Puncher for Punching Hole on Tipping Paper in a Curved Manner

Номер: US20130193120A1

The present invention discloses a laser puncher for punching holes on tipping paper in a curve manner, which comprises a panel, a light guiding cylinder, a laser connected with the light guiding cylinder, a transmission system driving a piece of tipping paper to move and at least one focusing optical head and at least one driving motor is fixed on the panel, a screw shaft is connected with the driving shaft of the driving motor, a nut is connected with the screw shaft and fixedly connected with a connecting rod, the other end of which is fixedly connected with at least one moving optical cylinder, one end of which is provided with the light guiding cylinder, and the other end of which penetrates the panel to be fixedly connected with the focusing optical head, the external periphery of the moving optical cylinder is provided with an anti-rotation linear bearing, which is fixed on the panel, and the driving motor drives the focusing optical head to reciprocate back and forth via the screw shaft, the nut, the connecting rod and the moving optical cylinder. The present invention can increase the identifiability of tipping papers on which holes are punched with a laser puncher as well as the air permeability of tipping papers. 1. A laser puncher for punching holes on tipping paper in a curved manner , comprising;a panel;a light guiding cylinder;a laser connected with the light guiding cylinder;a transmission system driving a piece of tipping paper to move; andat least one focusing optical head, wherein at least one driving motor is fixed on the panel, a screw shaft is connected with the driving shaft of the driving motor, a nut is connected with the screw shaft and fixedly connected with a connecting rod, the other end of which is fixedly connected with at least one moving optical cylinder, one end of which is fitted glidingly in the light guiding cylinder, and the other end of which penetrates the panel to be fixedly connected with the focusing optical head, the ...

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01-08-2013 дата публикации

LASER PROCESSING MACHINE AND LASER PROCESSING METHOD

Номер: US20130193125A1
Принадлежит: AMADA COMPANY, LIMITED

A laser processing machine includes a work head, a plate-like work working table for processing a plate-like work, a rod-like work working table including a rod-like work holder for processing a rod-like work, and a work area in which the work head is movably provided. The plate-like work working table is provided movably from one side of the work area into the work area. The rod-like work working table is provided movably from another side of the work area into the work area that is opposite side of the one side. According to the laser processing machine, when switching over between a processing of a plate-like work and a processing of a rod-like work, it is needed only to move/evacuate the plate-like work working table and the rod-like work working table to/from the work area, so that the switching-over operation can be easily done. 1. A laser processing machine comprising:a work head;a plate-like work working table for processing a plate-like work;a rod-like work working table including a rod-like work holder for processing a rod-like work; anda work area in which the work head is movably provided, whereinthe plate-like work working table is provided movably from one side of the work area into the work area, andthe rod-like work working table is provided movably from another side of the work area into the work area, the other side being opposite side of the one side.2. The laser processing machine according to claim 1 , whereinthe rod-like work holder is provided with a rod-like work insertion hole into which the rod-like work can be inserted along a movable direction of the rod-like work working table.3. The laser processing machine according to claim 1 , whereinthe rod-like work holder includes a first holder for holding the rod-like work, and a second holder movable on the rod-like work working table along a movable direction of the rod-like work working table.4. The laser processing machine according to claim 3 , whereinthe second holder is configured to be ...

