Способ изготовления стеклянного витража на керамическом основании

Устройство для изготовления минеральной ваты

Panzerglasverbundscheibe

Panzerglasverbundscheibe aus mehreren Schichten untereinander durch ein Verbindungsmittel verbundener Glas- oder Kunststoffscheiben, dadurch gekennzeichnet, dass mindestens eine Schicht (1; 11; 12) aus nebeneinander angeordneten transparenten Keramikkacheln (4–9) besteht.

HIGH STRENGTH LAMINATED BODIES

... 1324477 Glass laminate CORNING GLASS WORKS 20 Aug 1971 [28 Aug 1970] 39127/71 Heading CIM A laminated article composed of a plurality of fused adjacent laminµ each comprising a glass or glass-ceramic, in which the outermost lamina is compressively stressed, the innermost lamina is tensilely stressed and each lamina exhibits a state of stress opposite to the laminµ adjacent thereto, is produced by melting a batch for each layer and simultaneously combining the melts to form a laminated structure at a temperature at which the viscosity of the innermost lamina is less than the viscosity of the outermost lamina within the range 1 : 1 to 1 : 6. The temperature for combining the melts is between 1200‹ and 1350‹ C. The ratio of the thickness of the innermost layer to the outermost layer is between 10 : 1 and 30 : 1 for a three-ply article. In an article consisting of more than three lamina the ratio of the total thickness of the tensilely stressed laminµ to the total thickness of the compressively ...

Improvements in vacuum-tight ceramic bodies suitable for sealing to soft glass

A ceramic material suitable for sealing to glass in the manufacture of the envelopes of electric discharge devices and electric lamps comprises a mixture of 20 to 35 per cent beryllium oxide, 80 to 65 per cent magnesium oxide and 0,2 to 2 per cent titanium dioxide. Small quantities of acidic substances such as steatite or zirconia may be present. The material sinters so as to become impervious to gas at about 1400 DEG C. and melts at about 1800 DEG C.

IMPROVEMENTS IN OR RELATING TO THE PRODUCTION OF SOLDERED JOINTS BETWEEN BODIES OF REFRACTORY MATERIALS

... 1,209,658. Soldering; jointing. SIEMENS A.G. 24 July, 1968 [25 July, 1967], No. 35256/68. Headings B3R and B3V. In making a soldered joint between two bodies of refractory material, a soldering agent consisting of a metal carbide and at least one of iron boride, cobalt boride and nickel boride or instead of the said boride or borides the corresponding metal-boron eutectic mixtures is applied to the surfaces to be soldered and the treated surfaces are thereafter heated in vacuo or in inert or reducing atmosphere to create a liquid phase. Carbon parts are joined to each other or to molybdenum or metallized ceramic parts by using a mixture of nickel boride and molybdenum carbide. In place of metal boride or mixture of metal borides a eutectic mixture of finely-divided metal and elementary boron powder may be used. The boride soldering composition may be used to effect the actual joining or may be used merely for wetting, when a hard solder, e.g. silver-gold eutectic is used as the solder.

OXIDE GLASSES WITH LOW GLASS TRANSFORMATION TEMPERATURES.

PROCEDURE FOR ANODIC CONNECTION WITH LIGHT RADIATION

DIRECT BONDING METHODS USING LITHIUM

VERFAHREN ZUM HERSTELLEN EINES UHRGLASES.

Verfahren zur Herstellung eines aus mindestens zwei Teilen bestehenden Gegenstandes, dessen einer Teil mindestens teilweise aus Glas besteht, durch Verschmelzen dieses Glases mit einem andern Teil.

Procédé pour sceller l'un à l'autre des matériaux dont le coefficient de dilatation est compris entre 45.10-7 et 60.10-7.

Für vakuumdichte und temperaturunempfindliche Verschmelzungen geeignete Schmelzmasse.

Verfahren zur Herstellung eines aus einem Isolierteil und einem mit diesem fest verbundenen elektrisch leitenden Teil bestehenden Gegenstandes

Procédé de fabrication d'un article composite

Verfahren zum Verbinden von Graphitteilen mit Teilen aus Siliziumkarbid, Quarzglas oder Graphit

Process for producing a watch-glass

A ring (2) of sintered aluminium oxide is fastened on a planar round plate (6) of sapphire in such a way that the ring stands up from the plate in the axial direction. An oxide mixture is used as the binder between the transparent plate and the ring. A dry blend comprising about 45 % by weight zinc oxide powder of an average particle diameter of 0.5 mu m and approximately 55 % by weight alpha -aluminium oxide powder of an average particle diameter of 0.3 mu m is prepared. 10 g of this dry blend are suspended in 90 g of ethyleneglycol monomethylether. The contact surface of the ring is evenly coated with this paste. The layer thickness is at most 2.5 mu m. The coated ring and the polished plate of sapphire are heated separately to 950 to 1000 DEG C. Thereafter, the ring is exactly centred with respect to the plate and pressed together for 20 minutes under a pressure of 1000 kg/cm<2>. The ceramic bond between the ring and the plate obtained in this way has an adhesive strength of more than ...

Gas tight joint - for parts of silicon or silicon carbide in crystalline form

The joint is made by flame welding using glass welding rods of a glass whose coeff of thermal expansion does not differ > plus-or-minus 20% from that of the Si or SiC piece-parts at 300 degrees C. When jointing tubes the fillet may be butted between the ends or placed as an annular collar around their butted ends. In addition to flame heating using an oxidizing flame, the welding heat may be generated electrically the final weld being mechanically strong, thermal resistance and compatible with the materials.

A method of manufacturing a colored article; in particular orange colored; zirconia and decorative article colored zirconia obtained according to this method.

Linvention concerne un procédé de fabrication dun article orange à base de zircone caractérisé par le fait quil comprend les étapes successives consistant à réaliser un premier mélange comprenant une poudre de zircone, 3 à 20% en poids dau moins un stabilisant choisi parmi lensemble des oxydes comprenant loxyde dyttrium, loxyde de magnésium, et loxyde de calcium seuls ou en combinaison, 0,1% à 5% en poids dau moins un élément destiné à réaliser une phase vitreuse, et choisi parmi lensemble comprenant de loxyde de silicium, de loxyde daluminium, de loxyde lithium et de loxyde dyttrium seuls ou en combinaison, 1% à 6% en poids dune poudre doxyde de cérium; réaliser un deuxième mélange comprenant ledit premier mélange et un liant; réaliser un mélange granulé en opérant une granulation dudit deuxième mélange; former une ébauche en conférant à ce deuxième mélange granulé la forme de larticle désiré; fritter sous air pendant au moins trente minutes à une température comprise entre 1250 et 1500 ...

Production method for reducing bubble rate of glass ceramics composite plate

The invention discloses a production method for reducing a bubble rate of a glass ceramics composite plate. The method comprises the following steps: 1) spreading glaze on adobes; 2) printing in accordance with pre-designed patterns; 3) firing the printing for the first time so that the patterns are fixed on the adobes; 4) sprinkling mixing frits and stationary liquid; 5) firing for the second time; and 6) performing post-processing, wherein the mixing frits is a mixture of high-temperature frits and low-temperature frits, and fusion temperature of frit levelling of the high-temperature frits and the low-temperature frits differs 10 to 150 DEG C; and the stationary liquid is a mixture containing optionally one or two or more of a carbonate solution, a sulfate solution, an acetate solution or a chloride solution which contain alkali metal or alkaline earth metal, and the dissolvability ratio of the metallic compound to the water is 1 : (20 to 800) in the stationary liquid. The method can ...

Metal or ceramic based optical fiber, and its prepn. method

Processes of welding

Manufactoring process of an object for welding of glass

Lamp envelope

Procede d'obtention de titanate de plomb pulverulent

L'invention concerne un procede d'obtention de titanate de plomb pulverulent. Selon l'invention, il consiste a preparer une charge a partir de poudres de bioxyde de titane et de litharge ou de minium, a calciner la charge obtenue a 750-1 000 °C durant 10-50 heures et a broyer le produit obtenu. Le rapport en moles Pb0 : Ti02 dans la charge est de 1.01 : 1,05. La composition granulometrique du bioxyde de titane est la suivante : 45-60 microns 5 % en poids au plus 2-45 microns 90-98 % en poids moins de 2 microns 5 % en poids au plus, celle de la litharge ou du minium est : 50-100 microns 1 % en poids au plus 4-40 microns 89-95 % en poids moins de 4 microns 10 % en poids au plus. L'invention s'applique notamment au scellement de pieces de dispositifs electroniques.

