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Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 15257. Отображено 100.
05-01-2012 дата публикации

Hybrid laser arc welding process and apparatus

Номер: US20120000892A1
Автор: Daniel Anthony Nowak, Paul Stephen Dimascio
Принадлежит: General Electric Co

A welding method and apparatus for welding workpieces together by conducting a laser beam welding process on a joint region that includes a weld seam defined by and between faying surfaces of the workpieces, and then conducting a hybrid laser arc welding process on the joint region. The laser beam welding process entails causing a first laser beam to travel along the joint region, penetrate the weld seam and form a weldment. The hybrid laser arc welding process remelts the weldment by simultaneously causing an electric arc and a second laser beam to overlap and travel along the joint region and form a weld pool in the weldment. On cooling, a weld joint is formed within the joint region and its weld seam.

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Номер записи: 1
28-02-2017 дата публикации

Установка для лазерной обработки кольцевым пучком

Номер: RU0000168922U1
Автор: Александр Фёдорович Коваленко
Принадлежит: Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА")

Полезная модель относится к оборудованию для лазерной обработки и может быть использована для изготовления шайб из тугоплавких металлических или изоляционных неметаллических пластин.Техническим результатом полезной модели, совпадающим с задачей, на решение которой она направлена, является повышение производительности установки для лазерной обработки при изготовлении шайб.Технический результат достигается тем, что в установке для лазерной обработки кольцевым пучком, содержащей лазер и расположенные на оси лазерного пучка телескопический преобразователь диаметра лазерного пучка, состоящий из отрицательной линзы и положительной линзы, коническую линзу и фокусирующую линзу, коническая линза выполнена монолитной, состоящей из конуса с углом при его основании, рассчитываемом по уравнению, связывающему фокусное расстояние фокусирующей линзы, показатель преломления материала конической линзы и внутренний диаметр получаемой в результате обработки шайбы, и усеченного конуса с углом при его большем основании, рассчитываемом по уравнению, связывающему фокусное расстояние фокусирующей линзы, показатель преломления материала конической линзы и внешний диаметр получаемой в результате обработки шайбы, радиус меньшего основания усеченного конуса равен радиусу основания конуса, радиус большего основания усеченного конуса выполняют не менее радиуса пучка лазерного излучения после телескопического преобразователя, который рассчитывают по формуле, связывающей радиус конуса, внешний и внутренний диаметр получаемой шайбы. 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 168 922 U1 (51) МПК B23K 26/00 (2014.01) B23K 26/064 (2014.01) B23K 26/073 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ФОРМУЛА ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21)(22) Заявка: 2016125274, 24.06.2016 (24) Дата начала отсчета срока действия патента: 24.06.2016 (72) Автор(ы): Коваленко Александр Фёдорович (RU) Дата регистрации: 28.02.2017 Приоритет(ы): (22) Дата подачи заявки: 24.06.2016 ...

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Номер записи: 2
24-03-2017 дата публикации

Герметичный корпус

Номер: RU0000169601U1
Автор: Александр Фёдорович Коваленко, Геннадий Станиславович Осипов, Олег Николаевич Федорищев, Павел Николаевич Вышинский
Принадлежит: Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА")

Полезная модель представляет собой герметичный корпус и может быть использована при изготовлении герметичного ввода лазерного излучения в рабочий объем технологических установок, осуществляющих обработку материалов в вакууме или в среде инертных газов. Стенка герметичного корпуса через прокладку с двухсторонней отбортовкой, выполненную из титана, с обеих сторон которой расположена алюминиевая фольга, соединена по всему периметру с входным окном. Окно выполнено из прозрачного в заданном оптическом диапазоне материала и имеет конусоцилиндросферическую форму, коническая поверхность входного окна обращена навстречу лазерному пучку, а сферическая поверхность - внутрь герметичного корпуса. Техническим результатом является расширение функциональных возможностей корпуса за счет фокусировки лазерного излучения в кольцо. 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 169 601 U1 (51) МПК B23K 26/067 (2006.01) H01J 17/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ФОРМУЛА ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21)(22) Заявка: 2016120886, 27.05.2016 (24) Дата начала отсчета срока действия патента: 27.05.2016 24.03.2017 Приоритет(ы): (22) Дата подачи заявки: 27.05.2016 Адрес для переписки: 101000, Москва, Моспочтамт, а/я 918, ФГУП "ВНИИА", начальнику отдела 36, С.В. Жмайло (56) Список документов, цитированных в отчете о поиске: RU156784U1, 20.11.2015. RU119935U1, 27.08.2012. RU156783U1, 20.11.2015. RU155777U1, 20.10.2015. 1 6 9 6 0 1 (45) Опубликовано: 24.03.2017 Бюл. № 9 (73) Патентообладатель(и): Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА") (RU) R U Дата регистрации: (72) Автор(ы): Вышинский Павел Николаевич (RU), Коваленко Александр Фёдорович (RU), Федорищев Олег Николаевич (RU), Осипов Геннадий Станиславович (RU) 1 6 9 6 0 1 R U (57) Формула полезной модели Герметичный корпус с входным окном для ввода лазерного излучения в установку для обработки ...

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Номер записи: 3
31-07-2019 дата публикации

Лазерная оптическая головка

Номер: RU0000191258U1
Автор: Люция Раисовна Хайруллина, Федор Кузьмич Смородин
Принадлежит: Федеральное государственное бюджетное образовательное учреждение высшего образования "Казанский национальный исследовательский технический университет им. А.Н. Туполева-КАИ" (КНИТУ-КАИ)

Полезная модель относится к области обработки материалов лазерным лучом, а именно к процессам лазерной сварки, резки, сверления отверстий. При выполнении технологического режима - лазерной резки или сверлении отверстий движение внутреннего подвижного корпуса (3) с внутренним соплом (4) вниз осуществляется ручным штурвалом (5). При выполнении технологического режима - лазерной резки или сверлении отверстий движение внутреннего подвижного корпуса (3) с внутренним соплом (4) вверх происходит аналогичным образом. Перемещение осуществляется по рейке (13), установленной на внутреннем подвижном корпусе (3), где шестерня (12) закреплена на валу (10). Длина хода рейки (13) достигает до 10±0,025 мм, которая получена опытным путем. Для обеспечения резки или сверления отверстий металлов толщиной от 1 мм до 20 мм длина хода рейки (13) равна 5÷10 мм, при этом расстояние между срезом внутреннего сопла (4) и зоной обработки равно диаметру съемной насадки (17) 0,2±0,02 мм. Для обеспечения резки металлов толщиной от 20 мм до 40 мм длина хода рейки (13) равной 1÷5 мм, при этом расстояние между срезом внутреннего сопла 4 и зоной обработки равно диаметру съемной насадки (17) 0,5±0,02 мм. Для обеспечения сварки металлов толщиной от 1 мм до 20 мм расстояние между срезом внутреннего сопла (4) и зоной сварки равно двойному диаметру съемной насадки (17) 0,4±0,02 мм. Уменьшая или увеличивая размер фокусного пятна можно добиться высокого качества обрабатываемых деталей, выполненных резкой, сверлением отверстий или сваркой. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 191 258 U1 (51) МПК B23K 26/14 (2014.01) B23K 26/064 (2014.01) B23K 26/70 (2014.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B23K 26/14 (2019.05); B23K 26/064 (2019.05); B23K 26/70 (2019.05) (21)(22) Заявка: 2019113412, 29.04.2019 (24) Дата начала отсчета срока действия патента: 31.07.2019 Приоритет(ы): (22) Дата подачи заявки: 29.04.2019 (45) Опубликовано: 31.07.2019 Бюл. № ...

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Номер записи: 4
19-01-2012 дата публикации

Method for Cutting C-Mn Steel with a Fiber Laser

Номер: US20120012570A1
Автор: Francis Briand, Hakim Maazaoui, Karim Chouf
Принадлежит: La Soudure Autogene Francaise, LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude

The invention relates to a laser cutting method for cutting a C—Mn steel workpiece, characterized in that laser beam generation means comprising at least one silica fiber with an ytterbium-doped core is used to generate the laser beam. Preferably, the ytterbium-based fiber has a wavelength between 1.07 and 1.1 μ m, preferably 1.07 μ m, the quality factor of the laser beam is between 0.33 and 8 mm.mrad, and the laser beam has a power of between 0.1 and 25 kW. The assistance gas for the laser beam is chosen from nitrogen, helium, argon, oxygen, CO 2 and mixtures thereof, and, optionally, it further contains one or more additional compounds chosen from H 2 and CH 4 .

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Номер записи: 5
26-01-2012 дата публикации

Optical device and laser beam machining apparatus having optical device

Номер: US20120018412A1
Автор: Yusaku Ito
Принадлежит: Disco Corp

An optical device includes: a beam splitter by which a laser beam oscillated from an oscillator is branched into a first branch beam going ahead through transmission and a second branch beam going ahead through reflection; a first mirror by which the first branch beam going out of the beam splitter is reflected to go again toward the beam splitter; a second mirror by which the second branch beam going out of the beam splitter is reflected to go again toward the beam splitter; and a circular disk-like rotating unit for integrally rotating the first mirror and a second mirror, with a laser beam branch point in the beam splitter as a center of rotation.

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Номер записи: 6
22-03-2012 дата публикации

A method and a device for the electrical treatment of a plurality of containers

Номер: US20120067639A1
Автор: Andreas Heinze, Andreas WIRTH, Herbert Müller-Hartmann, Ludger Altrogge, Timo Gleissner
Принадлежит: LONZA COLOGNE GMBH

The invention relates to a method for the application of at least one voltage pulse to at least two containers fitted with electrodes, by means of which at least one voltage pulse is applied to at least one container, while at least one other container is subjected to a preparation or a post-processing. According to the invention the method comprises mutual exchange of the respective positions of the container to which a voltage pulse has already been applied and the further container. Furthermore, the invention relates to a device ( 1 ) for making electrical contact with at least one container fitted with electrodes, with at least one receptacle ( 3, 7 ) upon which at least one container can be set, and with at least one contact appliance ( 8 ) for making contact with the electrodes of the container. According to the invention at least two receptacles ( 3, 7 ) are provided, wherein one receptacle ( 7 ) is located at or inside the contact appliance ( 8 ), and wherein both receptacles ( 3, 7 ) and/or the contact appliance ( 8 ) can be moved such that after completion of the movement the other receptacle ( 3 ) is located at or inside the contact appliance ( 8 ).

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Номер записи: 7
22-03-2012 дата публикации

Laser irradiation apparatus, laser irradiation method, fabrication method for thin film semiconductor device and fabrication method for display apparatus

Номер: US20120067856A1
Автор: Keisuke Omoto, Masatoshi Inagaki, Minoru Nakajima
Принадлежит: Sony Corp

A laser irradiation apparatus, including: an optical system configured to form laser light of a linear cross section to be irradiated on an irradiation object; and a cutting member having a light blocking portion configured to block the laser light formed in the linear cross section by the optical system to cut the laser light so as to have a predetermined length along a line longitudinal direction; the light blocking portion having a plurality of fins provided on the light blocking portion thereof so as to fetch and absorb the laser light.

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Номер записи: 8
12-04-2012 дата публикации

Device for simultaneously processing the circumference of a workpiece with laser beams

Номер: US20120085740A1
Автор: Andreas Zintl, Jan Langebach, Martin Griebel, Werner Wollmann
Принадлежит: JENOPTIK Automatisierungstechnik GmbH

A device for simultaneously processing a circumference of a workpiece includes a plurality of laser-lens modules and a waveguide. The modules each include a diode laser and a lens system and is configured to emit a laser beam radially in a shared radiation plane. The waveguide includes a lower part and an upper part that together form a cavity enclosing the radiation plane. The laser-lens modules are configured so that the laser is reflected repeatedly between a bottom surface and a cover surface and propagates in an unaffected manner within the radiation plane so as to form a beam spot that strikes the workpiece with a homogeneous energy distribution. The beam spot has a height based on a distance between the surfaces and a width based on a divergence angle in the radiation plane and a distance of the module from the workpiece surface.

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Номер записи: 9
12-04-2012 дата публикации

Container with a plurality of reaction spaces and electrodes

Номер: US20120087841A1
Автор: Andreas Heinze, Andreas WIRTH, Herbert Mueller-Hartmann, Ludger Altrogge, Timo Gleissner
Принадлежит: LONZA COLOGNE GMBH

The invention relates to a container ( 1 ) with at least three reaction spaces ( 2 ) which in each case have at least one electrode pair for applying an electric voltage for generating an electric field within the reaction space ( 2 ) and which are arranged geometrically in at least one row and/or electrically connected in at least one row, wherein at least one electrode ( 3, 4 ) of a reaction space ( 2 ) is a common electrode ( 3, 4 ) with at least one other reaction space ( 2 ). According to the invention n+x electrodes ( 3, 4, 5 ) are provided, wherein n is the number of reaction spaces ( 2 ), with n≧3 and x is the number of rows, with x≧1.

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Номер записи: 10
14-06-2012 дата публикации

On-The-Fly Manipulation Of Spot Size And Cutting Speed For Real-Time Control Of Trench Depth And Width In Laser Operations

Номер: US20120145686A1
Автор: Brian Johansen, David Childers, Mehmet E. Alpay
Принадлежит: Electro Scientific Industries Inc

Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.

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Номер записи: 11
16-08-2012 дата публикации

Scanned laser light source

Номер: US20120205347A1
Автор: Abhilash J. Mayur, Alexander Goldin, Dean C. Jennings, Leonid M. Tertitski, Mark Yam, Paul A. O'Brien, Vernon Behrens
Принадлежит: Applied Materials Inc

The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

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Номер записи: 12
16-08-2012 дата публикации

Laser machining apparatus with switchable laser system and laser machining method

Номер: US20120205356A1
Автор: Christoph Plüss
Принадлежит: Individual

A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.

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Номер записи: 13
06-09-2012 дата публикации

Laser processing method and laser processing device

Номер: US20120223061A1
Автор: Etsuji Ohmura, Takafumi Atsumi, Yuji Ikeda
Принадлежит: Aisin Seiki Co Ltd

A laser processing method for forming a modification region serving as a starting point of cutting inside a member to be cut along a planned cutting line by relatively moving an optical axis of a condenser lens along the planned cutting line of the member and by irradiating the member with focused laser light, wherein a plurality of cross-sectional focused spots is simultaneously formed on a section which is perpendicular to the optical axis of the condenser lens at positions having a predetermined depth from a surface of the member and which is parallel to the surface and, at that time, at least one cross-sectional focused spot of the plurality of cross-sectional focused spots is formed on a projection line of the planned cutting line onto the cross section to form one or more inside modification regions having a desired shape.

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Номер записи: 14
06-12-2012 дата публикации

Pulsed light generation method

Номер: US20120307850A1
Автор: Motoki Kakui, Shinobu Tamaoki
Принадлежит: Sumitomo Electric Industries Ltd

The present invention relates to a method of enabling generation of pulsed lights each having a narrow pulse width and high effective pulse energys. A pulse light source has a MOPA structure, and comprises a single semiconductor laser, a bandpass filter and an optical fiber amplifier. The single semiconductor laser outputs two or more pulsed lights separated by a predetermined interval, for each period given according to a predetermined repetition frequency. The bandpass filter attenuates one of the shorter wavelength side and the longer wavelength side, in the wavelength band of input pulsed lights.

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Номер записи: 15
03-01-2013 дата публикации

Laser ablation tooling via distributed patterned masks

Номер: US20130003030A1
Автор: Thomas R.J. Corrigan
Принадлежит: 3M Innovative Properties Co

A distributed patterned mask for use in a laser ablation process to image a complete pattern onto a substrate. The mask has a plurality of apertures for transmission of light and non-transmissive areas around the apertures. When the apertures for the distributed pattern are repeatedly imaged on a substrate, structures within the distributed pattern merge within different areas of the imaged pattern to create the complete pattern with distributed stitch lines in order to reduce or eliminate the stitching effect in laser ablation. The mask can also form a sparse and distributed pattern including apertures that individually form merging portions of the complete pattern and collectively form a distributed pattern.

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Номер записи: 16
21-02-2013 дата публикации

Serial irradiation of a substrate by multiple radiation sources

Номер: US20130043412A1
Автор: Brent A. Anderson, Edward J. Nowak
Принадлежит: International Business Machines Corp

A system for configuring and utilizing J electromagnetic radiation sources (J≧2) to serially irradiate a substrate. Each source has a different function of wavelength and angular distribution of emitted radiation. The substrate includes a base layer and I stacks (I≧2; J≦I) thereon. P j denotes a normally incident energy flux on each stack from source j. In each of I independent exposure steps, the I stacks are concurrently exposed to radiation from the J sources. V i and S i respectively denote an actual and target energy flux transmitted into the substrate via stack i in exposure step i (i=1, . . . , I). t(i) and P t(i) are computed such that: V i is maximal through deployment of source t(i) as compared with deployment of any other source for i=1, . . . , I; and an error E being a function of |V 1 −S 1 |, |V 2 −S 2 |, . . . , |V I −S I | is about minimized with respect to P i (i=1, . . . , I).

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Номер записи: 17
21-03-2013 дата публикации

Laser machining device and laser machining method

Номер: US20130068742A1
Автор: Haruyasu Ito, Naoya Matsumoto, Norihiro Fukuchi, Takashi Inoue, Yuu Takiguchi
Принадлежит: Hamamatsu Photonics KK

A laser machining device 1 comprises a laser light source 10 , a spatial light modulator 20 , a controller 22 , a converging optical system 30 , and a shielding member 40 . The phase-modulating spatial light modulator 20 inputs a laser beam outputted from the laser light source 10 , displays a hologram modulating a phase of the laser beam at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated laser beam. The controller 22 causes the spatial light modulator 20 to display a plurality of holograms sequentially, lets the converging optical system 30 converge the laser beam outputted from the spatial light modulator 20 at converging positions having a fixed number of M, selectively places N converging positions out of the M converging positions into a machining region 91 , and machines an object to be machined 90.

