ОБРАБАТЫВАЮЩАЯ ГОЛОВКА

Изобретение относится к устройству (300) и способу жидкоструйной лазерной обработки. Устройство содержит обрабатывающую головку (1) для ввода лазерного луча (100) в струю (200) жидкости. Обрабатывающая головка (1) содержит оптический блок (2) с по меньшей мере одним оптическим элементом (20, 21.1, …, 21.4) для фокусировки лазерного луча (100) и блок (3) ввода с жидкостной камерой (32), ограниченной стенкой, причем в стенке расположено сопло (33) с сопловым отверстием (37) для формирования струи (200) жидкости. В состоянии, в котором блок (3) ввода соединен с оптическим блоком (2), фокусируемый оптическим блоком (2) лазерный луч (100) направляется в направлении луча через жидкостную камеру (32) блока (3) ввода в сопловое отверстие (37) и вводится в формируемую соплом (33), проходящую в направлении луча струю (200) жидкости. Для снабжения жидкостной камеры (32) жидкостью из оптического блока (2) между оптическим блоком (2) и блоком (3) ввода образуется жидкостный переход (50), причем в соединенном ...

Способ лазерного восстановления режущей кромки зубьев фрезы

Изобретение относится к инструментальному производству, а именно к технологии лазерного восстановления инструментальных сталей, и может быть использовано при изготовлении и ремонте деталей технологической оснастки и инструмента, в частности зубьев фрез. Сначала на предварительно подготовленную поверхность обработки наносят износостойкий порошковый материал. Затем производят его расплав перемещением лазерного излучения относительно режущей кромки с перекрытием зон наплавки на торце зуба и последующий отпуск при температуре 560-600°С в масле. После этого осуществляют заточку наплавленных поверхностей и лазерную закалку изделия с прецизионным позиционированием фокуса лазерного излучения на режущей кромке зуба фрезы без оплавления поверхности с последующим нанесением покрытия из нитрида титана. Технический результат заключается в повышении износостойкости восстанавливаемого инструмента. 5 ил.

СПОСОБ РЕМОНТА ОХЛАЖДАЕМОЙ ЛОПАТКИ ИЗ ЖАРОПРОЧНОГО СУПЕРСПЛАВА ТУРБИНЫ ГАЗОТУРБИННОГО ДВИГАТЕЛЯ

Изобретение относится к способу ремонта охлаждаемых лопаток из жаропрочного суперсплава турбины газотурбинного двигателя. Способ включает предварительное удаление с поверхности пера лопатки теплозащитного покрытия, зачистку торца колодца пера лопатки от следов приработки, зачистку наружной и внутренней поверхности стенок колодца торца пера лопатки, установку и фиксацию лопатки в приспособлении, подачу соосно лазерному лучу потока металлического порошка, химический состав которого совпадает с материалом лопатки, наплавку торца колодца пера лопатки в среде защитного газа, термическую обработку в вакууме и контроль. Наплавку металлического порошка осуществляют лазерным лучом в импульсном режиме с амплитудной модуляцией импульса, при этом каждый модулированный импульс лазерного луча состоит из переднего фронта импульса с плотностью мощности для осуществления наплавки и заднего фронта импульса с плотностью мощности для сопутствующего подогрева зоны наплавки при температуре, равной 0,7÷0,8 температуры ...

СПОСОБ ЛАЗЕРНОГО ПАРОТЕРМИЧЕСКОГО ОКСИДИРОВАНИЯ МЕТАЛЛИЧЕСКИХ ПОВЕРХНОСТЕЙ И УСТРОЙСТВО ДЛЯ ЕГО ОСУЩЕСТВЛЕНИЯ (ВАРИАНТЫ)

Лазерный комплекс для подводной резки и сварки конструкционных материалов

Bearbeitungseinrichtung für ein Werkstück

Bearbeitungseinrichtung für ein Werkstück (2), – wobei die Bearbeitungseinrichtung einen Werkstückhalter (1) aufweist, in den das Werkstück (2) einspannbar ist, – wobei die Bearbeitungseinrichtung eine erste Laservorrichtung (3) aufweist, mittels derer ein in einem Wasserstrahl (5) geführter erster Laserstrahl (4) emittierbar ist, mittels dessen von dem Werkstück (2) Material abtragbar ist, – wobei die Bearbeitungseinrichtung eine Antriebseinrichtung (6) aufweist, mittels derer die erste Laservorrichtung (3) relativ zum Werkstückhalter (1) zumindest in einer zum Wasserstrahl (5) orthogonalen Ebene positionierbar ist, – wobei die Bearbeitungseinrichtung eine Steuereinrichtung (7) aufweist, – wobei die Steuereinrichtung (7) derart ausgebildet ist, dass sie – die Antriebseinrichtung (6) derart ansteuert, dass die erste Laservorrichtung (3) relativ zum Werkstückhalter (1) zumindest in der zum Wasserstrahl (5) orthogonalen Ebene nacheinander an verschiedenen Positionen (P) positioniert wird, ...

Device, useful for processing workpiece, comprises holder in which workpiece is clamped, laser device emitting first laser beam on to jet of water, drive unit, and control unit, where laser device is positioned at different positions

The processing device comprises a holder (1) in which a workpiece (2) is clamped, a first laser device for emitting a first laser beam on to a jet of water, a drive unit (6) for positioning the first laser device relative to the workpiece holder in the jet of water in an orthogonal plane, and a control unit (7). A workpiece material is erodable by the first laser beam. The drive unit is positioned at different positions. The control unit controls the first laser device so that the first laser device emits the first laser beam on to the workpiece holder. The processing device comprises a holder (1) in which a workpiece (2) is clamped, a first laser device for emitting a first laser beam on to a jet of water, a drive unit (6) for positioning the first laser device relative to the workpiece holder in the jet of water in an orthogonal plane, and a control unit (7). A workpiece material is erodable by the first laser beam. The drive unit is positioned at different positions. The control unit ...

Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff

PROCEDURE AND DEVICE FOR SNAPPING CUTS OF A WORKPIECE OUT OF SPRÖDBRÜCHIGEM MATERIAL

NOZZLE FOR THE SURFACE TREATING OF METALLIC WORKPIECES

PROCEDURES FOR COOLING A WELDING SEAM RANGE DURING THE LASER WELDING AND DEVICE FOR WOULD DRIVE THROUGH THE PROCEDURE

Process and device for cooling the area of a weld during laser welding

PROCEDURE AND DEVICE FOR THE TREATMENT OF A WORKPIECE OF MEANS LASER BEAM.

Verfahren und System zum Bohren mit einem begrenzten Laserbohrer.

Es ist ein Verfahren zum Bohren eines Lochs (52) in einer Komponente geschaffen. Das Verfahren weist einen Laserstrahl (64) auf, der mittels Lichtführungs - und - fokussiermechanismen eines Laserbohrers (62) begrenzt ist. Das Verfahren umfasst ein Richten eines begrenzten Laserstrahls (64) in Richtung auf eine erste Lochposition an einer nahegelegenen Wand (66) der Komponente. Das Verfahren enthält ferner ein Erfassen einer Lichteigenschaft innerhalb eines durch die Komponente definierten Hohlraums (46). Die nahegelegene Wand (66) ist benachbart zu dem Hohlraum (46) positioniert, und der Sensor ist außerhalb des Hohlraums (46) positioniert. Das Verfahren enthält ferner ein Feststellen eines ersten Durchbruchs des begrenzten Laserstrahls (64) durch die nahegelegene Wand (66) der Komponente an der ersten Lochposition basierend auf dem Licht aus dem Innenraum des Hohlraums (46), das mit dem Sensor erfasst wird. Ein derartiges Verfahren (120, 200, 300, 400) kann ein komfortableres und zeiteffizienteres ...

Pulsation negative-pressure type laser enhancement KTIG-MIG hybrid welding device and KTIG-MIG hybrid welding method

Water-jet guided laser coupling device

The invention belongs to the technical field of water-jet guided laser, and particularly relates to a water-jet guided laser coupling device which comprises a water cavity, an optical cavity and a nozzle seat. The water cavity is of an annular structure with a hollow cavity and comprises an upper cavity body, a middle cavity body and a lower cavity body which are sequentially connected from top to bottom; the optical cavity is embedded in the upper portion of the middle cavity of the water cavity and comprises a light-transmitting cavity and an optical window, and the optical window is arranged in a groove formed in the lower end of the light-transmitting cavity and abuts against a step of the through hole in the upper portion of the middle cavity. The nozzle seat is embedded in the lower portion of the hollow cavity of the water cavity and comprises a nozzle base and a nozzle piece, the nozzle is arranged in a groove in the upper end of the nozzle base and abuts against the top of the ...

LASER IRRADIATION DEVICE AND SURFACE TREATMENT METHOD

Provided is a laser irradiation device (10) having improved treatment performance when treating a surface by irradiating a laser beam (B) onto a liquid-borne object to be irradiated (O). The laser irradiation device (10) is provided with: an irradiation optical system via which the laser beam (B) is irradiated once a surface part on the object-to-be-irradiated (O) side of an optical element (323) nearest the object and disposed adjacent to the object to be irradiated (O) has been disposed in the liquid, a surface part on the side opposite from the object-to-be-irradiated (O) side of the optical element (323) nearest the object and other optical elements (120, 130) being accommodated inside a housing (300) that substantially prevents infiltration of the liquid; a liquid discharging means (440) provided in the vicinity of an external peripheral edge part of the optical element (323) nearest the object, the liquid discharging means (440) discharging a liquid flow along substantially the surface ...

Encoding and identifying a plate-like workpiece

A method for encoding a plate-like workpiece comprising: defining an encoding area; applying a magnetic layer to the surface of the workpiece; fusing parts of the magnetic layer to the surface of the workpiece by acting on the workpiece with radiation within the encoding area; cooling the workpiece; removing the non-fused parts of the magnetic layer. The method permits the workpieces to be trackable in a simple manner, irrespective of surface treatments that may possibly be carried out or are to be carried out later.

LASER PROCESSING APPARATUS

Disclosed herein is a laser processing apparatus that includes a laser generation unit configured to generate a laser beam to process a workpiece, a first fluid jet generation unit configured to generate and inject a first fluid jet to deliver the laser beam to the workpiece, and a second fluid jet generation unit configured to inject a second fluid jet around the laser beam, wherein the first and second fluid jets are simultaneously or selectively injected.

METHOD AND DEVICE FOR PRODUCING A STRUCTURED ELEMENT BY MEANS OF MATERIAL-REMOVING MACHINING BY PULSED LASER RADIATION AND STRUCTURED ELEMENT

LASER SHOCK PEENING APPARATUS

アライメント調整方法、アライメント調整装置、及びアライメント調整装置を備えたレーザー加工装置

Способ и устройство для изготовления изделия из заготовки

Настоящее изобретение относится к способу и устройству для изготовления изделия, в частности бриллианта или другого ограненного драгоценного камня, из заготовки, в частности неограненного алмаза или другого сверхтвердого материала. Способ выполняется устройством, предоставляющим лазерный луч, расположенный внутри струи текучей среды, находящейся под давлением. Способ включает выполнение операций гранения заготовки лазерным лучом согласно предопределенной последовательности гранения для удаления материала заготовки с каждой завершенной операцией гранения. Способ дополнительно включает выполнение операций поворачивания заготовки вокруг одной и той же оси вращения согласно предопределенной последовательности поворачивания. При этом одну операцию поворачивания на угол, определенный из заранее заданной последовательности поворачивания, выполняют после каждой завершенной операции гранения, и при этом для выполнения операции гранения лазерный луч перемещают однократно вдоль двухмерной траектории ...

Способ лазерной обработки материалов в жидкой среде

Изобретение относится к способу лазерной обработки материалов в жидкой среде. Формирование лазерного луча осуществляют в струе жидкости с одновременной подачей их в зону обработки посредством устройства для лазерной обработки. Устройство состоит из генератора лазерного излучения, выполненного с возможностью работы в частотном режиме, оптического элемента, гидравлической камеры с окном для ввода лазерного луча из оптического элемента, устройства подачи жидкости в гидравлическую камеру с выходным отверстием для вывода лазерного луча из гидравлической камеры в струе жидкости. Предварительно жидкость подвергают фильтрации, термостабилизации с последующим нагнетанием ее в гидравлическую камеру. В выходном отверстии камеры установлена форсунка. В зоне обработки создают и поддерживают пониженное давление с помощью системы, образующей замкнутый контур и которая выполнена с возможностью циркуляции потока жидкости через форсунки, попарно установленные по торцам на входе для подачи жидкости из внешней ...

УСТРОЙСТВО ДЛЯ ОБРАБОТКИ ЗАГОТОВКИ РЕЗАНИЕМ С ПОМОЩЬЮ ЛАЗЕРНОГО ЛУЧА

LASERSTRAHL-BEARBEITUNGSVORRICHTUNG MIT EINER EINKOPPELVORRICHTUNG ZUM EINKOPPELN EINES FOKUSSIERTEN LASERSTRAHLS IN EINEN FLÜSSIGKEITSSTRAHL

Laserstrahl-Bearbeitungsvorrichtung mit einer Einkoppelvorrichtung (1) zum Einkoppeln eines fokussierten Laserstrahls (2) in einen Flüssigkeitsstrahl (3) definierten Querschnittes, aufweisend:eine in einem Gehäuse (4) angeordnete Flüssigkeitsdüse (5) zur Ausbildung des Flüssigkeitsstrahls (3); undeine in dem Gehäuse (4) angeordnete Austrittsöffnung (6) mit einem Querschnitt A4,durch welche der Flüssigkeitsstrahl (3) aus dem Gehäuse (4) austritt und deren Querschnitt größer als der Querschnitt des Flüssigkeitsstrahls (3) ist; undeine zwischen der Flüssigkeitsdüse (5) und der Austrittsöffnung (6) angeordnete Durchtrittskammer (7) für den Flüssigkeitsstrahl (3);eine Gas-Zuführung mit einem Querschnitt A1 und einem Druck p1; eine Druckkammer (9) für das Gas in Form eines Stauraumes mit einem Querschnitt A2 und einem Druck p2;und einen Ausgang eines ringförmigen Gasstrahles (17) aus einer Gasaustrittsdüse (11) mit einem Druck p5; dadurch gekennzeichnet, dasszumindest eine mit der Durchtrittskammer ...

Verfahren zur Behandlung einer Festkörperoberfläche

Die Erfindung betrifft ein Verfahren zur Behandlung einer Festkörperoberfläche, wobei das Verfahren die folgenden Schritte umfasst: (a) Bereitstellen eines fluiden Reaktionsmediums, (b) Zuführen des fluiden Reaktionsmediums zumindest in einer Bearbeitungszone zur Festkörperoberfläche und (c) Bestrahlung des fluiden Reaktionsmediums in der Bearbeitungszone mit einer Laserstrahlung, deren Laserfokus beabstandet zur Festkörperoberfläche im fluiden Reaktionsmedium angeordnet ist, sodass von der Laserstrahlung angeregtes fluides Reaktionsmedium in der Bearbeitungszone mit der Festkörperoberfläche wechselwirkt. Aufgabe der Erfindung ist es, ein Verfahren zur Behandlung einer Festkörperoberfläche vorzuschlagen, bei dem der thermische Einfluss auf das Werkstück gering ist und bei dem die auf der Oberfläche des Werkstücks erzielbaren Strukturgrößen minimiert sind. Weiterhin sollen die Einflussmöglichkeiten auf die Form und Geometrie der Wechselwirkung mit dem Werkstück erhöht werden. Diese Aufgabe ...

PROCEDURE FOR LASER CUTTINGS OF BIND OR PLATTENFÖRMIGEN WORKPIECES, IN PARTICULAR OF ELECTRIC SHEET

LASERSCHNEIDDUESE

VERFAHREN ZUM LASERBRENNSCHNEIDEN UND VORRICHTUNG ZUR DURCHFUEHRUNG DES VERFAHRENS

Enhanced wet cylindrical sapphire laser back processing method of processing device

PROCESSING APPARATUS AND PROCESSING METHOD USING SAME

Disclosed is a processing apparatus. The disclosed processing apparatus may comprise: a light irradiation unit allowing a processing region of a processing object to be irradiated with a processing beam in the first direction; and a fluid cooling unit for spraying cooling fluid to the processing object in the second direction different from the first direction so as to enable the cooling fluid to flow along a surface of the processing object while the processing region is irradiated with the processing beam by the light irradiation unit. COPYRIGHT KIPO 2018 ...

Laser processing apparatus

A laser processing apparatus has a liquid supply mechanism disposed at an upper portion of a holding unit. The liquid supply mechanism includes: a pool adapted to form a layer of a liquid on an upper surface of a workpiece held by a holding table; a transparent plate disposed such as to make contact with the layer of the liquid; a jet nozzle adapted to jet the liquid by positioning a jet port between an upper surface of the workpiece and the transparent plate toward an application position of a laser beam applied to the workpiece through the transparent plate; a liquid supply nozzle adapted to supply the liquid from one side of the pool; and a liquid discharge nozzle adapted to discharge the liquid from the other side of the pool.

DEVICE FOR GENERATING A JET OF LIQUID

The present application relates to a device for generating a jet of liquid propagating along a jet axis (A), said jet of liquid guiding a laser beam. The device comprises a distribution chamber (5) with at least one inlet (10) and at least one outlet (11) for the liquid, said distribution chamber (5) being of an annular shape encircling said jet axis (A). The distribution chamber (5) has a first effective liquid flow cross-section area S1. The device further includes an acceleration chamber (7) having at least one inlet (12) and one outlet for the liquid and a window (3) transparent to said laser beam to introduce said laser beam into said acceleration chamber (7) through said window (3). The window (3) is arranged in line with the jet axis (A) to enable the introduction of the laser beam coaxial to said jet axis (A). Said acceleration chamber (7) has an entrance cross-section S3 defined by a surface area of a cylinder barrel of a geometric cylinder arranged coaxially to the jet axis (A ...

WAFER PROCESSING METHOD

Provided is a wafer processing method by which a wafer of good processed quality can be divided into individual chips, while improving productivity and reducing cost. This wafer processing method is a method by which a wafer (W) in which are formed regions demarcating a plurality of chips by predetermined dividing lines (14) in a device layer (12) formed on the surface of a semiconductor substrate (10) is divided into individual chips along the predetermined dividing lines, wherein the method includes: a groove formation step for irradiating the wafer, from the side of the surface thereof on which the device layer is formed, with laser light induced by a liquid beam, doing so along the predetermined dividing lines, to eliminate the device layer in the predetermined dividing lines as well as to form grooves (16) in the semiconductor substrate; and a back surface processing step for processing the back surface of the wafer, and reducing the thickness of the wafer.

APPARATUS FOR MACHINING A WORKPIECE WITH A LASER BEAM

The invention relates to an apparatus (100, 200, 300, 700) and a method (400) for machining a workpiece (101) with a laser beam (10a). The apparatus (100, 200, 300, 700) comprises a machining unit (103) configured to provide a pressurized fluid jet (104) onto the workpiece (101) and to couple the laser beam (102) through at least one optical element (105) into the fluid jet (104) towards the workpiece (101). Further, it comprises a sensing unit (107) arranged to receive a laser-induced electromagnetic radiation (106) propagating away from the workpiece (101) through the fluid jet (104) and through at least one optical element, and configured to convert the received radiation (106) into a signal (108). The apparatus (100, 200, 300, 700) also comprises a signal processing unit (109) configured determine a state of machining the workpiece (101) based on the signal (108).

LASER PROCESSING MACHINE AND ALIGNMENT ADJUSTMENT METHOD

This laser processing machine, which processes a work piece mounted on a table (108) by irradiating the work piece with a laser light, is provided with: an optical head (10) having a nozzle (26b) that sprays a liquid to form a columnar liquid flow and introducing a laser light into the nozzle (26a) and shining said light; and an alignment adjustment device (40) having a reflector (42) that is disposed so as to face the optical head (10) and reflects the laser light, and a light-shielding portion (34) around the portion of the reflector (42) that reflects the laser light, and adjusting the position or orientation of introduction of the laser light into the columnar liquid flow (60).

Machines for the separative machining of plate-shaped workpieces

The invention relates to machines and methods for separative machining of plate-shaped workpieces by a processing beam. The machines include a first movement unit configured to move the workpiece in a first direction and a second movement unit including a machining head configured to emit the processing beam. The second movement unit is configured to move the machining head in a second direction perpendicular to the first direction to direct the processing beam onto the workpiece. The machines include a first workpiece support unit including a first workpiece-bearing face and a second workpiece support unit including a second workpiece-bearing face spaced apart by a gap from the first workpiece support unit and the first workpiece-bearing face. The gap extends along the second direction. The machines include at least one support slide arranged to move in the second direction within the gap and including a support slide bearing face.