Joining material comprises enamel and metal oxide mixture for fixing ceramic or glass spacers to glass substrate, e.g. for production of emissive screens

Matériau de jonction (30) entre au moins un espaceur (20) à base de céramique ou de verre et un substrat verrier (10), caractérisé en ce qu'il comprend un émail mélangé à au moins un oxyde de métal se présentant sous forme de particules.

PROCESS Of OBTAINING PULVERULENT LEAD TITANATE

LOWMELTING GLASS FOR WELDING OF CERAMIG WITH FERRITE

Adhesive compositions and method employing same

This invention relates to adhesive compositions which may be used for bonding laminated glass and for glueing silicon semiconductor elements onto substrates in manufacturing solar cells. These adhesive compositions contain organopolysiloxanes having SiC-bonded vinyl groups and Si-bonded hydrogen as well as catalysts which promote the addition of Si-bonded hydrogen to vinyl groups. All of the organopolysiloxanes in these compositions are free of Si-bonded hydroxylk or alkoxy groups and contain on the average 2 to 1,000 silicon atoms per molecule in which at least 99.5 percent and preferably 99.9 percent of the number of Si-bonded hydrogen atoms are present in organopolysiloxanes containing one Si-bonded hydrogen atom per molecule and one SiC-bonded vinyl group per molecule or containing 2 Si-bonded hydrogen atoms per molecule and at least 99.5 percent and preferably 99.9 percent of the number of SiC-bonded vinyl groups are present in organopolysiloxanes containing one Si-bonded hydrogen ...

Reaction bonding through activation by ion bombardment

A method for enhancing the bond energy of reaction bonded surfaces in which polished (10) and cleaned surfaces (12) are bombarded with oxygen ions, fluorine ions or a mixture of oxygen and fluorine ions (14) to activate these surfaces. The activated surfaces are then cleaned to remove particulates (15) and then contacted (16) at room temperature to make a reaction bond therebetween. The reaction bond may be heated (18) to further increase the bond energy. The bond energy of oxygen ion bombarded surfaces can have two times the bond energy of surfaces subject to a conventional bonding process. The addition of fluorine ions to the oxygen ions used to activate the surfaces can further increase the bond energy between the contacted surfaces by at least another factor of 2.

TRANSPARENT COMPOSITE

SEALING MATERIAL

PURPOSE: A sealing material, obtained by incorporating a low-melting lead-boric acid type glass with a filler having a low expansion coefficient and ultrafine metallic oxide particles at a specific weight ratio, suitable for sealing liquid crystal display tubes, etc., and having improved chemical and water resistance and printability. CONSTITUTION: A sealing material obtained by incorporating (A) 60W85wt% powder having about 10W20μm average particle diameter of a low-melting lead- boric acid type glass, having ≤450°C softening point, and obtained by using PbO as a main raw material with (B) 14W38wt% powder having about 5W15μm average particle diameter of a filler, e.g. lead titanate or zirconium silicate, having a low expansion coefficient and (C) 0.05W15wt% ultrafine particles of a metallic oxide, e.g. silicon dioxide or titanium oxide, having ≤1μm average particle diameter in a mixer or a dispersing machine, and applying an ultrafine particulate metallic oxide 13 to the surface of the ...

Способ получения беспористого покрытия корундовых подложек

Огнеупорный клей

VERFAHREN ZUM VERBINDEN EINES ENTGLASTEN GLASKOERPERS MIT EINEM VORGEFORMTEN KOERPER

Keramische Stoffzusammensetzung und ihre Verwendung.

Keramik-Glas-Verbundwerkstoff mit Hochleistungsverbindung

Keramik-Glas-Verbundwerkstoff mit Hochleistungsverbindung, dadurch gekennzeichnet, dass eine Keramikplatte und eine Glasplatte eine Verbindung eingehen.

Oxid-Gläser mit niedrigen Glas-Transformationstemperaturen.

Verfahren zur Herstellung von zusammengesetzten Formkörpern mit komplexer innerer Geometrie.

Zündkerze für ein Kraftfahrzeug und Verfahren zur Herstellung einer Zündkerze

Die vorliegende Erfindung betrifft eine Zündkerze (1) für ein Kraftfahrzeug, die einen sich entlang der Längsachse (X-X) der Zündkerze (1) erstreckenden im Wesentlichen zylindrischen keramischen Isolator (4) und eine den Isolator (4) entlang der Längsachse (X-X) der Zündkerze (1) mindestens abschnittsweise und in Umfangsrichtung (U) der Zündkerze (1) den Isolator (4) vollständig umgebende Glasurschicht (11), umfasst, wobei zwischen dem Isolator (4) und der Glasurschicht (11) in Umfangsrichtung (U) der Zündkerze (1) durchgehend eine Stützschicht (12) vorhanden ist, die stoffschlüssig mit dem Isolator (4) und der Glasurschicht (11) in Verbindung steht.

UNGESINTERTES NIEDERTEMPERATURGLASKERAMIKBAND FÜR ELEKTRONISCHE MIKROBAUTEILE, VERFAHREN ZUR HERSTELLUNG UND VERWENDUNG

Process for producing seals between devitrified glass and ceramic, metal or glass

To form a composite article of devitrified glass, up to 40% by volume of which is in the crystalline phase, and ceramic, glass or metal, a body of devitrified glass or having an outer layer of devitrified glass is placed in contact with a body of the ceramic, glass or metal and heat and pressure are applied to bond the two bodies. The process is particularly for forming matching seals with materials having low thermal coefficients of expansion, such as 30 to 70 x 10-7, and using the devitrified glass disclosed in Specification 1,078,328, particularly with the range for TiO2 of 10-13% by weight, examples are given joining the glass to a Ni-Co-Fe alloy, Al, on which a layer of the glass is devitrified, Cu, Pt and a borosilicate glass of composition SiO2, 67; B2O3, 15; Al2O3, 7.5; Na2O, 2.5; K2O, 3.5; Li2O, 5; Ba, 3, in percentages by weight.

Improvements in air-tight envelopes comprising ceramic materials

In airtight envelopes such as those of luminous electric discharge devices in which ceramic material is sealed hermetically to glass, the ceramic material is free from silica and consists of a compound of an alkaline earth with the oxide of titanium or zirconium. The cracking of the glass due to the absorption of silica is thus avoided. Examples are, 1 or 2 parts of MgO or BeO with 1 part of TiO2 or ZrO2. The compounds when sintered at 1400 to 1500 DEG C. are non-porous to air and will join to metals. Other substances may be added to reduce the sintering temperature. The electric leads may pass through a plate formed of the ceramic material to replace the usual foot tube, and an enamel of soft glass can be used to seal the joint. The major part of the envelope may be formed of the ceramic material and the remainder of glass. Metals may be sprayed or sintered on the surface of the ceramic material.

PROCEDURE FOR MANUFACTURING GAS DENSITIES A CONNECTION BETWEEN FROM CRYSTALLINE MATERIALS EXISTENCES PARTS AND GLASS BY MELTING ON

STRONG LAMINATED BODIES

Method for preparing harmonic oscillator

The invention relates to a method for preparing a harmonic oscillator. The method comprises the following steps of: preparing a harmonic oscillator body: putting two layers of raw materials into a mould, wherein one layer is first ceramic powder and the other layer is a uniform mixture of a pore-forming agent and the first ceramic powder; pressing and sintering to form the harmonic oscillator body; volatilizing or decomposing the pore-forming agent into pores; preparing a supporting seat: adding two layers of raw materials into the other mould, wherein one layer is second ceramic powder and the other layer is a uniform mixture of the pore-forming agent and the second ceramic powder; pressing and sintering to form a supporting seat; volatilizing or decomposing the pore-forming agent into pores; splicing the harmonic oscillator body with the supporting seat: respectively coating a splicing agent on the surfaces with the pores of the harmonic oscillator body and the supporting seat to enable ...

Glass lunch box with carbon-carbon composite

Tight semiconductor device

STRUCTURE AND METHOD FOR SEALING A SILICON/GLASS ENCLOSURE.

Structure and method for sealing an enclosure glass/silicon

La présente invention concerne une structure de scellement sous vide d'une cavité fermée par soudure anodique de la périphérie inférieure d'une plaque de verre (11) contre la périphérie supérieure d'une plaque de silicium (12). La plaque de verre comprend, en regard de la cavité, une ouverture (21) la traversant et la plaque de silicium comprend une palette (22) disposée en regard de l'ouverture. La palette est solidaire d'au moins une partie de la plaque de silicium par au moins une lamelle (23) de silicium suffisamment mince pour être souple.