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Номер записи: 18
04-04-2013 дата публикации

Method and apparatus for irradiating a semiconductor material surface by laser energy

Номер: US20130082195A1
Автор: Bruno Godard, Cyril Dutems, Herve Besaucele
Принадлежит: EXCICO FRANCE

An apparatus for irradiating semiconductor material is disclosed having, a laser generating a primary laser beam, an optical system and a means for shaping the primary laser beam, comprising a plurality of apertures for shaping the primary laser beam into a plurality of secondary laser beams. Wherein the shape and/or size of the individual apertures corresponds to that of a common region of a semiconductor material layer to be irradiated. The optical system is adapted for superposing the secondary laser beams to irradiate said common region. Further, the use of such an apparatus in semiconductor device manufacturing is disclosed.

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Номер записи: 19
02-05-2013 дата публикации

LASER CRYSTALLIZATION AND POLYCRYSTAL EFFICIENCY IMPROVEMENT FOR THIN FILM SOLAR

Номер: US20130109122A1
Автор: MOFFATT STEPHEN
Принадлежит:

Apparatus and methods of thermally processing semiconductor substrates are disclosed. Aspects of the apparatus include a source of intense radiation and a rotating energy distributor that distributes the intense radiation to a rectifier. The rectifier directs the radiation toward the substrate. Aspects of the method include using a rotating energy distributor to distribute pulsed energy to a substrate for processing. The rotational rate of the energy distributor is set based on the pulse repetition rate of the energy source. A substrate may be continuously translated with respect to the energy distributor at a rate set based on the pulse repetition rate of the energy source. 1. An apparatus for thermal processing of semiconductor substrates , comprising:a source of a rectangular laser light field;a rotating polygonal mirror disposed in an optical path of the rectangular laser light field and generating a plurality of reflected laser pulses having a rectangular shape and angularly distributed across a reflection field; anda rectifier disposed across the reflection field and above a work surface, and having one or more light-directing elements that direct the rectangular laser pulses from the reflection field toward the work surface.2. The apparatus of claim 1 , wherein the rectifier is a linear member disposed along an axis perpendicular to the optical path of the laser light field incident on the rotating polygonal mirror.3. The apparatus of claim 2 , wherein the rectifier comprises a plurality of optical elements.4. The apparatus of claim 2 , wherein the work surface comprises a conveyor movable in a direction substantially parallel to the optical path of the laser light incident on the rotating polygonal mirror.5. The apparatus of claim 3 , wherein the rectifier comprises a plurality of mirrors.6. The apparatus of claim 5 , wherein the rectifier further comprises a plurality of lenses.7. The apparatus of claim 6 , wherein each of the plurality of lenses has an ...

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Номер записи: 20
30-05-2013 дата публикации

Optical irradiation device for a system for producing three-dimensional work pieces by irradiating powder layers of a powdered raw material using laser radiation

Номер: US20130134637A1
Автор: Andreas Wiesner, Dieter Schwarze, Henner Schoeneborn
Принадлежит: SLM Solutions Group AG

An optical irradiation device is provided which includes a multimode optical fiber suitable for the central wavelength of a beam of light having a first beam profile which enters through an input connection for multimode guidance; a switching device, which can be switched between a first and second light conducting state and is configured to conduct the beam of light entering through the input connection in the first light conducting state to an output connection, such that the beam of light has the first beam profile on emerging from the output connection, and guides the beam of light entering the input connection to the output connection by the multimode optical fiber in the second light conducting state, so that the beam of light has a second beam profile different from the first beam profile on emerging from the output connection by the multimode guidance in the multimode optical fiber.

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Номер записи: 21
20-06-2013 дата публикации

Fibre optic laser machining equipment for etching grooves forming incipient cracks

Номер: US20130153554A1
Автор: Bruno Frei, Rudolf Von Niederhaeusern, Ulrich Duerr
Принадлежит: Rofin Lasag AG

A laser machining equipment for etching grooves in a wall of a mechanical part, or in a connecting rod for a spark ignition engine, includes a fiber optic laser device arranged to supply laser pulses. The fiber optic laser device is controlled so that laser pulses have a peak power of more than 400 W and at least two times greater than maximum mean power of the laser device, and duration of the laser pulses is below or within the nanosecond range of 1 ns to 1000 ns. The fiber optic laser device can be controlled in a quasi continuous wave (QCW) mode, or can be controlled in a Q-switch mode. The selected operating modes increase machining efficiency and produce a groove with an optimum transverse profile, particularly with a small mean radius of curvature at a bottom of the groove which then allows precise subsequent fracturing of the mechanical part with less force.

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Номер записи: 22
18-07-2013 дата публикации

LASER CUTTING SYSTEM AND METHODS FOR CREATING SELF-RETAINING SUTURES

Номер: US20130180966A1
Автор: "DAgostino William L.", Conner Jacob D., Dickey Fred M., Drubetsky Lev, Gross Jeffrey M., Naimagon Alexander, Whitworth Kevin R., Woolsey Ryan T.
Принадлежит:

A laser-machining system and method is disclosed for forming retainers on a suture thread. The laser system is preferably a femtosecond laser system which is capable of creating submicron features on the suture thread while preserving strength of the suture thread. The laser-machining system enables creation of retainers and self-retaining suture systems in configurations which are difficult and/or impossible to achieve using mechanical cutting technology. 1. A method for making a self-retaining suture comprising;(a) providing a suture thread having a surface;(b) identifying a first volume of suture material on the surface of the thread;(c) identifying a second volume of suture material from within the first volume of suture material;(d) directing a laser beam at the suture thread to ablate all of the suture material within the first volume of suture material with the exception of the second volume of suture material whereby the second volume of suture material forms a tissue retainer protruding from laser cut surface of the suture thread; and(e) repeating steps (b), (c) and (d) to generate a plurality of tissue retainers protruding from the suture thread.2. The method of claim 1 , wherein step (c) comprises identifying a second volume of suture material from within the first volume of suture material the second volume being less than 50% of the first volume.3. The method of claim 1 , wherein step (c) comprises identifying a second volume of suture material from within the first volume of suture material the second volume being less than 25% of the first volume.4. The method of claim 1 , wherein:step (c) comprises identifying a conical subvolume of suture material from within the volume of suture material wherein the subvolume of suture material; andstep (d) comprises directing a laser beam at the suture thread to ablate all of the suture material within the selected volume of suture material with the exception of the conical subvolume of suture material whereby the ...

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Номер записи: 23
25-07-2013 дата публикации

LASER PROCESSING MACHINE

Номер: US20130186871A1
Автор: Kato Etsushi, Matsumoto Junichi, Nishi Norio, Suzuki Masami, Tokuoka Satoshi, YONEYAMA Nobutaka
Принадлежит: KATAOKA CORPORATION

A processing machine includes mirrors and to reflect a beam L oscillated from a laser oscillator to a predetermined surface on which a workpiece is arranged, optical axis operating mechanisms and to position an optical axis of the beam L at a desired target irradiation position by changing directions of the mirrors and, a camera sensor to capture an image of the target irradiation position and its periphery reflected in the mirror, and an error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanisms and an actual position of the optical axis of the beam L in the predetermined surface by referring to the image captured by the camera sensor. A correction amount to the optical axis operating mechanisms and is determined based on the error to irradiate the target irradiation position with the beam L during processing. 1. A laser processing machine to apply processing by irradiating a workpiece with a laser beam , comprising:a mirror to reflect the laser beam oscillated from a laser oscillator to a predetermined surface on which the workpiece is arranged;an optical axis operating mechanism to position an optical axis of the laser beam at a desired target irradiation position in the predetermined surface by changing a direction of the mirror;a camera sensor to capture an image of the target irradiation position and its periphery in the predetermined surface reflected in the mirror; andan error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanism and an actual position of the optical axis of the laser beam in the predetermined surface, by referring to the image captured by the camera sensor,wherein a correction amount to be instructed to the optical axis operating mechanism can be determined based on the error in order to irradiate the target irradiation position with the laser beam during processing.2. A laser ...

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Номер записи: 24
08-08-2013 дата публикации

LASER BEAM MACHINING DEVICE AND A PROCESS OF LASER MACHINING COMPRISING A SINGLE LENS FOR LIGHT FOCUSSING

Номер: US20130200052A1
Автор: Wittwer Stefan
Принадлежит: BYSTRONIC LASER AG

A laser beam machining device () is provided, in which unfocused light (A) from a light exit point (B) is radiated onto a single lens (), where in the lens () focuses the laser light (A) and guides it onto a machining point of a work piece (). A distance (m, m) between the lens () and the light exit point (B) and a distance (l, l) between the lens () and the machining point of the workpiece () and a distance between the light exit point (B) and the aforementioned machining point can be varied. Moreover, a process of usage of a laser beam machining device () is provided. 119-. (canceled)20. A laser machining apparatus comprising:a light exit outlet configured to emit unfocused laser light;a lens situated in the direction of radiation of laser light emitted by said light exit outlet, said lens separated by a first controllably-variable distance from said light exit outlet;a laser machining locus disposed after said lens, said laser machining locus separated from said lens by a second controllably-variable distance, said laser machining locus separated from light exit outlet by a third controllably-variable distance;a drive system configured to controllably adjust the first controllably-variable distance, the second controllably-variable distance, and the third controllably-variable distance; andsaid drive system being operatively connected to said lens and to said light exit outlet.21. The laser machining apparatus as claimed in wherein:said lens is aspheric.22. A laser machining apparatus as claimed in further comprising:at least one aspheric surface on said lens, said at least one aspheric surface being shaped with an even asphericity.23. The laser machining apparatus as claimed in wherein:said lens is made of ZnS.24. The laser machining apparatus as claimed in wherein:the Strehl ratio is greater than 0.9 over operational ranges of the first, second, and third controllably-variable distances.25. The laser machining apparatus as claimed in wherein:said drive system ...

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Номер записи: 25
08-08-2013 дата публикации

SINGLE-SCAN LINE-SCAN CRYSTALLIZATION USING SUPERIMPOSED SCANNING ELEMENTS

Номер: US20130201634A1
Автор: Im James S., VAN DER WILT Paul C.
Принадлежит: COLUMBIA UNIVERSITY

The disclosure relates to methods and systems for single-scan line-scan crystallization using superimposed scanning elements. In one aspect, the method includes generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film; directing a first laser beam pulse onto a thin film using a first beam path; advancing the thin film at a constant first scan velocity in a first direction; and deflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film, wherein the second scan velocity is less than the first scan velocity. 1. A method for processing a thin film , the method comprising:generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film;directing a first laser beam pulse onto a thin film using a first beam path;advancing the thin film at a constant first scan velocity in a first direction; anddeflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film,wherein the second scan velocity is less than the first scan velocity.2. The method of claim 1 , wherein each laser beam pulse has a fluence selected to completely melt the thin film.3. The method of claim 1 , wherein the crystallization comprises a sequential lateral solidification (SLS) process.4. The method of claim 1 , wherein each laser beam pulse has a fluence selected to partially melt the thin film.5. The method of claim 1 , wherein the crystallization ...

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Номер записи: 26
08-08-2013 дата публикации

Microfluidic device for generating neural cells to simulate post-stroke conditions

Номер: US20130203086A1
Автор: Anilkumar Harapanahalli Achyuta, Chris Katnik, Javier Cuevas, Shankar Sundaram
Принадлежит: Charles Stark Draper Laboratory Inc, UNIVERSITY OF SOUTH FLORIDA

This application provides devices for modeling ischemic stroke conditions. The devices can be used to culture neurons and to subject a first population of the neurons to low-oxygen conditions and a second population of neurons to normoxic conditions. The neurons are cultured on a porous barrier, and on the other side of the barrier run one or more fluid-filled channels. By flowing fluid with different oxygen levels through the channels, one can deliver desired oxygen concentrations to the cells nearest those channels.

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Номер записи: 27
22-08-2013 дата публикации

LASER MACHINING APPARATUS AND LASER MACHINING CONTROL DEVICE

Номер: US20130218321A1
Автор: Kino Hiroshi, Koshimae Toshiki, Kumamoto Kenji, Kurokawa Hiroaki, Miyamoto Naoki, NISHIDA Satoshi
Принадлежит: Mitsubishi Electric Corporation

The laser machining apparatus includes a transmission fiber that transmits laser light emitted from a laser oscillator through the fiber, a machining head that emits the laser light, which is sent from the transmission fiber, vertically to a main surface of a machining object and sends reflected light, which is reflected coaxially with the laser light by the machining object, to the transmission fiber, a reflected light monitoring unit that detects a reflected light intensity of the reflected light sent from the transmission fiber, and a control device that controls the laser oscillator and the machining head, in which the control device includes a determining unit that, at a time when laser machining is started, determines whether the machining object corresponds to a machining condition or not in laser machining on the basis of the reflected light intensity. 18.-. (canceled)9. A laser machining apparatus comprising:a transmission fiber that transmits laser light emitted from a laser oscillator through the fiber;a machining head that emits the laser light, which is sent from the transmission fiber, vertically to a main surface of a machining object and sends reflected light, which is reflected coaxially with the laser light by the machining object, to the transmission fiber;a reflected-light-intensity detecting unit that detects a reflected light intensity of the reflected light sent from the transmission fiber; anda control device that controls the laser oscillator and the machining head, whereinthe control device includes a determining unit that, at a time when laser machining is started, determines whether the machining object corresponds to a machining condition in laser machining or not on a basis of the reflected light intensity, andthe determining unit compares a measurement time measured from when the piercing is started to when the reflected light intensity decreases to a predetermined value with a first specified range relating to a measurement time ...

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Номер записи: 28
26-09-2013 дата публикации

Piezoelectric substrate for the study of biomolecules

Номер: US20130249530A1
Автор: Minrui Yu, Robert H. Blick
Принадлежит: WISCONSIN ALUMNI RESEARCH FOUNDATION

A method of forming extremely small pores in a substrate may be used to produce, for example, an apparatus for the study of biological molecules, by providing a small pore in a piezoelectric substrate having electrodes, the latter that may be energized to change the pore dimensions.

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Номер записи: 29
21-11-2013 дата публикации

LASER PROCESSING HEAD, LASER PROCESSING APPARATUS, OPTICAL SYSTEM OF LASER PROCESSING APPARATUS, LASER PROCESSING METHOD, AND LASER FOCUSING METHOD

Номер: US20130306609A1
Автор: Tsubota Shuho, Watanabe Masao
Принадлежит:

A laser cutting apparatus () includes a laser processing head () that receives a laser beam emitted by a laser oscillator () and that uses a spherical lens for converging the laser beam so as to cause the intensity distribution of the laser beam to have a caldera-like shape, in which the intensity of the laser beam is higher in a peripheral area than in a central area, at the position of a workpiece (). Moreover, the laser processing head () radiates the laser beam whose focal position is displaced from the position of the workpiece () to the workpiece (). Therefore, the laser cutting apparatus () performs an inversion on the laser beam by using the spherical aberration of the spherical lens. Consequently, with a simple configuration, a laser beam whose inner area and outer area are inverted at the position of the workpiece () can be generated, and the processing direction for processing the workpiece () is not limited. 1. A laser processing head included in a laser processing apparatus that processes a workpiece by irradiating the workpiece with a laser beam ,wherein at least one of a spherical lens and an aspherical lens capable of generating spherical aberration, which are provided for converging the laser beam, causes an intensity distribution of the laser beam to have a caldera-like shape, in which the intensity of the laser beam is higher in a peripheral area than in a central area, at a position of the workpiece, and the laser beam whose focal position is displaced from the position of the workpiece is radiated onto the workpiece.2. The laser processing head according to claim 1 , wherein the intensity distribution of the laser beam at the position of the workpiece is ring-shaped.3. The laser processing head according to wherein the intensity distribution of the laser beam at the position of the workpiece is non-ring-shaped.4. The laser processing head according to claim 3 , wherein the intensity distribution of the laser beam at the position of the workpiece ...

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Номер записи: 30
05-12-2013 дата публикации

LASER MACHINING APPARATUS

Номер: US20130319985A1
Автор: Nomaru Keiji
Принадлежит: DISCO CORPORATION

A laser machining apparatus includes a chuck table for holding a workpiece, and an irradiation unit which irradiates a laser beam upon the workpiece held on the chuck table. The laser beam irradiation unit includes a condenser which condenses the laser beam and irradiates the condensed laser beam upon the workpiece held on the chuck table. The condenser includes first and second condenser lenses arrayed in series in an advancing direction of the laser beam, a first moving unit having a first driving source for moving the first condenser lens in a first direction perpendicular to an optical axis of the first condenser lens, and a second moving unit having a second driving source for moving the second condenser lens in a second direction perpendicular to the first direction. 1. A laser machining apparatus , comprising:workpiece holding means for holding a workpiece; andlaser beam irradiation means including laser beam oscillation means for oscillating a laser beam, and a condenser for condensing the laser beam oscillated by the laser beam oscillation means and irradiating the condensed laser beam upon the workpiece held on the workpiece holding means; first and second condenser lenses arrayed in series in an advancing direction of the laser beam,', 'first moving means having a first driving source for moving the first condenser lens in a first direction perpendicular to an optical axis of the first condenser lens, and', 'second moving means having a second driving source for moving the second condenser lens in a second direction perpendicular to the first direction, and, 'wherein the condenser includes'} 'power supplying means for supplying power to the first driving source of the first moving means and the second driving source of the second moving means.', 'the laser machining apparatus further comprises2. The laser machining apparatus according to claim 1 , wherein the first driving source and the second driving source are each configured from a piezoelectric ...