Laser Processing Apparatus, Laser Processing Method, and Method for Manufacturing Semiconductor Apparatus

A laser processing apparatus includes a holder configured to hold a workpiece, a head, a first nozzle, and a driver. The head is configured to irradiate a first portion of a main surface of the workpiece with a laser beam. The first nozzle is configured to supply a first liquid to the first portion. The driver is configured to drive the holder in such a manner that the workpiece can revolve around the optical axis of the laser beam at the first portion. Accordingly, the workpiece can be efficiently processed, and debris of the workpiece can be prevented from adhering to the main surface of the workpiece. 128-. (canceled)29. A laser processing apparatus comprising:a holder configured to hold a workpiece;a head configured to irradiate a first portion of a main surface of the workpiece with a laser beam;a first nozzle configured to supply a first liquid to the first portion; anda driver configured to drive the holder in such a manner that the workpiece can revolve around an optical axis of the laser beam at the first portion.30. The laser processing apparatus according to claim 29 , wherein the first nozzle is provided on the head in such a manner that the laser beam can be emitted from the first nozzle and can propagate through a liquid column formed by the first liquid between the first nozzle and the first portion.31. The laser processing apparatus according to claim 29 , further comprising a second nozzle configured to supply a second liquid to a second portion of the main surface different from the first portion.32. The laser processing apparatus according to claim 31 , wherein a second supply rate of the second liquid is higher than a first supply rate of the first liquid.33. The laser processing apparatus according to claim 29 , further comprising a plurality of second nozzles configured to supply a second liquid to a second portion of the main surface different from the first portion claim 29 ,a second supply rate of the second liquid being higher than a first ...

METHOD FOR TREATING THE SURFACE OF A SOLID OBJECT

СПОСОБ ЛАЗЕРНОГО ПАРОТЕРМИЧЕСКОГО ОКСИДИРОВАНИЯ МЕТАЛЛИЧЕСКИХ ПОВЕРХНОСТЕЙ И УСТРОЙСТВО ДЛЯ ЕГО ОСУЩЕСТВЛЕНИЯ (ВАРИАНТЫ)

Изобретение относится к способу и устройству (варианты) для паротермического оксидирования поверхностей деталей, изготовленных из металлов и сплавов. Покрывают изделие с подлежащей оксидированию поверхностью слоем воды заданной толщины. Воздействуют на покрытую водой поверхность лазерным излучением, имеющим длину волны, для которой вода является относительно прозрачной средой. Энергию и плотность потока энергии лазерного излучения и время облучения им поверхности выбирают так, чтобы обеспечить проникновение лазерного излучения сквозь слой воды и нагрев поверхности до по меньшей мере температуры, создающей фазовый переход воды в пар. Технический результат заключается в повышении износостойкости, коррозионной стойкости, диэлектрических, теплозащитных и декоративных характеристик различных изделий , в повышении скорости процесса окисления без достижения основной массой детали критических значений температуры, расширении спектра металлов и сплавов, допустимых для данного вида обработки, а также ...

Schutzgasdüse zu Laserbearbeitung und Verfahren zum Laserbearbeiten

Die Erfindung betrifft eine Schutzgasdüse zu Laserbearbeitung von Werkstücken mit einer Düse zum Zuführen eines Aktivgases und einem Laser zum Erwärmen eines Werkstücks an einem Punkt, dadurch gekennzeichnet, dass sie eine erste Spaltdüse zur Erzeugung eines um den Stahl rotierenden Gasstroms aufweist. Außerdem betrifft die Erfindung ein Verfahren zum Laserbearbeiten von Werkstücken, bei dem das Werkstück mit dem Laser an einem Punkt erwärmt wird.

Laser cutting in surface of hard object involves re-focusing laser beam on floor of cut when increasing cut depth by adjusting focusing arrangement

The method involves using a focused laser beam while the object is repeatedly scanned by the laser beam along the cut axis and the width off the cut is expanded by moving the focus perpendicularly to the cut axis. The beam is re-focused on the floor of the cut when increasing the cut depth by adjusting the focusing arrangement. AN Independent claim is also included for the following: an arrangement for automatically making a cut in the surface of a hard object with a focused laser beam.

Laser cutting nozzle

A laser cutting nozzle which has a laser beam enveloped by an inert gas and is intended for capacitive distance measurement and in which liquid is applied via the laser cutting nozzle to the material to be cut. For the purpose of achieving a design in which the capacitive distance measurement is not affected by the cooling liquid, the liquid feed 6 is arranged inside the discharge passage of the laser nozzle 4 in the circumferential region of the inert-gas envelope and in a manner known per se directly upstream of the discharge 4' of the laser beam enveloped by inert gas. ...

Oxy-laser cutting process and apparatus for carrying out the process

The invention relates to an oxy-laser cutting process in which the workpiece is located in a liquid bath, a material 1 into which the cutting gas is directed after passing through the workpiece being arranged under the workpiece. This material reduces the pressure of the cutting gas and absorbs the laser beam. In this case, it may be arranged in a container 2 in which a supporting surface for the workpiece to be cut is located, the material 1 which reduces the pressure of the cutting gas and absorbs the laser beam being covered at the top by the workpiece. ...

LASER GUMPTION NOZZLE

APPARATUS FOR MACHINING A WORKPIECE WITH A LASER BEAM

The invention relates to an apparatus (100, 200, 300, 700) and a method (400) for machining a workpiece (101) with a laser beam (10a). The apparatus (100, 200, 300, 700) comprises a machining unit (103) configured to provide a pressurized fluid jet (104) onto the workpiece (101) and to couple the laser beam (102) through at least one optical element (105) into the fluid jet (104) towards the workpiece (101). Further, it comprises a sensing unit (107) arranged to receive a laser-induced electromagnetic radiation (106) propagating away from the workpiece (101) through the fluid jet (104) and through at least one optical element, and configured to convert the received radiation (106) into a signal (108). The apparatus (100, 200, 300, 700) also comprises a signal processing unit (109) configured determine a state of machining the workpiece (101) based on the signal (108).

Processing equipment for laser wet cutting and detecting of surface mounting technology (SMT) template

Laser shock strengthening device of blisk

Laser wet cleaning method and device

LASER PROCESSING APPARATUS

An embodiment of the present invention relates to a laser processing apparatus. According to an embodiment of the present invention, provided is a laser processing apparatus which comprises: a laser generation unit generating a laser to process an object to be processed; and a waterjet generation unit generating a waterjet to transmit the laser to the object to be processed. Moreover, a beam mode of the laser reaching the object to be processed by adjusting at least one of offset and angular deflection with respect to the waterjet of the laser can be controlled. COPYRIGHT KIPO 2018 ...

METHODS OF TREATING INTRACEREBRAL HEMORRHAGES USING CYCLICAL ASPIRATION PATTERNS

An aspiration system includes a pump and a control system in communication with the pump. The control system includes a microcontroller, an antenna configured to receive a signal, and a pump control board in communication with the microcontroller. The antenna is in communication with the microcontroller. Upon receiving the signal, the pump control board operates the pump to create negative pressure according to the signal.

APPARATUS FOR MACHINING A WORKPIECE WITH A LIQUID JET GUIDED LASER BEAM AND THE ASSEMBLY THEREOF

УСТРОЙСТВО ДЛЯ ОБРАБОТКИ ЗАГОТОВКИ РЕЗАНИЕМ С ПОМОЩЬЮ ЛАЗЕРНОГО ЛУЧА

Изобретение относится к устройству (100, 200, 300, 7000) и способу (400) для обработки заготовки (101) резанием с помощью лазерного луча (102). Устройство (100, 200, 300, 700) содержит обрабатывающий блок (103), выполненный с возможностью подавать струю (104) текучей среды под давлением на заготовку (101) и вводить лазерный луч (102) через по меньшей мере один оптический элемент (105) в струю (104) текучей среды в направлении заготовки (101). Измерительный блок (107) устройства выполнен с возможностью приёма индуцированного лазером электромагнитного излучения (106), распространяющегося от заготовки (101) через струю (104) текучей среды и по меньшей мере через один оптический элемент, и с возможностью преобразования принятого излучения (106) в сигнал (108). Устройство (100, 200, 300, 700) содержит блок (109) обработки сигналов, выполненный с возможностью определения состояния обработки заготовки (101) на основе сигнала (108), направлено на улучшение традиционных устройства и решений. Технический ...

Устройство для лазерной обработки материалов в жидкой среде

Изобретение относится к устройству для лазерной обработки материалов, находящихся под водой, и может быть использовано в машиностроении и в других отраслях народного хозяйства. Устройство состоит из генератора лазерного излучения, выполненного с возможностью работы в частотном режиме, оптического элемента, гидравлической камеры с окном для ввода лазерного луча из оптического элемента, устройства подачи жидкости в гидравлическую камеру с выходным отверстием для вывода лазерного луча из гидравлической камеры в струе жидкости и системы создания и поддержания пониженного давления в зоне обработки. Устройство подачи жидкости выполнено в виде узла фильтрации, термостабилизации и нагнетания жидкости в гидравлическую камеру, в выходном отверстии которой установлена форсунка. Между гидравлической камерой и местом лазерной обработки расположена система создания и поддержания пониженного давления в зоне обработки, образующая замкнутый контур. Система выполнена с возможностью циркуляции потока жидкости ...

Устройство для лазерной резки и сварки конструкционных материалов в жидкой среде

Apparatus and method for laser operations on a workpiece

The apparatus includes a laser unit for emitting a laser beam (1) onto a workpiece (2), a unit (5) for delivery of a liquid as a reaction agent into work zone (3) formed by the laser beam on the workpiece. The method consists of emitting a laser beam onto a workpiece and delivering a liquid as a reaction agent to a work zone produced by the laser beam on the workpiece.

PROCEDURE AND DEVICE FOR CUTTING A MATERIAL OF MEANS OF A LASER BEAM.

PROCEDURE AND DEVICE FOR CONTINUOUS WELDING OF ON IMPACT LED VOLUMES OR SHEET METALS OF MEANS LASER BEAM

PROCEDURE FOR THE LASER TORCH CUTTING AND DEVICE FOR THE EXECUTION OF THE PROCEDURE

PROCEDURE FOR CUTTING AN ARTICLE AND FOR THE SUBSEQUENT TREATMENT OF THE CUT PROPERTY AS WELL AS CARRIER FOR HOLDING THE ARTICLE AND/OR THE CUT PROPERTY

Micro-water-column guiding laser micromachining device

Oil spouts device

The utility model relates to a belong to the laser cutting machine application technique field, especially a fueling injection equipment. It is including the oil spout subassembly, attach fitting, two -way solenoid valve and the gas circuit device that are used for the oil spout, outside oil sources passes through the attach fitting and gets into the oil spout subassembly, and what two -way solenoid valve intercommunication attach fitting and control connection connected gets into to the oil mass of oil spout subassembly, oil spout subassembly intercommunication gas circuit device to blowout through gas circuit device control oil mass. The utility model discloses an oil sources that the outside provided by the two -way solenoid valve control oil spout time, with the help of external auxiliary gas's effect, falls into laser cutting machine cutting mouth lower part with oil from the fuel sprayer blowout on the oil spout parts, and the help cutting machine punches fast, has avoided instiling ...

PROCESS AND DEVICE TO CUT MATERIALS USING A LASER BEAM

LASER IRRADIATION APPARATUS AND LASER IRRADIATION METHOD

METHOD FOR PRODUCING HONEYCOMB STRUCTURE

A honeycomb structure comprising ceramic and having at least a first end surface, a second end surface, a first sidewall, a second sidewall, and a plurality of channels extending from the first end surface to the second end surface and partitioned by inner walls, wherein a connecting hole comprising a first opening formed in the first sidewall or the second sidewall, and a second opening for connecting the plurality of channels and formed in the plurality of inner walls facing the first opening is formed from the first sidewall using a laser beam which passes through water flowing from a water jet.

Laser tool with color applicator

An example laser tool is configured to operate within a wellbore of a hydrocarbon-bearing rock formation. The laser tool includes one or more optical transmission media. The one or more optical transmission media are part of an optical path originating at a laser generator configured to generate a laser beam having an axis. The one or more optical transmission media are for passing the laser beam. The laser tool includes an optical element that is part of the optical path. The optical element is for receiving the laser beam from the one or more optical transmission media and for output to the hydrocarbon-bearing rock formation. The laser tool includes a color applicator head for discharging one or more coloring agents to a surface in the wellbore in a path of the laser beam.

BEAM DELIVERY SYSTEM, METHOD, TRAIN AND TRANSPORT SYSTEM

The present application relates to a beam delivery system (2), comprising a shield (4) which includes at least one beam passage (6) for transmission of at least one laser beam (8), an optics assembly (10) configured to at least partly focus the at least one laser beam (8) on the at least one beam passage (6), and means for providing a fluid flow (F) through the at least one beam passage (6). The invention also provides a train and a transport system, as well as a beam delivery method that comprises the steps of : transmitting at least one laser beam (8) through a respective at least one beam passage (6) of a shield (8), at least partly focusing the at least one laser beam (8) on the at least one beam passage (6), and providing a fluid flow (F) through the at least one beam passage (6).

Способ восстановления концевой части пера охлаждаемой лопатки турбины газотурбинного двигателя

Изобретение относится к технологии ремонта охлаждаемых лопаток турбины газотурбинного двигателя и может быть использовано в турбомашиностроении. Способ включает удаление теплозащитного покрытия до основного материала, шлифовку торца пера лопатки до торцовой перемычки, удаление ее и формирование паза под установку торцовой пластины, фиксацию торцовой пластины сваркой, нанесение пасты припоя, крепление торцовой пластины к лопатке высокотемпературной пайкой в вакууме, механическую обработку, восстановление стенки колодца торца пера лазерной наплавкой, термообработку в вакууме, механическую обработку наплывов наплавки, люминесцентный контроль, восстановление теплозащитного покрытия концевой части пера лопатки. Основным материалом лопатки является жаропрочный сплав с содержанием упрочняющей γ' фазы до 65%. Перед восстановлением импульсной лазерной наплавкой стенок колодца торца пера лопатки торцовую пластину предварительно подогревают лазерным лучом путем сканирования луча по поверхности торцовой ...

Düse zum Oberflächenbehandeln metallischer Werkstücke

A nozzle is disclosed for the surface treatment of metallic workpieces, in particular for coating, by powder welding or by thin-film alloying, highly stressed metallic components. The nozzle may be selectively connected to a mirror or lens focussed high energy irradiation system, preferably a high power laser system. The nozzle comprises conventional coolant units, protective gas ducts and powder conveyors/suction members. Compared with known laser nozzles, this nozzle allows highly stressed components to be homogeneously coated independently of the powder impingement angle, the supplied powder entraining gas and protective gas streams being uniformly and annularly distributed. A defined powder mass flow composed of a determined amount of powder and a determined proportion of entraining gas is distributed by a special powder supply arrangement in such a way that the outlet point of the powder entraining gas stream, shaped as a reversed cone, coïncides with the defocussed laser beam outside ...

Method and appts. for cooling a weld seam region during laser welding

Cooling of a weld seam region (4) during laser welding of sheets or strips (6,7) takes place by introduction of a liquid cool and in such a way that the weld seam region as close as possible to the welding focus is cooled. At the same time, an inert gas (helium, argon or something similar) under pressure is continuously fed between the liquid coolant and the weld seam region (4) to separate the latter from the coolant. The appts. includes a nozzle unit with three nozzles (12,14,15) foreseen respectively for a protective gas, an inert gas and a liquid coolant. The unit is attached to the welding head or to a stationary machine bed.

A aluminum door and window welding equipment

Laser water jet processing device and application thereof

A tool for laser beam machining glass material

High-strength composite aluminum alloy plate and preparation method thereof

Method for solving follow-up signal drift, laser processing head and laser processing system

The embodiment of the invention discloses a method for solving follow-up signal drifting, a laser processing head and a laser processing system.The method for solving follow-up signal drifting is applied to the laser processing head, the laser processing head comprises a cooling structure and a nozzle, and the method comprises the following steps that an insulating layer is arranged between the cooling structure and the nozzle; therefore, the liquid in the cooling structure can be electrically insulated from the nozzle, so that the influence of the conductivity of the liquid on a follow-up system is avoided, and the accuracy of a follow-up signal is ensured; force facing the other one of the cooling structure and the nozzle is applied to one of the cooling structure and the nozzle, so that abutting force within a preset range exists between the cooling structure and the nozzle, the pressure between the cooling structure and the nozzle can be within a small interval, the pressure between ...

PROCESS AND DEVICE TO CUT MATERIALS USING A LASER BEAM

가스가 핫 글래스 시트를 스코링하는 공정에 사용된 스프레이 노즐을 차지하는 것을 방지하기 위한 장치 및 방법

... 스프레이 노즐은 레이저 스코링 공정 또는 다른 고에너지 글래스 가열 공정 동안 핫 글래스 시트를 냉각하는 공정에 사용된다. 그 스코링은 레이저와 같은 고에너지 수단에 의해 행해진다. 스프레이 노즐은 노즐에 위치된 글래스를 냉각하는데 사용된 액체(예컨대, 물)에 가스를 생성하는 글래스 시트에 근접하여 위치된다. 가스(예컨대, 에어 버블)는 냉각액으로부터 제거된다. 다음에, 스프레이 노즐은 드로우의 하부에서 이동식 앤빌 머신을 이용하는 것과 같이 시트를 스코링하는 레이저가 진행하는 위치의 글래스 시트 상에 냉각액을 스프레이하는데 사용된다. 스프레이 노즐(퍼지 노즐)은 방출위치에 연결되는 퍼지 개구 및 튜브(tubing)을 갖춘다. 퍼지 노즐은 전처리 가스가 노즐의 퍼지 개구 근처에서 버블되는 경사 통로를 갖출 수 있다. 스프레이 노즐은 냉각제를 코일을 따라 이동시킬 수 있는 노즐 통로 주위를 통과하는 냉각 코일를 포함할 수 있다. 이는 노즐을 통해 통과하는 냉각액을 냉각시키고, 노즐의 냉각액에서의 버블의 용해성을 증가시킨다. 가스 필터는 가압된 냉각액 소스로부터 가스가 풍부한 냉각액을 수용하고, 그 냉각액으로부터 가스를 제거하고, 스프레이 노즐로 가스가 고갈된 냉각액을 보낸다.

METHOD AND APPARATUS FOR DETERMINING A POSITION OF A LIQUID JET THROUGH THE MODIFICATION OF AN ORIENTATION

A method for determining a spatial position of a liquid jet, in particular of a liquid jet for optically guiding a laser beam, comprises the steps: 118-. (canceled)19. A method for determining a position of a liquid jet , wherein the position is defined by at least one of the following features:(i) a position of a reference point of the liquid jet and(ii) a directional vector associated with the liquid jet,comprising the steps:a. providing a collision object having a measuring point for interacting with the liquid jet,b. detecting a state of the liquid jet in a first spatial configuration of the collision object relative to the liquid jet,c. performing at least one configuration change by changing from the first spatial configuration to a second spatial configuration of the collision object relative to the liquid jet, wherein said configuration change results in a change of the state of the liquid jet due to a change of an interaction of the measuring point and the liquid jet,d. detecting a spatial difference between the first and second configuration for determining the position of the liquid jet.20. The method as claimed in claim 19 , characterized in that the collision object has at least two measuring points for interacting with the liquid jet claim 19 , wherein said measuring points are provided in different elevation planes claim 19 , and in that at least two configuration changes are carried out.21. The method as claimed in claim 19 , characterized in that said configuration change is performed in a direction exclusively transverse to a lengthwise axis of the liquid jet.22. The method as claimed in claim 20 , characterized in that claim 20 , in order to determine the position of a midpoint or a diameter of the liquid jet claim 20 , the collision object is at first brought into interaction with the first measuring point on a first side of the liquid jet claim 20 , and then it is brought into interaction with the second measuring point on a second side of the ...

Machine tool

This machine tool is provided with: a pump which pressurizes a liquid; a nozzle which ejects the liquid pressurized by the pump toward a workpiece; and a pulsation removing pipe which is provided between a discharge port of the pump and the nozzle and which is formed by being wound a plurality of turns or by being bent zigzagged a plurality of times, wherein the workpiece is processed while the pressurized liquid is ejected.

METHOD OF AND APPARATUS FOR SUPPLYING COOLING WATER TO LASER PROCESSING HEAD AND METHOD OF PRODUCING COOLING WATER

A method of supplying cooling water to a laser processing head includes arranging a cooling water supply path connected to the laser processing head, connecting, to the cooling water supply path, a water supply path for supplying water and an antirust supply path for supplying antirust, keeping constant a ratio between a water quantity fed by a water feed means connected to the water supply path and an antirust quantity fed by an antirust feed means connected to the antirust supply path, mixing the water and antirust in the cooling water supply path, and supplying cooling water to the laser processing head. 1. A method of supplying cooling water to a laser processing head , comprising;providing a cooling water supply path connected to the laser processing head,connecting, to the cooling water supply path, a water supply path for supplying water and an antirust supply path for supplying antirust,keeping constant a ratio between a water quantity fed by a water feeder connected to the water supply path and an antirust quantity fed by an antirust feeder connected to the antirust supply path,mixing the water and antirust in the cooling water supply path, andsupplying cooling water to the laser processing head.2. The method of supplying cooling water according to claim 1 , wherein claim 1 , in the cooling water supply path claim 1 , a cooling water tank for storing cooling water is provided and the water and antirust are mixed in the cooling water tank.3. The method of supplying cooling water according to claim 1 , wherein claim 1 , in the cooling water supply path claim 1 , a cooling water tank is provided for storing cooling water and the water supply path for supplying water and the antirust supply path for supplying antirust are connected to a mixed solution supply path connected to the cooling water tank claim 1 , and water fed by the water feeder connected to the water supply path and antirust fed by the antirust feeder connected to the antirust supply path are ...