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08-08-2013 дата публикации

LASER BEAM MACHINING DEVICE AND A PROCESS OF LASER MACHINING COMPRISING A SINGLE LENS FOR LIGHT FOCUSSING

Номер: US20130200052A1
Автор: Wittwer Stefan
Принадлежит: BYSTRONIC LASER AG

A laser beam machining device () is provided, in which unfocused light (A) from a light exit point (B) is radiated onto a single lens (), where in the lens () focuses the laser light (A) and guides it onto a machining point of a work piece (). A distance (m, m) between the lens () and the light exit point (B) and a distance (l, l) between the lens () and the machining point of the workpiece () and a distance between the light exit point (B) and the aforementioned machining point can be varied. Moreover, a process of usage of a laser beam machining device () is provided. 119-. (canceled)20. A laser machining apparatus comprising:a light exit outlet configured to emit unfocused laser light;a lens situated in the direction of radiation of laser light emitted by said light exit outlet, said lens separated by a first controllably-variable distance from said light exit outlet;a laser machining locus disposed after said lens, said laser machining locus separated from said lens by a second controllably-variable distance, said laser machining locus separated from light exit outlet by a third controllably-variable distance;a drive system configured to controllably adjust the first controllably-variable distance, the second controllably-variable distance, and the third controllably-variable distance; andsaid drive system being operatively connected to said lens and to said light exit outlet.21. The laser machining apparatus as claimed in wherein:said lens is aspheric.22. A laser machining apparatus as claimed in further comprising:at least one aspheric surface on said lens, said at least one aspheric surface being shaped with an even asphericity.23. The laser machining apparatus as claimed in wherein:said lens is made of ZnS.24. The laser machining apparatus as claimed in wherein:the Strehl ratio is greater than 0.9 over operational ranges of the first, second, and third controllably-variable distances.25. The laser machining apparatus as claimed in wherein:said drive system ...

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08-08-2013 дата публикации

SINGLE-SCAN LINE-SCAN CRYSTALLIZATION USING SUPERIMPOSED SCANNING ELEMENTS

Номер: US20130201634A1
Принадлежит: COLUMBIA UNIVERSITY

The disclosure relates to methods and systems for single-scan line-scan crystallization using superimposed scanning elements. In one aspect, the method includes generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film; directing a first laser beam pulse onto a thin film using a first beam path; advancing the thin film at a constant first scan velocity in a first direction; and deflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film, wherein the second scan velocity is less than the first scan velocity. 1. A method for processing a thin film , the method comprising:generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film;directing a first laser beam pulse onto a thin film using a first beam path;advancing the thin film at a constant first scan velocity in a first direction; anddeflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film,wherein the second scan velocity is less than the first scan velocity.2. The method of claim 1 , wherein each laser beam pulse has a fluence selected to completely melt the thin film.3. The method of claim 1 , wherein the crystallization comprises a sequential lateral solidification (SLS) process.4. The method of claim 1 , wherein each laser beam pulse has a fluence selected to partially melt the thin film.5. The method of claim 1 , wherein the crystallization ...

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08-08-2013 дата публикации

Microfluidic device for generating neural cells to simulate post-stroke conditions

Номер: US20130203086A1

This application provides devices for modeling ischemic stroke conditions. The devices can be used to culture neurons and to subject a first population of the neurons to low-oxygen conditions and a second population of neurons to normoxic conditions. The neurons are cultured on a porous barrier, and on the other side of the barrier run one or more fluid-filled channels. By flowing fluid with different oxygen levels through the channels, one can deliver desired oxygen concentrations to the cells nearest those channels.

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22-08-2013 дата публикации

System for Laser Direct Writing of MESA Structures Having Negatively Sloped Sidewalls

Номер: US20130213944A1

In the field of photolithography systems designed to produce electronic components using the technique known as “lift-off” on a plane substrate comprising one or more plane photosensitive layers, a system uses a laser direct-write technique. It comprises optical or mechanical means configured such that the useful part of the optical beam is inclined on the plane of the photosensitive layers in order to create profiles with an inverted slope within said layers, the useful part of the optical beam being the part of the optical beam which effectively contributes to creating said profiles. In one preferred embodiment, the system comprises means for partial shuttering of the optical beam situated in the neighborhood of the focusing optics. 1. A system for laser direct writing on a plane substrate comprising one or more plane photosensitive layers , said system comprising:a writing laser, an optical beam coming from the writing laser having radial symmetry;a set of optics for focusing the optical beam onto the plane of the plane photosensitive layers;means for displacement in translation of the plane substrate, wherein the system comprises optical or mechanical means configured in such a manner that the useful part of the optical beam is inclined on the plane of the photosensitive layers in order to create profiles with an inverted slope within said layers, the useful part of the optical beam being the part of the optical beam which contributes effectively to creating said profiles, the optical axis of the focusing optics being perpendicular to the plane of the photosensitive layers.2. The laser direct-write system as claimed in claim 1 , wherein the system comprises means for partial shuttering of the optical beam situated in the neighborhood of the focusing optics.350. The laser direct-write system as claimed in claim 2 , wherein the shuttering means are an opaque thin plane blade () with a straight edge.4. The laser direct-write system as claimed in claim 2 , wherein ...