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Номер записи: 31
19-12-2013 дата публикации

LASER MACHINE, LASER MACHINE SYSTEM

Номер: US20130334183A1
Автор: Paganelli Dino Cataldo
Принадлежит:

A laser machine (), in particular for drilling, cutting, welding or engraving, comprising at least one laser light source () for generating a laser beam () and an optical system () to guide and/or manipulate the laser beam (), whereby the optical system () comprises at least one tool (), in particular an optical lens () or a nozzle, which is attached to an interchangeable tool holder (). It is provided that a guiding system () for the tool holder () is configured such that the tool holder () can only be slid sideways into or out of a tool bay () provided by the laser machine (), the guiding system () comprising an operable locking system () for restraining the movement of the tool holder () in the tool bay (). 1. A laser machine comprising at least one laser light source for generating a laser beam , an optical system to guide and/or manipulate the laser beam , the optical system comprises at least one tool , attached to an interchangeable tool holder , a guiding system for the tool holder is configured such that the tool holder can only be slid sideways into or out of a tool bay provided by the laser machine , the guiding system comprising an operable locking system for restraining the movement of the tool holder in the tool bay.2. A laser machine according to claim 1 , wherein the at least one tool is an optical lens.3. A laser machine according to claim 1 , wherein the at least one tool is a nozzle.4. A laser machine according to claim 1 , wherein the guiding system comprises at least one guiding rail attached to one of the tool holder and the tool bay and at least one guiding slot to engage with the guiding rail attached to the other of the tool bay and the tool holder.5. A laser machine according to claim 1 , wherein the locking system comprises at least one moveable locking piston and/or at least one operable locking magnet.6. A laser machine according to claim 5 , wherein the locking piston is actuated by compressed air claim 5 , wherein movement of the tool ...

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Номер записи: 32
26-12-2013 дата публикации

Laser reinforced direct bonding of optical components

Номер: US20130344302A1
Автор: David HÉLIE, Fabrice Lacroix, Real Vallee
Принадлежит: Individual

A method for the laser reinforced direct bonding of two optical components having a respective bonding surface and a reinforced optical assembly made thereby are provided. The method includes a first step of assembling the two optical components by direct bonding of their respective bonding surface together, thereby defining a direct-bonded interface therebetween. The method further includes a second step of reinforcing the direct-bonded interface with a weld seam including at least one substantially continuous reinforcing weld line forming a dosed shape enclosing a sealed direct-bonded region. Each weld line is inscribed by focusing ultrashort laser pulses at the direct-bonding interface so as to generate non-linear optical phenomena inducing a localized junction between the two optical components. Advantageously, embodiments of the present invention provide reinforced optical assemblies exhibiting hermetic and mechanically resistant bonds over a large area as well as negligible alteration of their optical transmission properties.

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Номер записи: 33
02-01-2014 дата публикации

Systems and methods for processing thin films

Номер: US20140001164A1
Автор: James S. Im
Принадлежит: Columbia University of New York

Methods and systems for processing a thin film are disclosed. Thin films are loaded onto two different loading fixtures, laser beam pulses are split into first and second laser beam pulses, the thin film loaded on one loading fixture is irradiated with the first laser beam pulses to induce crystallization while the thin film loaded on the other loading fixture is irradiated with the second laser beam pulses. At least a portion of the thin film loaded on the first and second loading fixtures is irradiated. The laser source system includes first and second laser sources and an integrator that combines the laser beam pulses to form combined laser beam pulses. The methods and system further utilize additional loading fixtures for processing additional thin film samples. The irradiation of additional thin film samples can be performed while thin film samples are being loaded onto the remaining loading fixtures.

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Номер записи: 34
09-01-2014 дата публикации

Method for partitioning and incoherently summing a coherent beam

Номер: US20140009829A1
Автор: Bruce E. Adams, Dean Jennings, Jiping Li, Samuel C. Howells, Stephen Moffatt, Timothy N. Thomas
Принадлежит: Applied Materials Inc

A method and apparatus for decorrelating coherent light from a light source, such as a pulsed laser, in both time and space in an effort to provide intense and uniform illumination are provided. For some embodiments employing a pulsed light source, the output pulse may be stretched relative to the input pulse width. The methods and apparatus described herein may be incorporated into any application where intense, uniform illumination is desired, such as pulsed laser annealing, welding, ablating, and wafer stepper illuminating.

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Номер записи: 35
16-01-2014 дата публикации

INFINITE THICKNESS LASER PROCESSING SYSTEM

Номер: US20140014634A1
Автор: BOGGERI ANDREW M., LIU HENRY J.
Принадлежит: FULL SPECTRUM LASER LLC

A laser material processing system comprises: a housing defining an engraving chamber, an xy laser beam steering system, and a non-telescoping sliding focus mechanism. The housing includes a removable bottom panel that allows processing of workpieces that exceed dimensions of the engraving chamber and allows stacking of the system on modular attachments for specialized functions. The focus mechanism includes a carriage mirror subassembly attached to the x-axis carriage, a sliding member moveably attached to the carriage mirror subassembly, and a focusing lens subassembly attached perpendicularly to the lower end of the sliding member. The carriage mirror subassembly and the focusing lens subassembly are configured to receive and focus a laser beam to a focal point. The focusing lens subassembly is adjusted along a z-axis by disengaging the locking component and vertically sliding the sliding member and is locked into a position by engaging the locking component with the sliding member. 1. A laser processing system comprising:a housing defining an engraving chamber; the xy laser beam steering system comprising', 'a first y-axis rail,', 'a second y-axis rail parallel to the first y-axis rail,', 'a first y-axis carriage moveably mounted to the first y-axis rail,', 'a second y-axis carriage moveably mounted to the second x-axis rail,', 'an x-axis rail perpendicular to both the first y-axis rail and the second y-axis rail wherein a first end of the x-axis rail is adjoined to the first y-axis carriage and a second end of the x-axis rail is adjoined to the second y-axis carriage, and', 'an x-axis carriage moveably mounted to the x-axis rail; and, 'an xy laser beam steering system located inside the engraving chamber,'} a carriage mirror subassembly attached to the x-axis carriage,', a linear guiding component and', 'a locking component, and, 'a sliding member moveably attached to the carriage mirror subassembly, the sliding member comprising'}, 'a focusing lens subassembly ...

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Номер записи: 36
06-02-2014 дата публикации

LASER PROCESSING APPARATUS

Номер: US20140034624A1
Автор: Nomaru Keiji
Принадлежит: DISCO CORPORATION

A laser processing apparatus has an optical transmitting unit for guiding a laser beam to a focusing unit. The optical transmitting unit includes a focusing lens for focusing the laser beam, an optical fiber unit for inputting the focused laser beam and guiding it to the focusing unit. The optical fiber unit includes an LMA fiber for inputting the focused laser beam. The LMA fiber has a large-diameter core covered with a cladding, a transmitting fiber provided by an SM fiber or a PM fiber. The transmitting fiber has a small-diameter core covered with a cladding, the small-diameter core having a diameter corresponding to the wavelength of the laser beam oscillated by the laser oscillator. A connector connects the LMA fiber and the transmitting fiber so that these fibers are axially aligned with each other. 1. A laser processing apparatus comprising:a chuck table for holding a workpiece; andlaser beam applying means for applying a laser beam to said workpiece held on said chuck table, said laser beam applying means including a laser oscillator for oscillating said laser beam, focusing means for focusing said laser beam oscillated by said laser oscillator and applying said laser beam focused to said workpiece held on said chuck table, and optical transmitting means for guiding said laser beam oscillated by said laser oscillator to said focusing means;said optical transmitting means including a focusing lens for focusing said laser beam oscillated by said laser oscillator and optical fiber means for inputting said laser beam focused by said focusing lens and guiding said laser beam to said focusing means; a large mode area fiber for inputting said laser beam oscillated by said laser oscillator and focused by said focusing lens, said large mode area fiber having a large-diameter core covered with a cladding,', 'a transmitting fiber provided by a single mode fiber or a polarization maintaining fiber, said transmitting fiber having a small-diameter core covered with a ...

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Номер записи: 37
13-02-2014 дата публикации

CELL CULTIVATION CONTAINER AND CELL CULTURING APPARATUS

Номер: US20140045252A1
Автор: Kobayashi Toyoshige, Matsuoka Shizu, Nakajima Ryota, Nozaki Takayuki
Принадлежит: Hitachi, Ltd.

Provided is a cell cultivation container equipped with electrodes, which enables automatic culturing, observation of automatically cultured cells, and measurement of electrical resistances. A circular electrode () is arranged on a base section or a side surface of a frame body () of a cell cultivation container, in such a manner that allows observation of cells. Additionally, a rod-shaped electrode () is arranged on a lid section () of the cell cultivation container, in such a manner that allows observation of cells. In an alternative configuration, the cell cultivation container has a flow channel () made of an electrically conductive material. An alternating current generator () is connected between the electrode () and the electrode (), and the transepithelial electrical resistances of cells are measured during culturing. This configuration enables automatic culturing, observation of automatically cultured cells, and measurement of electrical resistances. 1. A cell culture container for holding and culturing a cell , the cell culture container comprising:a frame body that holds culture liquid for culturing the cell;a lid that is detachably mounted on the frame body;a first electrode mounted on a bottom or on a side face of the frame body and having a shape enabling a cell observation, anda second electrode mounted on the lid and having a shape enabling a cell observation.2. The cell culture container according to claim 1 ,wherein the first electrode is composed of a circular electrode formed on the bottom of the frame body, andthe second electrode is composed of a rod electrode formed on the lid.3. The cell culture container according to claim 1 ,wherein the lid is formed with a flow channel from which the culture liquid is introduced to the frame body,the first electrode is composed of a circular electrode formed on the bottom of the frame body, andthe second electrode is configured to be capable of energizing the flow channel formed on the lid.4. The cell ...

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Номер записи: 38
06-03-2014 дата публикации

Leads incorporating a laser processed electrode

Номер: US20140067031A1
Автор: Eric M. Petersen, Steven R. Larsen
Принадлежит: Cardiac Pacemakers Inc

Medical devices may include an electrode that has been processed to increase its surface area. In some cases, an electrode may be processed using an ultrafast laser to produce an electrode surface that includes macrostructures formed within the electrode surface and nanostructures formed on the macrostructures. The nanostructures may be formed of material that was removed from the electrode surface in forming the macrostructures.

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Номер записи: 39
20-03-2014 дата публикации

LASER PROCESSING APPARATUS

Номер: US20140076869A1
Автор: Lee Choong-Ho, Lee Doh-Hyoung, Park Tong-Jin, Yun Sung-Sik
Принадлежит: Samsung Display Co., Ltd.

A laser processing apparatus includes a laser generator for generating laser beams, a diffraction optic element for dividing the laser beam generated by the laser generator into a plurality of sub-laser beams, and a beam number controller for controlling the number of the plurality of sub-laser beams. Accordingly, the diffractive optic element that splits a laser beam generated by the laser beam generator into a plurality of sub-laser beams and the beam number controller that controls the number of sub-laser beams are provided so that the processing speed of a processing target can be improved and, at the same time, the number of laser beams can be promptly controlled, thereby promptly forming various patterns of the processing target. 1. A laser processing apparatus , comprising:a laser generator for generating laser beams;a diffraction optic element for dividing the laser beam generated by the laser generator into a plurality of sub-laser beams; anda beam number controller for controlling a number of the plurality of sub-laser beams.2. The laser processing apparatus of claim 1 , the beam number controller comprising a beam blocking device for partially blocking the plurality of sub-laser beams and a location controller for controlling a location of the beam blocking device.3. The laser processing apparatus of claim 2 , the location controller comprising a horizontal location controller for controlling a horizontal location of the beam blocking device and a vertical location controller for controlling a vertical location of the beam blocking device.4. The laser processing apparatus of claim 3 , the beam blocking device comprising a horizontal blocking unit and a vertical blocking unit disposed perpendicular to the horizontal blocking unit.5. The laser processing apparatus of claim 4 , the vertical blocking unit being connected to an end of the horizontal blocking unit.6. The laser processing apparatus of claim 5 , the beam blocking device being formed in a shape of ...

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Номер записи: 40
20-03-2014 дата публикации

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

Номер: US20140076870A1
Автор: HIRANO Koji, Imai Hirofumi
Принадлежит: NIPPON STEEL & SMITOMO METAL CORPORATION

[Object] 122-. (canceled)23. A laser processing apparatus which processes a workpiece by guiding laser beams emitted from a laser oscillator , focusing the laser beams , and irradiating a surface of the workpiece with the focused laser beams , the laser processing apparatus comprising:at least one laser oscillator configured to emit the laser beams;a plurality of optical fibers configured to transmit the emitted laser beams; andat least one optical element configured to focus the laser beams emitted from the optical fibers and irradiate the surface of the workpiece with the focused laser beams,wherein, at output ends of the optical fibers, the output ends of the plurality of optical fibers are placed in one or a plurality of ring shapes, andwherein laser beams transmitted through the plurality of optical fibers placed on at least an outermost ring of the ring shapes each have a linear polarization, and polarization directions of the linearly polarized laser beams emitted from the output ends of the plurality of optical fibers are arranged radially around a center of the outermost ring.24. The laser processing apparatus according to claim 23 , wherein one of the optical fibers is further placed at a central part of the ring.25. The laser processing apparatus according to claim 23 ,wherein the output ends of the plurality of optical fibers are placed in a plurality of ring shapes which share a common center, andwherein, through the optical fibers placed in the ring shapes inside the outermost ring, polarized laser beams are transmitted, the polarized laser beams having polarization directions arranged radially around a center of the ring.26. The laser processing apparatus according to claim 23 ,wherein the output ends of the plurality of optical fibers are placed in a plurality of ring shapes which share a common center, andwherein, through the optical fibers placed in the ring shapes inside the outermost ring, laser beams are transmitted, the laser beams being non- ...

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Номер записи: 41
02-01-2020 дата публикации

GOLF CLUB HEAD AND MANUFACTURING METHOD FOR SAME

Номер: US20200001145A1
Автор: AGUAYO Roberto, Brunski Jeffrey D., Daraskavich Matthew R., PARK Sharon J.
Принадлежит: SUMITOMO RUBBER INDUSTRIES, LTD.

A golf club head includes a heel portion, a toe portion, a hosel, and a striking face. The striking face includes a plurality of scorelines each having an average depth no less than about 0.10 mm, a plurality of micro-grooves each having an average depth no greater than about 0.010 mm, and a plurality of textured surface treatment regions superimposed on the micro-grooves so as to at least partially intersect the micro-grooves. 1. A method comprising:(a) mechanically milling a striking face of a golf club head having a central region and a toe region thereby forming a plurality of generally parallel arcuate grooves that extend at least partially into the toe region;(b) forming a plurality of scorelines in the striking face, the scorelines extending horizontally and comprising an average scoreline width, a scoreline heel-ward extent that is coincident with a central region heel-ward extent, and a scoreline toe-ward extent that is coincident with a central region toe-ward extent; and(c) forming by material removal a plurality of horizontally-oriented lines at least in the central region interspersed between, and spaced from, the plurality of scorelines, the plurality of horizontally-oriented lines having an average line width less than the average scoreline width.2. The method of claim 1 , further comprising claim 1 , subsequent to step (a) and prior to step (c) claim 1 , applying a media blast to a portion of the striking face.3. The method of claim 1 , wherein the step (c) comprises forming the horizontally-oriented lines as to be substantially confined to the central region.4. The method of claim 1 , wherein the step (c) further comprises forming the plurality of horizontally-oriented lines by mechanical milling.5. The method of claim 1 , wherein the step (c) comprises forming the horizontally-oriented lines at a concentration of no less than 2 lines between each adjacently-located pair of scorelines of the plurality of scorelines.6. The method of claim 5 , wherein ...

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Номер записи: 42
07-01-2021 дата публикации

LASER DRILLING AND MACHINING ENHANCEMENT USING GATED CW AND SHORT PULSED LASERS

Номер: US20210001427A1
Автор: BUDE Jeffrey D., Guss Gabriel Mark, KELLER Wesley John, LY Sonny S., Negres Raluca A., Rubenchik Alexander M., SHEN Nan
Принадлежит: Lawrence Livermore National Security, LLC

The present disclosure relates to a laser system for processing a material. The system may make use of a laser configured to intermittently generate a first laser pulse of a first duration and a first average power, at a spot on a surface of the material being processed, and a second laser pulse having a second duration and a second peak power. The second duration may be shorter than the first duration by a factor of at least 100, and directed at the spot. The second laser pulse is generated after the first laser pulse is generated. The first laser pulse is used to heat the spot on the surface of the material, while the second laser pulse induces a melt motion and material ejection of molten material from the melt pool. 1. A laser system for processing a material , the laser system comprising:a laser configured to intermittently generate a first laser pulse of a first duration and a first average power, at a spot on a surface of the material being processed, and a second laser pulse having a second duration and a second peak power, the second duration being shorter than the first duration by a factor of at least 1000, and directed at the spot, and the second laser pulse being generated after the first laser pulse is generated; andthe first laser pulse from the laser is configured to at least heat the spot on the surface of the material, while the second laser pulse induces material ejection from the spot.2. The laser system of claim 1 , wherein the laser comprises:a gated continuous wave (CW) laser; anda pulsed laser.3. The laser system of claim 1 , further comprising a controller for controlling the laser.4. The laser system of claim 2 , further comprising a controller for controlling the CW laser and the pulsed laser.5. The laser system of claim 1 , wherein the first laser pulse has a duration of about 10 μs to 500 μs.6. The laser system of claim 1 , wherein the second laser pulse has a duration of about 1 μs to 100 μs.7. The laser system of claim 1 , wherein the ...