Glass composition for seals

Adjustment of the pH in the processes of deposit electrolytic

Improvements with sealings

METHOD AND DEVICE FOR PROCESSING THIN GLASSES

The invention relates to a compound (4) comprising a glass carrier (3) and a glass film (1) or comprising a silicon wafer (2), wherein the glass film (1) or the silicon wafer (2) has a thickness of at most 400 μm, particularly preferably of less than 145 μm, wherein the glass carrier (3) has a greater thickness than the glass film (1) or the silicon wafer (2), and a surface (10) of the glass film (1) or of the silicon wafer (2) is directly adhesively joined to a surface (30) of the glass carrier (3), and wherein the difference of the linear expansion coefficients of the glasses of the glass carrier and glass film or silicon wafer is less than 0.3*10-6 K-1, preferably less than 0.2*10-6 K-1, according to amount, in a temperature interval of between 20 and 200 °C ...

ELECTRONIC COMPONENT UNION, ELECTRONIC CIRCUIT MODULE UTILIZING THE SAME, AND PROCESS FOR MANUFACTURING THE SAME

A technique for bonding a glass substrate to an insulating substance, or a substrate of nonoxidized semiconductor, such as, for example, SiC without the use of any bonding agent. There are provided, as a first substrate, an insulating substance, or a substrate of nonoxidized semiconductor, such as, for example, SiC, the top surface of which is metallized, and, as a second substrate, a glass substrate containing ions diffusible by voltage. The metallized surface of the first substrate and the second glass substrate are bonded together by anodic bonding.

GLASS-CERAMIC MATERIAL AND METHOD OF MAKING

The present invention is a glass-ceramic material and method of making useful for joining a solid ceramic component and at least one other solid component. The material is a blend of M1-M2-M3-M4, wherein M1 is BaO, SrO, CaO, MgO, or combinations thereof, M2 is Al2O3, present in the blend in an amount from 2 to 15 mol%, M3 is SiO2 with up to 50 mol% B203 and a metal oxide selected from the group of La2O3, Y2O3, Nd2O3 or combinations thereof, or between 0.1 and 7.5 mol% K2O. In the case of a metal oxide from the group La2O3, Y2O3, Nd2O3 or combinations thereof, it is preferred that the composition contain an additional 0.1 to 3 mol %CuO. In all cases, the glass ceramic material in a crystalline phase substantially matches a coefficient of thermal expansion of solid electrolytes having a thermal expansion coefficient of 12 x 10-6 °C-1 as measured from 25 °C to 1000 °C, and does not degrade with repeated heat cycling. According to the present invention, the series of glass ceramics in the M1 ...

METHOD FOR MAKING MULTI-LAYER LAMINATED BODIES

Method of joining non-metallic and metallic components

A method of attaching a first member of one of quartz and a ceramic to a metal member. The method includes creating a hole in the metal member, the hole being smaller in size than the size of the first member over a temperature range, heating the metal member to a temperature sufficient to expand the hole to allow insertion of the first member in the hole, inserting a portion of the first member into the hole, and cooling the metal member to form a joined structure of the first member and the metal member.

CURABLE SLURRY FOR FORMING CERAMIC MICROSTRUCTURES ON A SUBSTRATE USING A MOLD

A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400 ·C to 600 ·C and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.

GLASS SEALED LENS CAP

PURPOSE: To obtain a glass sealed lens cap capable of uniformly forming a melted glass in recessed part of eyelet and sealing globular lens more tightly and firmly than hitherto by providing projection on the end edge of through-hole opening for sealing glass in the recessed part of eyelet. CONSTITUTION: A sealing glass tablet 14a is set between inner wall face of eyelet 12 and projection 18 and a globular lens is brought into contact with through hole 16 and heated. Then the tablet 14a is kept in melted state while contracting it onto the inside and the melted glass is gradually moved from inner face side of eyelet 12 onto a lens 10 side and spread in the recessed part of eyelet 12. When the melted glass is spread in the recessed part of eyelet 12, the projection 18 prevents contraction to the inside in melting of tablet 14a and moving of melted glass and operates not so as to immediately bring into contact with the outer face of lens 10. Consequently it is suppressed by the projection ...

GROOVING METHOD FOR CERAMIC THRUST PLATE

PROBLEM TO BE SOLVED: To provide a low-cost grooving method for a ceramic thrust plate capable of easily forming a dynamic pressure generating groove having excellent abrasion resistance in a surface of a ceramic board to be used as a thrust plate in a dynamic fluid bearing. SOLUTION: A polishing surface of the ceramic board 26 is printed with paste 28 of a sintered material in parts except a part corresponding to a target groove pattern to form a groove forming projecting part pattern 30. Thereafter, baking is performed to form the groove pattern (dynamic pressure generating groove 22) corresponding to the groove forming projecting part pattern. COPYRIGHT: (C)2005,JPO&NCIPI ...

Состав для соединения химически стойких материалов

Изобретение относится к составу для соединения керамики со стеклом и может использоваться в приборостроении для изготовления электролитических датчиков определения кислорода в различньпс средах. Цель изобретения - повьшение прочности и обеспечение вакуум-плотности и водостойкости при соединении диркониево- оксидной керамики со стеклом. Состав, состоящий из стеклосвязки и наполнителя , содержит в качестве стекло- связки раствор силиката натрия, а в качестве наполнителя - композицию из диоксида циркония, диоксида кремния , оксида цинка, гексафторосилика- та натрия при следующем соотношении компонентов, мас.%: SiO 28-30; ZrO 48-50; раствор , 12-19; ZnO 4-7; 0,. Состав обладает прочностью 29,8-45,6 МПа, водостойкостью 0,42-0,61% и вакуум-плотностью (,1) -10-2 ша. 1 табл. tp (Л ...

Способ получения порошка титаната свинца

... 1. СПОСОБ ПОЛУЧЕНИЯ ПОРОШКА ТИТАНАТА ССККЦА из оксида титана и глета или -сурика свинцовых, включающий приготовление шихты из порошков исходных компонентов,обжиг и помол, отличающийся тем,что,с ц.елью получения титаната свинца для припоечного стекпокомпозиционного материала, обеспечивающего герметичное спаивание, обжиг проводят при температуре .750-1000 С с выдержкой в течение 10-50.ч, используют оксид титана следующего гранулометрического состава, мас.%: 45-60-мкм65 2-45 мкм90-98 менее 2 а глет или сурик свинцовые - следующего гранулометрического состава, мас. %: 50-100 мкм$1 4-40 мкм.89-95 менее 4 (Л 2. Способ ПОП.1, отличающийся тем, что мольное соотношение РЬО к TiOj в шихте равно 1,0.11 ,05.

Способ контактно-реактивной пайки керамики с медью

Method for sealing welding of attachment element and glass plate used in photovoltaic module, involves partially penetrating interfacial layer, when welding materials of glass plate and attachment element

The method involves arranging an interfacial layer (12) between a glass plate (14) and an attachment element (10). A silicone or an acrylic layer is introduced in interfacial layer by ultrasonic vibrations produced by a sonotrode, such that the glass plate and attachment element are adhered with each other. The glass plate is bonded with attachment element over the interfacial element, such that the interfacial layer is isolated from specific area. The interfacial layer is penetrated partially, when welding the materials of glass plate and attachment element. An independent claim is included for a welding structure of glass plate and attachment element.

Verbundene Gegenstände und Verfahren zum Herstellen solcher verbundener Gegenstände

Laminated structure formed of ceramic color layer and conductive layer on glass

A laminated structure ?10; 20; 30! formed of a ceramic color layer and a conductive layer comprises a ceramic color layer ?2; 22; 32! formed on the surface of plate glass ?11! and a conductive layer ?3! formed on the surface of said ceramic color layer and containing silver ions. At least a partial layer ?2; 22b; 32b! constituting said ceramic color layer and located on the side on which said conductive layer is formed is comprised of any one of a ceramic layer ?2; 22b! containing a reducing agent and a ceramic layer ?32b! having a higher melting point.

Flux free bonded article and method

A flux-free bond between two bodies, particularly for bonding a crystal, e.g. of quartz or ceramic, to a delay line of an alkali-lead-silicate or borosilicate glass, is obtained by wetting the mating surfaces with molten indium, applying a nugget of bonding alloy, e.g. an indium-tin-lead solder, to one of the surfaces, heating the bodies to a temperature sufficient to melt the alloy, joining the surfaces and holding them together under pressure, and cooling until the indium and the alloy solidify. Specification 800,519 is referred to.