Liquid enhanced laser stripping

A method for stripping ceramic from a component includes applying a liquid to a ceramic coating of an outer surface of the component. The method also includes directing a plurality of laser pulses at the ceramic coating with the applied liquid in order to spall the ceramic coating from the component.

LIQUID ENHANCED LASER STRIPPING

A method for stripping ceramic from a component includes applying a liquid to a ceramic coating of an outer surface of the component. The method also includes directing a plurality of laser pulses at the ceramic coating with the applied liquid in order to spall the ceramic coating from the component.

APPARATUS FOR MACHINING A WORKPIECE WITH A LASER BEAM COUPLED INTO A FLUID JET, WITH AUTOMATIC LASER-NOZZLE ALIGNMENT ; METHOD OF ALIGNING SUCH A BEAM

СИСТЕМА АВТОМАТИЧЕСКОЙ ПОДСТРОЙКИ СКАНИРУЮЩЕЙ СИСТЕМЫ УСТАНОВКИ СЕЛЕКТИВНОГО ЛАЗЕРНОГО СПЛАВЛЕНИЯ

Изобретение относится к системе для автоматической подстройки сканирующей системы установки селективного лазерного сплавления. Видеокамера системы с объективом соединена с устройством управления, а маркеры расположены в поле зрения объектива видеокамеры на ростовой подложке рабочего стола. Маркеры выполнены в виде неподвижных маркеров, представляющих собой сквозные отверстия в рабочем столе, а система дополнительно содержит устройство очистки маркеров. Технический результат заключается в обеспечении непрерывного контроля точности пространственного положения видеосистемы для автоматической подстройки сканирующей системы установки селективного лазерного сплавления без остановки процесса сканирования. 2 з.п. ф-лы, 3 ил.

Способ формирования 3D микроструктур в оптических материалах

Изобретение относится к способу формирования 3D микроструктур в оптически прозрачном материале и может быть использовано, например, для изготовления элементов микрооптики, волоконной и интегральной оптики, фотоники, плазмоники, сенсорики и микрофлюидики. Осуществляют воздействие импульсного лазерного излучения на поверхность оптически прозрачного материала, которая находится в контакте с поглощающей лазерное излучение рабочей жидкостью. Осуществляют послойное удаление оптически прозрачного материала, который размещают в стенке камеры, заполненной рабочей жидкостью, давление которой изменяют в диапазоне от 1 до 30 МПа. Пучок лазерного излучения фокусируют на обратной поверхности оптически прозрачного материала. Воздействие лазерного излучения ведут с обеспечением формирования на границе с обрабатываемым материалом области повышенного поглощения лазерного излучения в рабочей жидкости и образованием 3D микроструктур. Плотность энергии в лазерном импульсе составляет 5-500 Дж/см, а длительность ...

Способ и устройство гидролазерной резки конструкционных материалов

VERFAHREN ZUM SCHNEIDEN VON WERKSTOFFEN

VERFAHREN UND VORRICHTUNG ZUM SCHNEIDEN EINES MATERIALS MITTELS EINES LASERSTRAHLES.

A system for cutting a material by a laser beam is based on producing a compact jet of a liquid, which is permeable for the laser beam immediately adjoining the exit of the laser beam from an optical fibre. This jet is now directed on the material to be cut. The optical fibre core (1) is surrounded by cladding (3) and a sheath (4) leaving the frontal area (2) bare. An annular nozzle (5) is screwed to the end of the sheath (4) and a hose (6) is pulled over it. Slots (8) give access for a liquid from the annulus (7) to the space (9) and the annular gap (12).

Precision machining method for i.c. engine piston sleeve

The precision machining method uses a beam, e.g. a laser, for discontinuous machining of the workpiece surface, for forming individual recesses in this surface at irregularly spaced points, during the rotation of the machined workpiece (2) about its longitudinal axis. An Independent claim for a precision machining device for machining a piston sleeve is also provided.

Process and device for laser beam treatment of workpieces

In a laser beam cutting device the focussing of the laser beam (1) and the adjustment of the focal spot (4) in respect of its vertical position is made swing free, and is achieved without subsequent correction of the workpiece coordinates, with the focussing lens (2) guided strictly parallel and coaxial with the optical axis. By active cooling of the surface of the workpiece in the immediate area of the focal spot (4), the critical heating-up zone is reduced and the accuracy and surface finish of the cut edge is improved.

METHOD AND APPARATUS FOR MANUFACTURING A WORKPIECE INTO A PRODUCT

The invention relates to a method and an apparatus for manufacturing a workpiece (101), specifically a rough diamond, into a product (102), specifically a brilliant. The method is performed by an apparatus providing a laser beam (103) coupled into a pressurized fluid jet (104). The method comprises executing multiple cuts of the workpiece (101) with the laser beam (103) according to a predetermined cut-sequence to remove workpiece (101) material with each completed cut. The method further comprises executing multiple rotations of the workpiece (101) around the same axis (106) of revolution according to a predetermined rotation-sequence (107). Thereby, a rotation is executed after a completed cut, and for executing a cut the laser beam (103) is moved along a two- dimensional path (108).

LASER PEENING PROCESSING APPARATUS AND LASER PEENING PROCESSING METHOD

The laser peening device pertaining to an embodiment of the present invention is provided with a laser oscillator for generating laser light, and a nozzle for condensing and radiating the laser light toward a work piece surface to be processed while circulating a liquid thereto, a straightening part for straightening the flow of the liquid being provided to the nozzle. The laser peening method pertaining to an embodiment of the present invention has a step for generating laser light, a step for manufacturing a product or a semi-finished product by condensing and radiating the laser light toward a work piece surface while circulating a liquid thereto, and a step for straightening the flow of the liquid using a straightening structure.

PROCESS FOR THE COOLING OF A WELDING SEAM AREA DURING LASER WELDING AND APPARATUS FOR THE IMPLEMENTATION OF THE PROCESS

The invention relates to a process and an apparatus for the cooling of a welding seam area during laser welding of plates or strips, preferably used in car body construction in automotive engineering. It is described how expediently the cooling agent supply and also the supply of an inert gas vei l built up between the focus and liquid coolant is achieved so that the liquid coolant is prevented from entering the welding seam area and causing detrimental effects there.

Water cooling device for welding circulation cooling

Orthogonal integrated cleaving device

An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.

Laser machining head

The invention relates to a laser machining head for a laser machining machine, comprising a mount ( 2 ) for a sensor part ( 3 ) formed from electrically conductive material, an outer insulation part ( 4 ) made from electrically insulating material, preferably made from plastic, for electrical shielding and an inner insulation part ( 5 ) inserted within the outer insulation part ( 4 ) as radiation shield, wherein the inner insulation part ( 5 ) is formed from metal and is electrically insulated from the sensor part ( 3 ).

Nozzle assembly for laser cutting apparatus

A laser cutting apparatus includes a galvo scanner system and a nozzle assembly. The galvo scanner system includes an outlet. The nozzle assembly includes a nozzle and a sleeve threadedly connected to each other, the sleeve mounted on the outlet of the galvo scanner system, the nozzle defining an air entrance. A gas supply is connected to the air entrance, and flows out of the nozzle.

System and method for manufacturing an airfoil

A system for manufacturing an airfoil includes a laser beam and a first fluid column surrounding the laser beam to create a confined laser beam directed at the airfoil. A liquid flowing inside the airfoil disrupts the first fluid column inside the airfoil. A method for manufacturing an airfoil includes confining a laser beam inside a first fluid column to create a confined laser beam and directing the confined laser beam at a surface of the airfoil. The method further includes creating a hole through the surface of the airfoil with the confined laser beam, flowing a liquid inside the airfoil, and disrupting the first fluid column with the liquid flowing inside the airfoil.

MASK TENSION WELDING DEVICE FOR THIN FILM DEPOSITION

A mask tension welding device for welding a mask for thin film deposition on a mask frame, the mask tension welding device including a tension unit to pull the mask in one direction; a pressurizing unit to press the mask to the mask frame, the pressuring unit including an upper housing, a lower housing coupled to the upper housing, a window between the upper housing and the lower housing, a space in the lower housing into which a fluid is injectable, and an inlet and an outlet to provide a passage through which the fluid is injected and discharged; and a laser welding unit to weld the mask and the mask frame to each other. 1. A mask tension welding device for welding a mask for thin film deposition on a mask frame , the mask tension welding device comprising:a tension unit to pull the mask in one direction; an upper housing,', 'a lower housing coupled to the upper housing,', 'a window between the upper housing and the lower housing,', 'a space in the lower housing into which a fluid is injectable, and', 'an inlet and an outlet to provide a passage through which the fluid is injected and discharged; and, 'a pressurizing unit to press the mask to the mask frame, the pressuring unit includinga laser welding unit to weld the mask and the mask frame to each other.2. The mask tension welding device as claimed in claim 1 , wherein the tension unit includes a mask tension clamp to pull ends of the mask and to fix the ends on the mask frame.3. The mask tension welding device as claimed in claim 1 , wherein the pressurizing unit pressurizes the mask on the mask frame to make facing surfaces of the mask frame and the mask adhere to each other.4. The mask tension welding device as claimed in claim 3 , wherein:the upper housing includes a first block in which a first hollow is formed,the lower housing includes a second block in which a second hollow is formed, andthe first block is coupled with the second block.5. The mask tension welding device as claimed in claim 4 , wherein:a ...

LASER PROCESSING APPARATUS

Disclosed herein is a laser processing apparatus that includes a laser generation unit configured to generate a laser beam to process a workpiece, a first fluid jet generation unit configured to generate and inject a first fluid jet to deliver the laser beam to the workpiece, and a second fluid jet generation unit configured to inject a second fluid jet around the laser beam, wherein the first and second fluid jets are simultaneously or selectively injected. 1. A laser processing apparatus , comprising:a laser generation unit configured to generate a laser beam to process a workpiece;a first fluid jet generation unit configured to generate and inject a first fluid jet into a first fluid to deliver the laser to the workpiece;a second fluid jet generation unit configured to inject a second fluid jet to a second fluid around the laser beam; andan assist injection unit configured to inject an assist fluid to the workpiece,wherein the first fluid of the first fluid jet and the assist fluid of the assist injection unit are supplied by the same pump, respectively, as the same fluid.2. The laser processing apparatus according to claim 1 , wherein the first fluid jet is a liquid claim 1 , and the second fluid jet is a gas.3. The laser processing apparatus according to claim 1 , wherein one of the first and second fluid jets is water claim 1 , and the other is a liquid containing water.4. The laser processing apparatus according to claim 1 , wherein the first fluid jet generation unit comprises:a first fluid chamber configured to accommodate a first fluid for generating the first fluid jet;a water supply section configured to supply the first fluid to the first fluid chamber; anda nozzle configured to inject the first fluid in the first fluid chamber to the workpiece.5. The laser processing apparatus according to claim 1 , wherein the second fluid jet generation unit comprises:a second fluid chamber configured to accommodate a second fluid;a second fluid supply section ...

METHOD FOR CLEANING NOZZLE AND LASER MACHINING APPARATUS

The technical problems to be solved are to keep the vicinity of the nozzle opening clean and to restrain the jet liquid column from tilting. The solution to problems lies in a method for cleaning a nozzle of a laser machining apparatus to process a work piece to be processed by a laser beam introduced into a jet liquid column, the method comprising the steps of: forming the jet liquid column by jetting a liquid from the nozzle; and irradiating a spot of the laser beam onto a vicinal section of an inlet opening of the nozzle in such a state that a peak power per unit area of the spot of the laser beam irradiated on a surface provided with the inlet opening of the nozzle does not go beyond a threshold value at which the nozzle is damaged and removing foreign matters attached on the surface. 1. A method for cleaning a nozzle of a laser machining apparatus to process a work piece to be processed by a laser beam introduced into a jet liquid column , the method comprising the steps of:forming the jet liquid column by jetting a liquid from the nozzle; andirradiating a spot of the laser beam onto a vicinal section of an inlet opening of the nozzle in such a state that a peak power per unit area of the spot of the laser beam irradiated on a surface provided with the inlet opening of the nozzle does not go beyond a threshold value at which the nozzle is damaged and removing foreign matters attached on the surface.2. The method according to claim 1 , wherein the step of removing the foreign matters comprises making the spot of the laser beam scan the vicinal section on the surface.3. The method according to claim 2 , the nozzle;', 'a liquid reception chamber to receive the liquid for the inlet opening; and', 'a window disposed on an upstream side with regard to the liquid reception chamber in an optical axis direction of the laser beam,, 'wherein the laser machining apparatus comprises making the laser beam converged within the liquid reception chamber; and', 'having the spot ...

CUTTING METHOD FOR POLYMER RESIN MOLD COMPOUND BASED SUBSTRATES AND SYSTEM THEREOF

The invention includes a system and method of using a laser for singulation of a polymer resin mold compound substrate into packages or chips by a laser ablation process. A metal jig used for holding the substrate includes trenches to allow the laser beam to penetrate during cutting. Built-in piping allows water to circulate in a base around the jig to cool the substrate during cutting. The laser beam can pass through a cutting nozzle along with compressed gas or air to cool the substrate and remove debris. A pulsed laser beam can be used in the cutting process, so that a combination of passes at different speeds and laser parameters can be achieved. This allows single pass singulation of units at high speed. 1. A system for singulation of a polymer resin mold compound-based substrate into packages by a laser ablation process comprised of:a buffer station comprising a heated plate to pre-heat the polymer resin mold compound-based substrate;a laser; anda jig for holding the polymer resin compound,wherein the laser cuts along trenches that are embedded in the jig, andwherein the jig is cooled by circulating a liquid through a base plate with a system of internal pipes.2. The system of claim 1 , wherein the trenches have a depth of approximately 1 to 3 centimeters and a width greater than or equal to 1 millimeter.3. The system of claim 1 , wherein the trenches have a width greater than or equal to 0.5 mm.4. The system of claim 1 , wherein vacuum pressure holds the polymer resin mold compound-based substrate to the jig.5. The system of claim 1 , wherein the laser is a pulsed laser with a repetition rate of 10 kHz and above.6. (canceled)7. The system of claim 1 , wherein the buffer station includes a gas ejector for fast-cooling gas to cool the polymer resin mold compound-based substrate to preserve its form after pre-heating.8. The system of claim 1 , wherein a source of compressed air or gas forces compressed air or gas in the direction of the laser.9. A method of ...

MANUFACTURING METHODS FOR MULTI-LOBED COOLING HOLES

A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface includes forming a cooling hole inlet at the first wall surface, forming a cooling hole outlet at the second wall surface, forming a metering section downstream from the inlet and forming a multi-lobed diffusing section between the metering section and the outlet. The inlet, outlet, metering section and multi-lobed diffusing section are formed by laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof. 1. A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface , the method comprising:forming a cooling hole inlet at the first wall surface;forming a cooling hole outlet at the second wall surface;forming a metering section downstream from the inlet; andforming a multi-lobed diffusing section between the metering section and the outlet,wherein the inlet, outlet, metering section and multi-lobed diffusing section are formed by a technique selected from the group consisting of laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof.2. The method of claim 1 , wherein the wall comprises a metal or superalloy substrate.3. The method of claim 1 , wherein the second wall surface comprises a coating claim 1 , and wherein at least a portion of the cooling hole extends through the coating.4. The method of claim 3 , wherein the coating comprises:a bond coating; anda thermal barrier coating.5. The method of claim 4 , wherein a portion of the diffusing section is located within the coating.6. The method of claim 5 , wherein the entire diffusing section is located within the coating.7. The method of claim 6 , wherein a portion of the metering section is located within the coating.8. The method of claim 1 , wherein the inlet and metering section ...

Laser removal of conductive seed layers

Various techniques are disclosed for an apparatus and a method to remove a layer from a substrate having a pattern formed on the layer. In one example, the apparatus comprises a stage configured to receive and hold the substrate. The apparatus may further comprise an irradiating device comprising a projection lens and configured to irradiate the surface of the substrate with pulses of laser light having a selected fluence to remove an interstitial portion of the layer between the pattern without removing the pattern for corresponding irradiated areas of the substrate. The pulses of laser light may be focused through the projection lens, and the stage and the projection lens may be configured to move continuously relative each other to irradiate a plurality of areas of the substrate with the pulses of laser light.

Methods and systems for machining precision micro holes into thick ceramic substrates

A combination of a liquid jet and a mechanical rotary tool can be used to machine precision micro holes in thick substrates. A liquid-jet guided laser can be used to rapidly drill core holes into the ceramic substrate. A sensor can be applied to detect the cut through point of the liquid-jet guided laser drilling step to allow a rapid and closed-loop controlled machining process. The substrate can be heated up for speeding up a liquid-jet guided laser drilling process. A mechanical tool such as a drill, a reamer or a mill can be applied to finish the core holes to a desired bore diameter. The mechanical tool cutting main surface can preferably consist of a diamond material. An inspection camera and illumination system can be applied to inspect each mechanically finished bore as part of the drilling process. 1. A method comprisingforming a hole in a substrate using a liquid-jet guided laser beam,wherein the liquid-jet guided laser beam comprises a laser beam internally reflected within a column of liquid,wherein the column of liquid is formed by flowing the liquid through a nozzle,wherein the internally reflected laser beam is formed by focusing a laser beam into the column of liquid;smoothing the hole using a mechanical rotary tool to achieve a final dimension,wherein the mechanical rotary tool is operated by a mechanical rotating system,wherein the mechanical rotary tool comprises a diameter suitable for the final dimension of the hole.2. A method as claim 1 ,wherein the hole is configured to provide a fluid connection between a top surface and a bottom surface of the substrate.3. A method as claim 1 ,wherein forming the hole using the liquid-jet guided laser beam comprises forming the hole using at least one of a circular motion or a spiral motion,wherein the circular motion or the spiral motion is configured to form the hole having a diameter of between 75 and 99% of the final dimension.4. A method as claim 1 ,{'b': 0', '05, 'wherein forming the hole using the ...

LASER BUILD-UP METHOD

A laser build-up method according to an embodiment includes the processes of: forming an annular counter sunk groove in an edge of an opening of a port on a side of a combustion chamber; and irradiating a laser beam while a metallic powder is being supplied to the counter sunk groove and successively forming a cladding layer for a valve seat, in which: the cladding layer is formed while a seal gas is being sprayed onto a melt pool the cladding layer includes a starting end part a part formed just after the starting end part is formed an intermediate part a part formed just before a terminating end part is formed and a terminating end part which are formed in this order. 1. A laser build-up method comprising the processes of:forming an annular counter sunk groove in an edge of an opening of a port on a side of a combustion chamber in a cylinder head roughly formed material; andirradiating a laser beam while a metallic powder is being supplied to the counter sunk groove and successively forming a cladding layer for a valve seat, wherein:the cladding layer is formed while seal gas is being sprayed onto a melt pool,the cladding layer comprises a starting end part, a part formed just after the starting end part is formed, an intermediate part, a part formed just before a terminating end part is formed, and a terminating end part, which are formed in this order, and the cladding layer is successively formed in an annular shape, andthe flow rate of the seal gas when an overlapped part in which the terminating end part overlaps with the starting end part is formed is made larger than the flow rate of the seal gas when the intermediate part is formed.2. The laser build-up method according to claim 1 , wherein the flow rate of the seal gas when the part formed just before the terminating end part is formed is formed is made larger than the flow rate of the seal gas when the intermediate part is formed.3. The laser build-up method according to claim 1 , wherein the flow rate ...

Laser welding with filler wire

A fusion welding system utilizing a radiant energy heat source such as a laser or electron-beam. The system uses a weld or filler wire having a non-round cross-section shape oriented such that the minor axis of the filler wire is aligned to intersect or nearly intersect the weld bead line. The filler wire cross-sectional shape provides enhanced surface interaction with the radiant energy heat source and possesses mechanical properties enabling more precise positioning of the wire relative to the radiant energy heat source and the weld area.