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Номер записи: 43
07-01-2021 дата публикации

CURVED QUASI-NON-DIFFRACTING LASER BEAMS FOR LASER PROCESSING OF TRANSPARENT WORKPIECES

Номер: US20210001430A1
Автор: Ungaro Craig John Mancusi
Принадлежит:

A method for processing a transparent workpiece comprises directing a laser beam oriented along a beam path into the transparent workpiece such that a portion of the laser beam directed into the transparent workpiece is a laser beam focal arc and generates an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece. The laser beam focal arc has a wavelength λ, a spot size w, and a Rayleigh range Zthat is greater than 2. The method of claim 1 ,wherein the curvature is defined by a line shift direction that deviates from an unaffected beam propagation direction, and{'sub': p', 'p, 'wherein the line shift direction varies in the x-direction according to a line shift function x(z) or the line shift direction varies in the y-direction according to a line shift function y(z); and'}{'sub': p', 'p, 'wherein the z-direction is the unaffected beam propagation direction and at least one of x(z) and y(z) is non-zero.'}3. The method of claim 2 , wherein the line shift function x(z) claim 2 , the line shift function y(z) claim 2 , or both comprise a hyperbola claim 2 , a parabola claim 2 , a circle claim 2 , an ellipse claim 2 , a logarithmic function claim 2 , an exponential function claim 2 , portions thereof claim 2 , or combinations thereof.4. The method of claim 2 , wherein the line shift function x(z) or the line shift function y(z) is 0.5. The method of claim 2 , wherein the defect has a central axis not aligned with the unaffected beam propagation direction.6. The method of claim 2 , wherein the unaffected beam propagation direction z is oriented at a non-normal angle of incidence to the transparent workpiece.7. The method of claim 1 , wherein the curvature is produced by impinging the laser beam on a phase-altering optical element.8. The method of claim 7 , wherein the phase-altering optical element comprises a spatial light modulator or adaptive optic.9. The method of claim 7 , wherein the phase- ...

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Номер записи: 44
07-01-2016 дата публикации

Laser processing apparatus

Номер: US20160001397A1
Автор: Cheol-woong BYUN, Tak Eun, Young-Min Park
Принадлежит: Micro Inspection Inc

The present disclosure provides a laser processing apparatus. A laser processing apparatus includes a laser generator, a laser amplifier, a chromatic dispersion tuner and an optical focusing unit. The laser generator is configured to generate ultrashort pulse laser having chirp characteristics by simultaneously generating a plurality of wavelengths. The laser amplifier is configured to amplify the laser generated by the laser generator. The chromatic dispersion tuner is configured to adjust chirp and pulse width of the laser output from the laser amplifier. The optical focusing unit is configured to irradiate a workpiece with the laser after adjusting the depth of focus of the laser with the chirp and the pulse width adjusted by the chromatic dispersion tuner.

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Номер записи: 45
05-01-2017 дата публикации

METHOD FOR JOINING DIFFERENT KINDS OF PLATES

Номер: US20170001262A1
Автор: LEE Mun Yong, SONG Mun Jong
Принадлежит:

The present invention relates to a joining method, and more specifically relates to a method for joining different kinds of plates that joins at least two plate members of which materials thereof are different from each other through laser welding. For this, a method for joining different kinds of plates according to an exemplary embodiment of the present invention may include disposing a first plate and a second plate, materials of which are different from each other, such that they are overlapped with each other, and joining the first plate and the second plate by irradiating a laser beam at a predetermined inclination angle and in a regular pattern onto the overlapped portion of the two plates. 1. A method for joining different kinds of plates , comprising:disposing a first plate and a second plate, materials thereof being different from each other, such that they are overlapped with each other; andjoining the first plate and second plate by irradiating a laser beam at a predetermine inclination angle and in a regular pattern onto the overlapped portion of the two plates.2. The method for joining different kinds of plates of claim 1 , wherein the first plate is made of aluminum and the second plate is disposed on the first plate and is made of steel of which a melting point is higher than that of the first plate.3. The method for joining different kinds of plates of claim 2 , wherein the laser beam is outputted as a regular pulse wave.4. The method for joining different kinds of plates of claim 2 , wherein a welding pool of the second plate is charged in a key hole formed on the first plate between the first plate and the second plate.5. The method for joining different kinds of plates of claim 2 , wherein the laser beam performs conduction welding that can form a welding pool on a plate member through a non-focus part.6. The method for joining different kinds of plates of claim 5 , wherein the laser beam is irradiated such that the diameter of the laser beam ...

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Номер записи: 46
02-01-2020 дата публикации

Machining Head for a Laser Machining Device

Номер: US20200001395A1
Автор: Kogel-Hollacher Markus, Schönleber Martin
Принадлежит:

A processing head for a laser processing device adapted for processing a workpiece using laser radiation has: adjustable focusing optics to focus laser radiation in a focal spot having an adjustable distance from the processing head; an optical coherence tomograph to measure a distance between the processing head and the workpiece by measuring an optical interference between measuring light reflected by the workpiece and measuring light not reflected by the workpiece; a path length modulator that can change, synchronously with and dependent on a change of the focal spot distance from the processing head, an optical path length in an optical path along which measuring light propagates; a scanning device, which deflects the laser radiation in different directions; and a control device, which i) controls a focal length of the focusing optics in such a way that the focal spot is situated at a desired location on the workpiece, ii) receives, from the coherence tomograph, information representing the distance between the processing head and the workpiece, and iii) uses information received from the coherence tomograph for a continuous correction of a positioning of the focal spot on the workpiece. 1. A processing head for a laser processing device adapted for the processing of a workpiece using laser radiation , wherein the processing head comprises;adjustable focusing optics configured to focus the laser radiation in a focal spot having an adjustable distance from the processing head;an optical coherence tomograph configured to measure a distance between the processing head and the workpiece by measuring an optical interference between measuring light, which was reflected by the workpiece, and measuring light, which was not reflected by the workpiece;a path length modulator that is configured to change, synchronously with and dependent on a change of the distance of the focal spot from the processing head, an optical path length in an optical path along which measuring ...

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Номер записи: 47
04-01-2018 дата публикации

METHOD AND APPARATUS FOR USE IN LASER SHOCK PEENING

Номер: US20180001417A1
Автор: "OLoughlin Mark E.", Dulaney Jeff, Glover Keith, May Gary, Sokol David
Принадлежит:

An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5J to about 10 J, an average power (defined as energy (J) x frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz. 130-. (canceled)31. A system comprising:a diode-pumped solid-state laser (DPSSL) oscillator configured to generate a pulsed laser beam having a first set of laser beam characteristics;a modulator configured to modify the pulsed laser beam to generate a modulated pulsed laser beam, wherein the modulated pulsed laser beam has a second set of laser beam characteristics;a multi-stage amplifier configured to modify the modulated pulsed laser beam to generate a first pulsed laser beam, wherein the first pulsed laser beam has a third set of laser beam characteristics, and further configured to modify the first pulse laser beam to generate a second pulsed laser beam, wherein the second pulsed laser beam has a fourth set of laser beam characteristics; anda beam delivery system configured to deliver the second pulsed laser beam to a target part to laser shock peen the target part.32. The system of claim 31 ,wherein the first set of laser beam characteristics comprises a first energy, a first temporal profile, and a first spatial profile;wherein the second set of laser beam characteristics comprises a second energy, a second temporal profile, and the first spatial profile;wherein the third set of laser beam characteristics comprises a third energy, a ...

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Номер записи: 48
07-01-2016 дата публикации

Method for decorating parts and decorated parts

Номер: US20160001587A1
Автор: Tokinobu SHIMADA
Принадлежит: Trinity Industrial Corp

A method for decorating a given part is designed to print designs onto a coat layer deteriorating the coat layer on the surface of the given part. In the coat layer-forming process, in spreading the metallic-coating material containing aluminum flake onto the surface of the resin compact, the coat layer is formed on the surface of it. In a laser-printing process, a laser is irradiated on the condition of being able to maintain the same state of the coat layer before and after irradiating the laser, so as to reduce the aspect ratio of the micronized-metallic powder, which is the average value of the ratio of the maximum dimension of the micronized-metallic powder to the average value of the minimum dimension of the micronized-metallic powder, which laser irradiation eventually thermally deforms the first scale-shaped micronized-metallic powder into a spherical shape in the coat layer to print designs on the film.

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Номер записи: 49
05-01-2017 дата публикации

EDGE CHAMFERING METHODS

Номер: US20170001900A1
Автор: Marjanovic Sasha, Pastel David Andrew, Piech Garrett Andrew, Quintal Jose Mario, Schillinger Helmut, Tsuda Sergio, Wagner Robert Stephen, Yeary Andrea Nicole
Принадлежит:

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange. 1. A method of chamfering a material comprising:focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction;directing the laser beam focal line into the material at a first angle of incidence to the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material;translating the material and the laser beam relative to each other, thereby laser drilling a plurality of defect lines along a first plane at the first angle within the material;directing the laser beam focal line into the material at a second angle of incidence to the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material;translating the material and the laser beam relative to each other, thereby laser drilling a plurality of defect lines along a second plane at the second angle within the material, the second plane intersecting the first plane, andseparating the material along the first plane and the second plane by applying an ion-exchange process to the material, wherein during separating of the material along the first plane and the second plane the ion-exchange process is applied to the material for time t, wherein 10 min≦t≦120 min.2. The method of claim 1 , wherein directing the laser beam focal line into the material at a first angle of incidence to the material is directed to a first surface of the material and directing the laser beam focal ...

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Номер записи: 50
13-01-2022 дата публикации

STEP-CORE FIBER STRUCTURES AND METHODS FOR ALTERING BEAM SHAPE AND INTENSITY

Номер: US20220009027A1
Автор: Chann Bien, VILLARREAL-SAUCEDO Francisco, ZHOU Wang-Long
Принадлежит:

In various embodiments, a workpiece is processed utilizing one or more output beams emitted from a step-core optical fiber and formed from one or more input beams that may have non-circular beam shapes. In various embodiments, an input beam may be a variable-power laser beam having a laser-beam numerical aperture (NA) that varies as a function of the power of the laser beam. The step-core optical fiber may have an outer core NA that is greater than or equal to the laser-beam NA at a laser power of approximately 100%, an inner core NA that is less than or equal to the outer core NA, and an inner core NA that is greater than or equal to the laser-beam NA at a power of 50%. 1. A method of processing a workpiece with a laser beam , the method comprising:providing a step-core optical fiber having an input end and an output end opposite the input end, wherein the step-core optical fiber comprises (i) an inner core having a first refractive index, (ii) surrounding the inner core, an outer core having a second refractive index smaller than the first refractive index, (iii) surrounding the outer core, a cladding having a third refractive index smaller than the second refractive index, (iv) a first inner core numerical aperture (NA) relative to the cladding, (v) a second inner core NA relative to the outer core, and (vi) an outer core NA relative to the cladding;disposing a workpiece proximate the output end of the optical fiber;directing into the input end of the optical fiber a variable-power laser beam having a laser-beam NA that varies as a function of the power of the laser beam, to thereby generate an output beam emitted from the output end of the optical fiber, wherein (i) the outer core NA is greater than or equal to the laser-beam NA at a power of approximately 100%, (ii) the second inner core NA is less than or equal to the outer core NA, and (iii) the second inner core NA is greater than or equal to the laser-beam NA at a power of 50%; andprocessing the workpiece ...

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Номер записи: 51
01-01-2015 дата публикации

Systems and methods for processing thin films

Номер: US20150004808A1
Автор: James S. Im
Принадлежит: Columbia University of New York

The present disclosure is directed to methods and systems for processing a thin film samples. In an exemplary method, semiconductor thin films are loaded onto two different loading fixtures, laser beam pulses generated by a laser source system are split into first laser beam pulses and second laser beam pulses, the thin film loaded on one loading fixture is irradiated with the first laser beam pulses to induce crystallization while the thin film loaded on the other loading fixture is irradiated with the second laser beam pulses. In a preferred embodiment, at least a portion of the thin film that is loaded on the first loading fixture is irradiated while at least a portion of the thin film that is loaded on the second loading fixture is also being irradiated. In an exemplary embodiment, the laser source system includes first and second laser sources and an integrator that combines the laser beam pulses generated by the first and second laser sources to form combined laser beam pulses. In certain exemplary embodiments, the methods and system further utilize additional loading fixtures for processing additional thin film samples. In such methods and systems, the irradiation of thin film samples loaded on some of the loading fixtures can be performed while thin film samples are being loaded onto the remaining loading fixtures. In certain exemplary methods and systems, the crystallization processing of the semiconductor thin film samples can consist of a sequential lateral solidification (SLS) process.

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Номер записи: 52
07-01-2021 дата публикации

METHODS, SYSTEMS AND COMPOSITIONS FOR FUNCTIONAL IN VITRO CELLULAR MODELS OF MAMMALIAN SYSTEMS

Номер: US20210003554A1
Автор: Hickman James J.
Принадлежит:

The present invention comprises methods, systems and compositions comprising cell culture analog systems, comprising components which optionally comprise biologically functional cells, and the components and systems function similarly to in vivo conditions. 137-. (canceled)38. A method of assessing one or more effects of varying an input variable or a cell culture characteristic on a microfluidic cell culture analog system , the method comprising:varying an input variable or a cell culture characteristic to which a microfluidic cell culture analog system is exposed, the microfluidic cell culture analog system comprising one or more organ components, each organ component comprising one or more chambers, and each organ component (i) being microfluidically coupled to one another, and (ii) comprising cells cultured on a surface;recording, over a duration of time, changes in measured electrophysiological properties, contractile properties or both in response to the varying input variable or cell culture characteristic;in which the electrophysiological properties, if measured, are measured from a first population of cells cultured on a surface comprising a microelectrode array housed in a first chamber and the contractile properties, if measured, are measured from a second population of cells cultured on a surface comprising a cantilever array housed in a second chamber;the recorded changes providing an assessment of the one or more effects of varying an input variable or a cell culture characteristic.39. The method of claim 38 , wherein the duration of time is a time period of days.40. The method of claim 38 , wherein the multiple microfluidically coupled organ components include a cardiac component claim 38 , and the method further comprises measuring at least one electrophysiological property from cardiomyocyte cells cultured on a microelectrode array of the cardiac component and simultaneously measuring at least one contractile property from cardiomyocyte cells ...

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Номер записи: 53
07-01-2021 дата публикации

METHOD FOR MANUFACTURING AN OPTICAL DEVICE

Номер: US20210003770A1
Автор: Ayi-Yovo Folly Eli, Durand Cédric, Gianesello Frédéric
Принадлежит:

An embodiment optical device includes a glass plate, a first trench disposed in the glass plate, and a second trench disposed in the glass plate. The second trench crosses the first trench, and the first trench has an open end in a first wall of the second trench. The optical device includes a waveguide disposed inside the first trench, where the waveguide is formed of a material having a refractive index different from that of the glass plate, and a mirror on a second wall of the second trench opposite the first wall and waveguide. The optical device includes an encapsulation layer filling the second trench and covering all of an upper surface of the waveguide and having a refractive index that is different from the waveguide and the glass plate.

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Номер записи: 54
20-01-2022 дата публикации

COMPACT DEVICE AND PROCESS FOR THE PRODUCTION OF NANOPARTICLES IN SUSPENSION

Номер: US20220016703A1
Автор: Barcikowski Stephan, Lau Marcus, Waag Friedrich
Принадлежит:

The invention shows a device for producing nanoparticles, the device having a pulsed laser with a scanning device for guiding the beam of the laser over a target that is fixed in a flow-through chamber. The flow-through chamber is reversibly connected to a supply line for carrier fluid, so that the flow-through chamber is exchangeable e.g. for a further flow-through chamber having a different target and/or a different dimensioning. 1. A device for the production of nanoparticles , comprising a pulsed laser , a scanning device to guide a beam of the laser , a flow-through chamber having a target support wall , a radiation-transparent wall opposite the target support wall , a supply line connected to at least one reservoir for carrier fluid and connected to the flow-through chamber , a controlled conveying device arranged in the supply line and configured to control a flow velocity of carrier fluid within the flow-through chamber in a range of 1 to 10 mm/s , wherein the laser has a maximum power of 5 W and is configured to emit pulses having a pulse energy of 0.01 to 10 mJ and a pulse duration of 0.5 to 10 ns with a repetition rate of 500 to 5000 Hz and a fluence of 0.1 to 10 J/cm.2. The device according to claim 1 , wherein the laser is configured to emit pulses having a pulse energy of 10 to 1000 μJ and a pulse duration of 0.5 to 1 ns with a repetition rate of 500 to 5000 Hz and a fluence of 0.1 to 10 J/cm.3. The device according to claim 1 , wherein a distance of the radiation-transparent wall section from a target supported by the target support wall is at maximum 5 mm.4. The device according to claim 1 , wherein the scanning device is configured to guide the laser beam at a speed of 0.1 to 10 m/s over a target supported by the target support wall.5. The device according to claim 1 , the conveying device comprising one or both of a controlled valve and a controlled pump.6. The device according to claim 1 , wherein the flow-through chamber is arranged with its ...