Lamp envelope

... 1,139,622. Glass-ceramic to silica glass seals. OWENS-ILLINOIS Inc. 1 Aug., 1967 [1 Aug., 1966], No. 35261/67. Heading C1M. A glass-ceramic lamp envelope is sealed to a silica glass window, both having compatible low coefficients of thermal expansion of less than 25 Î 10-7/‹ C. (0-300‹ C.) preferably between 4 and 10 by a vitreous copper containing sealing glass consisting of in mole percentages: SiO 2 75-80; Al 2 O 3 8-12; Cu 2 O 10-15; and optimally AlF 3 1-4. Fused silica or quartz may be used for the window in any well known type of lamp and sealing is affected in an oven in an atmosphere of nitrogen or by flame sealing. The solder glass may be applied to the rim either of the silica window or the glass-ceramic envelope and in any form such as a bead or paste. A fibre of the solder glass may be applied to the edge by a hand torch. Particles in an organic binder, for which examples are given, may be applied as a paste. Examples of glassceramics in weight percentages are: (1) ...

Improvements in and relating to the preparation of fused glass-ceramic joints

... 424,442. Glass - ceramic joints. PORZELLANFABRIK KAHLA, Kahla, Thuringia, Germany. Nov. 23, 1933, Nos. 32801 and 32802. Convention dates, Nov. 23, 1932 and July 31, 1933. [Class 56] [See also Group X] Ceramic bodies such as porcelain to be fused to glass in an oil- and air-tight manner are chosen so that the coefficient of expansion of the ceramic body is greater than that of the glass, for example, 10 to 30 per cent greater. Suitable materials for the ceramic body are pure silicates containing magnesium, such as those known under the Registered Trade Mark " Calit," and the trade name " Calan." Or the ceramic article may consist of sintered ceramic materials available as mixtures of aluminium silicates and aluminium oxides free from steatite, the coefficient of expansion of which is 2- 5 + 10<-6> or less, and that of the glass 1À75 + 10-‹ to 2À2 + 10-<6>. The ceramic materials mentioned have a small dielectric loss and a low electric conductivity.

Improvements in glass-to-metal and glass-to-ceramic seals

... 1,054,753. Glass composition; glass seals. GENERAL ELECTRIC CO. March 9, 1964 [March 14, 1963], No. 9847/64. Heading C1M. [Also in Division B3] A glass is composed by weight of about 40% B 2 O 3 , 25% Al 2 O 3 and 35% BaO and the mean coefficients of thermal expansion of the glass in the range 20-500‹ C. differ from that of Ta at the same temperature by not more than 10 x 10-7/‹ C., and the glass may be sealed to Ta and other metals, alloys and ceramics. A suitable batch composition is in parts by weight: BaCO 3 , 45À1; Al(OH) 3 , 38.3; and H 3 BO 3 , 71À1. After the batch is melted, the glass is chilled on a cold metal plate. To make a seal, in a preferred method, the glass is then crushed and milled to- 100 U.S.S. sieve size, mixed with binder comprising butyl methacrylate diluted with trichlorethane and including as lubricant a powdered vegetable stearine. After mixing and drying, the glass is crushed, and annular pellets are pressed therefrom, heated at 400‹ C. to volatilize ...

Improvements in or relating to hermetically sealed semiconductor device

... 1,015,549. Semi-conductor devices. WESTINGHOUSE ELECTRIC CORPORATION. July 11, 1963 [July 2, 1962], No. 26058/63. Heading H1K. A housing for a semi-conductor device comprises an apertured glass plate with leads extending through its side walls into the aperture, sealed to a thermally conductive baseplate carrying the device. The other face of the plate is sealed through an apertured frame plate to a closure member. Transistors and diodes, e.g. of germanium or silicon may be mounted in such housings but Fig. 1 shows a housing for a solid circuit. The base-plate may consist of alumina, beryllia, porcelain, or high silica glass, in which case it is sprayed with metal, or of nickel-iron-chromium or nickel-iron-cobalt alloy. Two glass plates with leads 16 sandwiched between them and a frame plate 24 are bonded to it. The glass within the frame plate is then sandblasted or etched away to form the aperture shown in which the leads are exposed. After mounting the solid circuit connections are made ...

Improvements in or relating to electric discharge devices

In electric discharge devices in which the leads pass through a plate of ceramic material which is sealed to quartz or to a glass which has about the same coefficient of expansion as quartz, the ceramic material is composed of pure silica, alumina and magnesia, mixed and fired to give a homogeneous mass. The material may consist of 55 per cent silica, 35 per cent alumina and 10 per cent magnesia. During the sealing the plate may be supported in a refractory mould of alumina. Specifications 282,402, [Class 22], 390,269, 409,315, and 446,106 are referred to.

Face plate assembly for electron image tubes

... 1,081,513. Cathode-ray tubes. GENERAL ELECTRIC CO. May 6, 1965 [June 12, 1964], No. 19203/65. Heading H1D. The faceplate 20 of a cathode-ray tube, e.g. an image orthicon camera tube, is sealed to a reduced thickness (0À003 to 0À006 inch) inner portion 18 of a doubly convoluted metal frame 17 which is sealed to a metal ring 31 sealed to the tube envelope 13, the inner convolution of the frame 17 being of lesser amplitude than the outer convolution 121 and providing a resilient support for the faceplate. The faceplate may be a bundle of optical fibres or may be of soda lime optical glass or sapphire, brazed or sealed with glass frit to a frame 17 of Ti, Ta, stainless steel or alloys of Ti, Ta or chromium or Fe-Ni alloys. The frame 17 is preformed with the large convolution 21, but the smaller convolution adjacent the faceplate 20 may be formed in the reduced thickness inner portion of the frame 17 during sealing. The frame 17 is brazed or arc-welded to a metal ring which is sealed to the ...

PROCEDURE FOR PRODUCTION GAS DENSITIES OF A CONNECTION BETWEEN FROM CRYSTALLINE MATERIALS EXISTENCES PARTS AND GLASS BY MELTING ON

VERFAHREN ZUM HERSTELLUNG EINER GASDICHTEN VERBINDUNG ZWISCHEN AUS KRISTALLINEN STOFFEN BESTEHENDEN TEILEN UND GLAS DURCH ANSCHMELZEN

FLUX-LESS SOLDERING OF GLASS TO METAL

... - 10 - Case 4342 FLUX-LESS SOLDERING OF GLASS TO METAL A pressure sensitive Silicon chip is indirectly bonded to a Stainless Steel housing of an electronic pressure transmitter through an intermediate holder assembly. This indirect bonding of the Silicon chip prevents thermal cracking of the Silicon chip due to the difference in thermal expansion of the Stainless Steel housing and the Silicon chip. The intermediate holder assembly includes a Borosilicated glass tube having the Silicon chip bonded thereto which tube is soldered to a Nickel-Iron alloy holder by an eutectic alloy solder. The soldering of the glass tube to the Nickel-Iron holder is accomplished without the use of flux due to layers of Chrome, Nickel, and Gold being formed on the glass tube.

GAS-TIGHT CONNECTION AND METHOD FOR PRODUCING SAME

Welding composition, shell assembly, preparation method and electronic equipment

Binding method of pottery and glass product

The high-temp. resistance materials of Al2O3, SiO2 and ZrO2 etc. and raw materials of clay and water etc. are mixed in accordance with proper proportion and agitated thoroughly and then the pottery is made up through the processes of hand-throwing, finishing, glazing and sitering etc., then a hollow glass tube after being high-temp. softened is put into said sintered pottery and uniformly blown to the internal wall of the pottery to make the glass material fully bind together with the internal wall of the pottery. The invented product is a kind of decoratives such as flower vase, lampshade etc. with special effect.

PRODUCTION OF GAS-TIGHT CONNECTIONS TO CRYSTALLINE SILICON OR SILICON CARBIDE COMPONENTS

IMPROVED METHOD OF COATING GRAPHITE IN ARTICLES GLASS AND GLASS-CERAMIC ARTICLES AND

METHOD OF OBTAINING LEAD TITANATE POWDER

Assembly of parts out of glass and metal

MATERIAL OF JUNCTION ENTERS OF THE SPACERS AND A GLASS SUBSTRATE

Process of assembly of parts out of graphite and assemblies obtained by the preceding or similar process

Bonding of silicon carbide chip with a semiconductor

A module and a method of making the module is disclosed. The module is fod from a semiconductor and a silicon carbide chip for high temperature applications. The module is designed to be compatible with current silicon IC processes.