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22-08-2013 дата публикации

LASER MACHINING APPARATUS AND LASER MACHINING CONTROL DEVICE

Номер: US20130218321A1
Принадлежит: Mitsubishi Electric Corporation

The laser machining apparatus includes a transmission fiber that transmits laser light emitted from a laser oscillator through the fiber, a machining head that emits the laser light, which is sent from the transmission fiber, vertically to a main surface of a machining object and sends reflected light, which is reflected coaxially with the laser light by the machining object, to the transmission fiber, a reflected light monitoring unit that detects a reflected light intensity of the reflected light sent from the transmission fiber, and a control device that controls the laser oscillator and the machining head, in which the control device includes a determining unit that, at a time when laser machining is started, determines whether the machining object corresponds to a machining condition or not in laser machining on the basis of the reflected light intensity. 18.-. (canceled)9. A laser machining apparatus comprising:a transmission fiber that transmits laser light emitted from a laser oscillator through the fiber;a machining head that emits the laser light, which is sent from the transmission fiber, vertically to a main surface of a machining object and sends reflected light, which is reflected coaxially with the laser light by the machining object, to the transmission fiber;a reflected-light-intensity detecting unit that detects a reflected light intensity of the reflected light sent from the transmission fiber; anda control device that controls the laser oscillator and the machining head, whereinthe control device includes a determining unit that, at a time when laser machining is started, determines whether the machining object corresponds to a machining condition in laser machining or not on a basis of the reflected light intensity, andthe determining unit compares a measurement time measured from when the piercing is started to when the reflected light intensity decreases to a predetermined value with a first specified range relating to a measurement time ...

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29-08-2013 дата публикации

Apparatus and method for repair of defects in an electronic energy control or display device

Номер: US20130225027A1
Принадлежит: Sage Electrochromics Inc

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

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26-09-2013 дата публикации

Piezoelectric substrate for the study of biomolecules

Номер: US20130249530A1
Автор: Minrui Yu, Robert H. Blick
Принадлежит: WISCONSIN ALUMNI RESEARCH FOUNDATION

A method of forming extremely small pores in a substrate may be used to produce, for example, an apparatus for the study of biological molecules, by providing a small pore in a piezoelectric substrate having electrodes, the latter that may be energized to change the pore dimensions.

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03-10-2013 дата публикации

Opto-electric hybrid board

Номер: US20130259430A1
Принадлежит: Nitto Denko Corp

An opto-electric hybrid board includes: an electric circuit board including an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer; an optical element mounted on a surface of the electric circuit board with the electrical interconnect lines formed thereon; and an optical waveguide including a core and formed on the back surface of the insulative layer of the electric circuit board. The core includes at its end portion a reflecting surface capable of reflecting alight beam to propagate the light beam between the core and the optical element. The insulative layer is made of a light-transmissive material. A portion of the insulative layer corresponding to an optical path between the reflecting surface of the core and the optical element is in the form of a lens portion.

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17-10-2013 дата публикации

Method for welding steel material to ni-based superalloy and welding joint

Номер: US20130272781A1
Принадлежит: IHI Corp

When a turbine impeller ( 4 ) formed from an Ni-based superalloy and a rotor shaft ( 2 ) formed from a steel material are joined by being fused together via welding in a boundary portion, a mixing ratio of a welding metal ( 6 ) that is formed in the boundary portion by fusing together the Ni-based superalloy forming the turbine impeller ( 4 ) and the steel material forming the rotor shaft ( 2 ) is between 0.5 and 0.8. As a result, it is possible to obtain a sound welding joint in which there are no cracks in the boundary between the welding metal ( 6 ) and the Ni-based superalloy ( 4 ).