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Номер записи: 55
20-01-2022 дата публикации

FEMTOSECOND LASER SYSTEM FOR PROCESSING MICRO-HOLE ARRAY

Номер: US20220016729A1
Автор: JIANG Lan, LI Jiaqun, Yan Jianfeng
Принадлежит:

Provided is a femtosecond laser system for processing a micro-hole array, comprising: a femtosecond laser, a half-wave plate, a polarizer, a concave lens, a convex lens, a diaphragm, a mechanical shutter, a phase-type spatial light modulator, a first plano-convex lens, a reflecting mirror, a second plano-convex lens, a dichroic mirror, a camera, a processing objective lens, a six-axis translation stage and a transmissive white light source. 1. A femtosecond laser system for processing a micro-hole array , comprising: a femtosecond laser , a half-wave plate , a polarizer , a concave lens , a convex lens , a diaphragm , a mechanical shutter , a phase-type spatial light modulator , a first plano-convex lens , a reflecting mirror , a second plano-convex lens , a dichroic mirror , a camera , a processing objective lens , a six-axis translation stage and a transmissive white light source;wherein the femtosecond laser, the half-wave plate, the polarizer, the concave lens, the convex lens, the diaphragm and the mechanical shutter are sequentially arranged on a first optical axis;wherein the mechanical shutter is configured to control a femtosecond laser beam to be incident on the phase-type spatial light modulator to generate a spatially shaped femtosecond laser pulse;wherein the spatially shaped femtosecond laser pulse sequentially passes through the first plano-convex lens, the reflecting mirror, the second plano-convex lens and the dichroic mirror to reach the processing objective lens, and is focused by the processing objective lens to be irradiated on a sample to be processed on the six-axis translation stage to form the micro-hole array for the sample;wherein the half-wave plate and the polarizer together constitute an energy adjustment system for adjusting energy of the femtosecond laser and making a polarization direction of the emitted femtosecond laser beam horizontal;wherein the phase-type spatial light modulator is configured to perform phase modulation to the ...

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Номер записи: 56
20-01-2022 дата публикации

LASER PROCESSING METHOD

Номер: US20220016731A1
Автор: Nomaru Keiji
Принадлежит:

A laser processing method for processing a wafer using a laser processing apparatus, where the laser processing apparatus includes a holding unit, a laser oscillator for emitting a pulsed laser beam, a polygon mirror for dispersing the pulsed laser beam emitted from the laser oscillator, a condenser for condensing the pulsed laser beam dispersed by the polygon mirror and applying the condensed pulsed laser beam to the workpiece and dispersed region adjuster for controlling a dispersed region of the pulsed laser beam, where the laser processing method includes steps of holding the workpiece on the holding unit and processing the workpiece held by the holding unit by applying the pulsed laser beam, where during processing, the dispersed region adjuster controls the dispersed region of the pulsed laser beam by causing the pulsed laser beam to follow a direction in which the mirror facets of the polygon mirror are rotated. 1. A laser processing method for processing a wafer with a laser beam using a laser processing apparatus , the laser processing apparatus including a holding unit for holding the workpiece thereon , a laser oscillator for emitting a pulsed laser beam , a polygon mirror for dispersing the pulsed laser beam emitted from the laser oscillator , a condenser for condensing the pulsed laser beam dispersed by the polygon mirror and applying the condensed pulsed laser beam to the workpiece held by the holding unit and dispersed region adjusting means for controlling a dispersed region of the pulsed laser beam , the laser processing method comprising:a holding step of holding the workpiece on the holding unit; anda processing step of processing the workpiece held by the holding unit by applying the pulsed laser beamwherein, in the processing step, the dispersed region adjusting means controls the dispersed region of the pulsed laser beam by causing the pulsed laser beam to follow a direction in which the mirror facets of the polygon mirror are rotated.2. The ...

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Номер записи: 57
08-01-2015 дата публикации

Laser Pulse Shaping Method

Номер: US20150010029A1
Автор: Albrecht Lindinger, Karsten Heyne
Принадлежит: FREIE UNIVERSITAET BERLIN

A laser pulse shaping method is configured for microscopically viewing and modifying an object. A temporal modulation and a two-dimensional spatial modulation of laser pulses are carried out. At least the phase of the laser pulses is modulated dependent on the location, and the modulated laser pulses are directed at the object.

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Номер записи: 58
14-01-2016 дата публикации

LASER METHOD WITH DIFFERENT LASER BEAM AREAS WITHIN A BEAM AND DEVICES

Номер: US20160008919A1
Автор: Bostanjoglo Georg, Burbaum Bernd
Принадлежит:

Use of a laser beam () which has one external and one internal laser beam area () with different intensities enables a higher temperature gradient to be produced in the z-direction. 113-. (canceled)14. A method for applying a laser beam to a substrate for heating the substrate where the laser beam impinges on the substrate , the method comprising:applying a laser beam to impinge on the substrate, impinging the laser beam to have two different laser beam areas which impinge on the substrate, wherein the two different laser beam areas differ in at least one of output of the laser beam areas and wavelengths of the laser beam areas; andwherein the laser beam has a radially internal laser beam area, and a surrounding radially external laser beam area, and the external laser beam area completely surrounding the internal laser beam area.15. The method as claimed in claim 14 , in which the external laser beam area has an intensity such that the external laser beam areas does not melt the substrate or a material supplied to the substrate to be impinged upon on the substrate.16. The method as claimed in claim 14 , wherein the substrate to be impinged upon is metallic.17. The method as claimed in claim 14 , further comprising remelting a crack in the substrate at the laser beam areas.18. The method as claimed in claim 14 , further comprising:applying a welding material to the substrate on which the laser beam is impinging and performing deposition welding on the material by impinging the laser beam such that the deposition welding takes place.19. The method as claimed in claim 14 , further comprising:impinging the laser beam on the substrate such that the internal laser beam area is arranged concentrically within the area surrounded by the external laser beam area.20. The method as claimed in claim 14 , wherein an intensity or an output of the internal laser beam area is at least 20% greater than an intensity or an output of the external laser beam area for either causing more ...

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Номер записи: 59
14-01-2016 дата публикации

PROCESSING APPARATUS AND PROCESSING METHOD

Номер: US20160008920A1
Автор: Danno Minoru, FUJITA Yoshihito, Goya Saneyuki, ISHIDE Takashi, KANAOKA Kohei, KINOUCHI Masato, SUZUKI Ryu, WATANABE Toshiya, YAMASAKI Makoto, YAMASHITA Tsugumaru
Принадлежит: MITSUBISHI HEAVY INDUSTRIES, LTD.

A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation head and a control device. The irradiation head includes a laser turning unit and a condensing optical system The laser turning unit includes a first prism a second prism a first rotating mechanism and a second rotating mechanism The control device adjusts the differences between rotation speeds and phase angles of the first prism and the second prism based on a relation between at least a heat affected layer of a workpiece and a turning speed of laser. 1. A processing apparatus which performs processing by irradiating a workpiece with laser , comprising:an irradiation head configured to irradiate the workpiece with the laser and including a laser turning unit which turns the laser relative to the workpiece and a condensing optical system which collects the laser turned by the laser turning unit; anda control device configured to control an operation of the irradiation head, whereinthe laser turning unit includes a first prism which refracts the laser, a second prism which is arranged at a position opposite to the first prism and refracts the laser output from the first prism, a first rotating mechanism which rotates the first prism, and a second rotating mechanism which rotates the second prism, andthe control device controls the first and second rotating mechanisms based on a relation between at least an allowable thickness of a heat affected layer of the workpiece and a turning speed of the laser emitted to the workpiece, and adjusts differences between rotation speeds and phase angles of the first and second prisms.2. The processing apparatus according to claim 1 , whereinthe first rotating mechanism includes a first spindle which holds the first prism and of which a part of the light path of the laser is hollow, and a first hollow motor to which the first spindle is rotatably inserted and ...

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Номер записи: 60
14-01-2016 дата публикации

Device For Operating A Machine Tool And Machine Tool

Номер: US20160008921A1
Автор: Lenk Andreas, RÜDIGER Garn, SCHRÖDER Martin
Принадлежит: Continental Automotive GmbH

A device is provide for operating a machine tool. The machine tool includes a rotation unit designed to rotate a workpiece about an axis of rotation with an adjustable rotational speed progression, and an ultra-short pulse laser for generating laser pulses, the laser being arranged such that material of the workpiece is removed by means of the laser pulses. The device is configured to adjust the rotational speed progression based on geometry data of a specified geometry and/or a specified surface quality characteristic value representative of a corresponding surface quality. 1. A device for operating a machine tool ,wherein the machine tool has a rotation unit that rotates a workpiece about an axis of rotation with an adjustable rotational speed progression, and an ultra-short pulse laser for generating laser pulses, wherein the ultra-short pulse laser is arranged such that material of the workpiece is removed by the laser pulses, andwherein the device is configured to adjust the rotational speed progression based on speed control data comprising at least one of (a) geometry data of a specified geometry or (b) a specified surface quality characteristic value representative of a corresponding surface quality.23-. (canceled)4. The device of claim 1 , wherein the machine tool further comprises a galvanometer scanner arranged between the ultra-short pulse laser and the workpiece and configured to displace a point of impingement of the respective laser pulse on the surface of the workpiece along the axis of rotation with an adjustable scanning speed progression claim 1 , andwherein the device is configured to adjust the scanning speed progression based on the speed control data.5. (canceled)6. A machine tool for machining a workpiece claim 1 , with the machine tool comprising:a rotation unit configured to rotate the workpiece about an axis of rotation with an adjustable rotational speed progression,an ultra-short pulse laser that generates laser pulses and is arranged ...

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Номер записи: 61
14-01-2016 дата публикации

REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES

Номер: US20160008923A1
Автор: Astle David James, Child Tyler Christensen, Kasagani Vimal Kumar, Loose Cameron LaMar, Sorenson Max Ernest, Stevens Blake LeRoy
Принадлежит:

A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed. 1. A method for selectively removing a protective coating from a substrate , comprising:applying a protective coating to a substrate; andselectively cutting at least a portion of the protective coating with a removal medium comprising a laser light.2. The method of claim 1 , wherein applying the protective coating comprises applying a polyp-xylylene) coating to the substrate.3. The method of claim 1 , wherein selectively cutting at least the portion of the protective coating comprises exposing a periphery of at least one portion of the substrate through the protective coating.4. The method of claim 1 , wherein exposing the periphery of the at least one portion of the substrate comprises exposing a periphery of a selected feature and/or component of the substrate.5. The method of claim 3 , wherein exposing at least the periphery of the at least one portion of the substrate comprises exposing the protective coating to a laser beam.6. The method of claim 5 , further comprising:exposing an area of the substrate delineated by the periphery of the at least one portion of the substrate.7. The method of claim 6 , wherein the area is exposed by scanning the laser beam across a region of the protective coating located over the area of the substrate.8. The method of claim 7 , wherein scanning comprises raster scanning the laser beam across the region of the protective coating.9. The method of claim 1 , wherein selectively cutting comprises selectively cutting at least the portion of the protective ...

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Номер записи: 62
12-01-2017 дата публикации

EDGE CHAMFERING BY MECHANICALLY PROCESSING LASER CUT GLASS

Номер: US20170008793A1
Автор: Bankaitis Jonas, Uhlig Kevin William
Принадлежит: CORNING INCORPORATED

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser that is followed by mechanical polishing with a compliant polishing wheel. 1. A method of processing a workpiece comprising the steps of:(i) focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction;(ii) directing the laser beam focal line into the workpiece at a first angle of incidence to the workpiece, the first angle intersecting an edge of the workpiece, the laser beam focal line generating an induced absorption within the workpiece, the induced absorption producing a defect line along the laser beam focal line within the workpiece;(ii) translating the workpiece and the laser beam relative to each other, thereby laser drilling a plurality of defect lines along a first plane at the first angle within the workpiece, each of said defect lines having a diameter of not greater than 5 μm; and(iv) separating the workpiece along the plane to create a laser cut workpiece with at least one cut surface; and(v) processing the workpiece by polishing the cut surface of the laser cut workpiece with a polishing wheel, wherein the polishing wheel has a bulk modulus of elasticity of 0.1 GPa to 5 GPa.3. A method of laser processing a glass material comprising:focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction; andlaser drilling a plurality of defect lines along each of N planes within the material by, for each of the N planes:directing the laser beam focal line into the material at a corresponding angle of incidence to the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line ...

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Номер записи: 63
12-01-2017 дата публикации

Cell culture and experiment device

Номер: US20170009196A1
Автор: HAI Yuan, Jiandong Huang, Jinming CUI, Olaf Eichstaedt, Ruxu Du, Shijie ZENG
Принадлежит: Guangzhou Institute of Advanced Technology of CAS

The invention discloses a cell culture and experiment device used in the field of biological and genetic engineering experiment apparatus, comprising a central distribution compartment, a culture compartment, a treatment compartment, and pipelines for delivering liquid between the central distribution compartment and the culture compartment and between the central distribution compartment and the treatment compartment. The central distribution compartment is equipped with a distribution chamber and a piston which can be moved forward and backward in the distribution chamber to alter the working volume of the distribution chamber. At the bottom of the distribution chamber, the central distribution compartment is equipped with a distribution valve controlling the connectivity between the distribution chamber and any of the channels. The invention provides a miniaturized apparatus integrating the central distribution compartment, the culture compartment and the treatment compartment, which can replace manual operations, save time and labor, and avoid wasting experimental raw material.

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Номер записи: 64
14-01-2016 дата публикации

GLASS SHEET PROCESSING METHOD AND GLASS SHEET PROCESSING APPARATUS

Номер: US20160009587A1
Автор: NAGATA Takahiro, SAITO Isao
Принадлежит: Asahi Glass Company, Limited

A glass sheet processing method is provided for irradiating a laser beam on a glass sheet and forming a cleavage in the glass sheet with thermal stress. If each of an irradiation area of the laser beam on the surface and an irradiation area of the laser beam on the back face of the glass sheet includes a peak position of a power density of the laser beam, each irradiation area has an asymmetrical power density distribution that is asymmetrical with respect to a reference line that passes through the peak position and is parallel to a moving direction of the peak position. If each irradiation area has no peak position, each irradiation area has an asymmetrical shape that is asymmetrical with respect to a reference line that passes through a centroid position of the irradiation area and is parallel to a moving direction of the centroid position. 1. A glass sheet processing method comprising the steps of:irradiating a laser beam on a glass sheet such that the laser beam is transmitted through the glass sheet from a surface to a back face of the glass sheet;moving an irradiating position of the laser beam with respect to the glass sheet; andforming a cleavage in the glass sheet with thermal stress that is generated by irradiating the laser beam;wherein the laser beam is emitted from a light source and is irradiated on the surface of the glass sheet to form an irradiation area of the laser beam on the surface, and the laser beam that has been transmitted through the surface of the glass sheet is irradiated on the back face of the glass sheet to form an irradiation area of the laser beam on the back face;wherein in a case where each irradiation area includes a peak position of a power density of the laser beam, each irradiation area is arranged to have an asymmetrical power density distribution that is asymmetrical with respect to a reference line that passes through the peak position of the irradiation area and is parallel to a moving direction of the peak position; ...

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Номер записи: 65
27-01-2022 дата публикации

Laser Processing Apparatus

Номер: US20220023972A1
Автор: Aida Kana, Kuki Junichi, Yoshii Shungo
Принадлежит:

A laser processing apparatus includes a processing nozzle. The processing nozzle includes an upper wall having a laser beam passage port defined therein, a lower wall that is connected to a lower portion of a part of the upper wall and that includes a debris capturing chamber defined therein, a suction port defined between another part of the upper wall and the lower wall, a first air ejection port defined in the lower wall, for ejecting air across the debris capturing chamber toward the suction port in a predetermined direction perpendicular to an optical path of a laser beam, and a second air ejection port defined in the lower wall below the first air ejection port, for ejecting air in the predetermined direction. A flow rate of air ejected from the second air ejection port is smaller than a flow rate of air ejected from the first air ejection port. 1a beam condenser having a condensing lens for converging the laser beam; anda processing nozzle fixed to a lower portion of the beam condenser, an upper wall having a laser beam passage port that is defined therein and through which the laser beam converged by the condensing lens passes toward the workpiece,', 'a lower wall that is connected to a lower portion of a part of the upper wall and that includes a debris capturing chamber defined therein, the debris capturing chamber having an upper portion connected to the laser beam passage port and an opening defined in a lower portion thereof for taking in debris scattered from the workpiece that is ablated by the laser beam,', 'a suction port defined between another part of the upper wall and the lower wall, for drawing in the debris introduced through the opening into the debris capturing chamber,', 'a first air ejection port defined in the lower wall, for ejecting air across the debris capturing chamber toward the suction port in a predetermined direction perpendicular to an optical path of the laser beam passing through the laser beam passage port, and', 'a second ...

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Номер записи: 66
11-01-2018 дата публикации

METHOD OF LASER PROCESSING OF A METALLIC MATERIAL WITH OPTICAL AXIS POSITION CONTROL OF THE LASER RELATIVE TO AN ASSIST GAS FLOW, AND A MACHINE AND COMPUTER PROGRAM FOR THE IMPLEMENTATION OF SAID METHOD

Номер: US20180009061A1
Автор: Sbetti Maurizio
Принадлежит:

A method of laser processing of a metallic material is described, by means of a focused laser beam having a predetermined transverse power distribution on at least one working plane of the metallic material, comprising the steps of: 1. A method of laser processing of a metallic material , in particular for laser cutting , drilling or welding of said material , by means of a focused laser beam having a predetermined transverse power distribution on at least one working plane of the metallic material , comprising the steps of:providing a laser beam emitting source;leading the laser beam emitted by said emitting source along a beam transport optical path to a working head arranged in proximity to said metallic material;collimating the laser beam along an optical axis of propagation incident on the metallic material;focusing said collimated laser beam in an area of a working plane of said metallic material; andconducting said focused laser beam along a working path on the metallic material comprising a succession of working areas,wherein the method comprises shaping the laser beam, wherein shaping the laser beam comprises:reflecting said collimated beam by means of a deformable controlled surface reflecting element having a reflecting surface with a continuous curvature including a plurality of independently movable reflection areas, andcontrolling the arrangement of said reflection areas to establish a predetermined transverse power distribution of the beam on at least one working plane of the metallic material as a function of the area of the current working plane and/or the current direction of the working path on the metallic material.2. The method according to claim 1 , comprising the steps of:delivering a flow of assist gas towards said area of the working plane of the metallic material along an axis of the assist gas flow, andcontrolling the arrangement of said reflection areas to establish said predetermined transverse power distribution of the beam in an area ...