LASER BEAM MACHINE AND ALIGNMENT ADJUSTING METHOD

This laser processing machine, which processes a work piece mounted on a table by irradiating the work piece with a laser light, is provided with: an optical head having a nozzle that sprays a liquid to form a columnar liquid flow and introducing a laser light into the nozzle and shining said light; and an alignment adjustment device having a reflector that is disposed so as to face the optical head and reflects the laser light, and a light-shielding portion around the portion of the reflector that reflects the laser light, and adjusting the position or orientation of introduction of the laser light into the columnar liquid flow. 1. A laser beam machine for machining a workpiece by irradiating a laser beam to the workpiece mounted to a table , characterized by:an optical head having a nozzle configure to discharge liquid to form a pillar-like liquid flow, the optical head introducing a laser beam into the nozzle to irradiate; andan alignment adjusting device, having a reflecting plate, disposed to face the optical head, for reflecting the laser beam, and a shielding part disposed around a portion of the reflecting plate, the portion being adapted to reflect the laser, the alignment adjusting device being configure to adjust the incident position and angle of the laser beam relative to the pillar-like liquid flow.2. The laser beam machine according to claim 1 , wherein the optical head comprises an optical system configured to lead the laser beam from a laser oscillator to the nozzle claim 1 , a camera configured to capture an image of the nozzle and the reflecting plate claim 1 , and a housing configure to enclose the optical system and the camera claim 1 , the nozzle being disposed on a bottom face of the housing claim 1 ,Wherein the alignment adjusting device is disposed in the laser beam machine at a position allowing the shielding member to contact intimately with the bottom face of the housing to enclose the nozzle.3. The laser beam machine according to claim 2 ...

APPARATUS FOR INTRODUCING A PARTING AGENT INTO A HOLLOW WORKPIECE, LOADING STATION, SYSTEM AND METHOD

An apparatus for introducing a parting agent into a hollow workpiece before or during processing of the hollow workpiece by using a laser processing machine, includes an introduction section with a nozzle for dispensing the parting agent and a centering element which is disposed on the introduction section and serves for centering the introduction section within the hollow workpiece. A loading station, a system and a method are also provided. 1. An apparatus for introducing a parting agent into a hollow workpiece before or during processing of the hollow workpiece by using a laser processing machine , the apparatus comprising:an introduction section with a nozzle for dispensing the parting agent; anda centering element disposed on said introduction section, said centering element serving for centering said introduction section within the hollow workpiece.2. The apparatus according to claim 1 , wherein said centering element includes a plurality of centering brush fibers.3. The apparatus according to claim 1 , wherein said introduction section includes a guide rod having a free end at which said nozzle is disposed claim 1 , and said centering element is disposed on said guide rod.4. The apparatus according to claim 3 , which further comprises a stabilization element provided on said guide rod claim 3 , in addition to said centering element claim 3 , for preventing tilting of said guide rod in the hollow workpiece.5. The apparatus according to claim 1 , which further comprises an introduction hose with a nozzle for dispensing the parting agent claim 1 , said introduction hose configured to be introduced into a hollow workpiece instead of said introduction section.6. The apparatus according to claim 3 , which further comprises an energy chain adjoining an end of said guide rod facing away from said free end of said guide rod at which said nozzle is disposed.7. The apparatus according to claim 6 , which further comprises a chain drum for rolling-up said energy chain.8. ...

APPARATUS FOR AUTOMATIC JET ANGLE ADJUSTMENT

The invention relates to an apparatus for machining a workpiece with a laser beam . The apparatus comprises a machining unit configured to provide a pressurized fluid jet and to couple the laser beam into the fluid jet . It further comprises a motion unit configured to rotate the machining unit around an x-axis and/or y-axis, a determining unit configured to determine a first angle between the fluid jet and the y-axis and/or a second angle between the fluid jet and the x-axis, and a processing unit configured to control the motion unit to rotate the machining unit 102 around the x-axis based on the first angle and/or around the y-axis based on the second angle. 1100101100. Apparatus () for machining a workpiece with a laser beam () , the apparatus () comprising{'b': 102', '103', '101', '103, 'a machining unit () configured to provide a pressurized fluid jet () and to couple the laser beam () into the fluid jet (),'}{'b': 104', '102, 'a motion unit () configured to rotate the machining unit () around an x-axis and/or y-axis,'}{'b': 105', '103', '103, 'a determining unit () configured to determine a first angle between the fluid jet () and the y-axis and/or a second angle between the fluid jet () and the x-axis, and'}{'b': 106', '104', '102, 'a processing unit () configured to control the motion unit () to rotate the machining unit () around the x-axis based on the first angle and/or around the y-axis based on the second angle.'}2100. Apparatus () according to claim 1 , wherein{'b': 106', '104', '102, 'the processing unit () is configured to control the motion unit () to rotate the machining unit () by a first adjustment angle around the x-axis and/or by a second adjustment angle around the y-axis,'}the first adjustment angle being defined by a difference between a first target angle and the first angle, andthe second adjustment angle being defined by a difference between a second target angle and the second angle.3100. Apparatus () according to claim 1 , wherein{'b': ...

Laser Shock Peening Method for Obtaining Large-Area Uniform Surface Morphology

Provided is a laser shock peening method for obtaining a large-area uniform surface morphology. Using the relationship between the thickness of an absorption layer and a plastic deformation due to the laser shock peening and using a grid-shaped absorption layer () having a staggered distribution in thickness in cooperation with a two-layer interlaced laser shock processing method significantly reduce the height difference between micro-protrusions () and micro-pits () produced by an impact of a square light spot, and effectively reduce the roughness of the workpiece surface such that a large-area uniform surface morphology is formed on the workpiece surface. 1. A laser shock peening (LSP) method to induce a uniform surface morphology with a large area wherein said method is characterized in that: a latticed absorbing layer that has interlaced thicknesses and a two-layer interleaved LSP is used in combination , wherein technological parameters of the two-layer LSP remain unchanged , and the distance between a starting position in the second layer and that of the first layer is a/2 along both X- and Y-directions , and wherein the method reduces a height difference between micro-convex and micro-concave caused by massive square-spots , reduces surface roughness of a work-piece , induces a uniform micromorphology with a large area , and has a uniform strengthening effect on the surface of the work-piece.2. The LSP method according to claim 1 , characterized by following steps:mount the work piece on a five-axis workbench and cover the latticed absorbing layer onto the surface work-piece to be processed;use a laser control device to set laser output power and laser parameters, modulate the round spot into square-spot, and the overlapping distance between both adjacent square-spots is set to f;use a numerical control system to adjust the five-axis workbench, so as to make the position of the laser beam and the corner of a single lattice of the absorbing layer overlapped ...

Gas ejection

An example gas ejection device, for a cutting apparatus, comprises a housing to retain a gas and a slot provided in the housing. A nozzle is movably disposed within the slot. The nozzle is to discharge a gas retained in the housing.

Coaxial laser-wire optical system for use in additive manufacturing

A feed head apparatus for use in laser wire additive manufacturing, comprising an optical housing adapted to receive a laser beam therein and a wire therein, wherein the wire is adapted for use in additive manufacturing; a first reflective optic for receiving and reflecting the laser beam; and a second reflective optic for receiving laser light reflected by the first reflective optic, wherein the second reflective optic directs the laser light received from the first reflective optic onto the wire in a cylindrical configuration such that the wire and the cylinder of laser light are coaxial with regard to one another within a portion of the optical housing.

LASER PEENING PROCESSING DEVICE AND LASER PEENING PROCESSING METHOD

A laser peening processing device includes a laser oscillator configured to oscillate a laser beam; and a nozzle configured to inject liquid to a workpiece for laser peening processing, and to cause the laser beam to be incident on the liquid to irradiate the workpiece with the laser beam which propagates through the liquid. The nozzle includes a lens configured to concentrate the laser beam so that a focal point of the laser beam is formed at a processing position of the laser peening processing, a cylindrical casing configured to protect the laser beam before the laser beam is incident on the liquid, and a pipe disposed in the casing and configured to form a flow path for the liquid. 1. A laser peening processing device comprising:a laser oscillator configured to oscillate a laser beam; anda nozzle configured to inject liquid to a workpiece for laser peening processing, and to cause the laser beam to be incident on the liquid to irradiate the workpiece with the laser beam which propagates through the liquid,wherein the nozzle comprisesa lens configured to concentrate the laser beam so that a focal point of the laser beam is formed at a processing position of the laser peening processing,a cylindrical casing configured to protect the laser beam before the laser beam is incident on the liquid, anda pipe disposed in the casing, and configured to form a flow path for the liquid.2. The laser peening processing device according to claim 1 ,wherein the nozzle comprises a prism that changes a traveling direction of the laser beam from an incident direction to the nozzle to a vertical lower direction, andan exit of the pipe is disposed on an emission side of the laser beam from the prism, and the disposed exit causes the laser beam to be incident on the liquid on the emission side of the laser beam from the prism.3. The laser peening processing device according to claim 1 , further comprising:a movement mechanism configured to move the workpiece so that a processing ...

Stent and process for producing same

This stent is a self-expandable stent constituted of an Ni—Ti base alloy or Co—Cr base alloy and formed into a cylindrical shape with mesh openings. The stent has been configured so that the Af point is 22-26° C., the stress-displacement curve has a yield point, and the crystal grains in a cross-section of the stent have an average cross-sectional area, as determined by the area fraction method, of 0.2-50 μm 2 .

Machining condition adjustment device and machine learning device

A machining condition adjustment device adjusts settings of an ionizer so as to neutralize a charge carried by plasma generated during laser beam machining of a workpiece by a laser beam machining device, calculates an amount of charge per unit time that is to be radiated from the ionizer, based on the amount of charge carried by the plasma generated during the laser beam machining, and sets the ionizer to radiate the calculated amount of charge per unit time.

LASER PROCESSING DEVICE

According to one embodiment, a laser processing device includes a light irradiation section, and a mirror. The light irradiation section is adapted to emit a laser beam from a light source from a tip. The mirror is opposed to the tip of the light irradiation section. The mirror is adapted to reflect the laser beam emitted from the light irradiation section with an aspherical reflecting surface. An angle formed between the laser beam transmitted from the light irradiation section to the mirror and the laser beam reflected by the mirror is equal to or larger than 90 degrees. 1. A laser processing device comprising:a light irradiation section adapted to emit a laser beam from a light source from a tip; anda mirror opposed to the tip of the light irradiation section, and adapted to reflect the laser beam emitted from the light irradiation section with an aspherical reflecting surface,an angle formed between the laser beam transmitted from the light irradiation section to the mirror and the laser beam reflected by the mirror being equal to or larger than 90 degrees.2. The device according to claim 1 , whereinan angle formed between an optical axis of the laser beam transmitted from the light irradiation section to the mirror and an optical axis of the laser beam reflected by the mirror is equal to or larger than 90 degrees.3. The device according to claim 1 , whereinthe angle is larger than 90 degrees and smaller than 180 degrees.4. The device according to claim 1 , whereina shape of the reflecting surface is one of a paraboloid, a hyperboloid, and an ellipsoid.5. The device according to claim 1 , whereinthe reflecting surface has one end and the other end, a distance between the other end and the light irradiation section in a first direction from the light irradiation section toward the mirror being shorter than a distance between the one end and the light irradiation section in the first direction,in the first direction, the one end of the reflecting surface is ...

SPOT HEATER AND DEVICE FOR CLEANING WAFER USING THE SAME

A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer. 1. A device for cleaning a wafer , the device comprising:a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer;a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; anda spot heater configured to heat a spot of the top surface of the wafer.2. The device of claim 1 , wherein the heater chuck comprises: a ring-shaped first region; and', 'a ring-shaped second region surrounding the first region;, 'a top plate supporting the wafer and comprisinga first ring heater configured to heat the first region from underneath the top plate; anda second ring heater configured to heat the second region from underneath the top plate.3. The device of further comprising a controller configured to independently control the first and the second ring heaters.4. The device of claim 1 , wherein the spot heater is configured to irradiate the spot with laser light and heat the wafer.5. The device of claim 4 , wherein the laser light has a wavelength in a near infrared (NIR) region.6. The device of claim 4 , wherein the spot heater comprises:a laser source configured to supply the laser light; anda filter provided between the laser source and the irradiated spot and configured to adjust a size of the irradiated spot.7. The device of claim 4 , wherein the spot heater comprises:a laser source configured to supply the laser light; anda vertical position adjusting device configured to adjust a size of the irradiated spot by adjusting a vertical position of the laser source.8. The device of ...

Laser Machining Nozzle for a Laser Machining Device, and Laser Machining Device

Described is a laser machining nozzle for a laser machining device having a detection device for detecting radiation from a process zone defined by the laser machining nozzle. The surface of the laser machining nozzle has at least one contrast section which has a scattering and/or absorbing effect at least for radiation at an observation wavelength. Also described are a laser machining device and a method for implementing a laser machining nozzle in a laser machining device.

Machining head and machining device

A processing head ( 1 ) for surface processing by means of a laser beam is disclosed. The processing head ( 1 ) comprises a through passage ( 2 ) for a laser having a longitudinal axis (A), at least one powder supply passage ( 3 ) and a cooling passage ( 4 ) for cooling the processing head ( 1 ). The processing head ( 1 ) is at least configured of two parts and comprises a body ( 5 ) and a sleeve ( 6 ). The sleeve ( 6 ) is suitable for the arrangement at the body ( 5 ). The through passage ( 2 ) of the laser and the powder feed channel ( 3 ) are configured in the body ( 5 ). The body ( 5 ) at least partly forms a first sidewall of the cooling passage ( 4 ). The sleeve ( 6 ) at least partly forms a second sidewall of the cooling passage ( 4 ).

METHODS, SYSTEMS AND ASSEMBLIES FOR LASER DEPOSITION

This invention relates to a workpiece positioning system for holding and manipulating a workpiece. The system includes a rail, a headstock assembly, and a tailstock assembly. The tailstock assembly is mountable to the rail in spaced relation to the headstock assembly to enable the workpiece to be supported between the headstock assembly and the tailstock assembly. The tailstock assembly includes a locking mechanism operable between a locking position in which the tailstock assembly is lockable against the rail in a desired position relative to the headstock, and an unlocked position in which the tailstock assembly is adapted to traverse the rail. The invention also provides a powder injection nozzle having a body and aa tube releasably connected to the body. The tube defines a through passage having at least one inlet for receiving a cladding material and an outlet for delivering the cladding material from the tube. 1. A powder injection nozzle , including:a body;a tube releasably connected to the body, the tube defining a through passage having at least one inlet for receiving a cladding material and an outlet for delivering the cladding material from the tube.2. A powder injection nozzle according to claim 1 , wherein the body is an elongate hollow body.3. A powder injection nozzle according to or claim 1 , wherein the body has at least one inlet for receiving a gas and an outlet for ejecting the gas from the body claim 1 , thereby to form a gas shield about the cladding material as it is delivered from the tube.4. A powder injection nozzle according to claim 3 , wherein the gas inlet includes a gas inlet tube having a first free open end for connection to a gas supply line and second fixed end extending through a hole formed in a wall of the body claim 3 , thereby to provide a passageway for the gas from the first free end to an interior of the body.5. A powder injection nozzle according to or claim 3 , wherein the gas inlet tube includes a first portion defining ...

ADVANCED BACK-STRIKE PROTECTION PROCESS AND RELATED DEVICES FOR WATER JET GUIDED LASER PROCESS

When water jet guided laser drilled through the first body, there is a confined embodiment between the first body and the second body. To prevent water jet guided laser to continue in this direction and create damage on the second body, a volume vibrator is connected to the embodiment and media that filled embodiment get pumped in and pumped out from the embodiment at adjustable frequency and cycle volume. Mechanical energy is then transferred into the embodiment to generate local media vibration. The laminar flowing state of the water jet is interrupted and the laser beam confined in the water jet is dispersed. Plugging method is also involved to insure when there are multiple holes on the embodiment, there will be enough mechanical energy get transferred to the laser breakthrough location. 1. A volume vibrator that can pump in and pump out media from the embodiment. The volume vibrator contains control system that can adjust the pumping frequency and pumping volume of the volume vibrator.2. Mechanical energy from volume vibrator will get transferred into embodiment and generate local media vibration , which interrupt the laminar flow state of the water jet for water jet guided laser.3. A plugging method that will change the impedance of different flow path and insure there is enough mechanical energy get transferred to the laser beam breakthrough location.41. The media mentioned in will include any type of gas or liquid or mixture. For example claim 1 , air claim 1 , argon claim 1 , water claim 1 , alcohol claim 1 , mixture of different liquid and solid particle suspension. We defined the media as any fluid that can be pumped in and pumped out by volume vibrator claim 1 , its physical state can be gas claim 1 , liquid claim 1 , solid or mixture of different states claim 1 , i.e. claim 1 , a solid particle suspended in the liquid or gas. The present invention is directed to provide a novel method and related devices to avoid back-strike damage that may happened ...

Real Time Monitoring Method and Process Control for Water Jet Guided Laser System Machining

Based on the mechanism of the water jet guided laser system, both shielding gas and optical to water jet coupling components have significant influence on the laminar flowing state of the water jet. By applying a camera and imaging system to monitor the laser jet and analyze the width comparing to pre-measured and stored data, we can draw a conclusion on health of optical to water jet coupling components as well as the machining progress of the laser beam. A clear system definition and procedure have been defined to understand and implement this invention. 1. A digital-optical analysis system that can focus onto a very thin water jet (30 um to 200 um) and clearly image the glowing water jet when laser beam is transferred inside the water jet. The system will include a wavelength filter , optical attenuator , camera and sensor , program to analyze the brightness of each pixel and software to interpret the pixel and communicate to the machine controller.2. A procedure that measure the idling laser jet width and compare it to laser jet width with brand new optical water jet coupling components. The difference between two values is compared to a preset table 1 and the health status of the coupling components can be determined.3. A procedure that measured laser jet width during machining process and compare it to laser jet width before machining start. The difference between two values are compared against a preset table 2 and the progress state of the drilling can be determined.4. Preset table samples given in Table 1 and Table 2 are just examples showing the theory , different applications and optical components set up will have different preset table based on experiments and analysis. The present invention is directed to provide a real-time monitoring method for water jet guided laser machining process. More particularly, the water jet status and laser beam quality will be monitored and feedback to machine. Signal will be interpreted and used to control the machining ...

Laser processing apparatus, laser processing method and distance measurement method

According to an embodiment, a laser processing apparatus has: a laser light source; a light collector; a water nozzle; a sound sensor; a timer; and a distance calculator. The light collector collects the laser light on a workpiece. The water nozzle supplies a water stream to a surface to be treated of the workpiece. The sound sensor is provided at a predetermined position relative to at least one of the water nozzle and the light collector, and receives a sound coming from the surface to be treated. The timer detects a detected time width from a reference time point to a time point when the sound sensor receives the sound. The distance calculator calculates a distance from one of the water nozzle and the light collector to the surface to be processed.

Method and Apparatus for Manufacturing a Workpiece into a Product

The invention relates to a method and an apparatus for manufacturing a workpiece, specifically a rough diamond, into a product, specifically a brilliant. The method is performed by an apparatus providing a laser beam coupled into a pressurized fluid jet. The method comprises executing multiple cuts of the workpiece with the laser beam according to a predetermined cut-sequence to remove workpiece material with each completed cut. The method further comprises executing multiple rotations of the workpiece around the same axis of revolution according to a predetermined rotation-sequence. Thereby, a rotation is executed after a completed cut, and for executing a cut the laser beam is moved along a two-dimensional path.

METHOD AND APPARATUS FOR CUTTING AND ABLATING A WORKPIECE WITH A COMPLEX FLUID-JET-GUIDED LASER BEAM

The invention relates to a method and an apparatus for cutting or ablating a particular material of the workpiece with a pulsed laser beam coupled into a fluid jet. The method comprises producing the pulsed laser beam with at least one laser source, providing the pressurized fluid jet onto the workpiece, and coupling the pulsed laser beam into the fluid jet towards the workpiece. The pulsed laser beam comprises at least two superimposed pulsations selected based on the particular material of the workpiece. A first pulsation has a different power and frequency than a second pulsation.

Nozzle for laser machining and laser machining apparatus

A nozzle for laser machining is provided with a flange portion and formed in an annular shape, and includes a first communication hole communicating between a first end portion and a second end portion on a side opposite to the first end portion, a circumferential groove portion provided between the flange portion and the second end portion, and a plurality of second communication holes communicating between a surface of the flange portion on a first end portion side and a side surface of the circumferential groove portion on the first end portion side. A side surface of the circumferential groove portion on a second end portion side extends so that the plurality of second communication holes are invisible from the second end portion side.

LASER PROCESSING DEVICE, AND LASER PROCESSING METHOD

A laser processing device according an embodiment is a laser processing device that irradiates a processing region of a workpiece with pulsed laser light through a liquid to subject the processing region to a laser peening process or a laser forming process. The laser processing device includes: a laser irradiation unit including a laser oscillator that outputs the pulsed laser light; and an accommodation unit that includes an injection port through which the liquid is injected to the processing region, and accommodates the laser irradiation unit. A pulse width of the pulsed laser light is 200 ps to 2 ns, and the pulsed laser light output from the laser oscillator is emitted to the processing region through a liquid that is injected from the injection port. 1: A laser processing device that irradiates a processing region of a workpiece with pulsed laser light through a liquid to subject the processing region to a laser peening process or a laser forming process , comprising:a laser irradiation unit including a laser oscillator that outputs the pulsed laser light; andan accommodation unit that includes an injection port through which the liquid is injected to the processing region, and accommodates the laser irradiation unit,wherein a pulse width of the pulsed laser light is 200 ps to 2 ns, andthe pulsed laser light output from the laser oscillator is emitted to the processing region through a liquid that is injected from the injection port.2: The laser processing device according to claim 1 ,wherein the laser irradiation unit includes a condensing unit that condenses the pulsed laser light generated by the laser oscillator to the processing region.3: The laser processing device according to claim 1 ,wherein the pulsed laser light is laser light of which a polarization state is unsteady.4: A laser processing method of irradiating a processing region of a workpiece with pulsed laser light through a liquid to subject the processing region to a laser peening process or ...