Composite substrate material and process for producing the same

A functional film, which has photo-catalytic effects, is overlaid on a surface of each of at least two substrate materials. The functional film, which has been overlaid on the surface of each of the substrate materials, is exposed to light having a wavelength falling within an absorption wavelength range of the functional film. The substrate materials are then bonded to each other with the functional films, which have been exposed to the light, intervening between the substrate materials. The functional film may be a film containing TiO₂, and the light irradiated to the functional film may be ultraviolet light. In cases where a film other than the functional film is also overlaid on the surface of each of the substrate materials, the functional film is formed as a top layer.

Curable slurry for forming ceramic microstructures on a substrate using a mold

A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.

Anodic bonding method and method of producing an inkjet head using the bonding method

Disclosed is a method of anodically bonding a silicon substrate (1) to a glasssubstrate (2) wherein the thickness of at least a portion (5) of the silicon substrate (1) is less than the thickness of the glass substrate (2). The method comprises establishing a suitable bonding temperature, heating the substrates to the bonding temperature and applying a voltage between the substrates for a predetermined time. In order to prevent reduced thickness portions (5) of the first substrate (1) from getting warped, the bonding temperature is calculated such that the contraction of the silicon substrate (1) while cooling from the selected bonding temperature to room temperature is equal to or greater than the contraction of the glass substrate (2). The preferred use of this method for manufacturing inkjet heads having electrostatic actuators with such reduced thickness portions (5) serving as vibration plates of the actuators is described. ...

JOINING METHOD OF ROUGH SURFACE BODY AND JOINED BODY AT ROUGH SURFACE

PROBLEM TO BE SOLVED: To provide a method for joining rough surface bodies by which the rough surface bodies having roughened state surfaces can be strongly joined with good dimensional accuracy, and the adhesion between each rough surface can be maintained even in a high temperature environment. SOLUTION: A nickel plating layer 12 and a gold plating layer 13 are formed on a joining face of a rough surface body 11. On the other hand, a nickel plating layer 22 and a tin plating layer 23 are formed on the joining face of the rough surface body 21. The joining faces of the gold plating layer 13 and the tin plating layer 23 are mutually stuck, and the stuck faces are heated and pressed to join the rough surface body 11 to the rough surface body 21. COPYRIGHT: (C)1999,JPO ...

MANUFACTURE OF SILICON-GLASS JUNCTION MEMBER

PURPOSE: To obtain the optimum manufacturing method for surface mounting by a method wherein a cavity and a through hole are formed in advance on the cutting line on one main surface of silicon, and an insulating film is formed on the side wall of the through hole. CONSTITUTION: Using a photomask, having a V-groove 10 and a through hole 3 pattern independently arranged on the external shape line of one main surface of a silicon wafer 1 of <100> crystal orientation having a thermal oxide film, exposing and developing operations are conducted, and the SiO2 film on the respective part is removed, and silicon is etched. A rectangular cavity 11 is formed on another surface, and after the whole surface has been thermally oxidized and washed, a Cr/Au multilayer film is formed on the surface of the wafer on the side of the V-groove and the through hole, an electrode pattern 9 is formed, a vibrator 6 is mounted, and a borosilicate glass 4, having a cavity 8, is anode-junctioned to the wafer. Accordingly ...

УСТАНОВКА ДЛЯ ОПЛАВЛЕНИЯ СТЕКЛОВИДНЫХ ПОКРЫТИЙ

... 1. Установка для оплавления стекловидных покрытий, содержащая баллоны с газом, шланги, горелку с двумя и более соплами, отличающаяся тем, что между баллонами и горелкой расположены коллектор и камера распределения газа, сопла горелки установлены в кассете с образованием одного и более линейных рядов.2. Установка для оплавления стекловидных покрытий по п.1, отличающаяся тем, что кассета с соплами установлена подвижно с возможностью ее вертикального перемещения, поворота и фиксации под углом к оплавляемому стекловидному покрытию.

Aus einer keramischen Farbschicht und einer leitfähigen Schicht gebildete Schichtstruktur

Method of joining a carbon body to another body

In soldering a carbon body to another body a diffusion inhibiting barrier layer comprising a carbide is provided on the face of the carbon body and solder is applied to the barrier layer. Graphite may be joined to graphite, silicon carbide quartz or quartz glass and the barrier layer may be of one or more of titanium, zirconium, niobium and silicon carbides while the solder may be one or more of titanium, zirconium and niobium silicides or of silicon. The carbide layer may be formed by applying a layer of metal silicide on to the graphite face and subjecting the latter to heat so that the silicide reacts with the graphite to form a carbide and a metal silicide solder together with up to 50% by weight of a metal carbide may be applied in powder form. In an example in which the end of a graphite tube is to be closed by a flat graphite wafer or by a graphite body having a spigot entering the end of the tube, the faces of the tube and closure body to be joined are coated with a suspension of ...

UNGESINTERTES LOW-TEMPERATURE GLASS CERAMIC VOLUME FOR ELECTRONIC MICRO CONSTRUCTION UNITS, PROCEDURES FOR THE PRODUCTION AND USE

METHOD FOR PRODUCING PACKAGE, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

A method for producing a package includes preparing a base substrate provided with a low-melting glass and a lid, defoaming the low-melting glass by heating the low-melting glass to a temperature equal to or higher than the pour point in a reduced pressure atmosphere, and joining the base substrate and the lid to each other by superimposing the base substrate and the lid on each other through the low-melting glass, and then heating the low-melting glass to a temperature equal to or higher than the pour point in a reduced pressure atmosphere. 1. A method for producing an electronic device , comprising:preparing a base substrate and a lid, at least one of which is provided with a low-melting glass;defoaming the low-melting glass by heating the low-melting glass to a temperature equal to or higher than the pour point in a reduced pressure atmosphere;joining the base substrate and the lid to each other by superimposing the base substrate and the lid on each other through the low-melting glass, and then heating the low-melting glass to a temperature equal to or higher than the pour point in a reduced pressure atmosphere; andmounting a functional device on the base substrate through a supporting member, which is performed before the joining.2. The method for producing an electronic device according to claim 1 , wherein in the defoaming claim 1 , the low-melting glass is heated to a temperature equal to or higher than the working point.3. The method for producing an electronic device according to claim 1 , wherein in the joining claim 1 , the low-melting glass is heated to a temperature equal to or higher than the pour point and equal to or lower than the working point.4. The method for producing an electronic device according to claim 1 , wherein the method includes heating the low-melting glass to a temperature lower than the transition point in an oxygen-containing atmosphere claim 1 , which is performed before the defoaming.5. The method for producing an electronic ...

LIGHTWEIGHT CARRIER STRUCTURE, PARTICULARLY FOR OPTICAL COMPONENTS, AND METHOD FOR ITS PRODUCTION

A carrier structure (), particularly for optical components, includes a carrier body () which is formed from ceramic with hollows (), and at least one cover layer () which is formed from glass, arranged on at least one surface of the carrier body (), and is connected to the carrier body () by means of at least one bond connection () produced by means of anodic bonding. Methods for producing the carrier structure () and the use of the carrier structure as a mirror body, carrier for optical components and/or mechanical carrier for dynamically moved components are also described. 1. A carrier structure comprising:a carrier body having a thickness direction and a lateral direction and consisting of SiSiC ceramic with hollows, wherein the hollows extend in the thickness direction through the carrier body in such a manner that at least one side wall extending in the lateral direction remains, which forms at least one main surface of the carrier body and which closes one side of the carrier body in the lateral direction, andat least one cover layer comprising glass and arranged on the at least one main surface of the carrier body,wherein the at least one cover layer is connected to the at least one main surface of the carrier body by at least one anodic bond connection being produced by anodic bonding and the at least one anodic bond connection comprises an ion concentration gradient across an interface between the at least one cover layer and the at least one main surface of the carrier body connected to one another.2. The carrier structure according to claim 1 , wherein the carrier body comprises a composite of a plurality of carrier body parts.3. The carrier structure according to claim 2 , wherein the carrier body parts form a closed hollow structure.4. The carrier structure according to claim 1 , wherein the at least one cover layer comprises two glass layers which are arranged on mutually opposite main surfaces of the carrier body.5. The carrier structure according ...

Method for producing hermetic package

A technical object of the present invention is to devise a method by which bonding strength between an element base and a sealing material layer can be increased without thermal degradation of a member to be housed inside, to thereby improve long-term reliability of a hermetic package. A method of producing a hermetic package of the present invention includes the steps of: preparing a ceramic base and forming a sealing material layer on the ceramic base; preparing a glass substrate and arranging the ceramic base and the glass substrate so that the glass substrate is brought into contact with the sealing material layer on the ceramic base; and irradiating the sealing material layer with laser light from a glass substrate side to seal the ceramic base and the glass substrate with each other through intermediation of the sealing material layer, to thereby provide a hermetic packages.