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14-11-2013 дата публикации

ACOUSTO-OPTIC DEFLECTOR APPLICATIONS IN LASER PROCESSING OF DIELECTRIC OR OTHER MATERIALS

Номер: US20130299468A1
Принадлежит:

A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece. 1. A method for dithering a laser beam to process features in a workpiece , the method comprising:imparting, using a first positioning system, first relative movement of a laser beam spot position along a processing trajectory;imparting, using a second positioning system, second relative movement of the laser beam spot position along a dither direction relative to the processing trajectory, wherein the second relative movement is superimposed on the first relative movement, and wherein the second relative movement is at a substantially higher velocity than that of the first relative movement;amplitude modulating, using the second positioning system, a laser beam based on a specific feature characteristic at one or more corresponding target locations on the workpiece; andemitting the laser beam to the workpiece during the second relative movement to effectively widen a laser beam spot at the workpiece in the dither direction.2. The method of claim 1 , further comprising:controlling one or more acousto-optic ...

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21-11-2013 дата публикации

LASER PROCESSING HEAD, LASER PROCESSING APPARATUS, OPTICAL SYSTEM OF LASER PROCESSING APPARATUS, LASER PROCESSING METHOD, AND LASER FOCUSING METHOD

Номер: US20130306609A1
Принадлежит:

A laser cutting apparatus () includes a laser processing head () that receives a laser beam emitted by a laser oscillator () and that uses a spherical lens for converging the laser beam so as to cause the intensity distribution of the laser beam to have a caldera-like shape, in which the intensity of the laser beam is higher in a peripheral area than in a central area, at the position of a workpiece (). Moreover, the laser processing head () radiates the laser beam whose focal position is displaced from the position of the workpiece () to the workpiece (). Therefore, the laser cutting apparatus () performs an inversion on the laser beam by using the spherical aberration of the spherical lens. Consequently, with a simple configuration, a laser beam whose inner area and outer area are inverted at the position of the workpiece () can be generated, and the processing direction for processing the workpiece () is not limited. 1. A laser processing head included in a laser processing apparatus that processes a workpiece by irradiating the workpiece with a laser beam ,wherein at least one of a spherical lens and an aspherical lens capable of generating spherical aberration, which are provided for converging the laser beam, causes an intensity distribution of the laser beam to have a caldera-like shape, in which the intensity of the laser beam is higher in a peripheral area than in a central area, at a position of the workpiece, and the laser beam whose focal position is displaced from the position of the workpiece is radiated onto the workpiece.2. The laser processing head according to claim 1 , wherein the intensity distribution of the laser beam at the position of the workpiece is ring-shaped.3. The laser processing head according to wherein the intensity distribution of the laser beam at the position of the workpiece is non-ring-shaped.4. The laser processing head according to claim 3 , wherein the intensity distribution of the laser beam at the position of the workpiece ...

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21-11-2013 дата публикации

Light transmission system with optical waveguide

Номер: US20130308901A1
Автор: Kai-Wen Wu
Принадлежит: Individual

A light transmission system includes a light guide support, a first convex lens, an optical waveguide member, and two second convex lenses. The light guide support includes a first surface, a second surface, a hollow space formed between the first surface and the second surface, and an inner reflecting surface forming an angle of 45 degrees relative to the first surface. The first convex lens is formed at the first surface, and configured for converging light to the inner reflecting surface. The optical waveguide member is located at the hollow space, and includes a main section parallel with the first surface, two first branch sections extending from and forming equal angles relative to the main section, and two second branch sections extending from the respective first branch sections. The two second convex lenses are formed at the second surface and aligned with the respective second branch sections.