LASER MACHINING METHOD

Laser machining method, including: liquid supplying into rectifying chamber; rectifying chamber attenuating disturbances in flow of liquid supplied; liquid injecting into liquid oscillating chamber exclusively from one direction from liquid inlet port arranged on only one portion of sidewall of liquid oscillating chamber; liquid jetting as jet liquid column into air from nozzle; laser beam focusing on axis of nozzle and guiding to machining point by jet liquid column; surface wave of jet liquid column generating and gradually increasing in amplitude in direction away from nozzle; a body of jet liquid column atomizing when jet liquid column strikes workpiece on machining point. Liquid flows from oscillating chamber inlet path for guiding liquid from rectifying chamber to oscillating chamber inlet port, oscillating chamber inlet path guiding liquid along window from one direction of liquid oscillating chamber to oscillating chamber inlet port. 1. A laser machining method , comprising:a liquid supplying into a rectifying chamber;the rectifying chamber attenuating disturbances in flow of the liquid supplied;a liquid injecting into a liquid oscillating chamber exclusively from one direction from a liquid inlet port arranged on only one portion of a sidewall of the liquid oscillating chamber;the liquid jetting as a jet liquid column into air from a nozzle;a laser beam focusing on the axis of the nozzle and guiding to a machining point by the jet liquid column;a surface wave of the jet liquid column generating and gradually increasing in amplitude in the direction away from the nozzle anda body of the jet liquid column atomizing when the jet liquid column strikes the workpiece on the machining point,wherein the liquid flows from an oscillating chamber inlet path for guiding the liquid from the rectifying chamber to the oscillating chamber inlet port, the oscillating chamber inlet path guiding the liquid along the window from one direction of the liquid oscillating chamber ...

Laser apparatus

Disclosed herein is a laser apparatus including: a laser oscillator configured to generate a laser beam; a plurality of mirror mount assemblies each arranged in one of predetermined reference transmission steps, each of the mirror mount assemblies including: a mount-side reflective mirror configured to reflect and transmit the laser beam; and an aligner configured to change alignment of the mount-side reflective mirror to adjust a machining optical path through which the laser beam transmitted by the mount-side reflective mirror travels; a laser nozzle assembly including a laser nozzle configured to radiate the laser beam transmitted from the mirror mount assembly located in the last step of the reference transmission steps onto an object to be processed; a database configured to store big data constructed to include optical path adjustment data indicating a pattern of selective adjustment of the machining optical path by the mount-side reflective mirror linked with the aligner according to a driving method of the aligner; and a controller configured to correct, when distortion occurs in the machining optical path, the distortion of the machining optical path by selectively driving the aligner provided in each of at least one mirror mount assembly among the mirror mount assemblies based on the big data using a driving method according to a pattern of the distortion of the machining optical path.

PRODUCTION SYSTEM FOR FORMING FILTRATION TUBES INCLUDING SUBSYSTEMS AND METHOD OF USING SAME

A production system and method of using the same for forming filtration tubes. The system includes: a six-axis robotic arm that moves tubes between sub-systems. The arm moves an unprocessed tube from an input-output subsystem, to an inspection system, a laser cutting system, and optional post-processing system. The inspection may include a laser and/or camera that scans a surface of a tube to determine abnormalities, defects, and/or quality issues. The laser cutting system cuts pores, holes, or slots into and through a wall of the tube, that passes inspection, to form a filtration tube used to filter solids from fluids. The post-processing system may post-process and/or clean the tube after cutting. If the tube fails inspection, it is moved to a reject bin or tray. The arm moves completed filtration tubes to a finished tube bin or tray. 1. A production system for processing and inspecting tubes to form filtration tubes , the system comprising:a six-axis robotic arm configured to move each tube between a plurality of sub-systems, the sub-systems comprising:a tube input-output subsystem configured to hold a plurality of tubes, the robotic arm being configured to withdraw a tube for processing from the tube input-output subsystem;an inspection system configured to receive and inspect the tube placed therein by the robotic arm, the inspection system configured to inspect the tube by scanning a surface of the tube to determine presence of abnormalities, defects, and/or quality issues; anda laser cutting system configured to receive the tube via the robotic arm moving said tube to the laser cutting system, the laser cutting system being configured to cut a plurality of slots, holes, and/or pores into and through a wall of the tube to form a filtration tube that is configured to filter solids from fluids.2. The system according to claim 1 , further comprising a post-processing system for processing the tube cut by the laser cutting system claim 1 , the robotic arm being ...

LASER MACHINING APPARATUS AND LASER MACHINING METHOD

A laser machining device includes a plurality of optical fibers and a collimator lens arranged in parallel along a supply nozzle for supplying a molten material, and a laser beam projected from the optical fiber is applied onto an axis between a tip of the supply nozzle and a build-up welding spot. 1. A laser machining method comprising: an optical fiber; a condenser lens; and a supply nozzle for supplying a molten material , wherein the supply nozzle is arranged so as to penetrate the condenser lens , and the molten material supplied from the supply nozzle is irradiated with a laser beam from the optical fiber on an axis of the condenser lens or on a periphery of the axis or on an axis of the supply nozzle or on a periphery of the axis.2. A laser machining method comprising: a plurality of optical fibers; a condenser lens condensing a laser beam of each of the optical fibers; and a supply nozzle for supplying a molten material by injection , wherein the supply nozzle is arranged so as to penetrate the condenser lens , the optical fibers are arranged on the periphery of the supply nozzle , and the molten material supplied from the supply nozzle is irradiated with the laser beam from the optical fiber at least on an axis between a nozzle tip port and a welding spot on an axis of the condenser lens or on a periphery of the axis.3. The laser machining method according to claim 1 , wherein the condenser lens through which the supply nozzle penetrates is arranged at the center claim 1 , the optical fibers are arranged on the periphery of the supply nozzle claim 1 , and the molten material supplied from the supply nozzle is irradiated from the periphery of the molten material with the laser beam from the optical fibers.4. The laser machining method according to claim 1 , wherein the periphery of the welding spot is irradiated at the same time as the irradiation on the axis by applying of the laser beams from the plurality of optical fibers claim 1 , or the periphery of ...

LASER PROCESSING APPARATUS

A laser beam applying unit of a laser processing apparatus includes a laser oscillator, a condenser adapted to focus the laser beam emitted from the laser oscillator and apply the laser beam to a workpiece, and a liquid jetting apparatus disposed at a lower end portion of the condenser and adapted to jet a liquid to an upper surface of the workpiece. The liquid jetting apparatus includes: a transparent plate disposed at the lower end portion of the condenser and permitting transmission therethrough of the laser beam; a casing provided with a space defined by a ceiling wall composed of the transparent plate, side walls, and a bottom wall; an opening formed in the bottom plate, extending in a processing feeding direction, and permitting passage therethrough of the laser beam focused by the condenser; and a liquid supply section adapted to supply the liquid to the casing. 1. A laser processing apparatus comprising:a chuck table adapted to hold a plate-shaped workpiece;a laser beam applying unit adapted to apply a laser beam to the workpiece held by the chuck table to process the workpiece; anda processing feeding unit adapted to putting the chuck table and the laser beam applying unit into relative processing feeding,wherein the laser beam applying unit includes a laser oscillator adapted to emit a laser beam, a condenser adapted to focus the laser beam emitted from the laser oscillator and to thereby apply the laser beam to the workpiece held by the chuck table, and a liquid jetting apparatus disposed at a lower end portion of the condenser and adapted to jet a liquid to an upper surface of the workpiece,the liquid jetting apparatus includes a transparent plate disposed at the lower end portion of the condenser and permitting transmission therethrough of the laser beam, a casing provided with a space defined by a ceiling wall composed of the transparent plate, side walls, and a bottom wall, an opening formed in the bottom wall, extending in a processing feeding ...

CROSS JET LASER WELDING NOZZLE

A compact nozzle for laser welding is provided that includes an air knife cross-jet to protect the laser optic, coaxially supplied process shield gas and active air cooling in a singular and compact nozzle. Generally, the nozzle includes a mounting interface at a first end to connect to the laser processing device. An air knife section is positioned adjacent the mounting interface and the optical output of the laser so that the air knife flow can protect the optic from plasma and spatter damage. Further the air flow in the air knife is directed through the nozzle for direct cooling. Adjacent the air knife is the process gas shield that is isolated from the air knife such that the process gas is not contaminated by flow from the air knife. 1. A nozzle for a laser welding system that directs a laser beam along an optical axis through an optic onto a work piece , said nozzle comprising:a first gas directing section that directs a first airflow through said laser beam in a direction substantially perpendicular to said optical axis of said laser beam and a second airflow to through cooling passages in said nozzle; anda second gas directing section that directs a process gas flow through a passageway in said nozzle to a process gas reservoir concentric with said laser beam an output end of said nozzle, said process gas filling the pathway of said laser beam.2. The nozzle of claim 1 , wherein said first airflow is an air knife.3. The nozzle of claim 2 , wherein the flow of said air knife entrains ambient air to create an air barrier to protect said optic from byproducts generated during laser welding.4. The nozzle of claim 1 , wherein said first airflow creates a barrier to protect said optic from byproducts generated during laser welding.5. The nozzle of claim 1 , further comprising:at least one opening in said nozzle positioned between said first gas directing section and said second gas directing section to allow said first air flow to draw in ambient air and prevent ...

Water Cooling of Laser Components

The invention features methods and apparatuses for thermally regulating a laser processing head. A thermal regulation device includes a body shaped to matingly engage a laser processing nozzle and to define a fluid flow boundary of a liquid flow passage between the body and an exterior surface of the laser processing nozzle when the thermal regulation device is affixed to the laser processing nozzle. The thermal regulation device also includes an inlet formed in a first end of the body and configured to provide liquid to the liquid flow passage, the liquid remaining external to an exterior surface of the laser processing nozzle. The thermal regulation device also includes an outlet formed in a second end of the body opposite the first end. The outlet is configured to exhaust liquid from the liquid flow passage. 1. A thermal regulation device for a laser processing head , the thermal regulation device comprising:a body shaped to matingly engage a laser processing nozzle and to define a fluid flow boundary of a liquid flow passage between the body and an exterior surface of the laser processing nozzle when the thermal regulation device is affixed to the laser processing nozzle;an inlet formed in a first end of the body and configured to provide liquid to the liquid flow passage, the liquid remaining external to an exterior surface of the laser processing nozzle; andan outlet formed in a second end of the body opposite the first end, the outlet configured to exhaust liquid from the liquid flow passage.2. The thermal regulation device of wherein the liquid remains external to the nozzle holder.3. The thermal regulation device of wherein the outlet is configured to direct liquid radially outward from the thermal regulation device.4. The thermal regulation device of wherein the outlet is configured to direct liquid coaxially with the laser processing head and the liquid is exhausted to atmosphere about the laser processing nozzle.5. The thermal regulation device of ...

LASER PROCESSING APPARATUS

A liquid supply mechanism disposed at an upper portion of a holding unit includes a liquid chamber having a transparent plate positioned to form a gap between itself and an upper surface of a workpiece held on a holding table, a roller formed of a transparent member that is disposed in a non-contact state at a position proximate to an upper surface of the workpiece held on the holding table inside the liquid chamber and that produces a flow of a liquid on the workpiece; a motor rotating the roller, a liquid supply nozzle supplying the liquid into the gap from one side of the liquid chamber, and a liquid discharge nozzle discharging the liquid from the other side of the liquid chamber. A laser beam is applied to the workpiece through the transparent plate, the roller, and the liquid supplied into the gap. 1. A laser processing apparatus comprising:a holding unit having a holding table holding a plate-shaped workpiece;a laser beam applying unit applying a laser beam to the workpiece held on the holding table to process the workpiece; anda liquid supply mechanism disposed at an upper portion of the holding unit, a liquid chamber having a transparent plate positioned to form a gap between itself and an upper surface of the workpiece held on the holding table,', 'a roller formed of a transparent member that is disposed in a non-contact state at a position proximate to the upper surface of the workpiece held on the holding table inside the liquid chamber and that produces a flow of a liquid on the workpiece,', 'a roller rotating mechanism rotating the roller,', 'a liquid supply nozzle supplying the liquid into the gap from one side of the liquid chamber, and', 'a liquid discharge nozzle discharging the liquid from the other side of the liquid chamber, and, 'wherein the liquid supply mechanism includes'}the laser beam applying unit includes a laser oscillator emitting a laser beam, and a condenser condensing the laser beam emitted from the laser oscillator to apply the ...

Laser processing apparatus

A liquid supply mechanism is disposed on an upper portion of a holding unit of a laser processing apparatus. The liquid supply mechanism includes: a liquid chamber having a transparent plate positioned such that a gap is formed between the transparent plate and the top surface of a workpiece held on a holding table; a linear-motion mechanism configured to linearly move the transparent plate over the liquid chamber; a liquid supply nozzle configured to supply a liquid from one side of the liquid chamber to the gap; and a liquid discharge nozzle configured to discharge the liquid from another side of the liquid chamber. A laser beam irradiating unit includes a laser oscillator configured to irradiate the workpiece through the transparent plate and the liquid supplied to the gap.

WATER JET LASER CUTTING DEVICE AND CUTTING METHOD

There are provided a water jet laser cutting device and cutting method. The water jet laser cutting device includes an impulsive fluid jet unit and at least one laser beam emitting unit. Each laser beam emitting unit is configured to emit laser toward a cutting line, so as to turn a workpiece at the cutting line into a molten state. The impulsive fluid jet unit is configured to jet an impulsive fluid toward the cutting line in a molten state, so as to cut apart the cutting line in a molten state with an impulsive force of the impulsive fluid, and remove molten scraps at the cutting line. 1. A water jet laser cutting device , comprising an impulsive fluid jet unit and at least one laser beam emitting unit , wherein ,each laser beam emitting unit is configured to emit a laser beam toward a cutting line, so as to turn a workpiece at the cutting line into a molten state; andthe impulsive fluid jet unit is configured to jet an impulsive fluid toward the cutting line in the molten state, so as to cut apart the cutting line in the molten state with an impulsive force of the impulsive fluid, and remove molten scraps at the cutting line.2. The device according to claim 1 , wherein claim 1 , the impulsive fluid is a mixture of water and steam.3. The device according to claim 2 , wherein claim 2 ,the impulsive fluid jet unit is configured to,impact the cutting line by a first impulsive fluid to partially cut the cutting line in the molten state, so that a precutting line is formed at the cutting line; andimpact the precutting line by a second impulsive fluid, so that the precutting line is cut apart completely,content of water in the first impulsive fluid is greater than content of water in the second impulsive fluid.4. The device according to claim 3 , wherein claim 3 ,the first impulsive fluid includes 90-99 vol % water;the second impulsive fluid includes 1-10 vol % water.5. The device according to claim 1 , further comprising a control unit claim 1 , which is configured to ...

LASER PROCESSING APPARATUS

A laser processing apparatus has a liquid supply mechanism disposed at an upper portion of a holding unit. The liquid supply mechanism includes: a pool adapted to form a layer of a liquid on an upper surface of a workpiece held by a holding table; a transparent plate disposed such as to make contact with the layer of the liquid; a jet nozzle adapted to jet the liquid by positioning a jet port between an upper surface of the workpiece and the transparent plate toward an application position of a laser beam applied to the workpiece through the transparent plate; a liquid supply nozzle adapted to supply the liquid from one side of the pool; and a liquid discharge nozzle adapted to discharge the liquid from the other side of the pool. 1. A laser processing apparatus comprising:a holding unit including a holding table adapted to hold a plate-shaped workpiece;a laser beam applying unit adapted to apply a laser beam to the workpiece held by the holding table to process the workpiece; anda liquid supply mechanism disposed on the holding unit,wherein the liquid supply mechanism includes:a pool adapted to form a layer of a liquid on an upper surface of the workpiece held by the holding table;a transparent plate disposed such as to make contact with the layer of the liquid;a jet nozzle adapted to jet the liquid toward an application position of the laser beam applied to the workpiece through the transparent plate;a liquid supply nozzle adapted to supply the liquid from one side of the pool; anda liquid discharge nozzle adapted to discharge the liquid from other side of the pool.2. The laser processing apparatus according to claim 1 , wherein the laser beam applying unit includes dispersing means dispersing the laser beam emitted from a laser oscillator. The present invention relates to a laser processing apparatus for applying a laser beam to a plate-shaped workpiece to process the workpiece.A wafer having a plurality of devices such as integrated circuits (ICs) and large ...

Apparatus for 3D Shaping of a Workpiece by a Liquid Jet Guided Laser Beam

The invention relates to an apparatus for 3D shaping of a workpiece by material ablation with a laser beam . The apparatus comprises a machining unit , which is configured to provide a pressurized fluid jet onto the workpiece and to couple the laser beam into the fluid jet towards the workpiece . Further, the apparatus includes a motion controller configured to set an x-y-z-position of the workpiece relative to the machining unit . It also includes a measuring unit configured to measure a z-position of the point of incidence of the pressurized fluid jet on the workpiece in the z-direction. 1100101102100. Apparatus () for 3D shaping of a workpiece () by material ablation with a laser beam () , the apparatus () comprising{'b': 103', '104', '101', '102', '104', '101, 'a machining unit () configured to provide a pressurized fluid jet () onto the workpiece () and to couple the laser beam () into the fluid jet () towards the workpiece (),'}{'b': 105', '101', '103, 'a motion controller () configured to set an x-y-z-position of the workpiece () relative to the machining unit (),'}{'b': 107', '108', '104', '101, 'a measuring unit () configured to measure a z-position of the point of incidence () of the pressurized fluid jet () on the workpiece () in the z-direction.'}2100. Apparatus () according to claim 1 , further comprising{'b': 106', '102', '105', '108', '104', '101', '107, 'a laser controller () configured to adjust the power or energy of the laser beam () based on an x-y-z-position set by the motion controller () and a z-position of the point of incidence () of the pressurized fluid jet () on the workpiece () measured by the measuring unit ().'}3100. Apparatus () according to claim 1 , wherein{'b': 102', '100, 'the laser beam () is pulsed, and the apparatus () further comprises'}{'b': 106', '200', '105', '200', '108', '104', '101', '107', '200, 'a laser controller () configured to adjust individually the energy of each laser pulse () based on an x-y-z-position set by ...

METAL DROPLET JETTING SYSTEM

Systems and methods for additive manufacturing, and, in particular, such methods and apparatus as employ pulsed lasers or other heating arrangements to create metal droplets from donor metal micro wires, which droplets, when solidified in the aggregate, form 3D structures. A supply of metal micro wire is arranged so as to be fed towards a nozzle area by a piezo translator. Near the nozzle, an end portion of the metal micro wire is heated (e.g., by a laser pulse or an electric heater element), thereby causing the end portion of the metal micro wire near the nozzle area to form a droplet of metal. A receiving substrate is positioned to receive the droplet of metal jetted from the nozzle area. 1. A system for metal laser jetting , comprising:a supply of metal micro wire arranged so as to be fed towards a nozzle area by a translator, the metal micro wire being supported along its length in a through hole of a glass substrate, the nozzle area being located at an exit of the through hole; anda laser positioned to emit, under control of a controller, a light pulse towards the nozzle area where the end of the metal micro wire is positioned by the translator, thereby causing an end portion of the metal micro wire near the nozzle area to be heated.2. The system for metal laser jetting of claim 1 , further comprising a receiving substrate positioned to receive a droplet of metal jetted from the nozzle area.3. The system for metal laser jetting of claim 1 , wherein the supply of metal micro wire is organized in a spool which is carried on a reel.4. The system for metal laser jetting of claim 1 , wherein the supply of metal micro wire is organized in multiple spools of metal micro wires claim 1 , each associated with its own respective translator and supporting glass substrate arrangement.5. The system for metal laser jetting of claim 1 , wherein the supply of metal micro wire is organized in multiple spools of metal micro wires and a single glass substrate is shared by some or ...

Optical processing head and optical processing apparatus

An overall apparatus is downsized by reducing the size of a light beam branching structure. There is provided an optical processing head including an optical element group that guides a processing light beam from a light source to a process surface, and a light beam branching portion that branches reflected light of the processing light beam from the process surface and an observation light beam for observing a state of the process surface. The light beam branching portion is arranged on a light beam path of the processing light beam, and includes, between the optical element group and the process surface, a half mirror that guides the observation light beam to an observation optical system.