SUBSTRATE CERAMIC LAMINATE

The invention relates to substrate ceramic laminates. In particular, the invention relates to substrate ceramic laminates in which the ceramic layer is a functional layer. 1. Component with functional surface.2. Component according to claim 1 , characterized in that the component comprises a substrate and a polycrystalline functional layer claim 1 , the functional layer comprising the functional surface.3. Component according to claim 2 , characterized in that the polycrystalline functional layer comprises a ceramic.4. Component according to one of claim 2 , characterized in that the substrate comprises a plastic claim 2 , a glass claim 2 , a glass ceramic or a ceramic or a composite material or a flexible material.5. Component according to claim 1 , characterized in that the functional layer has a thickness of less than 2 mm claim 1 , preferably less than 0.5 mm and especially preferably Jess than 100 μm.6. Component according to claim 1 , characterized in that the substrate and/or the functional layer is transparent.7. Component according to claim 1 , characterized in that the functional layer is mechanically and/or chemically and/or thermally stable.8. Component according to claim 1 , characterized in that the functional layer has an optical function claim 1 , particularly an antireflective effect and/or a filter effect.9. Component according to characterized in that the functional layer has a scratch-resistant and/or an anti-fog effect.10. Component according to claim 1 , characterized in that the substrate and the functional layer are connected to each other by means of an adhesion promoter.11. Component according to claim 10 , characterized in that the adhesion promoter is transparent and has a refractive index which lies between the refractive index of the substrate and of the functional layer claim 10 , or a transparent adhesion promoter which has the same refractive index as the functional layer.12. Component according to claim 1 , characterized in that the ...

METHOD OF ANNEALING CERAMIC GLASS BY LASER

A method for annealing thin-films of ceramics such as AlOon glass by laser such that the underlying glass substrate is unaffected by the laser heating. This is accomplished by applying a thin MgO buffer layer to the glass, depositing an amorphous ceramic layer on the textured transparent buffer layer, and annealing the ceramic layer with a heated line source. The ceramic layer crystallizing forming a ceramic coated substrate. The buffer layer is also textured which serves to induce texture in the AlOfilm deposited on the buffer layer. The induced texture on the AlOprovides advantageous properties. The ceramic glass can be used for a variety of applications such as covers to solar panels, CICs used in satellites, displays, automobile windows, and substrates for LEDs. 1. A method of making a ceramic coated substrate comprising the steps of:depositing a textured transparent buffer layer on a transparent substrate,depositing an amorphous ceramic layer on the textured transparent buffer layer, andannealing the ceramic layer with a heated line source, said ceramic layer crystallizing forming a ceramic coated substrate.2. The method of where the substrate is glass.3. The method of claim 1 , where the substrate is ceramic.4. The method of claim 1 , where the substrate is plastic (polymer).5. The method of claim 1 , where the heated line source is a laser.6. The method of claim 1 , where the ceramic is AlO.7. The method of claim 1 , where the transparent buffer layer is MgO.8. The method of claim 1 , where the phase of AlOis alpha.9. The method of claim 1 , where the MgO is textured.10. A method of making a ceramic coated substrate without thermally impacting the substrate comprising the steps of:depositing a textured transparent buffer layer on a transparent substrate,depositing an amorphous ceramic layer on the textured transparent buffer layer, andannealing the ceramic layer with a heated line source, said ceramic layer crystallizing forming a ceramic coated substrate, ...

SEALED DEVICES AND METHODS FOR MAKING THE SAME

Disclosed herein are sealed devices comprising at least one cavity containing at least one quantum dot or at least one laser diode are also disclosed herein. The sealed devices can comprise a glass substrate sealed to an inorganic substrate, optionally via a sealing layer, the seal extending around the at least one cavity. Display and optical devices comprising such sealed devices are also disclosed herein, as well as methods for making such sealed devices. 155-. (canceled)56. A sealed device comprising:a glass substrate comprising a first surface;an inorganic substrate comprising a second surface;a sealing layer in contact with at least a portion of the first surface and at least a portion of the second surface;at least one seal bonding the glass substrate to the inorganic substrate via the sealing layer;wherein the inorganic substrate has a thermal conductivity of greater than about 2.5 W/m-K,wherein at least one of the first or second surfaces comprises at least one cavity containing at least one quantum dot and at least one LED component or wherein at least one of the first or second surfaces comprises at least one cavity containing at least one laser diode, andwherein the at least one seal extends around the at least one cavity.57. The sealed device of claim 56 , wherein the glass substrate comprises a glass chosen from aluminosilicate claim 56 , alkali-aluminosilicate claim 56 , borosilicate claim 56 , alkali-borosilicate claim 56 , aluminoborosilicate claim 56 , and alkali-aluminoborosilicate glasses.58. The sealed device of claim 56 , wherein the inorganic substrate comprises aluminum nitride claim 56 , aluminum oxide claim 56 , beryllium oxide claim 56 , boron nitride claim 56 , or silicon carbide.59. The sealed device of claim 56 , wherein the sealing layer comprises a glass chosen from tin fluorophosphate glasses claim 56 , tungsten-doped tin fluorophosphate glasses claim 56 , chalcogenide glasses claim 56 , tellurite glasses claim 56 , borate glasses ...

METHOD FOR CONNECTION OF PARTS COMPOSED OF MATERIALS THAT ARE DIFFICULT TO SOLDER

A method for connecting a first part, composed of a difficult to solder material, with a second part. A wetting of a first surface of the first part, to be connected with the second part, with a first solder, and connecting the first solder with the first surface of the first part, takes place by introducing heat and ultrasound energy. A wetting of a second surface of the second part, to be connected with the first part, with a second solder takes place. Subsequently, machining of the surface of the first solder is carried out for removal of an oxide layer. Then the first and the second solder covered surfaces are brought into contact with one another, to form a unit. This is followed by exposing the unit to a temperature within a predetermined temperature range, which has an upper temperature limit of less than 800° C. 1. A method for connecting a first part composed of a material that is difficult to solder with a second part , wherein the following steps are performed:a) wetting of a first surface of the first part, to be connected with the second part, with a first solder, and connecting the first solder with the first surface of the first part by introducing heat and ultrasound energy;b) wetting of a second surface of the second part, to be connected with the first part, with a second solder;c) machining of the surface of the first solder, to be connected with the second solder, for removal of an oxide layer produced in Step a);d) producing a connection of the first surface of the first part, wetted with the first solder, and of the second surface of the second part, wetted with the second solder, by bringing the first and the second surface into contact with one another to form a unit;e) performing a temperature step in which the unit is exposed to a temperature within a predetermined temperature range, which has a lower temperature limit and an upper temperature limit, wherein the upper temperature limit is less than 800° C.2. The method according to claim 1 ...

Transparent Composite Material

The invention relates to a transparent composite material for various applications, having crystalline and amorphous inorganic materials with improved material properties. 1. Composite material , comprising amorphous inorganic material is directly bonded to a transparent crystalline inorganic material.2. Composite material according to claim 1 , wherein the amorphous inorganic material is a glass or a metal.3. Composite material according to claim 1 , wherein the transparent crystalline inorganic material is a monocrystal or a polycrystalline ceramics.4. Composite material according to claim 1 , wherein the transparent crystalline inorganic material is selected from oxides of the compounds comprising Al and/or Mg and/or yttrium; nitrides claim 1 , oxynitrides or sulfides of aluminum or silicon; oxides of zirconium and/or yttrium claim 1 , aluminum oxynitride; zinc sulfide; silicon carbide claim 1 , boron carbide claim 1 , boron nitride claim 1 , carbon claim 1 , lanthanum-doped lead zirconate titanate claim 1 , or fluoride of Ca and/or Mg and/or aluminum having up to 5% dopants of the group consisting of the lanthanoids and/or actinides and/or ferrous or non-ferrous metals claim 1 , or mixtures thereof.5. Composite material according to claim 1 , wherein the amorphous inorganic material has an index of refraction of >1.6.6. Composite material according to claim 1 , wherein the composite material has a temperature resistance of at least >400° C.7. Composite material according to claim 1 , wherein the amorphous inorganic material and/or the crystalline inorganic material have a compressive stress of >10 MPa claim 1 , at least in part claim 1 , in the composite material.8. Composite material according to claim 1 , wherein the amorphous inorganic material has a minimum viscosity of log(η)≤15 claim 1 , during production.9. Composite material according to claim 1 , wherein between the two temperatures of 20-300° C. and a volume ratio of amorphous inorganic material to ...