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05-12-2013 дата публикации

LASER MACHINING APPARATUS

Номер: US20130319985A1
Автор: Nomaru Keiji
Принадлежит: DISCO CORPORATION

A laser machining apparatus includes a chuck table for holding a workpiece, and an irradiation unit which irradiates a laser beam upon the workpiece held on the chuck table. The laser beam irradiation unit includes a condenser which condenses the laser beam and irradiates the condensed laser beam upon the workpiece held on the chuck table. The condenser includes first and second condenser lenses arrayed in series in an advancing direction of the laser beam, a first moving unit having a first driving source for moving the first condenser lens in a first direction perpendicular to an optical axis of the first condenser lens, and a second moving unit having a second driving source for moving the second condenser lens in a second direction perpendicular to the first direction. 1. A laser machining apparatus , comprising:workpiece holding means for holding a workpiece; andlaser beam irradiation means including laser beam oscillation means for oscillating a laser beam, and a condenser for condensing the laser beam oscillated by the laser beam oscillation means and irradiating the condensed laser beam upon the workpiece held on the workpiece holding means; first and second condenser lenses arrayed in series in an advancing direction of the laser beam,', 'first moving means having a first driving source for moving the first condenser lens in a first direction perpendicular to an optical axis of the first condenser lens, and', 'second moving means having a second driving source for moving the second condenser lens in a second direction perpendicular to the first direction, and, 'wherein the condenser includes'} 'power supplying means for supplying power to the first driving source of the first moving means and the second driving source of the second moving means.', 'the laser machining apparatus further comprises2. The laser machining apparatus according to claim 1 , wherein the first driving source and the second driving source are each configured from a piezoelectric ...

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05-12-2013 дата публикации

Methods of cutting glass using a laser

Номер: US20130323469A1
Принадлежит: Corning Inc

A method of cutting a glass article includes translating a laser beam relative to a first surface of the glass article. The laser beam includes a beam waist having a center. The center of the beam waist of the laser beam is positioned at or below a second surface of the glass article. The laser beam creates a plurality of defects along a score line in the glass article such that the plurality of defects extends a distance into the glass article, and at least some individual defects of the plurality of defects are non-orthogonal to the first surface of the glass article and are biased in a direction of translation of the laser beam. Glass articles having edge defects are also disclosed.

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19-12-2013 дата публикации

LASER PROCESSING MACHINE, LASER CUTTING MACHINE, AND METHOD FOR ADJUSTING A FOCUSED LASER BEAM

Номер: US20130334181A1
Принадлежит:

Laser processing machines and methods for adjusting focused laser beams. Laser processing heads have nozzle with openings admitting primary laser beam. An orientation device is included, as well as at least one sensor to mutually center primary beam and opening of nozzle. A first beam handling unit is arranged near the nozzle opening and may convert primary beam into a secondary wide-band heat beam, and then may emit this secondary beam towards a sensor; or may reflect/scatter at least a portion of the primary beam towards sensor. The sensor detecting the converted secondary beam is arranged within the laser processing head. In an adjustment process, a primary beam may be converted into a wide-band heat radiation as secondary radiation at the beam handling unit, and emitted and/or diverted into a scattered/reflex beam towards the sensor. Respective position of nozzle opening center and primary beam is calculated from sensor-measured values, and nozzle center and beam center are automatically displaced to mutual center. The axial position of beam focus may be also be measured and set via the nozzle centering procedure. 1. A laser processing machine comprising:a laser processing head, said laser processing head having an interior, said interior having an interior wall, said interior wall being disposed about a central axis;a nozzle associated with said laser processing head, said nozzle having a nozzle opening for a focused laser beam, said nozzle opening having at least one edge;a beam handling unit disposed near said nozzle opening, said beam handling unit being made of a material converting a focused laser beam at said at least one nozzle opening edge to a wide-band heat beam, said beam handling unit positioned to emit the wide-band heat beam as a secondary electromagnetic radiation beam in a propagation direction back into said interior and away from said nozzle opening and said beam handling unit;a beam reflector disposed in said laser processing head to reflect ...