METHOD AND DEVICE FOR SEPARATING A FLAT WORKPIECE INTO A PLURALITY OF SECTIONS

A method of separating a workpiece into a plurality of sections includes generating one or a plurality of lines of modified material along one or a plurality of predefined separating lines in the workpiece in a first step by local material processing using a laser beam through a surface of the workpiece, which results in a reduction of breaking stress of the workpiece along the separating lines, and dividing, in a second step, the workpiece into the sections along the separating lines by thermal laser beam separation, wherein the one or the plurality of lines are generated completely or at least in portions at a distance from the surface in the workpiece. 126-. (canceled)27. A method of separating a workpiece into a plurality of sections comprising:generating one or a plurality of lines of modified material along one or a plurality of predefined separating lines in the workpiece in a first step by local material processing using a laser beam through a surface of the workpiece, which results in a reduction of breaking stress of the workpiece along the separating lines, anddividing, in a second step, the workpiece into the sections along the separating lines by thermal laser beam separation, whereinthe one or the plurality of lines are generated completely or at least in portions at a distance from the surface in the workpiece.28. The method as claimed in claim 27 , wherein the one or the plurality of lines are generated such that they start at the surface of the workpiece and then extend at a varying distance with respect to the surface along the separating line in the workpiece.29. The method as claimed in claim 27 , wherein the one or the plurality of lines are generated such that they start at a marginal position of each section at the surface and then extend at a varying distance with respect to the surface along the separating line in the workpiece.30. The method as claimed in claim 27 , wherein the one or the plurality of lines are generated such that they ...

LASER LIGHT SOURCE MODULE

The present invention discloses a laser light source module for subjecting a plate, it includes a substrate, a first light source, a second light source, a temperature reduction unit, a first modification module, a second modification module and a third modification module. The first light source emits a first light beam in the direction of an emitted area of the substrate; the second light source emits a second light beam in the direction of the emitted area of the substrate; the first modification module modifies an optical characteristic of the second light beam; the second modification module modifies the location of the plate that is subjected to the first light beam, the second light beam and/or the temperature reduction unit; and the third modification module is connected to the temperature reduction unit for modifying the angle. 1. A laser light source module for subjecting a plate to treatment comprising:a substrate defined with a setting area and an emitted area on two sides thereof, the plate being disposed in the emitted area;a first light source disposed in the setting area for generating a first light beam to be emitted in the direction of the emitted area;a second light source disposed in the setting area for generating a second light beam;a temperature reduction unit disposed in the emitted area;a first modification module coupled to the second light source for modifying an optical characteristic of the second light beam;a second modification module disposed in the emitted area and coupled to the substrate for modifying the location of the plate that is subjected to at least one of the second light beam, the first light beam and the temperature reduction unit; anda third modification module disposed in the emitted area, optionally co-axially disposed with the second modification module, and connected to the temperature reduction unit for modifying the angle at which the plate is required to be subjected to the temperature reduction unit.2. The laser ...

SYSTEMS AND METHODS FOR FORMATION OF CONTINUOUS CHANNELS WITHIN TRANSPARENT MATERIALS

A system and method for producing continuous channels within a transparent material is disclosed. According to one embodiment, the system and method includes forming a channel with a laser beam, such that the continuous channel has at least one vent from the channel to outside the transparent material. 1. A method comprising:generating, using a laser source, a laser beam;converging, using a focus optic, the laser beam to a focal region outside of a transparent material;moving the focal region from outside the transparent material to inside the transparent material along a first scan path; andforming a continuous channel within the transparent material generally along the first scan path, wherein the continuous channel has a vent to outside the transparent material located at least at one end.2. The method of claim 1 , further comprising:moving the focal region from inside the transparent material to outside the transparent material along a continuation of the first scan path; andelongating the continuous channel within the transparent material along the continuation of the first scan path, such that the continuous channel has vents to outside the transparent material located at least at two ends.3. The method of claim 1 , further comprising:moving the focal region along a second scan path that is substantially parallel to and separated by a separation distance from the first scan path, wherein the separation distance is based upon a width of the focal region; andwidening a width of the continuous channel.4. The method of claim 3 , wherein the separation distance is substantially along one or more of 3 mutually orthogonal axes claim 3 , including: a lateral (X) axis claim 3 , a horizontal (Y) axis claim 3 , and a vertical (Z) axis.5. The method of claim 3 , wherein the separation distance is between about 1 and 100 micrometers.6. The method of claim 1 , further comprising claim 1 , removing ablation product from within the continuous channel.7. The method of claim 6 ...

DEVICE AND METHOD OF PRODUCING A STRUCTURED ELEMENT, AND STRUCTURED ELEMENT

A method produces a structured element by material-removing machining of a workpiece with pulsed laser radiation, the workpiece consisting of a workpiece material transparent to the laser radiation, the laser radiation being radiated into the workpiece from a radiation entry side and, in an area of a rear side of the workpiece located opposite the radiation entry side, being focused within the workpiece in a focus area such that workpiece material is removed in the focus area by multi-photon absorption, and includes bringing the rear side of the workpiece, at least in a machining area currently being machined around the focus area, into contact with a free-flowing liquid transparent to the laser radiation, wherein at least some of the liquid is set to flow in a direction towards the machining area such that the liquid flows into the machining area at an acute angle of 60° or less to the rear side. 115.-. (canceled)16. A method of producing a structured element by material-removing machining of a workpiece with pulsed laser radiation ,the workpiece consisting of a workpiece material transparent to the laser radiation, the laser radiation being radiated into the workpiece from a radiation entry side and, in an area of a rear side of the workpiece located opposite the radiation entry side, being focused within the workpiece in a focus area such that workpiece material is removed in the focus area by multi-photon absorption, comprising bringing the rear side of the workpiece, at least in a machining area currently being machined around the focus area, into contact with a free-flowing liquid transparent to the laser radiation, wherein at least some of the liquid is set to flow in a direction towards the machining area such that the liquid flows into the machining area at an acute angle of 60° or less to the rear side.17. The method according to claim 16 , wherein the angle is 20° to 60°.18. The method according to claim 16 , wherein the liquid in the machining area is ...

Method and System for Confined Laser Cutting

A method of monitoring an operation status of a confined laser cutting tool includes emitting light in the form of laser beams from a laser source. The method includes using a nozzle to form a confining column composed of a liquid. The method further includes forming a confined laser beam, the confined laser beam defined by the confluence of the laser beams and the confining column. The method also includes sensing a characteristic of the confined laser beam with a sensor. The method further includes determining the operation status of the confined laser cutting tool based on the sensed characteristic of the confined laser beam. The method also includes deactivating the laser source when the sensed characteristic of the confined laser beam reaches a predetermined threshold. The method may also include providing an operator notification after deactivating the laser source. 1. A method of monitoring an operation status of a confined laser cutting tool , the method comprising:emitting light in the form of laser beams from a laser source having a beam axis;forming a confining column comprised of a liquid using a nozzle in fluid communication with a reservoir of confining fluid;directing the emitted laser beams through a focusing lens aligned with the beam axis of the laser source and positioned to focus the laser beams, such that the laser beams are guided and confined by the confining column to form a confined laser beam, the confined laser beam comprising the confining column and a portion of the laser beams confined therein, the confined laser beam operable for cutting a workpiece;sensing, using an optical sensor with a high-pass filter, a characteristic of the confined laser beam, the sensed characteristic of the confined laser beam comprising an intensity or a length of re-emitted light from the confined laser beam at a wavelength greater than six hundred nanometers; anddetermining, via a controller in operative communication with the sensor, the operation status ...

MACHINE TOOL

This machine tool is provided with: a pump which pressurizes a liquid; a nozzle which ejects the liquid pressurized by the pump toward a workpiece; and a pulsation removing pipe which is provided between a discharge port of the pump and the nozzle and which is formed by being wound a plurality of turns or by being bent zigzagged a plurality of times, wherein the workpiece is processed while the pressurized liquid is ejected. 1. A machine tool for processing a workpiece while ejecting a pressurized liquid , comprising:a pump configured to pressurize the liquid;a nozzle configured to eject the liquid pressurized by the pump toward the workpiece; anda pulsation removing pipe provided between a discharge port of the pump and the nozzle, the pulsation removing pipe is formed with a pile wound a plurality of turns or bent zigzagged a plurality of times.2. The machine tool according to claim 1 , wherein the machine tool is a laser processing machine and the nozzle ejects the liquid pressurized by the pump along an optical axis of a laser beam.3. The machine tool according to claim 1 , wherein the pulsation removing pipe is formed by an elastically deformable hose. This application is a U.S. national phase patent application of International Patent Application No. PCT/JP2015/065649, filed May 29, 2015, the contents of which is hereby incorporated by reference in the present disclosure in its entirety.The present invention relates to a machine tool that performs machining, while ejecting a pressurized liquid toward a workpiece, and reduces the pressure pulsations in the liquid.Patent Literature 1 describes a hybrid laser processing method, comprising a pump that pumps a high-pressure liquid, an accumulator for storing the liquid transferred from the pump and for discharging the stored liquid, and a processing head for forming the liquid into a columnar shape and spraying the liquid toward a workpiece, as well as for irradiating the workpiece with laser light having passed ...

ADDITIVE MANUFACTURED CONGLOMERATED POWDER REMOVAL FROM INTERNAL PASSAGES

A tool includes a head that extends form the flexible section, an emitter within the head; and a nozzle to eject a cooling fluid therefrom. A method of additively manufacturing a component including delivering series of thermal shocks to a conglomerated powder within an internal passage of an additively manufactured component to facilitate removal of the conglomerated powder. 113-. (canceled)14. A method of additively manufacturing a component , comprising:delivering a series of thermal shocks with a tool to a conglomerated powder within an internal passage of an additively manufactured component to facilitate removal of the conglomerated powder.15. The method as recited in claim 14 , further comprising alternating operation of the emitter and ejection of a cooling fluid thereby delivering the series of thermal shocks.16. The method as recited in claim 14 , further comprising inducing sufficient internal CTE (Coefficient of Thermal Expansion) differential strain to fracture the weak bonds between partially sintered metal particles of the conglomerated powder.17. The method as recited in claim 14 , further comprising cleaning conglomerated powder from the powder with the tool subsequent to completion of the additive manufacturing.18. The method as recited in claim 14 , further comprising transporting the conglomerated powder out of the internal passage along spiral grooves in the tool.19. The method as recited in claim 14 , wherein the internal passage defines an aspect ratio with a diameter to length of less that 1:4.20. The method as recited in claim 14 , wherein the internal passage is a non-line of sight passage. The instant application is a divisional application of U.S. patent application Ser. No. 14/946,874 filed Nov. 20, 2015.The present disclosure relates to additive manufacturing and, more particularly, to removing conglomerated powder from within an internal passage.Precision engineered parts such as gas turbine components may be manufactured by an ...

LASER PROCESSING APPARATUS

Disclosed herein is a laser processing apparatus that includes a laser generation unit configured to generate a laser beam to process a workpiece, a first fluid jet generation unit configured to generate and inject a first fluid jet to deliver the laser beam to the workpiece, and a second fluid jet generation unit configured to inject a second fluid jet around the laser beam, wherein the first and second fluid jets are simultaneously or selectively injected. 1. A laser processing apparatus comprising:a laser generation unit configured to generate a laser beam to process a workpiece;a first fluid jet generation unit configured to generate and inject a first fluid jet to deliver the laser beam to the workpiece; anda second fluid jet generation unit configured to inject a second fluid jet around the laser beam,wherein the first and second fluid jets are simultaneously or selectively injected.2. The laser processing apparatus according to claim 1 , wherein the first fluid jet is a liquid claim 1 , and the second fluid jet is a gas.3. The laser processing apparatus according to claim 1 , wherein one of the first and second fluid jets is water claim 1 , and the other is a liquid containing water.4. The laser processing apparatus according to claim 1 , wherein the first fluid jet generation unit comprises:a first fluid chamber configured to accommodate a first fluid for generating the first fluid jet;a water supply section configured to supply the first fluid to the first fluid chamber; anda nozzle configured to inject the first fluid in the first fluid chamber to the workpiece.5. The laser processing apparatus according to claim 1 , wherein the second fluid jet generation unit comprises:a second fluid chamber configured to accommodate a second fluid;a second fluid supply section configured to supply the second fluid to the second fluid chamber; anda second fluid nozzle configured to inject the second fluid in the second fluid chamber.6. The laser processing apparatus ...

A DOUBLE-SIDE SYNCHRONOUS LASER SHOCK PEENING METHOD FOR LEADING EDGE OF TURBINE BLADE

A double-side synchronous laser shock peening (LSP) method for leading edges of turbine blades employs two laser beams with the same diameter and different pulse energy to synchronously shock the front and back sides of each point within 8-10 mm range of the leading edge of the blade, wherein the laser pulse energy on the front side is greater than the laser pulse energy on the back side, and wherein, the laser power density on the front side is used to generate dynamic plastic deformation on the entire laser-shock spot area, while the laser power density on the back side is used to balance off excessive shock-wave pressure in the central area of laser-shock spot on the front side and avoid macroscopic deformation of the blade in the central area of laser-shock spot on the front side, and an optimal strengthening effect is achieved finally. 110-. (canceled)11: A double-side synchronous laser shock peening (LSP) method for strengthening a leading edge of turbine blade , comprising simultaneously using two laser beams with a same diameter and different pulse energy to shock front and back sides of each point within 8-10 mm range of the leading edge of the blade , wherein the laser pulse energy on the front side is greater than the laser pulse energy on the back side , and wherein , the laser power density on the front side is used to generate dynamic plastic deformation on the entire laser-shock spot area , while the laser power density on the back side is used to balance off excessive shock-wave pressure in the central area of laser-shock spot on front side and avoid macroscopic deformation of the blade in the central area of laser-shock spot on the front side , whereupon an optimal strengthening effect is achieved.12: The double-side synchronous LSP method according to claim 11 , comprising the following specific steps: (1) the turbine blade is fixed with fixtures; (2) flowing water is used as a confinement layer claim 11 , wherein claim 11 , the spot of laser at ...

Laser cutting and machining method for plated steel plate, laser cut-and-machined product, thermal cutting and machining method, thermal cut-and-machined product, surface-treated steel plate, laser cutting method, and laser machining head

A laser cutting and machining method for plated steel plated, when irradiating a laser beam LB on to the upper surface of a plated steel plate W and laser cutting and machining same: a plating layer-containing metal that has been melted and/or evaporated by the irradiation of the laser beam LB is caused to flow on to a cut surface of the plated steel plate W as a result of assist gas that is jetted towards a laser machining units; and the plating layer-containing metal is coated on the cut surface.

MACHINING HEAD

The invention relates to a machining head for coupling a laser beam into a liquid jet. This machining head comprises an optical unit having at least one optical element for focusing the laser beam, and a coupling unit having a liquid chamber that is delimited by a wall, wherein a nozzle having a nozzle opening for generating a liquid jet is disposed in the wall. In a state in which the coupling unit is connected to the optical unit, the laser beam that is capable of being focused by the optical unit is directable in a beam direction through the liquid chamber of the coupling unit into the nozzle opening, and is capable of being coupled into the liquid jet that is generatable by the nozzle and runs in the beam direction. For the liquid chamber to be supplied with liquid from the optical unit, a liquid interface is formed between the optical unit and the coupling unit, wherein, in the state in which the coupling unit is connected to the optical unit, the liquid interface, when viewed in the beam direction, is disposed ahead of that optical element of the optical unit that is last in the beam direction. 122-. (canceled)23. A liquid-jet laser machine tool having a machining head for coupling a laser beam into a liquid jet , wherein the machining head has a nozzle having a nozzle opening for generating the liquid jet , and the laser beam is capable of being focused by a focusing installation into an port of the nozzle opening for the laser beam to be coupled into the liquid jet , and wherein the liquid-jet laser machine tool comprises a two-dimensional image sensor for a region of the nozzle around the port of the nozzle opening to be depicted , characterized in that the laser beam is capable of being defocused about a port of the nozzle opening such that laser light from the laser beam is reflected from the region of the nozzle around the port of the nozzle opening toward the image sensor so that a depiction of the region of the nozzle around the port of the nozzle ...

Laser Processing Head with Resiliently Movable Shielding Sheets

A laser processing head for processing workpieces by a laser beam discharged from the laser processing head, comprising a shielding housing secured to the laser processing head for shielding the laser beam, the shielding housing being open at a workpiece side and being formed by a plurality of shielding sheets which are supported independently of each other so as to be resiliently movable relative to the laser processing head in a direction of the laser beam and a parallelogram bearing that secures the shielding sheets to a housing carrier of the shielding housing.

Multifunctional laser processing apparatus

A multifunctional laser processing apparatus includes a hollow milling shaft, a light path tool holder, a tool-holder-type melting module, a laser light source, and a temperature sensor. The hollow milling shaft includes a first light path channel and a connection portion. The light path tool holder can be connected to the connection portion. The light path tool holder has a second light path channel communicating with the first light path channel. The tool-holder-type melting module can be connected to the connection portion. The tool-holder-type melting module has a third light path channel communicating with the first light path channel. The laser light source is configured to emit a laser light beam toward the first light path channel. The temperature sensor is disposed on an outer surface of the hollow milling shaft and is configured to sense a temperature of a work piece during a multifunctional processing process.

Method and system for confined laser drilling

A method for drilling a hole in a component is provided. The method includes positioning a confined laser drill within a predetermined distance of a near wall of the component for directing a confined laser beam of the confined laser drill towards an outside surface of the near wall. The confined laser beam is formed of a liquid column and a laser positioned within the liquid column. The method also includes sensing an amount of liquid from the confined laser beam present outside the near wall of the component with a sensor. Moreover, the method includes determining a breakthrough the confined laser beam through the near wall based on the amount of liquid sensed outside the near wall of the component.

Method and system for confined laser drilling

A method for drilling a hole in a component is provided. The method includes directing a confined laser beam of the confined laser drill towards a first hole position on a near wall of the component. The method also includes sensing a characteristic of light within a cavity defined by the component. The near wall is positioned adjacent to the cavity and the sensor is positioned outside the cavity. The method also includes determining a first breakthrough of the confined laser beam through the near wall the component at the first hole position based on the light from within the cavity sensed with the sensor. Such a method may allow for more convenient and time efficient confined laser drilling of gas turbine components.

Machining Robot for Machining Workpieces Using a Laser Beam, Comprising a Machining Laser Integrated into a Robot Arm

The application relates to a machining robot (1) for machining workpieces using a laser beam (2), in particular a machining robot (1) having six axes, wherein the laser beam (2) is to be directed, especially by deflecting means, substantially along a longitudinal axis (3) of the machining robot (1) via an articulated coupling means (14) into an inlet (4) into a central machining robot shaft (5) and to a machining robot head (6) comprising a laser machining tool, in particular a jet nozzle means (19) around an output region (8) of the laser beam (2); the machining laser (9) for generating the laser beam (2) is integrated into a machining robot arm (10) which is part of the central machining robot shaft (5) and which essentially comprises a carbon housing (11), in particular consists of a carbon housing (11).

SYSTEM AND METHOD FOR FORMING PASSAGES IN AN AIRFOIL

A system for forming a passage in an airfoil includes a liquid-jet guided laser that generates a laser beam confined within a fluid column, and a purge medium supply that is fluidly coupled to an aperture of the airfoil. A purge medium flows from the purge medium supply in a flow direction that is substantially parallel to an inner surface of the inner cavity. A controller is configured to direct the liquid-jet guided laser to cut a first passage through the outer surface. A centerline of the passage forms an acute angle with respect to the purge medium flow direction. The first passage is formed at a first radial position that is radially distal to the aperture. A method for forming passages in an airfoil using the system described herein is also disclosed. 1. A system for forming passages in an airfoil , comprising:a liquid jet guided laser that generates a laser beam confined within a fluid column;a purge medium supply fluidly coupled to an aperture of the airfoil, the purge medium supply providing a purge medium into an inner cavity of the airfoil, wherein the purge medium flows in a flow direction that is substantially parallel to an inner surface of the inner cavity;a controller in communication with the liquid-jet guided laser, wherein the controller executes logic stored in a memory that directs the liquid-jet guided laser to cut a first passage through an outer surface of the airfoil such that the fluid column and the laser beam penetrate into the cavity, wherein a centerline of the passage forms an acute angle with respect to the purge medium flow direction, wherein the first passage is formed at a first radial position defined along the outer surface of the airfoil, wherein the first radial position is radially distal to the aperture.2. The system as in claim 1 , wherein the aperture is positioned proximate to a tip portion of the airfoil and the purge flow and the first radial position is proximate to the root portion.3. The system as in claim 1 , ...

LASER SHOCK PEENING METHOD AND DEVICE FOR BOTTOM SURFACE OF TENON GROOVE OF AIRCRAFT BLADE

A laser shock peening method and device for a bottom surface of a tenon groove of an aircraft blade. During the laser shock peening process, according to geometric characteristics of the bottom surface of a tenon groove, a circular facula of a laser beam is changed into a strip-shaped facula, at the same time as a flow-guiding injection device and a water pumping device are respectively arranged at two end surfaces of the bottom surface of the tenon groove to ensure the stability of a water confinement layer. 1. A laser shock peening method for a bottom surface of a tenon groove of an aircraft blade , the method comprising:utilizing a light path conversion system to change a laser beam with a circular facula into a laser beam with a strip-shaped facula and high power density, so as to carry out laser shock peening for the bottom surface of a tenon groove that is covered by an absorbing layer, according to the geometric characteristics of the bottom of the tenon groove; wherein the laser beam with the strip-shaped facula has a width between 0.5 mm and 1 mm, a length between 7 mm and 14 mm, and pulses providing between 5 J and 12 J of energy per pulse with a pulse width between 10 ns and 30 ns;utilizing a flow-guiding injection device and a water pumping device to control water flow parameters at a water inlet and a water outlet on the bottom of the tenon groove respectively, to create a water confinement layer having a thickness from 1 mm to 1.5 mm.2. A device for laser shock peening a bottom surface of a tenon groove of an aircraft blade comprising:a laser configured to provide pulses providing between 5 J and 12 J of energy per pulse with a pulse width between 10 ns and 30 ns;a laser control unit;a light path conversion system configured to change a laser beam with a circular facula into a laser beam with a strip-shaped facula and high power density, wherein the laser beam with the strip-shaped facula has a width between 0.5 mm and 1 mm, a length between 7 mm and ...