A kind of complex-curved shell and preparation method thereof

本发明公开了一种复杂曲面外壳的制备方法，包括以下步骤：S1：提供至少两片板材，将至少两片所述板材分别热弯处理，形成能够拼接成所述复杂曲面外壳的至少两个曲面部件，其中至少两片所述板材的材质为玻璃、陶瓷和蓝宝石中的一种或几种；S2：对至少两个所述曲面部件分别进行表面加工处理；S3：将至少两个所述曲面部件拼接成所述复杂曲面外壳的形状，再对拼接处进行熔接处理，形成所述复杂曲面外壳。本发明还公开了一种复杂曲面外壳，由上述制备方法制得。本发明实现了玻璃、陶瓷和蓝宝石等材质的复杂3D曲面的电子产品外壳的制备工艺，不受产品结构限制，工艺适用性广。

High velocity metallic powder spray fastening

The present invention provides a low temperature joining method that is compatible with multiple materials and results in a bond between joined structures without reducing the mechanical properties of the joined structures base materials. The method of the present invention includes the steps of contacting a first structure to a second structure; and directing particles of a metallic bonding material towards an interface between the first structure and second structure at a velocity to cause the particles of the metallic bonding material form a molecular fusion between the first structure and second structure.

Glass-graphite bonding system for sodium-sulphur batteries and batteries made therefrom

TRANSPARENT ENCLOSURE ELEMENT

Die vorliegende Erfindung betrifft ein transparentes Einkapselungselement. Ein transparentes Einkapselungselement (10) aus Quarzglas wird in einer optischen Komponente (16) verwendet, die mindestens ein optisches Element (12) und eine Montageplatte (14) aufweist, auf der das optische Element (12) montiert ist, und bildet zusammen mit der Montageplatte (14) ein Gehäuse (18), in dem das optische Element (12) aufgenommen ist. Die Konzentration von Aluminium in einem Oberflächenabschnitt (22) ist höher als die Konzentration von Aluminium in einem Innenabschnitt (24). The present invention relates to a transparent encapsulation element. A transparent encapsulation element (10) made of quartz glass is used in an optical component (16) which has at least one optical element (12) and a mounting plate (14) on which the optical element (12) is mounted and forms together with the Mounting plate (14), a housing (18) in which the optical element (12) is received. The concentration of aluminum in a surface section (22) is higher than the concentration of aluminum in an inner section (24).

Joint material between a spacer and a glass substrate

在至少一个陶瓷或玻璃基间隔片(20)与玻璃基片之间的本发明连接材料(30)，其特征在于它含有与至少一种呈微粒状的金属氧化物混合的珐琅。

Bond interface for joining partly metallised glass or ceramic substrate

Borosilicate or ceramic substrate (1) with partly metallised interface side (2) is bonded to a three-dimensionally structured Si substrate (4), oxidised (3) on the interface side. The interfaces are sepd. from one another in the edge region by formation of a wedge-like opening with predetermined profile, so that each surface of the metallisation layer is a predetermined min. distance from the oxide-free surface of the Si substrate.

Sealed devices and methods for making the same

Disclosed herein are sealed devices comprising at least one cavity containing at least one quantum dot or at least one laser diode are also disclosed herein. The sealed devices can comprise a glass substrate sealed to an inorganic substrate, optionally via a sealing layer, the seal extending around the at least one cavity. Display and optical devices comprising such sealed devices are also disclosed herein, as well as methods for making such sealed devices.

PROCESS FOR THE PRODUCTION OF A CONDUCTIVE CONNECTING LAYER

METHOD OF ESTABLISHING A GAS-TIGHT CONNECTION FOR PARTS IN SILICON OR CRYSTALLINE SILICON CARBIDE

WAY TO PRODUCE GLASSED CERAMIC BUILDING MATERIALS

Method of manufacturing conductive lead layer

Multilayer sheet for interior and exterior partitions and linings

A multilayer sheet (1, 1b) for interior and exterior partitions and linings is described, comprising at least one transparent material sheet (4) enclosed between at least two opaque material sheets (2, 3), each with at least one through hole (20) coinciding with at least one through hole (30) in the other opaque material sheet (3). The opaque material sheets (2, 3) are preferably made of porcelain ceramic material, and the transparent material sheet (4) is preferably made of transparent glass ( Figure 1 ).

YAG ceramic joined body and method for producing same

一种YAG陶瓷接合体，是将YAG陶瓷与YAG陶瓷或光学玻璃接合而成的YAG陶瓷接合体，其特征在于，所述YAG陶瓷接合体具备玻璃作为接合层，透射率的变化率为7％以内。课题是提供一种接合体及其制造方法，所述接合体是将YAG陶瓷与YAG陶瓷接合而成的接合体、或者将YAG陶瓷与光学玻璃接合而成的接合体，所述接合体抑制了接合界面处的光的反射。

Direct bonding methods using lithium

Silver-glass pastes.

An improved silver-glass paste for bonding a silicon die to a ceramic substrate consisting essentially of silver flake, glass frit, resin, surfactant containing lyophilic and lyophobic groups and solvent. The surfactant provides a steric barrier around the silver and glass to stabilize the paste and reduce voiding and cracking when the paste is used to bond the die to the substrate.

Electrode with outwardly radiating arms

The electrode (1) has outwardly radiating arms (2) lying parallel to the bond plane.

Patent FR2332335B3

Joint material between a spacer and a glass substrate

A joint material for joining at least one ceramic-based or glass-based spacer to a glass substrate, including an enamel mixed with at least one metal oxide in the form of particles.

Anodic bonding process with light irradiation

Disclosed is a process and an apparatus for anodic bonding, in which Si substrate (S) and glass substrate (G) are contacted each other, a voltage is applied therebetween, and then light (Ld) is irradiated on a contact portion thereof, whereby the Si substrate and the glass substrate are bonded at a lower temperature than transition temperature of the glass substrate.

Transparent sealing member

本发明涉及透明密封构件。该透明密封构件是用于光学部件(16)的石英玻璃制的透明密封构件(10)，该光学部件(16)具有至少一个光学元件(12)和安装有所述光学元件(12)的安装基板(14)，所述透明密封构件(10)与所述安装基板(14)一起构成容纳所述光学元件(12)的封装(18)，表面部(22)的铝浓度比内部(24)的铝浓度高。

Patent JPS4962514A

Preparation technology of energy-saving and decoration integrated ceramic plate and glass fiber sheet composite material

本发明涉及建筑材料技术领域，具体涉及一种节能装饰一体化陶瓷板和玻璃纤维薄板复合材料的制备技术。所述的节能装饰一体化陶瓷板和玻璃纤维薄板复合材料的制备技术，包括以下制备步骤：将低熔点玻璃粉、空心玻璃微珠、粘度剂混合配制，得到碱性混合料，将其浸渍挤压进入玻璃纤维毡，折叠进行纤维针刺；然后在其表面喷涂碱性混合料，干燥，得到玻璃纤维薄板；将上述制得的玻璃纤维薄板两面与陶瓷板叠加，放入辊道窑进行烧结，低温退火，得到节能装饰一体化陶瓷板和玻璃纤维薄板复合材料。本发明提供一种节能装饰一体化陶瓷板和玻璃纤维薄板复合材料的制备技术，制备出超薄、节能、强度高复合材料，具有巨大的社会效益和经济效益。

Substrate ceramic laminate

FIELD: laminated products or materials.SUBSTANCE: invention relates to substrate ceramic laminates, the functional layer of which is ceramic, and concerns a part with a functional surface and its application. Part with a functional includes a substrate and a polycrystalline functional layer, wherein said functional layer includes said functional surface. Substrate and functional layer are connected to each other through an adhesion promoter. Functional layer includes a transparent ceramic, which contains Al-Mg-spinel-, AlO-, AlON-, SiAION-ceramic, ZrOor a mixed oxide ceramic from the Y-Al-Mg-O system, and the ceramic may contain up to 5 wt. % of alloying elements.EFFECT: invention provides for the creation of parts with a mechanically, chemically or thermally stable functional surface.18 cl, 1 dwg

Substrate ceramic laminate

본 발명은 기재 세라믹 라미네이트에 관한 것이다. 본 발명은 특히 세라믹 층이 기능성 층인 기재 세라믹 라미네이트에 관한 것이다. The present invention relates to a base ceramic laminate. The present invention particularly relates to a base ceramic laminate in which the ceramic layer is a functional layer.