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Номер записи: 67
11-01-2018 дата публикации

METHOD OF LASER PROCESSING OF A METALLIC MATERIAL WITH HIGH DYNAMIC CONTROL OF THE MOVEMENT AXES OF THE LASER BEAM ALONG A PREDETERMINED PROCESSING PATH, AS WELL AS A MACHINE AND A COMPUTER PROGRAM FOR THE IMPLEMENTATION OF SAID METHOD

Номер: US20180009062A1
Автор: Sbetti Maurizio
Принадлежит:

A method of laser processing of a metallic material is described by means of a focused laser beam having a predetermined transverse power distribution on at least one working plane of the material, comprising the steps of: 1. A method of laser processing of a metallic material , in particular for laser cutting , drilling or welding of said material , by means of a focused laser beam having a predetermined transverse power distribution at at least one working plane of the metallic material , comprising the steps of:providing a laser beam emitting source;leading the laser beam emitted by said emitting source along a beam transport optical path to a working head arranged in proximity of said metallic material;collimating the laser beam along an optical axis of propagation incident on the metallic material;focusing said collimated laser beam in an area of a working plane of said metallic material; andconducting said focused laser beam along a working path on the metallic material comprising a succession of working areas,wherein the method comprises shaping the laser beam, wherein shaping the laser beam comprises:reflecting said collimated beam by means of a deformable, controlled surface reflecting element having a reflecting surface with a continuous curvature including a plurality of independently movable reflection areas, andcontrolling the arrangement of said reflection areas to establish a predetermined transverse power distribution of the beam at at least one working plane of the metallic material as a function of the area of the current working plane and/or the current direction of the working path on the metallic material.2. The method according to claim 1 , comprising the steps of:delivering a flow of assist gas towards said area of the working plane of the metallic material along an axis of the assist gas flow,when the predetermined working path on the metallic material varies from a first to a second working direction, controlling the relative translation of ...

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Номер записи: 68
14-01-2021 дата публикации

LASER PROCESSING APPARATUS

Номер: US20210008661A1
Автор: Kobayashi Yutaka, UEKI Atsushi
Принадлежит:

A calculating section of a control unit calculates a vertical position Defocus for a condensing lens using a height value H of a modified layer in a wafer that is set by a setting section according to the equation (1) below. 1. A laser processing apparatus comprising:a processing unit for positioning a focused point of a laser beam that is transmittable through a workpiece and that is focused by a condensing lens, within the workpiece to cause the focused point to form a modified layer within the workpiece;a chuck table having a holding surface for holding the workpiece thereon;a processing feed unit for processing-feeding the chuck table and the processing unit relatively to each other in a direction parallel to the holding surface;lifting and lowering means for moving the condensing lens in a direction perpendicular to the holding surface; anda control unit, wherein a setting section for setting a height value from a lower surface of the workpiece at a predetermined vertical position from the lower surface of the workpiece in order to form the modified layer at the predetermined vertical position within the workpiece, and', {'br': None, 'i': b', 'a, 'Defocus=(thickness of the workpiece−height value−)/\u2003\u2003(1)'}, 'a calculating section for calculating a vertical position Defocus for the condensing lens according to the height value of the modified layer that is set by the setting section and the equation (1) below,'}], 'the control unit includes'}where “a” and “b” represent constants, and positions the condensing lens at at least two points at different heights, forming at least two modified layers at different depths, while lowering the focused point of the condensing lens stepwise from an upper surface of the wafer,', 'plots spots corresponding to the at least two modified layers in a coordinate system having a vertical axis representing distance Depth from the modified layer to the upper surface of the workpiece and a horizontal axis representing vertical ...

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Номер записи: 69
14-01-2021 дата публикации

LASER WELDING OF TRANSPARENT WORKPIECES

Номер: US20210008664A1
Автор: Kumkar Malte, Zimmermann Felix
Принадлежит:

Methods and devices for laser welding of mutually overlapping workpieces by pulsed laser beams, for example, Ultrashort-pulsed (USP) laser beams, are provided. In one aspect, a method includes directing a pulsed laser beam through one workpiece onto the other workpiece and moving the pulsed laser beam in a feed direction relative to the two workpieces to produce a weld seam between the two workpieces bearing against one another. A deflection back and forth of the pulsed laser beam directed transversely or parallel to the feed direction is superposed on the pulsed laser beam moved in the feed direction. 1. A method of laser welding of two mutually overlapping workpieces by a pulsed laser beam , the method comprising:directing the pulsed laser beam through a first workpiece onto a second workpiece, the first and second workpieces mutually overlapping each other; andmoving the pulsed laser beam in a feed direction relative to the first and second workpieces to produce a weld seam between the first and second workpieces,wherein a deflection back and forth of the pulsed laser beam directed transversely or parallel to the feed direction is superposed on the pulsed laser beam moved in the feed direction.2. The method of claim 1 , wherein at least one of the first workpiece or the second workpiece is formed from at least one of glass claim 1 , polymer claim 1 , or glass ceramic.3. The method of claim 2 , wherein the at least one of the first workpiece or the second workpiece is formed partially with an opaque material.4. The method of claim 1 , wherein at least one of the first workpiece or the second workpiece has a transparency of at least 90% at a laser wavelength of the pulsed laser beam.5. The method of claim 1 , wherein the first and second workpieces are moved exclusively in the feed direction and at the same time the laser beam is deflected back and forth exclusively transversely or parallel to the feed direction.6. The method of claim 1 , wherein the first and ...

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Номер записи: 70
14-01-2021 дата публикации

LASER PROCESSING METHOD

Номер: US20210008668A1
Автор: Danno Minoru, Goya Saneyuki, GYOBU Satoshi
Принадлежит:

A laser processing method includes a step of irradiating a workpiece, in which a metal layer made of a heat-resistant alloy and a protective layer made of a thermal barrier coating are laminated, with a first laser beam that is a short-pulse laser beam, and forming a through-hole penetrating the metal layer, and a step of irradiating the workpiece with a laser beam to expand the through-hole. 1. A laser processing method comprising:a step of irradiating a workpiece, in which a metal layer made of a heat-resistant alloy and a protective layer made of a thermal barrier coating are laminated, with a first laser beam that is a short-pulse laser beam, and forming a through-hole penetrating the metal layer; anda step of irradiating the workpiece with a laser beam to expand the through-hole.2. The laser processing method according to claim 1 ,wherein, in the step of forming the through-hole, the workpiece is irradiated with the first laser beam to form the through-hole penetrating the protective layer and the metal layer.3. The laser processing method according to claim 1 ,wherein the step of expanding the through-hole includesa step of irradiating the protective layer with the first laser beam as the laser beam to expand the through-hole in the protective layer, anda step of irradiating the metal layer with the first laser beam as the laser beam to expand the through-hole in the metal layer.4. The laser processing method according to claim 2 ,wherein the step of expanding the through-hole includesa step of irradiating the protective layer with the first laser beam as the laser beam to expand the through-hole in the protective layer, anda step of irradiating the metal layer with the first laser beam as the laser beam to expand the through-hole in the metal layer.5. The laser processing method according to claim 3 ,wherein the step of expanding the through-hole in the metal layer makes an output of the first laser beam higher than that in the step of expanding the through- ...

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Номер записи: 71
10-01-2019 дата публикации

GOLF CLUB HEAD AND MANUFACTURING METHOD FOR SAME

Номер: US20190009138A1
Автор: AGUAYO Roberto, Brunski Jeffrey D., Daraskavich Matthew R., PARK Sharon J.
Принадлежит: DUNLOP SPORTS CO. LTD.

A golf club head includes a heel portion, a toe portion, a hosel, and a striking face. The striking face includes a plurality of scorelines each having an average depth no less than about 0.10 mm, a plurality of micro-grooves each having an average depth no greater than about 0.010 mm, and a plurality of textured surface treatment regions superimposed on the micro-grooves so as to at least partially intersect the micro-grooves. 1. A method comprising:(a) mechanically milling a striking face of a golf club head having a central region and a toe region thereby forming a plurality of generally parallel arcuate grooves located in the central region and the toe region;(b) forming a plurality of scorelines in the striking face, the scorelines extending horizontally and comprising an average scoreline width, a scoreline heel-ward extent that is coincident with a central region heel-ward extent, and a scoreline toe-ward extent that is coincident with a central region toe-ward extent; and(c) forming by material removal a plurality of horizontally-oriented lines in the central region interspersed between, and spaced from, the plurality of scorelines, the plurality of horizontally-oriented lines having an average line width less than the average scoreline width.2. The method of claim 1 , further comprising claim 1 , subsequent to step (a) and prior to step (c) claim 1 , applying a media blast to a portion of the striking face.3. The method of claim 1 , wherein the step (c) comprises forming the horizontally-oriented lines as to be substantially confined to the central region.4. The method of claim 1 , wherein the step (c) further comprises forming the plurality of horizontally-oriented lines by mechanical milling.5. The method of claim 1 , wherein the step (c) comprises forming the horizontally-oriented lines at a concentration of no less than 2 lines between each adjacently-located pair of scorelines of the plurality of scorelines.6. The method of claim 5 , wherein the ...

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Номер записи: 72
10-01-2019 дата публикации

COMPACT LASER MACHINING HEAD

Номер: US20190009364A1
Автор: Murkin John
Принадлежит:

An improved laser-machining head unit for fabric comprising a diagonal mirror assembly with a tubular sleeve extending downward to an internally threaded distal tip. An annular adapter is provided with an externally-threaded male fining at one end and an internally-threaded receptacle at an opposing end. The externally-threaded male fitting of the adapter is adjustably screw-threaded into the internally threaded distal tip of the tubular sleeve. A laser nozzle has a frusto-conical tip and an annular collar Cm attachment to the adapter, the collar being externally threaded and fixedly screw-inserted into the internally-threaded receptacle of the adapter. In addition, there is a gas inlet affixed to the collar of the laser nozzle for introducing gas at a 90-degree angle thereto. The screw-adjustable configuration ensures proper alignment at all times of the lens, the beam and the nozzle aperture, and air stream. 1. A laser-machining head unit , comprising:a diagonal mirror assembly having a housing with a laser inlet and an orthogonal laser outlet, a reflecting mirror seated inside the housing for directing laser light from said inlet into said outlet;a tubular sleeve in optical communication with said mirror assembly and extending downward from the outlet of said diagonal mirror assembly, anda laser nozzle in optical communication with said tubular sleeve and having an inlet and an interior channel leading to a frusto-conical tip for directing laser light along a linear path from said inlet onto a workpiece, anda gas inlet to the laser nozzle for introducing gas flow perpendicularly to said linear path.2. The laser-machining head unit according to claim 1 , further comprising one or more focusing lenses seated inside the laser nozzle.3. The laser-machining head unit according to claim 1 , wherein said laser nozzle is adjustably attached to said tubular sleeve.4. The laser-machining head unit according to claim 3 , wherein said laser nozzle is adjustably attached to ...

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Номер записи: 73
14-01-2021 дата публикации

MICROFLUIDIC CELLULAR MEMBRANE MODIFICATION DEVICES

Номер: US20210009931A1
Автор: Shkolnikov Viktor, XIN DAIXI
Принадлежит:

The present disclosure is drawn to microfluidic cellular membrane modification devices. In one example, a microfluidic cellular membrane modification device can include a microfluidic channel including a pumping portion and an electric field portion. An electrode pair can be positioned about the electric field portion. A bidirectional pump can be in fluid communication with the microfluidic channel at the pumping portion to move fluid backward and forward through the electric field portion. 1. A microfluidic cellular membrane modification device , comprising:a microfluidic channel including a pumping portion and an electric field portion;an electrode pair positioned about the electric field portion; anda bidirectional pump in fluid communication with the microfluidic channel at the pumping portion to move fluid backward and forward through the electric field portion.2. The microfluidic device of claim 1 , wherein the bidirectional pump is integrated within the microfluidic channel.3. The microfluidic device of claim 1 , wherein the bidirectional pump comprises a thermal resistor to move fluid via thermally-generated bubbles.4. The microfluidic device of claim 3 , further comprising an ejection nozzle in fluid communication with the bidirectional pump to eject a portion of the fluid displaced by the thermally-generated bubbles.5. The microfluidic device of claim 1 , wherein the electric field portion includes a constriction having a constricted cross-sectional area relative to a cross-sectional area of the pumping portion.6. The microfluidic device of claim 5 , wherein the fluid to be loaded or loaded within the microfluidic channel includes cells claim 5 , and wherein the constricted cross-sectional area is large enough to accommodate a single cell carried by the fluid.7. The microfluidic device of claim 1 , wherein the microfluidic channel has a serpentine shape crossing the electrode pair multiple times to provide multiple electric field portions.8. The ...

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Номер записи: 74
14-01-2021 дата публикации

ACCELEROMETER WITH BUILT-IN TEMPERATURE CORRECTION

Номер: US20210011047A1
Автор: Goodman William
Принадлежит:

Systems and methods are disclosed for generating temperature compensated acceleration data in analog and digital format from a torque balance accelerometer (TBA). During manufacture of the TBA, a calibration process is used for measuring a TBA scale factor and offset. After collecting scale and offset data, said data is loaded into the memory of the TBA. Field operation of the device includes: sensing a current temperature, retrieving the closest scale and offset correction factors from memory of the TBA, and performing linear interpolation to generate a temperature-compensated output for the TBA. 1. A method for internally generating temperature compensated acceleration analog and digital output data from a torque balance accelerometer (TBA) having at least one flexure arm , comprising:ablating one side of the flexure arm to detect acceleration;performing factory calibration of the TBA by collecting scale and offset correction factors at one or more temperatures and storing the scale and offset correction factors in a memory of the TBA;during field operation, sensing a current temperature, retrieving the scale and offset correction factors associated with a current temperature from the memory of the TBA, and performing linear interpolation to generate temperature-compensated analog and digital data outputs for the TBA.2. The method of claim 1 , comprising:receiving an analog output from the TBA;reading scale and offset correction factors from two calibrated temperatures one above and one below the current temperature;determining an adjusted scale and offset correction factor for the current temperature.3. The method of claim 2 , wherein the determining an adjusted scale and offset correction factor comprises linearly interpolating the factors.4. The method of claim 1 , comprising generating as an output a temperature calibrated analog voltage proportional to an acceleration.5. The method of claim 1 , wherein the TBA includes a flapper whose movement correlates with ...

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Номер записи: 75
15-01-2015 дата публикации

CO2 LASER WITH RAPID POWER CONTROL

Номер: US20150014286A1
Автор: Staupendahl Gisbert
Принадлежит:

Subject matter of the invention is a COlaser that permits a rapid power modulation, particularly a highly efficient Q-switching. The key concept is the sub-division of the resonator into a high-power branch, containing inter alia the active medium (), and a low-power feedback branch (), in which the power-sensitive beam-shaping elements, particularly the modulators, are arranged. This is made possible by a suitable arrangement of a polarisation beam splitter () and a λ/4-phase shifter (). The free adjustability of an angle φ between said two components permits the extremely flexible realisation of various operating modes, particularly the optimisation of the feedback degree during pulse generation. 1. A COlaser comprising:a resonator closed at both ends by resonator end mirrors and containing an active medium, and comprising electrodes for a pump energy supply,wherein the resonator is sub-divided along a resonator axis extending perpendicularly to the resonator end mirrors, between the resonator end mirrors into a high-power branch and a feedback path,wherein the high-power branch and the feedback branch are separated from one another by a polarisation beam splitter for coupling out part of a laser beam generated in the resonator,wherein in the high-power branch between a first of the resonator end mirrors and the polarisation beam splitter the active medium and a λ/4-phase shifter is disposed,wherein in the feedback branch between a second of the resonator end mirrors and the polarisation beam splitter elements for beam-shaping are disposed,wherein the λ/4-phase shifter and the polarisation beam splitter are arranged to be turned with respect to one another by an angle φ, and that about an axis of rotation having at least one component of rotation in parallel to the resonator axis or about the resonator axis,wherein the resonator axis extends either in a straight line or in a bent line through the polarisation beam splitter, andwherein the second resonator end ...

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Номер записи: 76
03-02-2022 дата публикации

PROCESSING OPTICAL UNIT, LASER PROCESSING APPARATUS AND METHOD FOR LASER PROCESSING

Номер: US20220032398A1
Автор: Flamm Daniel, Grossmann Daniel, Kleiner Jonas, Kumkar Malte
Принадлежит:

A processing optical unit for workpiece processing includes a birefringent polarizer configured to split at least one input laser beam into a pair of partial beams polarized perpendicularly to one another. The processing optical unit further includes a focusing optical unit arranged downstream of the birefringent polarizer in the beam path and configured to focus the pair of partial beams onto focus zones in a focal plane. The processing optical unit is configured to produce at least partly overlapping focus zones of the pair of partial beams. 1. A processing optical unit for workpiece processing , comprising:a birefringent polarizer configured to split at least one input laser beam into a pair of partial beams polarized perpendicularly to one another, anda focusing optical unit arranged downstream of the birefringent polarizer in the beam path and configured to focus the pair of partial beams onto focus zones in a focal plane,wherein the processing optical unit is configured to produce at least partly overlapping focus zones of the pair of partial beams.2. The processing optical unit as claimed in claim 1 , wherein the birefringent polarizer element is configured to produce a position offset claim 1 , an angle offset claim 1 , or a combination of position offset and angle offset between the pair of partial beams.3. The processing optical unit as claimed in claim 2 , wherein the birefringent polarizer element is configured to produce an angle offset and is arranged in a plane that is optically conjugate with respect to the focal plane.4. The processing optical unit as claimed in claim 2 , wherein the polarizer element is configured to produce a position offset and is arranged upstream of a further optical unit in the beam path claim 2 , wherein the processing optical unit is configured to image the position offset between the pair of partial beams into the focal plane.5. The processing optical unit as claimed in claim 1 , wherein the processing optical unit is ...