PROCESS OF TREATING A WORKPIECE USING A LIQUID JET GUIDED LASER BEAM

The invention concerns a process for treating a workpiece, preferably for shaping a workpiece by ablating material, by a liquid jet guided laser beam. The process comprises the following steps: Production of a liquid jet by a nozzle; impinging the liquid jet on a reference surface allocated to the workpiece, whereby an intersection of the liquid jet with the reference surface defines a liquid jet-footprint; effecting a displacement between the liquid jet and the reference surface, whereby the liquid jet-footprint evolves to a trace along a trajectory associated with the trace during the time frame, wherein the trace covers a trace-area; irradiating the workpiece at least during part of the time frame with a laser beam coupled into the liquid jet, preferably for ablating material such that the trace has at least one overlap-area, wherein each of the at least one overlap-areas is defined by an associated common area of an associated second length-section of the trace and an associated first length-section of the trace and wherein the workpiece is irradiated by the laser beam along at least one of the length-sections. It concerns further a computerized numerical control (CNC) program for controlling a liquid jet guided laser machining device and a computer readable medium containing such a CNC program. Further, it contains a computer program for generating the above mentioned CNC program. Finally the invention concerns a liquid jet guided laser machining device to perform the above mentioned process. 115-. (canceled)16. Process for treating a workpiece , preferably for shaping a workpiece by ablating material , by a liquid jet guided laser beam within a time frame , comprising the following steps:a) producing a liquid jet by a nozzle,b) impinging the liquid jet on a reference surface allocated to the workpiece, whereby an intersection of the liquid jet with the reference surface defines a liquid jet-footprint,c) effecting a displacement between the liquid jet and the ...

LASER-JET LIQUID BEAM SELF-GENERATED ABRASIVE PARTICLE FLOW COMPOSITE PROCESSING DEVICE AND METHOD

A laser-jet liquid beam self-generated abrasive particle flow composite processing device and a method, the device including a spraying nozzle and a work box, wherein the spraying nozzle is connected with a supplying mechanism configured to supply a salt saturated solution at a set pressure to the spraying nozzle; the spraying nozzle is connected with a cooling mechanism configured to cool the salt saturated solution inside the spraying nozzle and precipitate fine crystal grains from the salt saturated solution; the spraying nozzle is further connected with a mirror tube; the mirror tube is connected with a laser generating mechanism configured to generate laser rays; and the work box is configured to fix a workpiece and collect the salt saturated solution sprayed by the spraying nozzle. The processing device can effectively improve processing quality of the workpiece. 1. A laser-jet liquid beam self-generated abrasive particle flow composite processing device , comprising:a spraying nozzle, connecting with a supplying mechanism configured to supply a salt saturated solution at a set pressure to the spraying nozzle; the spraying nozzle is connected with a cooling mechanism configured to cool the salt saturated solution inside the spraying nozzle and precipitate fine crystal grains from the salt saturated solution; the spraying nozzle may spray out the fine crystal grains along with the salt saturated solution to perform impact and grinding on the surface of a workpiece; the spraying nozzle is further connected with a mirror tube; and the mirror tube is connected with a laser generating mechanism configured to generate laser rays; anda work box, configured to fix the workpiece and collect the salt saturated solution sprayed out by the spraying nozzle.2. The laser-jet liquid beam self-generated abrasive particle flow composite processing device according to claim 1 , wherein the supplying mechanism comprises a liquid storage box configured to contain the salt ...

Device and Method for Applying Pressure to Stress-Producing Layers for Improved Guidance of a Separation Crack

The present invention relates to a method, according to claim , for separating at least one solid body layer (), particularly a solid body disk, from a donor substrate (). The method according to the invention comprises preferably at least the following steps: providing a donor substrate (); producing or arranging a stress-producing layer () on a particularly flat surface () of the donor substrate () which axially defines the donor substrate (); pressing at least one pressure application element () of a pressure application device () onto at least one pre-determined portion of the stress-producing layer (), in order to press the stress-producing layer () onto the surface (); separating the solid body layer () from the donor substrate () by thermally applying the stress-producing layer (), thereby producing mechanical stress in the donor substrate (), the mechanical stress creating a crack for separating a solid body layer (), and the pressure application element () being pressed onto the stress-producing layer () during the thermal application of the stress-producing layer (). 115-. (canceled)16. A method of separating a solid-state slice from a donor substrate , the method comprising:providing the donor substrate;generating or disposing a stress generation layer on a surface of the donor substrate and that axially bounds the donor substrate;pressing at least one pressurizing element of a pressurizing device onto at least one predetermined proportion of the stress generation layer for pressing the stress generation layer onto the surface;separating the solid-state slice from the donor substrate by subjecting the stress generation layer to thermal stress which generates mechanical stresses in the donor substrate and gives rise to a crack for separation of the solid-state slice,wherein the at least one pressurizing element is pressed onto the stress generation layer during the subjecting of the stress generation layer to the thermal stress.17. The method of claim 16 , ...

Laser processing apparatus and laser processing method

A laser processing apparatus for radiating a laser beam to a member to be treated provided in an air environment to perform surface treatment. The member to be treated forms a structure extending in a vertical direction. The laser processing apparatus includes: a liquid supply mechanism that jets and supplies liquid to a surface of the member to be treated; a laser radiation mechanism that radiates the laser beam in pulses to the surface of the member to be treated via the liquid; and a cylindrical gas laminar flow nozzle disposed below the liquid supply mechanism and configured to jet a gas upward to form a gas flow surrounding the member to be treated around an axis direction thereof.

Methods and systems to keep a work piece surface free from liquid accumulation while performing liquid-jet guided laser based material processing

A gas flow can be provided together with a liquid jet guided laser beam to remove accumulated liquid on the processing surface. The gas flow can be configured to have minimum interference with the liquid jet guided laser beam, while functions to blow away liquid generated by the liquid jet. Keeping the surface free from accumulated liquid can improve the efficiency of the liquid jet guided laser processing. 1. A liquid jet guided laser system comprising:a laser for emitting a laser beam;a first nozzle module for forming a liquid jet from a liquid supply line;an optical element for introducing the laser beam into the liquid jet;a second nozzle module comprising a first gas inlet connected to one or more gas supply lines to form a first gas flow, wherein the first gas flow is an assist gas, and the liquid jet with the assist gas exits out of the second nozzle module through a first exit;a third nozzle module comprising a second gas inlet connected to one or more gas supply lines to form a second gas flow, wherein the second gas flow is an air jet;the second nozzle module and the third nozzle module form a second conduit between the second nozzle module and the third nozzle module;the air jet passes through the second conduit and exits out of a second exit formed between the second nozzle module and the third nozzle module;the air jet exits separately from the laser and liquid jet with assist gas;the air jet surrounds the laser and the liquid jet with assist gas.2. The system claim 1 , as in claim 1 , wherein:the first nozzle module and the second nozzle module form a first conduit between the first nozzle and the second nozzle module;the liquid jet and the assist gas pass through the first conduit, through the second nozzle module and exit out the first exit formed in the second nozzle module.3. The system claim 2 , as in claim 2 , wherein:the first conduit flows the assist gas toward the liquid jet, wherein the assist gas envelops the liquid jet when exiting the ...

LASER PROCESSING METHOD

A laser processing method for performing groove processing by applying to a workpiece a laser beam of such a wavelength as to be absorbed in the workpiece includes: a protective member disposing step of disposing a protective member on an upper surface of the workpiece; a liquid layer forming step of forming a liquid layer on the upper surface of the workpiece; a laser beam applying step of applying the laser beam through the liquid layer to subject the upper surface of the workpiece to groove processing and to produce minute bubbles; and a debris removing step of removing debris from inside of grooves by rupture of the bubbles. 1. A laser processing method for performing groove processing by applying to a workpiece a laser beam of such a wavelength as to be absorbed in the workpiece , the laser processing method comprising:a protective member disposing step of disposing a protective member on an upper surface of the workpiece;a liquid layer forming step of forming a liquid layer on an upper surface of the protective member disposed on the upper surface of the workpiece, after the protective member disposing step is performed;a laser beam applying step of applying the laser beam through the liquid layer to subject the upper surface of the workpiece to groove processing and to produce minute bubbles; anda debris removing step of removing debris from inside of grooves by rupture of bubbles.2. The laser processing method according to claim 1 , whereinthe workpiece is a wafer in which a plurality of devices are formed on an upper surface while partitioned by a plurality of intersecting division lines, andthe laser beam applying step includes applying the laser beam along the division lines.3. The laser processing method according to claim 1 , whereinthe laser beam applying step includes applying the laser beam through a transparent plate disposed on an upper side of the liquid layer. The present invention relates to a laser processing method for processing a workpiece ...

METHOD FOR PREPARING AND/OR PERFORMING THE SEPARATION OF A SUBSTRATE ELEMENT AND SUBSTRATE SUB-ELEMENT

The present disclosure relates to a method for preparing and/or performing the separation of a substrate element into at least two substrate sub-elements along a separation face and a substrate sub-element which is manufactured and/or can be manufactured in particular by use of the method according to the disclosure. 1. Method for preparing and/or performing the separation of a substrate element into at least two substrate sub-elements along a separation face , comprising the steps of:providing the substrate element, wherein the substrate element comprises a substrate body, wherein the substrate body comprises a substrate material; andcontrolling a line focus within the substrate body so that the substrate material of the substrate body is at least locally removed and/or displaced along the separation face at least section-wise;wherein the line focus represents a focus of a light beam;wherein the light beam is formed at least in the area of the line focus in the form of a light beam with an asymmetrical beam supply.2. Method according to claim 1 ,wherein at least one of the following conditions applies to the asymmetrical beam supply:(i) an energy is supplied asymmetrically and so that the centroid-of-area of the energy distribution lies in at least one plane perpendicular to the plane in which the beam propagation occurs, in the area of the previously unmodified substrate material;(ii) partial beams of the light beam are incident only from a half of a half space or a part thereof;(iii) the light beam has a polar angle p of 0° Подробнее

High power laser flow assurance systems, tools and methods

A high power laser system for providing laser beams in various laser beam patterns along a laser beam path that is positioned to provide for the in situ laser processing of materials in tubulars, such as pipes in a hydrocarbon producing well. Laser treating for providing flow assurance by direct and indirect laser processing of materials interfering with flow.

METHOD FOR THE EDGE-TO-EDGE ASSEMBLY OF TWO PANELS USING FRICTION STIR WELDING

A method for edge-to-edge welding of a first sheet metal panel to a second sheet metal panel on a bearing structure. The method comprises positioning and fixing the first panel to the bearing structure, positioning and fixing the second panel to the bearing structure with the second panel overlapping a raw edge of the first panel, jointly cutting the first panel and the second panel in the overlap area to form a connection edge of the first panel and a connection edge of the second panel, withdrawing scrap cuttings from the first panel and scrap cuttings from the second panel, and friction stir welding the connection edges. 1. A method for edge-to-edge welding of a first sheet metal panel to a second sheet metal panel , this method comprising:positioning the first panel;positioning the second panel with the second panel overlapping a raw edge of the first panel to form an overlap area of the first and second panels;jointly cutting the first panel and the second panel in the overlap area in order to form a connection edge of the first panel and a connection edge of the second panel;friction stir welding the connection edges to edge-to-edge weld the first panel to the second panel.2. The method according to claim 1 ,wherein the first panel is positioned by being fixed to a bearing structure, andwherein the second panel is positioned by being fixed to this bearing structure.3. The method according to claim 1 ,wherein the first panel is positioned on a mounting of an apparatus, andwherein the second panel is positioned with respect to the first panel by being borne by a handling unit.4. The method according to claim 1 , wherein the cutting step is implemented using a laser cutting method.5. The method according to claim 4 , wherein the cutting step is implemented using a laser water jet cutting method.6. The method according to claim 1 , wherein the cutting step produces a cut having a width less than three tenths of a millimeter.7. The method according to claim 4 , ...

Apparatus for Machining a Workpiece with a Liquid Jet Guided Laser Beam and the Assembly Thereof

The present invention provides an apparatus 100, 200, 300, 900 and a method 400 for machining a workpiece 101 with a laser beam 102. In particular, the apparatus 100, 200, 300 comprises a nozzle 103 for generating a pressurized fluid jet 104, and at least one optical element 105 configured to couple the laser beam 102 into the fluid jet 104. The apparatus 100, 200, 300 also includes a hermetic enclosure 106 surrounding the nozzle 103 and the at least one optical element 105. The hermetic enclosure 106 includes an upper part 107 provided with an interface unit 108, and a lower part 109 removably attached to the upper part 107 by means of the interface unit 108. The lower part 109 comprises an exit aperture 110 for outputting the fluid jet 104 towards the workpiece 101, wherein the exit aperture 110 and the fluid jet 104 are coaxially aligned. The apparatus 900 has a different lower part 901, which is attached to the upper part 109 and comprises a channel for outputting the fluid jet towards the workpiece, wherein a ratio of a length of the channel to a diameter, particularly constant diameter, of the channel is between 1:1 to 20:1, preferably between 5:1 to 15:1.

HIGH POWER LASER OFFSHORE DECOMMISSIONING TOOL, SYSTEM AND METHODS OF USE

There is provided high power laser systems, high power laser tools, and methods of using these tools and systems for cutting, sectioning and removing structures objects, and materials, and in particular, for doing so in difficult to access locations and environments, such as offshore, underwater, or in hazardous environments, such as nuclear and chemical facilities. Thus, there is also provided high power laser systems, high power laser tools, and methods of using these systems and tools for removing structures, objects, and materials located offshore, under bodies of water and under the seafloor. 122-. (canceled)23. An offshore method of cutting material associated with an offshore structure comprising:a. positioning a high power laser system over a body of water and proximate to a location of an offshore structure, the high power laser system comprising a high power laser and a high power laser cutter assembly;b. the high power laser cutter assembly defining a laser beam delivery path for delivery of a high power laser beam along the beam delivery path;c. propagating a high power laser beam along the beam delivery path, the laser beam having a power of at least 5 kW; and,d. changing a relative position of a material to be sectioned and the laser beam path in a predetermined laser beam delivery pattern, whereby the laser beam cuts the material in a predetermined cut.24110-. (canceled)111. An offshore laser cutting system comprising a laser cutting tool , the laser cutting tool comprising: (i) an end of a conveyance structure, comprising an optical fiber capable of transmitting high power laser energy;', '(ii) a conveyance termination section; and,', '(iii) an anchoring section;, '(a) a laser tool body defining a longitudinal axis and comprising(b) a stand-off distance setting device, whereby the laser tool body axis may be positioned in a predetermined location relative to an axis of a tubular to be cut;(c) a motor section;(d) a laser cutting head section, ...

Decoupled Liquid-Jet Guided Laser Nozzle Cap

A head assembly for a liquid jet guided laser system is disclosed having a coupling unit removably disposed to a laser focus optic module of the laser system. The coupling unit has a nozzle assembly removably connected to the coupling unit. The nozzle assembly has a liquid jet nozzle and a nozzle cap. The nozzle cap has a plurality of axial assist gas conduits and static assist gas conduits in fluid communication with an assist gas source extending through the nozzle cap body to individually transport assist gas to axial exit ports and static exit ports positioned to exhaust assist gas proximate the liquid jet. At least a portion of the plurality of axial assist gas conduits are partitioned from fluid communication with the liquid jet hole. A lateral movement assembly can be configured between the laser focus optic module and coupling unit. 1. A head assembly for a liquid jet guided laser system comprising;a coupling unit removably disposed to a laser focus optic module of the laser system, the coupling unit comprising; a nozzle cap body defining a liquid jet hole axially aligned and extending through the center of the nozzle cap body,', 'a plurality of axial assist gas conduits and static assist gas conduits in fluid communication with an assist gas source, the plurality of axial assist gas conduits and plurality of static assist gas conduits entering the nozzle cap body through entrance ports positioned in an annular pattern concentric with the liquid jet hole and extending through the nozzle cap body to individually transport assist gas to axial exit ports and static exit ports positioned to exhaust assist gas proximate the liquid jet; and, 'a nozzle assembly removably connected to the coupling unit, the nozzle assembly defining an axial direction and radial direction and comprising a liquid jet nozzle and a nozzle cap, wherein the liquid jet nozzle is configured to form a liquid jet, the nozzle cap comprising;'}wherein at least a portion of the plurality of ...

PROTECTIVE SHIELD FOR LIQUID GUIDED LASER CUTTING TOOLS

This disclosure provides a shield for use in a liquid guided laser system and related method of use. The shield comprises a rigid body with a target facing surface. The rigid body defines a through hole with a diameter that accommodates a liquid guided laser path. The rigid body has a thickness that defines a length of the liquid guided laser path through the rigid body. The thickness of the rigid body is at least twice the diameter of the through hole. The rigid body is positioned in the liquid guided laser path of the liquid guided laser system between a discharge nozzle of the liquid guided laser system and a target. 1. A shield comprising:a rigid body with a target facing surface;wherein the rigid body defines a through hole with a diameter that accommodates a liquid guided laser path and the rigid body has a thickness that defines a length of the liquid guided laser path through the rigid body;wherein the thickness of the rigid body is at least twice the diameter of the through hole; and,whereby the rigid body is positioned in the liquid guided laser path of a liquid guided laser system between a discharge nozzle of the liquid guided laser system and a target.2. The shield of claim 1 , wherein the rigid body is comprised of a material having a Young's modulus greater than 200 Gpa.3. The shield of claim 2 , wherein the rigid body is comprised of materials selected from tungsten carbide claim 2 , boron nitride claim 2 , and ceramic matrix composites.4. The shield of claim 1 , wherein the rigid body is substantially non-reflective adjacent the liquid guided laser path.5. The shield of claim 4 , wherein the rigid body is substantially non-reflective on all surfaces.6. The shield of claim 1 , wherein the ratio between the thickness of the rigid body and the diameter of the through hole is in the range of 2:1 to 10:1.7. The shield of claim 1 , wherein the rigid body is a cylinder claim 1 , the thickness of the rigid body is a height of the cylinder claim 1 , and a ...

Method and apparatus for levitation additive welding of superalloy components

Superalloy components for turbine engines are additively welded by propelling a stream of powdered filler, which includes superalloy powder filler, through a nozzle at a powder stream mass flow rate, with pressurized gas. The powdered filler stream is melted and agglomerated into a continuous melt stream with a laser or arc heating source located downstream of the nozzle. The melt stream is levitated within a magnetic field generated by at least one electromagnet coil that is oriented downstream of the heating source, and directed onto the superalloy component, by relative motion between the melt stream and the superalloy component.

LASER SHOCK PEENING APPARATUS

A laser shock peening device and components thereof. The optical system of the laser peening device includes sapphire optical elements, such as a lens or a prism. A water channel is provided in a pen for the laser shock peening device that has a curved flow path to direct the water. An air conduit in the pen provides a stream of air to the surface receiving the laser shock peening treatment.

SYSTEM AND METHOD FOR CUTTING A PASSAGE IN AN AIRFOIL

A method for cutting passages in an airfoil using a liquid-jet guided laser beam includes positioning a frustoconical tip of the liquid-jet guided laser at a first X, Y and Z location that is defined with respect to the airfoil and at a first standoff distance of greater than 5 mm and less than 20 mm from an outer surface of the airfoil. The method also includes generating a laser beam confined within a fluid column via the liquid jet guided laser, wherein the laser beam is aimed at the outer surface. The method further includes monitoring for breakthrough of the laser beam through an inner surface of an inner cavity of the airfoil, shutting off the laser beam once breakthrough is detected and repositioning the frustoconical tip at a second X, Y and Z location and at a second standoff distance. A system for cutting a passage in an airfoil is also disclosed herein. 1. A method for cutting passages in an airfoil using a liquid-jet guided laser beam , comprising:positioning a frustoconical tip of the liquid-jet guided laser at a first X, Y and Z location defined with respect to the airfoil and at a first standoff distance of greater than 5 mm and less than 20 mm from an outer surface of the airfoil;generating a laser beam confined within a fluid column via the liquid-jet guided laser, wherein the laser beam is aimed at the outer surface;monitoring for breakthrough of the laser beam through an inner surface of an inner cavity of the airfoil;shutting off the laser beam once breakthrough is detected; andrepositioning the frustoconical tip at a second X, Y and Z location and at a second standoff distance.2. The method as in claim 1 , wherein the standoff distance is between 10 mm and 15 mm.3. The method as in claim 1 , further comprising flowing a purge medium through the inner cavity of the airfoil.4. The method as in claim 1 , further comprising flowing a purge medium through the inner cavity of the airfoil after a predefined number of pulses of the laser beam.5. The ...