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19-12-2013 дата публикации

LASER MACHINE, LASER MACHINE SYSTEM

Номер: US20130334183A1
Принадлежит:

A laser machine (), in particular for drilling, cutting, welding or engraving, comprising at least one laser light source () for generating a laser beam () and an optical system () to guide and/or manipulate the laser beam (), whereby the optical system () comprises at least one tool (), in particular an optical lens () or a nozzle, which is attached to an interchangeable tool holder (). It is provided that a guiding system () for the tool holder () is configured such that the tool holder () can only be slid sideways into or out of a tool bay () provided by the laser machine (), the guiding system () comprising an operable locking system () for restraining the movement of the tool holder () in the tool bay (). 1. A laser machine comprising at least one laser light source for generating a laser beam , an optical system to guide and/or manipulate the laser beam , the optical system comprises at least one tool , attached to an interchangeable tool holder , a guiding system for the tool holder is configured such that the tool holder can only be slid sideways into or out of a tool bay provided by the laser machine , the guiding system comprising an operable locking system for restraining the movement of the tool holder in the tool bay.2. A laser machine according to claim 1 , wherein the at least one tool is an optical lens.3. A laser machine according to claim 1 , wherein the at least one tool is a nozzle.4. A laser machine according to claim 1 , wherein the guiding system comprises at least one guiding rail attached to one of the tool holder and the tool bay and at least one guiding slot to engage with the guiding rail attached to the other of the tool bay and the tool holder.5. A laser machine according to claim 1 , wherein the locking system comprises at least one moveable locking piston and/or at least one operable locking magnet.6. A laser machine according to claim 5 , wherein the locking piston is actuated by compressed air claim 5 , wherein movement of the tool ...

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19-12-2013 дата публикации

LASER PROCESSING APPARATUS

Номер: US20130334185A1
Автор: Nomaru Keiji
Принадлежит:

A laser processing apparatus including a laser beam branching mechanism provided between a laser oscillator and a focusing unit. The laser beam branching mechanism includes a spread angle adjusting unit for adjusting the spread angle of a laser beam and a branching unit for branching the laser beam into a plurality of laser beams. The branching unit includes a half-wave plate, a first polarization beam splitter for separating the laser beam into P polarized light and S polarized light, a first mirror for reflecting the P polarized light, a second mirror for reflecting the S polarized light, and a second polarization beam splitter for leading the P polarized light reflected by the first mirror and the S polarized light reflected by the second mirror to different optical paths extending in the same direction. 1. A laser processing apparatus comprising:a chuck table for holding a workpiece;laser beam applying means for applying a laser beam to the workpiece held on the chuck table, the laser beam applying means including laser beam oscillating means for oscillating a laser beam, focusing means for focusing the laser beam oscillated by the laser beam oscillating means and applying the laser beam focused to the workpiece held on the chuck table, and a laser beam branching mechanism provided between the laser beam oscillating means and the focusing means for branching the laser beam oscillated by the laser beam oscillating means into a plurality of laser beams; andfeeding means for relatively moving the chuck table and the laser beam applying means in a feeding direction;the laser beam branching mechanism including spread angle adjusting means for adjusting the spread angle of the laser beam oscillated by the laser beam oscillating means and a branching unit for branching the laser beam passed through the spread angle adjusting means into the plurality of laser beams;the branching unit including a half-wave plate, a first polarization beam splitter for separating the ...