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Номер записи: 77
03-02-2022 дата публикации

METAL MEMBER AND MANUFACTURING METHOD FOR METAL MEMBER

Номер: US20220032399A1
Автор: Furukawa Masashi, NAKATA Hiromichi, UCHIMURA Masahiro
Принадлежит: TOYOTA JIDOSHA KABUSHIKI KAISHA

A manufacturing method for a metal member includes irradiating a first region of a surface of the base material, the surface having at least any one of Cu, Al, Sn, Ti, and Fe, as a main component, with a laser beam to melt the first region; generating metal particles from a vapor or plasma of a metal released to a predetermined atmosphere by melting the surface of the base material in the first region, and depositing the metal particles in the first region; irradiating a second region adjacent to the first region with a laser beam to melt the second region; and generating metal particles from a vapor or plasma of a metal released to a predetermined atmosphere by melting the surface of the base material in the second region, and depositing the metal particles in each of the first region and the second region. 1. A manufacturing method for a metal member that includes a base material of which at least a surface is made of a material containing at least any one of Cu , Al , Sn , Ti , and Fe , as a main component , and an uneven portion having an uneven shape , which is formed on the surface of the base material , the manufacturing method comprising forming the uneven portion , irradiating a first region of the surface of the base material with a pulse-oscillating laser beam to melt the surface of the base material in the first region,', 'generating metal particles from a vapor or plasma of a metal released to a predetermined atmosphere by melting the surface of the base material in the first region, and depositing the metal particles in the first region,', 'irradiating a second region of the surface of the base material with the pulse-oscillating laser beam, the second region being adjacent to the first region, to melt the surface of the base material in the second region, and', 'generating metal particles from a vapor or plasma of a metal released to the predetermined atmosphere by melting the surface of the base material in the second region, and depositing the metal ...

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Номер записи: 78
03-02-2022 дата публикации

Si SUBSTRATE MANUFACTURING METHOD

Номер: US20220032503A1
Автор: Hirata Kazuya, Tabata Shin
Принадлежит:

An Si substrate manufacturing method includes a separation band forming step of forming a separation band through positioning a focal point of a laser beam with a wavelength having transmissibility with respect to Si to a depth, equivalent to a thickness of an Si substrate to be manufactured, from a flat surface of an Si ingot and irradiating the Si ingot with the laser beam while relatively moving the focal point and the Si ingot in a direction < parallel to a cross line at which a crystal plane { and a crystal plane { intersect or a direction [ orthogonal to the cross line, and an indexing feed step of executing indexing feed of the focal point and the Si ingot relatively in a direction orthogonal to a direction in which the separation band is formed. 1100. A silicon substrate manufacturing method for manufacturing a silicon substrate from a silicon ingot in which a crystal plane () is made to be a flat surface , the silicon substrate manufacturing method comprising:{'b': 110', '100', '111', '110, 'a separation band forming step of forming a separation band through positioning a focal point of a laser beam with a wavelength having transmissibility with respect to silicon to a depth equivalent to a thickness of the silicon substrate to be manufactured from the flat surface and irradiating the silicon ingot with the laser beam while relatively moving the focal point and the silicon ingot in a direction <> parallel to a cross line at which a crystal plane {} and a crystal plane {} intersect or a direction [] orthogonal to the cross line;'}an indexing feed step of executing indexing feed of the focal point and the silicon ingot relatively in a direction orthogonal to a direction in which the separation band is formed; and{'b': '100', 'a wafer manufacturing step of repeatedly executing the separation band forming step and the indexing feed step to form a separation layer parallel to the crystal plane () as a whole inside the silicon ingot and separating the silicon ...

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Номер записи: 79
10-01-2019 дата публикации

LASER PROCESSING APPARATUS

Номер: US20190013636A1
Автор: Morikazu Hiroshi
Принадлежит:

A laser processing apparatus includes: a chuck table that holds a workpiece; a laser beam applying unit that applies a pulsed laser beam having a predetermined line width to the workpiece held by the chuck table; and a processing feeding unit that performs relative processing feeding of the chuck table and the laser beam applying unit. The laser beam applying unit includes: a laser oscillator that oscillates the pulsed laser beam; a focusing device that focuses the pulsed laser beam oscillated by the laser oscillator; and a pulse width adjustment unit that is disposed between the laser oscillator and the focusing device and that generates a time difference in a wavelength region of the pulsed laser beam in the predetermined line width, thereby adjusting the pulse width. 1. A laser processing apparatus comprising:a chuck table that holds a workpiece;a laser beam applying unit that applies a pulsed laser beam of a wavelength having a predetermined line width to the workpiece held by the chuck table; anda processing feeding unit that performs relative processing feeding of the chuck table and the laser beam applying unit, a laser oscillator that oscillates the pulsed laser beam,', 'a focusing device that focuses the pulsed laser beam oscillated by the laser oscillator, and', 'a pulse width adjustment unit that is disposed between the laser oscillator and the focusing device and that generates a time difference in a wavelength region of the pulsed laser beam in the line width, thereby adjusting pulse width., 'wherein the laser beam applying unit includes'}2. The laser processing apparatus according to claim 1 ,wherein the laser beam applying unit further includes a polarization beam splitter that splits the pulsed laser beam oscillated by the laser oscillator,the focusing device focuses the pulsed laser beam reflected by the polarization beam splitter, andthe pulse width adjustment unit is disposed on the opposite side of the polarization beam splitter from the laser ...

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Номер записи: 80
19-01-2017 дата публикации

POLYCRYSTALLINE SiC WAFER PRODUCING METHOD

Номер: US20170014944A1
Автор: Hirata Kazuya, Nishino Yoko
Принадлежит:

There is provided a polycrystalline SiC wafer producing method. In this method, in a modified layer forming step for forming an interface for producing a polycrystalline SiC wafer from a polycrystalline SiC ingot, the formed interface is a surface formed by linking of modified layers formed in such a manner that an initial modified layer is formed through splitting of polycrystalline SiC into amorphous silicon and amorphous carbon at the light focus point of a pulse laser beam and then polycrystalline SiC splits into amorphous silicon and amorphous carbon at a position at which the power density is constant with absorption of the continuously-emitted pulse laser beam by amorphous carbon formed in advance. 1. A polycrystalline SiC wafer producing method for producing a polycrystalline SiC wafer from a polycrystalline SiC ingot , the method comprising:a modified layer forming step of positioning a light focus point of a pulse laser beam having such a wavelength as to be transmitted through the polycrystalline SiC ingot at a predetermined position from an irradiated surface of the polycrystalline SiC ingot and irradiating the polycrystalline SiC ingot with the pulse laser beam to form modified layers at a position at which an interface between the polycrystalline SiC wafer and the polycrystalline SiC ingot is to be formed; anda polycrystalline SiC wafer separating step of giving an external force to an upper side relative to the interface formed by the modified layer forming step and separating the polycrystalline SiC wafer from the interface,wherein the interface formed in the modified layer forming step is a surface formed by linking of modified layers formed in such a manner that an initial modified layer is formed through splitting of polycrystalline SiC into amorphous silicon and amorphous carbon at the light focus point of the pulse laser beam, the pulse laser beam emitted next is absorbed by the amorphous carbon formed by the pulse laser beam emitted in advance ...

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Номер записи: 81
18-01-2018 дата публикации

OPTOGENETIC CONTROL OF ENDOTHELIAL CELLS

Номер: US20180015296A1
Автор: BROWN Tyler C., MOORE Christopher I.
Принадлежит:

The invention features methods for regulating vascular properties by controlling the membrane properties of endothelial cells using optogenetics and light. The invention features methods to transport therapeutics across the vascular barrier into tissues such as the brain and the lung, with high spatial and temporal precision, and for controlling vascular properties such as vascular tone, arterial diameter, and vascular growth. 12-. (canceled)3. A method to deliver a therapeutic across the vascular endothelial barrier comprising endothelial cells expressing an optogenetic reagent in a subject , said method comprising the steps of: a) introducing said therapeutic into the blood stream of said subject; and b) contacting said endothelial cells with light , wherein said light activates said optogenetic reagent and thereby changes permeability of said endothelial cells and opens the vascular endothelial barrier such that said therapeutic in the blood stream crosses the vascular endothelial barrier.4. The method of claim 3 , wherein said optogenetic reagent is selected from the group consisting of ChR1 claim 3 , ChR2 claim 3 , VChR1 claim 3 , ChR2 C128A claim 3 , ChR2 C128S claim 3 , ChR2 C128T claim 3 , ChD claim 3 , ChEF claim 3 , ChF claim 3 , ChIEF claim 3 , NpHR claim 3 , eNpHR claim 3 , Arch 3.0 claim 3 , Arch T 3.0 claim 3 , Mac 3.0 claim 3 , melanopsin claim 3 , chimeras of these proteins and natural and engineered variants thereof.5. The method of claim 3 , wherein said optogenetic reagent are expressed in the endothelial cells by introducing a recombinant nucleic acid encoding the optogenetic reagent into said cells or precursors thereof.6. The method of claim 5 , wherein said recombinant nucleic acid is introduced into said cells by using any one or more of a virus claim 5 , an electroporation device claim 5 , a transfection method claim 5 , and a transgenic method.7. The method of claim 6 , wherein said recombinant nucleic acid is encapsidated within a ...

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Номер записи: 82
18-01-2018 дата публикации

Laser-Transmitting Tooling

Номер: US20180015578A1
Автор: Kode Sai Kumar, Ravindra Deepak VM
Принадлежит: Micro-LAM, Inc.

A laser-transmitting machining tool is disclosed. The laser-transmitting machining tool has a plurality of faces including an entrance face, a rake face, a flank face connected to the rake face, a rake side face extending between the entrance face and the rake face, and a flank side face extending between the entrance face and the flank face. The connection of the rake face to the flank face defines a cutting edge. The rake face extends away from the rake side face to define a rake angle. The entrance face is configured to receive and refract a laser beam to the rake face, the flank face, and the cutting edge for causing the laser beam to refract into and heat the workpiece at a compression region extending proximate at least the rake face and a tensile region extending proximate the flank face. A system for machining a workpiece is disclosed. A method for machining a workpiece is also disclosed. 1. A laser-transmitting machining tool for machining a workpiece , the laser-transmitting machining tool comprising:a body of material having an entrance face, a rake face, a flank face connected to the rake face, a rake side face extending between the entrance face and the rake face, and a flank side face extending between the entrance face and the flank face,wherein the connection of the rake face to the flank face defines a cutting edge,wherein the entrance face is configured to receive and refract a laser beam to the rake face, the flank face, and the cutting edge, causing the laser beam to refract into and heat the workpiece at a compression region extending proximate at least the rake face and a tensile region extending proximate the flank face, and a highly negative rake angle causing the compression region of the workpiece to be a highest compression region and the tensile region of the workpiece to be a lowest tensile region;', 'a midrange negative rake angle causing the compression region of the workpiece to be a high compression region and the tensile region of ...

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Номер записи: 83
21-01-2016 дата публикации

HAIR CUTTING DEVICE

Номер: US20160016256A1
Автор: CIUHU CALINA, HILVERDA KLAAS, Moeskops Bastiaan Wilhelmus Maria, VEENSTRA GEERT, Voncken Rudolf Maria Jozef, WESTERHOF Willem Auke
Принадлежит:

The present application relates to a device for cutting hair comprising a skin contacting face () that is placed against a surface of the skin () of a user during use. The device also has an optical system configured to direct a cutting laser beam () across a cutting zone () parallel to and spaced from said skin contacting face to cut hairs extending into the cutting zone. Also provided is a laser positioning mechanism which is arranged so that, during use of the device, the distance (H) between said cutting laser beam and said skin contacting face is changed to maintain a predetermined distance between the cutting laser beam and the surface of the skin of a user.

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Номер записи: 84
21-01-2016 дата публикации

METHOD AND APPARATUS FOR PERFORMING LASER CURVED FILAMENTATION WITHIN TRANSPARENT MATERIALS

Номер: US20160016257A1
Автор: HOSSEINI S. ABBAS
Принадлежит: ROFIN-SINAR TECHNOLOGIES INC.

Systems and methods are described for forming continuous curved laser filaments in transparent materials. The filaments are preferably curved and C-shaped. Filaments may employ other curved profiles (shapes). A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths in the range of 100 μm-10 mm. An aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process. 1. A method of laser processing a transparent material , comprising the steps of:providing a laser beam, said laser beam includes a burst of laser pulses or a single laser pulse;providing a cubic phase plate or mask in said laser beam path to induce cubic phase in said laser pulses forming Airy beam;externally focusing said laser Airy beam relative to said transparent material to form a beam waist at a location that is external to said transparent material; and,said laser pulses are focused such that a sufficient energy density is maintained within said transparent material to form a continuous laser C-shaped curved filament therein without causing optical breakdown.2. A method of processing a transparent material , comprising the steps of:providing a laser beam, said laser beam having a plurality of bursts and each of said bursts include a plurality of pulses;generating an initial waist of said laser beam external to said transparent material;generating a weakly focused laser beam distributed within said transparent material in a C-shaped ...

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Номер записи: 85
15-01-2015 дата публикации

SEMICONDUCTOR PROCESSING APPARATUS USING LASER

Номер: US20150017784A1
Автор: KIM Jong-guw
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

Provided is a semiconductor processing apparatus, including a first laser beam irradiation unit having a first variable beam expanding telescope and a first galvanometer scanner transferring a first laser beam having a first wavelength, a second laser beam irradiation unit having a second variable beam expanding telescope and a second galvanometer scanner transferring a second laser beam having a second wavelength, and a telecentric lens. 1. A semiconductor processing apparatus , comprising:a first laser beam irradiation unit including a first variable beam expanding telescope and a first galvanometer scanner transferring a first laser beam having a first wavelength;a second laser beam irradiation unit including a second variable beam expanding telescope and a second galvanometer scanner transferring a second laser beam having a second wavelength; anda telecentric lens.2. The semiconductor processing apparatus according to claim 1 , wherein the telecentric lens includes:a first telecentric lens configured to receive the first laser beam from the first laser beam irradiation unit; anda second telecentric lens configured to receive the second laser beam from the second laser beam irradiation unit.3. The semiconductor processing apparatus according to claim 2 , wherein the first telecentric lens and the second telecentric lens each include a diameter aperture claim 2 , a concave lens claim 2 , an aspherical lens claim 2 , and a convex lens.4. The semiconductor processing apparatus according to claim 1 , wherein the first laser beam has a wavelength of an infrared ray area band.5. The semiconductor processing apparatus according to claim 1 , wherein the second laser beam has a wavelength of a visible ray area band.6. The semiconductor processing apparatus according to claim 1 , wherein the first galvanometer scanner includes:a first X-direction galvanometer scanner configured to scan with the first laser beam in an X-direction; anda first Y-direction galvanometer ...

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Номер записи: 86
15-01-2015 дата публикации

Method for performing laser crystallization

Номер: US20150017816A1
Автор: Alexander Voronov, Gyoo-wan Han, Je-Kil Ryu, Nang-Lyeom Oh
Принадлежит: Samsung Display Co Ltd

A method for performing a laser crystallization is provided. The method includes generating a laser beam, refracting the laser beam to uniformize an intensity of the laser beam at a focal plane of the laser beam. The laser beam whose intensity is uniformized is applied into an object substrate mounted with a stage.

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Номер записи: 87
15-01-2015 дата публикации

Laser processing apparatus and laser processing method

Номер: US20150017817A1
Автор: Hiroyoshi HIEJIMA, Michiharu Ota, Yuta FURUMURA
Принадлежит: Aisin Seiki Co Ltd, Toyota Motor Corp

A laser processing apparatus includes a laser beam generating device that generates a first pulse laser beam for temporarily increasing a light absorptance in a predetermined region of a processing object, and a second pulse laser beam to be absorbed in the predetermined region in which the light absorptance has temporarily increased, and a support portion that is provided on a downstream of the first pulse laser beam and the second laser beam generated by the laser beam generating device and has a placement surface for placing the processing object. The laser beam generating device emits the second pulse laser beam with a delay with respect to the first pulse laser beam by a delay time within a predetermined period of time before the light absorptance that has temporarily increased in the predetermined region returns to an original value.

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Номер записи: 88
21-01-2016 дата публикации

METHOD AND DEVICE FOR STRUCTURING THE SURFACE OF A HARD MATERIAL COATED SOLID BODY BY MEANS OF A LASER

Номер: US20160016711A1
Автор: Boegli Charles, ENGEL Andy, REISSE Günter, Steffen Werner, WEISSMANTEL Steffen
Принадлежит: BOEGLI-GRAVURES S.A.

A packing foil having optical diffraction effective areas and/or authentication features includes at least a first structure produced by passing a homogeneous intensity distribution spot of a laser beam having laser pulse durations in a nano-second range through a mask and a diaphragm before imaging the laser beam on at least one area of an exposed surface of the packaging foil using imaging optics positioned downstream of the mask and the diaphragm, and at least a second structure superposed on the first structure, the second structure produced by a second laser having pulse durations in the pico- or femtosecond range.