DEVICE FOR GENERATING A JET OF LIQUID

The present application relates to a device for generating a jet of liquid propagating along a jet axis (A), said jet of liquid guiding a laser beam. The device comprises a distribution chamber () with at least one inlet () and at least one outlet () for the liquid, said distribution chamber () being of an annular shape encircling said jet axis (A). The distribution chamber () has a first effective liquid flow cross-section area S. The device further includes an acceleration chamber () having at least one inlet () and one outlet for the liquid and a window () transparent to said laser beam to introduce said laser beam into said acceleration chamber () through said window (). The window () is arranged in line with the jet axis (A) to enable the introduction of the laser beam coaxial to said jet axis (A). Said acceleration chamber () has an entrance cross-section S defined by a surface area of a cylinder barrel of a geometric cylinder arranged coaxially to the jet axis (A), said cylinder barrel having a radius corresponding to the smallest distance between the jet axis (A) and said at least one inlet of the acceleration chamber (), wherein the area of the cylinder barrel being located within said acceleration chamber (). A nozzle for generating said jet of liquid is arranged in said outlet of the acceleration chamber () and defines a direction of the jet axis (A). At least one connection passage () extends from the at least one outlet () of the distribution chamber () to the at least one inlet () of the acceleration chamber (), said at least one connection passage () having a second effective liquid flow cross-section area S. The second effective liquid flow cross-section area S is smaller than the first effective liquid flow cross-section area S, preferably by an order of magnitude (S/S«1) and the second effective liquid flow cross-section area S is smaller than the entrance cross-section S (S/S<1). The device comprises a wall element () having a central opening, ...

Method and apparatus for laser processing

In a laser processing method, laser lights of fiber lasers or direct diode lasers is irradiated onto an iron-based plate material from a nozzle, a nozzle with a nozzle opening whose opening diameter is preliminarily set according to a thickness of the plate material is selected from plural nozzles whose nozzle openings have different opening diameters from each other, and the plate material is cut while irradiating the laser lights onto the plate material and injecting assist gas from the nozzle opening toward the plate material.

WORKPIECE PROCESSING METHOD

A workpiece processing method includes a protective film forming step of coating an upper surface of a wafer with a protective film including a water-soluble resin, a laser processing step of applying a laser beam of such a wavelength as to be absorbed in the wafer to the upper surface to subject the wafer to ablation, and a cleaning step of removing the protective film from the upper surface of the wafer together with debris generated in the laser processing step. The cleaning step includes a first cleaning sub-step of spinning a spinner table holding the wafer and supplying a cleaning fluid to the upper surface of the wafer and a second cleaning sub-step of supplying a mixed fluid of gas and the cleaning fluid to the upper surface of the wafer held by the spinning spinner table, to clean the wafer. 1. A workpiece processing method comprising:a protective film forming step of coating an upper surface of a workpiece with a protective film including a water-soluble resin;a laser processing step of applying a laser beam of such a wavelength as to be absorbed in the workpiece to the upper surface to subject the workpiece to ablation, after the protective film forming step is carried out; anda cleaning step of removing the protective film from the upper surface of the workpiece together with debris generated in the laser processing step, after the laser processing step is carried out, a holding sub-step of holding the workpiece by a spinner table in a state in which the upper surface of the workpiece coated with the protective film is exposed,', 'a first cleaning sub-step of spinning the spinner table holding the workpiece and supplying a cleaning fluid to the upper surface of the workpiece, and', 'a second cleaning sub-step of supplying a mixed fluid of gas and the cleaning fluid to the upper surface of the workpiece held by the spinning spinner table, to clean the workpiece, after the first cleaning sub-step is carried out., 'wherein the cleaning step includes'}2. The ...

LASER LIGHT IRRADIATION APPARATUS AND LASER PEENING TREATMENT METHOD

An embodiment is to provide a laser light irradiation apparatus and a laser peening treatment method, by which even a member to be processed, existing in a narrow portion, can be easily processed by laser peening. The laser light irradiation apparatus according to the embodiment includes: an optical fiber through which laser light is guided; a condensing lens that is placed on one end of the optical fiber, the condensing lens and the optical fiber defining the light path of the laser light; a guide that retains the optical fiber; and a movement mechanism for changing the position of the optical fiber, wherein the light path of the laser light guided through the optical fiber is emitted at an angle changed to more than 0° and less than 90° with respect to the central axis of the optical fiber by the condensing lens. 1. A laser light irradiation apparatus , comprising:an optical fiber through which laser light is guided;a condensing lens that is placed on one end of said optical fiber, said condensing lens and said optical fiber defining a light path of said laser light;a guide that retains said optical fiber; anda movement mechanism for changing a position of said optical fiber,wherein the light path of said laser light guided through said optical fiber is emitted at an angle changed to more than 0° and less than 90° with respect to a central axis of said optical fiber by said condensing lens.2. The apparatus according to claim 1 , whereinsaid condensing lens is a part of an optical lens having a diameter larger than a diameter of a core of said optical fiber; andsaid central axis of said optical fiber and an optical axis of said optical lens do not correspond with each other.3. The apparatus according to claim 1 , whereinan end face, closer to said condensing lens, of said optical fiber is cut obliquely with respect to the central axis of said optical fiber.4. The apparatus according to claim 1 , whereinsaid optical fiber and said condensing lens are joined to each ...

METHOD FOR MEASURING INCLINATION OF WATERJET OF LASER MACHINING DEVICE

The purpose of the present invention is to provide a method for measuring the inclination of a waterjet relative to a machine coordinate system of a laser machining device. The present invention provides a method for measuring the inclination of a waterjet of a laser machining device in which a laser beam that has been introduced and guided into a waterjet jetted from an optical head is moved relative to a workpiece fixed to a table so as to machine the workpiece, wherein measured is the inclination of the waterjet relative to the table which is within a stable-length range in which the laser beam passing through the inside of the waterjet can be reflected so as to advance in the axial direction. 1. A method for measuring inclination of a water jet of a laser machining device which machines a workpiece by relatively moving laser light which has been introduced and guided into the interior of a water jet jetted from an optical head and a workpiece which is fixed to a table , characterized by:measuring the inclination of the water jet with respect to the table within a stable-length range in which the laser light passing through the interior of the water jet can be reflected and advance in the axial direction.2. The method for measuring inclination of a water jet of a laser machining device of claim 1 , further comprising:arranging the optical head at a first height position along a vertical first feed axis, jetting the water jet from the optical head in a substantially vertically downward direction;measuring a center position of the water jet in a horizontal plane;arranging the optical head at a second height position along the first feed axis;jetting the water jet from the optical head in a substantially vertically downward direction;measuring the center position of the water jet in the horizontal plane; andmeasuring the inclination of the water jet with respect to the first feed axis the difference between the center position of the water jet at the first height ...

METHOD OF AND APPARATUS FOR SUPPLYING COOLING WATER TO LASER PROCESSING HEAD AND METHOD OF PRODUCING COOLING WATER

A method of supplying cooling water to a laser processing head includes arranging a cooling water supply path connected to the laser processing head, connecting, to the cooling water supply path, a water supply path for supplying water and an antirust supply path for supplying antirust, keeping constant a ratio between a water quantity fed by a water feed means connected to the water supply path and an antirust quantity fed by an antirust feed means connected to the antirust supply path, mixing the water and antirust in the cooling water supply path, and supplying cooling water to the laser processing head. 1. A method of supplying cooling water to a laser processing head , comprising;providing a cooling water supply path connected to the laser processing head,connecting, to the cooling water supply path, a water supply path for supplying water and an antirust supply path for supplying antirust,keeping constant a ratio between a water quantity fed by a water feeder connected to the water supply path and an antirust quantity fed by an antirust feeder connected to the antirust supply path,mixing the water and antirust in the cooling water supply path, andsupplying cooling water to the laser processing head.2. The method of supplying cooling water according to claim 1 , wherein claim 1 , in the cooling water supply path claim 1 , a cooling water tank for storing cooling water is provided and the water and antirust are mixed in the cooling water tank.3. The method of supplying cooling water according to claim 1 , wherein claim 1 , in the cooling water supply path claim 1 , a cooling water tank is provided for storing cooling water and the water supply path for supplying water and the antirust supply path for supplying antirust are connected to a mixed solution supply path connected to the cooling water tank claim 1 , and water fed by the water feeder connected to the water supply path and antirust fed by the antirust feeder connected to the antirust supply path are ...

Method and device for managing replacement time for consumable part of machine tool

In order to monitor replacement time for a consumable part of a machine tool, the present invention defines a time period after the power of the machine tool is turned off until the next turn-on thereof as a pause time for the consumable part, and provides a notification that the replacement time for the consumable part has come when the pause time is not less than a predetermined threshold.

Apparatus for Machining a Workpiece with a Laser Beam

The invention relates to an apparatus and a method for machining a workpiece with a laser beam . The apparatus comprises a machining unit configured to provide a pressurized fluid jet onto the workpiece and to couple the laser beam through at least one optical element into the fluid jet towards the workpiece . Further, it comprises a sensing unit arranged to receive a laser-induced electromagnetic radiation propagating away from the workpiece through the fluid jet and through at least one optical element, and configured to convert the received radiation into a signal . The apparatus also comprises a signal processing unit configured determine a state of machining the workpiece based on the signal 1100200300700101102100200300700. Apparatus ( , , , ) for machining a workpiece () with a laser beam () , the apparatus ( , , , ) comprising{'b': 103', '104', '101', '102', '105', '104', '101, 'a machining unit () configured to provide a pressurized fluid jet () onto the workpiece () and to couple the laser beam () through at least one optical element () into the fluid jet () towards the workpiece (),'}{'b': 107', '106', '101', '104', '106', '108, 'a sensing unit () arranged to receive a laser-induced electromagnetic radiation () propagating away from the workpiece () through the fluid jet () and through at least one optical element, and configured to convert the received radiation () into a signal (),'}{'b': 109', '101', '108, 'a signal processing unit () configured determine a state of machining the workpiece () based on the signal ().'}2100200300700. Apparatus ( claim 1 , claim 1 , claim 1 , ) according to claim 1 , wherein{'b': 109', '101', '102', '101, 'the signal processing unit () is configured to determine, as the state of machining the workpiece (), whether the laser beam () has broken through the workpiece ().'}3100200300700. Apparatus ( claim 1 , claim 1 , claim 1 , ) according to claim 1 , wherein{'b': 107', '106', '104', '105', '102', '104, 'the sensing unit () ...

A method of fabricating plates of super-hard material using a collimated cutting beam

A method of fabricating plates of super-hard material and cutting techniques suitable for such a method. A method of fabricating a plate ( 14 ) of super-hard material, the method comprising: • providing a substrate ( 4 ) have a lateral dimension of at least 40 mm; • growing a layer of super-hard material on the substrate ( 4 ) using a chemical vapour deposition process; and • slicing one or more plates ( 14 ) of super-hard material from the substrate using a collimated cutting beam ( 8 ), the or each plate of super-hard material ( 14 ) having a lateral dimension of at least 40 mm, wherein the collimated cutting beam ( 8 ) is collimated with a half angle divergence of no more than 5 degrees.

METHOD AND DEVICE FOR GENERATING A JET OF FLUID FOR MATERIAL PROCESSING AND FLUID NOZZLE FOR USE IN SAID DEVICE

The invention relates to a method and a device for generating a jet of liquid which is suitable, in the manner of a waveguide, to carry a laser beam injected into it and which is used to process a work piece. Said device comprises a liquid nozzle for generating a jet of liquid and a gas outlet nozzle, disposed at a distance from the liquid nozzle and producing a flow of gas enclosing the jet of liquid on the exterior thereof. A gas storage is defined between the liquid nozzle and the gas outlet nozzle. The jet of liquid is passed or ejected through the gas outlet nozzle. The jet of liquid has a diameter of preferably 60 m or less and the flow of gas has a diameter of 1-2 mm. 1. A method for generating a jet of fluid which is suitable for guiding , in the manner of a waveguide , a laser beam which is injected into it , for the purpose of processing a workpiece , wherein the jet of fluid is generated with a fluid nozzle , and wherein the jet of fluid is surrounded on the outside by a gas stream , characterized in that the jet of fluid is guided through a gas outlet nozzle which is arranged at a distance from the fluid nozzle and forms the gas stream.2. The method as claimed in claim 1 , characterized in that the jet of fluid is generated with a diameter of 200 μm or less and in that the gas stream has a diameter of 0.5-2 mm.3. The method as claimed in one of claim 1 , characterized in that the gas of the gas stream has a kinematic gas viscosity which is less than that of a surrounding atmospheric gas.4. The method as claimed in claim 1 , characterized in that gas for generating the gas stream flows into a first flow region without affecting the jet of fluid and is deflected into a second flow region claim 1 , adjoining said first flow region claim 1 , so as to flow around the jet of fluid claim 1 , a junction between said first and second flow regions being at a predefined radial distance from the jet of fluid claim 1 , and the gas being fed into said first flow ...

Apparatus for Measuring a Fluid Jet Guiding a Laser Beam

The invention relates to an apparatus for machining a workpiece with a high-intensity laser beam , the apparatus being configured to provide a pressurized fluid jet and to couple the laser beam into the fluid jet . The apparatus comprises a detection unit configured to receive and detect secondary radiation generated by the laser beam in the fluid jet . The detection unit includes a sensing unit configured to convert secondary radiation into a detection signal . The apparatus is configured to generate, with the detection unit , a plurality of detection signals at a single position or at different positions along the fluid jet 1100101100102101102. Apparatus () for machining a workpiece with a high-intensity laser beam () , the apparatus () being configured to provide a pressurized fluid jet () and to couple the laser beam () into the fluid jet () ,{'b': '100', 'claim-text': [{'b': 103', '104', '101', '102', '103, 'a detection unit () configured to receive and detect secondary radiation () generated by the laser beam () in the fluid jet (), the detection unit () including'}, {'b': 105', '104', '106, 'a sensing unit () configured to convert secondary radiation () into a detection signal (),'}], 'wherein the apparatus () comprises'}{'b': 100', '103', '106', '102, 'wherein the apparatus () is configured to generate, with the detection unit (), a plurality of detection signals () at a single position or at different positions along the fluid jet ().'}2100. Apparatus () according to claim 1 , wherein{'b': 103', '303', '104', '105, 'the detection unit () further includes a spectral separation unit () configured to isolate at least a part of the received secondary radiation () onto the sensing unit ().'}3100. Apparatus () according to claim 2 , wherein{'b': '303', 'the spectral separation unit () includes an optical filter, a prism, a dielectric mirror, a diffraction grating, or a multiple aperture optical setup.'}4100. Apparatus () according to claim 1 , wherein{'b': 103', ...

LASER CLADDING METHOD AND DEVICE FOR IMPLEMENTING SAME

A method and device for laser cladding by independently heating the cladding material and the surface of the workpiece consist in formation of the series of parallel annular laser beams, possibly different wavelengths, with an adjustable distribution of laser radiation power across the annular beams. The annular beams are transformed into a series of conical beams which are separately focused along a single optical axis, along which the cladding material is fed. The device can be supplemented with a cylindrical mirror for the multipass laser radiation through the stream of cladding material with the possibility of the laser radiation return to the laser resonator. 13.-. (canceled)4. A laser cladding method , comprising: feeding a cladding material into a focal region of a laser beam , which being located on a surface of an object to be treated , wherein:a series of parallel annular laser beams is formed from an initial circular laser beam with an adjustable distribution of laser radiation power across the annular beams;the annular beams are transformed into a series of conical beams and are separately focused along a single optical axis, along which the cladding material is fed.5. The method according to claim 4 , wherein the cladding material is a solid claim 4 , a liquid claim 4 , a gas claim 4 , a powder claim 4 , an aerosol or a heterogeneous plasma.6. The method according to claim 4 , wherein laser radiation wavelengths are different for different annular beams.7. A laser cladding device claim 4 , comprising: a laser claim 4 , which is optically linked to a first system for forming a conical beam claim 4 , a focusing lens and system for feeding a cladding material; wherein the device is supplemented with an optical system for forming a series of annular laser beams with an adjustable distribution of laser radiation power across the annular beams claim 4 , a rotating mirror with an opening through which tubes are passed for feeding a gas claim 4 , a cooling ...

SPOT HEATER AND DEVICE FOR CLEANING WAFER USING THE SAME

A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer. 1. A heater comprising:a heating source configured to heat a wafer;a support arm for supporting the heating source; anda cover unit isolating the heating source from the outside and comprising a transparent material, a first part comprising the transparent material and being located under the heating source; and', 'a second part not being transparent,, 'wherein the cover unit compriseswherein the heating source irradiates laser light onto the wafer.2. The heater of claim 1 , wherein the laser light penetrates the first part.3. The heater of claim 1 , wherein the cover unit is transparent entirely.4. The heater of claim 1 , further comprising a filter between the heating source and the wafer and configured to be an iris.5. The heater of claim 4 , wherein the heating source irradiates laser light onto the wafer claim 4 , andthe filter filters the laser light to adjust a size of a spot that is heated.6. The heater of claim 1 , wherein the cover unit comprises a purge part configured to remove foreign materials from the heating source.7. The heater of claim 6 , wherein the cover unit further comprising a cable supplying purge gas.8. The heater of claim 7 , wherein the purge gas comprises nitrogen gas.9. A device for cleaning a wafer claim 7 , the device comprising:a chuck on which the wafer is mounted;a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; anda heater comprising a heating source configured to heat the wafer, a support arm for supporting the heating source, and a cover unit isolating the heating source from ...

LASER MACHINING APPARATUS

A laser machining method, including: liquid supplying into a rectifying chamber; the rectifying chamber attenuating disturbances in flow of the liquid supplied; a liquid injecting into a liquid oscillating chamber exclusively from one direction from a liquid inlet port arranged on only one portion of a sidewall of the liquid oscillating chamber; the liquid jetting as a jet liquid column into air from a nozzle; a laser beam focusing on the axis of the nozzle and guiding to a machining point by the jet liquid column; a surface wave of the jet liquid column generating and gradually increasing in amplitude in the direction away from the nozzle; a body of the jet liquid column atomizing when the jet liquid column strikes the workpiece on the machining point. 1. A laser machining apparatus for machining with a laser beam that is guided to a machining point by a liquid , comprising:a nozzle including a nozzle inlet opening, the nozzle jetting a jet liquid column;a rectifying chamber having an annular shape, the rectifying chamber attenuating disturbances in flow of the liquid;a liquid oscillating chamber having a generally cylindrical shape with a height greater than its diameter, the liquid oscillating chamber guiding the liquid to the nozzle inlet opening;an oscillating chamber inlet port arranged at only one arc portion of a circumference of a sidewall of the oscillating chamber that allows inflow of the liquid from the rectifying chamber from one direction of the liquid oscillating chamber, the one direction being a radial direction of the oscillating chamber;a laser oscillator generating a laser beam;a focusing optical system focusing the laser beam generated by the laser oscillator above the nozzle inlet opening to cause the jet liquid column to guide the laser beam;a window opposed the nozzle inlet opening to cause the laser beam transmitting from the focusing optical system to enter the liquid oscillating chamber,only one oscillating chamber inlet path for guiding ...

COMBINED LIQUID GUIDED LASER AND ELECTRICAL DISCHARGE MACHINING

This disclosure provides a system, method, and resulting workpiece combining liquid guided laser and electrical discharge machining to create a common feature. The workpiece is positioned in a liquid guided laser cutting path and machined by the liquid guided laser device to create an intermediate feature in the workpiece. The work piece is then positioned in an electrical discharge machining (EDM) device so that an electrode of the EDM device is operatively positioned proximate the intermediate feature and machined using the EDM device to modify the intermediate feature in the workpiece to create the finished common feature in the workpiece. 1. A method of machining a workpiece comprising:positioning the workpiece in a liquid guided laser cutting path;liquid guided laser machining the workpiece to create at least one intermediate feature in the workpiece;positioning the workpiece in an electrical discharge machining (EDM) device, wherein an electrode of the EDM device is operatively positioned proximate the at least one intermediate feature in the workpiece; and,electrical discharge machining the workpiece using the EDM device to modify the at least one intermediate feature in the workpiece to create at least one finished feature in the workpiece.2. The method of claim 1 , wherein the at least one intermediate feature in the workpiece is a hole with an intermediate depth created by the liquid guided laser during the liquid guided laser machining step and the EDM device modifies the hole to a finished depth in the electrical discharge machining step to create the at least one finished feature in the workpiece.3. The method of claim 2 , wherein the intermediate depth is less than an EDM efficiency threshold and the finished depth is greater than the EDM efficiency threshold.4. The method of claim 1 , wherein the electrode of the EDM device is operatively positioned inside the at least one intermediate feature in the workpiece during the electrical discharge machining ...