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19-12-2013 дата публикации

LASER PROCESSING APPARATUS

Номер: US20130334186A1
Автор: Nomaru Keiji
Принадлежит:

A laser processing apparatus includes a laser beam branching mechanism provided between a laser oscillator and a focusing unit. The branching mechanism includes a branching unit for branching a laser beam into a plurality of laser beams. The branching unit includes a half-wave plate for 45° rotating the polarization plane of the laser beam. A first polarization beam splitter separates the laser beam passed through the half-wave plate into P polarized light and S polarized light. A first mirror reflects the P polarized light and a second mirror reflects the S polarized light. A second polarization beam splitter leads the reflected P polarized light and the reflected S polarized light to different optical paths extending in the same direction, and an angle adjusting mechanism adjusts the angle of reflection of at least one of the P polarized light and the S polarized light. 1. A laser processing apparatus comprising:a chuck table for holding a workpiece;laser beam applying means for applying a laser beam to said workpiece held on said chuck table, said laser beam applying means including laser beam oscillating means for oscillating a laser beam, focusing means for focusing said laser beam oscillated by said laser beam oscillating means and applying said laser beam focused to said workpiece held on said chuck table, and a laser beam branching mechanism provided between said laser beam oscillating means and said focusing means for branching said laser beam oscillated by said laser beam oscillating means into a plurality of laser beams; andfeeding means for relatively moving said chuck table and said laser beam applying means in a feeding direction;said laser beam branching mechanism including a branching unit for branching said laser beam oscillated by said laser beam oscillating means into said plurality of laser beams;said branching unit including a half-wave plate for 45° rotating the polarization plane of said laser beam oscillated by said laser beam oscillating ...

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19-12-2013 дата публикации

Optical module and method of manufacturing optical module

Номер: US20130336620A1

A method of manufacturing an optical module includes the steps of applying the invisible light onto the resin member and the optical device, observing, with use of a camera, a part of the resin member located at the optical fiber coupling plane and an image formed at the optical fiber coupling plane by the optical device active layer while applying the invisible light onto the resin member and the optical device, aligning positions of the resin member and the circuit board with respect to each other while observing the part of the resin member located at the optical fiber coupling plane and the image formed at the optical fiber coupling plane, and fixing the resin member to the circuit board while maintaining the aligned positions of the resin member and the circuit board.

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26-12-2013 дата публикации

Ir reflowable optical transceiver

Номер: US20130343698A1
Автор: Jamyuen Ko
Принадлежит: Intel Corp

An optical connector includes a plastic lens body having a CTE sufficient to withstand solder reflow. The optical connector includes a substrate to electrically connect to a circuit, and the optical-electrical conversion can occur on the connector. The substrate can include a laser diode and a photodetector to convert optical and electrical signals. The laser diode and photodetector can be controlled by a controller on the substrate.

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26-12-2013 дата публикации

Laser reinforced direct bonding of optical components

Номер: US20130344302A1
Принадлежит: Individual

A method for the laser reinforced direct bonding of two optical components having a respective bonding surface and a reinforced optical assembly made thereby are provided. The method includes a first step of assembling the two optical components by direct bonding of their respective bonding surface together, thereby defining a direct-bonded interface therebetween. The method further includes a second step of reinforcing the direct-bonded interface with a weld seam including at least one substantially continuous reinforcing weld line forming a dosed shape enclosing a sealed direct-bonded region. Each weld line is inscribed by focusing ultrashort laser pulses at the direct-bonding interface so as to generate non-linear optical phenomena inducing a localized junction between the two optical components. Advantageously, embodiments of the present invention provide reinforced optical assemblies exhibiting hermetic and mechanically resistant bonds over a large area as well as negligible alteration of their optical transmission properties.

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02-01-2014 дата публикации

Systems and methods for processing thin films

Номер: US20140001164A1
Автор: James S. Im
Принадлежит: Columbia University of New York

Methods and systems for processing a thin film are disclosed. Thin films are loaded onto two different loading fixtures, laser beam pulses are split into first and second laser beam pulses, the thin film loaded on one loading fixture is irradiated with the first laser beam pulses to induce crystallization while the thin film loaded on the other loading fixture is irradiated with the second laser beam pulses. At least a portion of the thin film loaded on the first and second loading fixtures is irradiated. The laser source system includes first and second laser sources and an integrator that combines the laser beam pulses to form combined laser beam pulses. The methods and system further utilize additional loading fixtures for processing additional thin film samples. The irradiation of additional thin film samples can be performed while thin film samples are being loaded onto the remaining loading fixtures.

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