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Номер записи: 89
21-01-2016 дата публикации

DEVICE AND METHODS COMPRISING MICROELECTRODE ARRAYS FOR ELECTROCONDUCTIVE CELLS

Номер: US20160017268A1
Автор: Chae Junseok, GUPTA Kshitiz, KIM Deok-Ho, Laflamme Michael
Принадлежит:

The present invention relates to the devices and method comprising microelectrode arrays for the differentiation, maturation and functional analysis of electroconductive cells, including muscle cells (including, but not limited to, cardiomyocytes, skeletal muscle myocytes and smooth muscle myocytes) and neuronal cells. The microelectrode present on the arrays can be used to stimulate and record from cells cultured on the substrate. In some embodiments, the substrate has a substantially smooth surface, and in other embodiments the substrate is nanotextured, including an array of substantially parallel grooves and ridges of nanometer-micrometer widths.

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Номер записи: 90
18-01-2018 дата публикации

APPARATUS, SYSTEMS AND METHODS FOR PROGRAMMABLE TISSUE CULTURE ILLUMINATION

Номер: US20180016538A1
Автор: Bugaj Lukasz, Lim Wendell
Принадлежит:

The disclosed apparatus, systems and methods relate to an illumination opto-plate configured to specifically light the wells of a culture plate. 1. An illumination device , comprising: i. a plurality of LED fixtures;', 'ii. a microcontroller; and', 'iii. at least one LED driver; and, 'a. a base, comprising;'} i. at least one layer;', 'ii. a plurality of openings; and', 'iii. a plurality of walls,, 'b. an adaptor, comprising;'}wherein the isled fixtures are configured to illuminate a culture plate.2. The illumination device of claim 1 , wherein each of the plurality of LED fixtures is independently programmable.3. The illumination device of claim 1 , wherein the adaptor has three layers.4. The illumination device of claim 3 , wherein a plurality of diffuser paper is disposed between the adaptor layers.5. The illumination device of claim 3 , wherein the adaptor layers further comprise mounting points.6. The illumination device of claim 3 , wherein the adaptor further comprises a mounting ridge configured for reception of the culture plate.7. The illumination device of claim 6 , wherein the walls of the adaptor are configured for individual well illumination.8. The illumination device of claim 7 , wherein the opto-plate further comprises a memory.9. A system for illuminating a culture plate comprising: i. at least one LED fixture;', 'ii. at least one LED driver; and', 'iii. at least one microcontroller;, 'a. an opto-plate, comprising i. at least one layer;', 'ii. at least one opening; and', 'iii. a plurality of walls, wherein the adaptor is attached to the opto-plate such that when the culture plate is placed on the adaptor the LED fixtures illuminate the culture plate., 'b. an adaptor, comprising;'}10. The system of claim 9 , wherein the walls of the adaptor are configured such that each well within the culture plate is individually illuminated.11. The system of claim 9 , further comprising a lid.12. The system of claim 9 , further comprising an Arduino configured to ...

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Номер записи: 91
16-01-2020 дата публикации

Sensor Device for Scanning Laser Processing of a Workpiece by Means of a Laser Beam Deflected About a Pivot Point

Номер: US20200016689A1
Автор: Griebel Martin, WITTENBECHER Wolfgang
Принадлежит:

The invention relates to a sensor device for scanning laser processing of a workpiece by means of a laser beam deflected about a pivot point, said device comprising a holding device and at least two sensors, wherein the holding device is formed by a matrix- or honeycomb-shaped arrangement of sleeves, consisting of individual sleeves whose sleeve axes intersect at a point of intersection (P) outside the holding device, and the at least two sensors each being arranged in one of the sleeves such that their sensor axis coincides with the sleeve axis. The holding device advantageously is a monolithic component produced in a generative manufacturing process. 1. A sensor device for scanning laser processing of a workpiece by a laser beam deflected about a pivot point , the device comprising:a holding device being formed by a matrix- or honeycomb-shaped arrangement of firmly interconnected sleeves comprised of individual sleeves open on at least one side, each sleeve having a sleeve axis, the sleeve axes intersecting at a point of intersection (P) outside the holding device; andat least two sensors, each of the at least two sensors having a sensor axis and being arranged in one of the sleeves such that their sensor axis coincides with the sleeve axis.2. The sensor device according to claim 1 , wherein each sleeve has a sleeve wall which is bounded by a first end face and a second end face or a bottom face claim 1 , and wherein the point of intersection (P) is located on a side of the first end face of each sleeve.3. The sensor device according to claim 2 , wherein first end faces of each sleeve form a contiguous mating surface which is adapted to a surface contour of the workpiece to be processed in a processing area.4. The sensor device according to claim 3 , wherein at least some of the first end faces are provided with spacers facing away from the holding device and wherein the workpiece to be processed can be applied against the spacers.5. The sensor device according to ...

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Номер записи: 92
16-01-2020 дата публикации

Marking system for decorating workpieces

Номер: US20200016690A1
Автор: Hall David Lynn, Polk Michael Lane
Принадлежит:

A marking system for decorating one or more workpieces includes a plurality of marking stations that can mark product images on blank workpieces to produce product workpieces, at least some of which have different sizes, shapes, materials, or a combination thereof, a control system that can select one of the plurality of marking stations and send product image data to the selected one of the plurality of marking stations, and a robotic manipulator that can transport a blank workpiece to the selected marking station under the control of the robotic manipulator. The selected marking station can mark the product image the blank workpiece based on the product image data which produces a product workpiece. The robotic manipulator can remove the product workpiece from the selected one of the plurality of marking stations. 1. A marking system for decorating one or more workpieces , comprising:a plurality of marking stations configured to mark product images on blank workpieces to produce product workpieces, at least some of which have different sizes, shapes, materials, or a combination thereof;a control system configured to select one of the plurality of marking stations and send product image data to the selected one of the plurality of marking stations; anda robotic manipulator configured to transport a blank workpiece to the selected one of the plurality of marking stations under the control of the robotic manipulator,wherein the selected one of the plurality of marking stations is configured to mark the product image the blank workpiece based on the product image data which produces a product workpiece,wherein the robotic manipulator is configured to remove the product workpiece from the selected one of the plurality of marking stations.2. The marking system of claim 1 , wherein at least one of the blank workpieces is labeled with a blank workpiece identification code claim 1 , the marking system further comprising:a workpiece scanner configured to scan the blank ...

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Номер записи: 93
16-01-2020 дата публикации

Laser-Transmitting Tooling

Номер: US20200016707A1
Автор: Kode Sai Kumar, Ravindra Deepak VM
Принадлежит: Micro-LAM, Inc.

A laser-transmitting machining tool is disclosed. The laser-transmitting machining tool has a plurality of faces including an entrance face, a rake face, a flank face connected to the rake face, a rake side face extending between the entrance face and the rake face, and a flank side face extending between the entrance face and the flank face. The connection of the rake face to the flank face defines a cutting edge. The rake face extends away from the rake side face to define a rake angle. The entrance face is configured to receive and refract a laser beam to the rake face, the flank face, and the cutting edge for causing the laser beam to refract into and heat the workpiece at a compression region extending proximate at least the rake face and a tensile region extending proximate the flank face. A system for machining a workpiece is disclosed. A method for machining a workpiece is also disclosed. 1. An opto-mechanical tool for machining a workpiece , the opto-mechanical tool comprising:a body of material having an entrance face, a rake face, a flank face connected to the rake face to define a cutting edge, a rake side face extending between the entrance face and the rake face, and a flank side face extending between the entrance face and the flank face,wherein the entrance face is configured to receive and refract a light beam to the rake face, the flank face, and the cutting edge, causing the light beam to refract into and heat the workpiece at a compression region extending proximate at least the rake face and a tensile region extending proximate the flank face.2. The opto-mechanical tool of claim 1 , wherein the rake face extends away from the rake side face to define a rake angle and the flank face extends away from the flank side face to define a flank angle relative to the rake angle.3. The opto-mechanical tool of claim 1 , wherein the material defining the body comprises one of a diamond claim 1 , a sapphire claim 1 , cubic boron nitride (CBN) claim 1 , ...

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Номер записи: 94
21-01-2021 дата публикации

OPTICAL PULSE STRETCHER, LASER APPARATUS, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Номер: US20210016390A1
Автор: ASHIKAWA Koji
Принадлежит: Gigaphoton Inc.

An optical pulse stretcher includes a separation optical element configured to separate pulsed laser light incident on a first surface thereof into first transmitted light and first reflected light, a reflective optical system configured to guide the first reflected light to be incident on a second surface of the separation optical element that is the surface opposite the first surface, and a holding member that has a through hole having an opening area smaller than the area of a reflective surface of a reflective optical element provided in the reflective optical system, is disposed on the rear side of the reflective optical element, and is configured to hold the reflective optical element. 1. An optical pulse stretcher comprising:a separation optical element configured to separate pulsed laser light incident on a first surface thereof into first transmitted light and first reflected light;a reflective optical system configured to guide the first reflected light to be incident on a second surface of the separation optical element that is a surface opposite the first surface; anda holding member that has a through hole having an opening area smaller than an area of a reflective surface of a reflective optical element provided in the reflective optical system, is disposed on a rear side of the reflective optical element, and is configured to hold the reflective optical element.2. The optical pulse stretcher according to claim 1 ,wherein an opening section of the through hole has an opening width in a first direction greater than an opening width in a second direction perpendicular to the first direction.3. The optical pulse stretcher according to claim 2 ,wherein the opening section has a substantially oblong shape.4. The optical pulse stretcher according to claim 3 ,wherein the opening section has a substantially oblong shape having rounded corners.5. The optical pulse stretcher according to claim 2 ,wherein the opening section has a substantially elliptical shape.6 ...

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Номер записи: 95
21-01-2021 дата публикации

PUNCTURE FORMING METHOD, SAMPLE SEPARATING METHOD, SEMICONDUCTOR ELEMENT MANUFACTURING METHOD, SEMICONDUCTOR LASER ELEMENT MANUFACTURING METHOD, AND SEMICONDUCTOR LASER ELEMENT

Номер: US20210016395A1
Автор: ASAKA Hiroshi, Ikeda Daisuke, KITAGAWA Hideo, ONO Masayuki
Принадлежит:

A puncture forming method is a method of forming punctures in a sample by irradiating a surface of the sample with a light beam. The puncture forming method includes: forming a first puncture by irradiating a first position on the surface of the sample with a first pulse of the light beam; and after the forming of the first puncture, forming a second puncture which at least partially overlaps the first puncture by irradiating, with a second pulse of the light beam, a second position on the surface of the sample positioned away from the first position in a first direction. The second puncture has a tip which is positioned inside the sample and which is bent in a direction opposite to the first direction. 1. A puncture forming method of forming a puncture in a sample by irradiating a surface of the sample with a light beam , the puncture forming method comprising:forming a first puncture by irradiating a first position on the surface of the sample with a first pulse of the light beam; andforming a second puncture by irradiating a second position on the surface of the sample with a second pulse of the light beam after the forming of the first puncture, the second puncture at least partially overlapping the first puncture, the second position being positioned away from the first position in a first direction,wherein the second puncture has a tip positioned inside the sample, the tip being bent in a direction opposite to the first direction.2. The puncture forming method according to claim 1 ,wherein the light beam is polarized in a direction perpendicular to the first direction.3. The puncture forming method according to claim 1 ,wherein the light beam is a laser beam.4. A semiconductor element manufacturing method of manufacturing a semiconductor element by separating a semiconductor element substrate claim 1 , the semiconductor element manufacturing method comprising:forming a first puncture by irradiating a first position on a surface of the semiconductor element ...

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Номер записи: 96
17-01-2019 дата публикации

SYSTEMS AND METHODS FOR CARDIOMYOCYTE PACING

Номер: US20190017028A1
Автор: Herron Todd, Jalife Jose, Jiang Jiang
Принадлежит:

Provided herein are systems and methods for cardiomyocyte pacing of cultured cells, including cardiomyoctyes. In particular, provided herein are systems and methods employing electrode arrays with multiwell culture devices that provide electrical stimulation to cells cultured in individual wells of the devices. 135-. (canceled)36. An electrode array that provides electrical current or voltage to a plurality of samples in a multiwell plate , the electrode array comprising a plurality of electrodes or electrode pairs , wherein each electrode or electrode pair provides a current or a voltage to a single well of a multiwell plate.37. The electrode array of wherein each electrode or electrode pair of the electrode array provides field stimulation to a sample in a well of the multiwell plate and/or provides point stimulation to a sample in a well of the multiwell plate.38. The electrode array of wherein each electrode or electrode pair of the electrode array is present in a low impedance circuit.39. The electrode array of wherein said well of the multiwell plate comprises a sample comprising a cell claim 36 , tissue claim 36 , organ claim 36 , or organoid.40. The electrode array of wherein said well of the multiwell plate comprises a sample comprising a material that responds to electrical stimulation.41. The electrode array of wherein said well of the multiwell plate comprises a sample comprising a cardiomyocyte.42. The electrode array of wherein the electrode array comprises 12 claim 36 , 24 claim 36 , or 96 electrodes or electrode pairs.43. A system for providing electrical stimulation to a plurality of samples claim 36 , the system comprising:a) an electrode array that provides electrical current or voltage to a plurality of samples in a multiwell plate, the electrode array comprising a plurality of electrodes or electrode pairs, wherein each electrode or electrode pair provides a current or a voltage to a single well of a multiwell plate; andb) a multiwell plate.44. ...

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Номер записи: 97
17-01-2019 дата публикации

METHOD FOR THE OPTOINJECTION OF EXOGENOUS MATERIAL INTO A BIOLOGICAL CELL

Номер: US20190017071A1
Автор: Difato Francesco, PALAZZOLO Gemma, Soloperto Alessandro
Принадлежит: FONDAZIONE ISTITUTO ITALIANO DI TECNOLOGIA

A method for the optoinjection of exogenous material in a recipient biological cell is disclosed and comprises: placing a biological cell on a planar surface of a substrate, transmitting a sub-ns pulsed laser beam through a variable convergence/divergence collimator; focusing the laser beam in a focal spot positioned along an axial direction substantially perpendicular to the substrate; moving the focal spot towards the cell along the axial direction by continuously varying the electric control signal from a first amplitude value a second amplitude value the second amplitude value of the control signal is selected such that the second axial position is positioned inside the cell. 1. A method for the optoinjection of exogenous material into a recipient biological cell , wherein the cell comprises a cell membrane which encloses it , the method comprising:(a) placing a biological cell on a planar surface of a substrate, the cell having a basal surface resting on the planar surface of the substrate and an apical surface opposite the basal surface and in contact with a fluid solution which contains exogenous material;(b) transmitting a sub-ns pulsed laser beam through a variable convergence/divergence collimator, the collimator comprising a lens with focal length tunable by means of a variable amplitude control electrical signal;(c) directing the laser beam, having passed through the collimator, through an objective lens configured to focus the laser beam along an optical axis in a focal spot, the optical axis defining an axial direction substantially perpendicular to the planar surface of the substrate, such that the focal spot is positioned along the axial direction;{'sub': i', 'i, '(d) setting the electric control signal to a first amplitude value which defines a first focal length of the lens, corresponding to a first axial position zof the focal spot along the optical axis, wherein the first amplitude value of the control signal is selected such that the first axial ...

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Номер записи: 98
17-01-2019 дата публикации

RADIATION SENSOR

Номер: US20190017088A1
Автор: Yoon Chang, Ziaie Babak
Принадлежит:

A radiation sensor, comprising a housing, a first chamber disposed in the housing and configured to contain a microorganism. A second chamber is disposed in the housing and configured to contain a fermentation material, the second chamber separated from the first chamber by a breakable separator. A breaking member is configured to break the breakable separator when pressed by a user. A flexible membrane is configured to flex when the microorganism ferments and thereby releases a gaseous byproduct. An electronic indicator is configured to relay information indicating the amount of fermentation, when the radiation sensor has been exposed to radiation less fermentation takes place resulting in a smaller volume of released gaseous byproduct. 1. A radiation sensor , comprising:a housing;a first chamber disposed in the housing and configured to contain a microorganism;a second chamber disposed in the housing and configured to contain a fermentation material, the second chamber separated from the first chamber by a breakable separator;a breaking member configured to break the breakable separator when pressed by a user;a flexible membrane configured to flex when the microorganism ferments and thereby releases a gaseous byproduct;an electronic indicator configured to relay information indicating the amount of fermentation, when the radiation sensor has been exposed to radiation less fermentation takes place resulting in a smaller volume of released gaseous byproduct.2. The radiation sensor of claim 1 , the microorganism is yeast.3. The radiation sensor of claim 1 , the fermentation material is glucose.4. The radiation sensor of claim 1 , the gaseous byproduct is CO.5. The radiation sensor of claim 1 , the electronic indicator includes a proximity switch claim 1 , a battery and a light emitting diode (LED) claim 1 , such that sufficient release of the gaseous byproduct results in closing of the proximity switch and thereby coupling of the battery to the LED and thereby ...

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Номер записи: 99
21-01-2016 дата публикации

LASER ANNEALING APPARATUS AND LASER ANNEALING METHOD USING THE SAME

Номер: US20160020097A1
Автор: AHN SANGHOON, CHEONG BYOUNGHO, Cho Joo Woan, Choo Byoung Kwon
Принадлежит:

A laser annealing apparatus includes a beam splitter that splits a laser beam emitted from a laser source into a reflection light beam and a transmission light beam, a beam vibrator that makes an irradiation point of the reflection light beam or the transmission light beam vibrate in a predetermined direction, a beam inverter that inverts the reflection light beam or the transmission light beam, and a light collector that collects the reflection light and the transmission light.

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Номер записи: 100