Preparation technology of energy-saving and decoration integrated ceramic plate and glass fiber sheet composite material

本发明涉及建筑材料技术领域，具体涉及一种节能装饰一体化陶瓷板和玻璃纤维薄板复合材料的制备技术。所述的节能装饰一体化陶瓷板和玻璃纤维薄板复合材料的制备技术，包括以下制备步骤：将低熔点玻璃粉、空心玻璃微珠、粘度剂混合配制，得到碱性混合料，将其浸渍挤压进入玻璃纤维毡，折叠进行纤维针刺；然后在其表面喷涂碱性混合料，干燥，得到玻璃纤维薄板；将上述制得的玻璃纤维薄板两面与陶瓷板叠加，放入辊道窑进行烧结，低温退火，得到节能装饰一体化陶瓷板和玻璃纤维薄板复合材料。本发明提供一种节能装饰一体化陶瓷板和玻璃纤维薄板复合材料的制备技术，制备出超薄、节能、强度高复合材料，具有巨大的社会效益和经济效益。

Direct bonding methods using lithium

Methods of improving the direct bonding of articles are disclosed. Lithium can be incorporated into the composition of one of the articles and/or lithium can be added to a bonding surface by ion exhchange, absorption, ion implantation, coating, or deposition. Bonding is achieved without use of adhesives or high temperature fusion. The invention is useful for bonding a wide variety of articles together such as optical components, optical fibers and articles having different coefficients of thermal expansion or refractive indices.

Yag ceramic joined body and production method therefor

Yag陶瓷接合体及其制造方法

一种YAG陶瓷接合体，是将YAG陶瓷与YAG陶瓷或光学玻璃接合而成的YAG陶瓷接合体，其特征在于，所述YAG陶瓷接合体具备玻璃作为接合层，透射率的变化率为7％以内。课题是提供一种接合体及其制造方法，所述接合体是将YAG陶瓷与YAG陶瓷接合而成的接合体、或者将YAG陶瓷与光学玻璃接合而成的接合体，所述接合体抑制了接合界面处的光的反射。

Graphite structure with increased flexibility

An article of manufacture including a graphite sheet having a texturized surface. The article of manufacture comprises, in one embodiment, about 90 to 99 percent vermicular graphite and about 1 to 10 percent of a filler (e.g., talc or mica). The article of manufacture may also include an insert in the form of a sheet of, for example, stainless steel, polyester film, or fiberglass fabric. Also, a method including combining an article having a surface texture with a graphite sheet, and imparting the surface texture to a surface of the graphite sheet.

Leichtgewicht-Trägerstruktur, insbesondere für optische Bauteile, Verfahren zu deren Herstellung und Verwendung der Trägerstruktur

Trägerstruktur (100), insbesondere für optische Bauteile, umfassend:- einen Trägerkörper (10), der aus Keramik mit Hohlräumen (11) gebildet ist, und- mindestens eine Deckschicht (21, 22), die aus Glas gebildet und auf mindestens einer Oberfläche des Trägerkörpers (10) angeordnet ist, dadurch gekennzeichnet, dass- der Trägerkörper (10) aus SiC-Keramik gebildet ist,- die mindestens eine Oberfläche des Trägerkörpers (10) eine geschlossene Seitenwand (14) umfasst, und- die mindestens eine Deckschicht (21, 22) über mindestens eine durch anodisches Bonden hergestellte Bondverbindung (23, 24) mit der Seitenwand (14) des Trägerkörpers (10) verbunden ist.

Silica member and led device

The present invention relates to a silica member including a main body including silica glass, in which the main body has an other member-joining portion for joining to another member, in which the other member-joining portion has a base layer, an intermediate layer, and a surface layer comprising Au that are formed on the other member-joining portion in this order from the main body, and in which the base layer has a porosity of higher than or equal to 5% and lower than or equal to 10%, the intermediate layer has a porosity of higher than or equal to 4% and lower than or equal to 5%, the base layer has a thickness of larger than or equal to 20 nm and smaller than or equal to 100 nm, and the intermediate layer has a thickness of larger than or equal to 100 nm and smaller than or equal to 200 nm.

气密封装体的制造方法

本发明的技术课题在于通过发明不招致收纳于内部的构件的热劣化且可以提高元件基体与密封材料层的固着强度的方法而提高气密封装体的长期可靠性。本发明的气密封装体的制造方法，其特征在于，其具备：准备陶瓷基体、且在陶瓷基体上形成密封材料层的工序；准备玻璃基板、且使玻璃基板与陶瓷基体上的密封材料层接触的方式配置陶瓷基体和玻璃基板的工序；以及从玻璃基板侧朝着密封材料层照射激光、且隔着密封材料层将陶瓷基体和玻璃基板密封而得到气密封装体的工序。

気密パッケージの製造方法

本発明の技術的課題は、内部に収容される部材の熱劣化を招くことなく、素子基体と封着材料層の固着強度を高め得る方法を創案することにより、気密パッケージの長期信頼性を高めることである。本発明の気密パッケージの製造方法は、セラミック基体を用意すると共に、セラミック基体上に封着材料層を形成する工程と、ガラス基板を用意すると共に、ガラス基板がセラミック基体上の封着材料層に接触するように、セラミック基体とガラス基板を配置する工程と、レーザー光をガラス基板側から封着材料層に向けて照射し、封着材料層を介してセラミック基体とガラス基板を封着して、気密パッケージを得る工程と、を備えることを特徴とする。

기밀 패키지의 제조 방법

본 발명의 기술적 과제는 내부에 수용되는 부재의 열화를 초래하지 않고 소자 기체와 실링 재료층의 고착 강도를 높일 수 있는 방법을 창안함으로써, 기밀 패키지의 장기 신뢰성을 높이는 것이다. 본 발명의 기밀 패키지의 제조 방법은 세라믹 기체를 준비함과 아울러 세라믹 기체 상에 실링 재료층을 형성하는 공정과, 유리 기판을 준비함과 아울러 유리 기판이 세라믹 기체 상의 실링 재료층에 접촉하도록 세라믹 기체와 유리 기판을 배치하는 공정과, 레이저 광을 유리 기판측으로부터 실링 재료층을 향하여 조사해서, 실링 재료층을 통하여 세라믹 기체와 유리 기판을 실링하여 기밀 패키지를 얻는 공정을 구비하는 것을 특징으로 한다.

気密パッケージの製造方法

光学部品の接合方法

【課題】光学部品と支持部品とを接合する場合に、光学部品の熱除去のために、異種材料の光学部品と支持部品とを強い接合力で接合させ、かつ、熱除去を効率よく行うことができるようにする。【解決手段】石英ガラスからなる光学部品１０と、セラミックスからなる支持部品１５とを接合させる方法であり、支持部品１５表面に無電解メッキで金属層１６０を形成する工程と、形成された金属層を研磨パッド３５２で研磨し支持部品１５表面に第１平滑面１６１ａを形成する工程と、光学部品１０表面を研磨パッド３５２で研磨し第２平滑面１０ａを形成する工程と、超音波洗浄水で第１平滑面１６１ａと第２平滑面１０ａとを洗浄する工程と、真空室内で、第１平滑面１６１ａに蒸着で第１金属膜１７を形成し、第２平滑面１０ａに蒸着で第２金属膜１１を形成する工程と、第１金属膜１７と第２金属膜１１とを接触させた面間の原子拡散により原子間接合させる工程と、を備える接合方法。【選択図】図１１

Vacuum vessel

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Preparation method for an electronic device housing

Verfahren zur Herstellung von aus Glas und keramischen Werkstuecken bestehenden Geraeten

玻璃、氧化铝陶瓷-玻璃结构件及制备方法与应用

本发明涉及玻璃制造及氧化铝陶瓷连接技术领域，公开了玻璃、氧化铝陶瓷‑玻璃结构件及制备方法与应用。本发明提供的玻璃，以所述玻璃的总重为基准，以氧化物计，其化学组成包括：氧化钠8‑15wt％、氧化硼10‑15wt％、氧化硅60‑80wt％、氧化锂0‑5wt％、氧化铝0‑5wt％、氧化镁2‑5wt％和氧化钙1‑5％；其中，(氧化钠+氧化锂)的总重量含量≤18wt％，(氧化硅+氧化硼)的总重量含量为75‑85wt％，(氧化钠+氧化锂+氧化钙)：(氧化镁+氧化硼+氧化铝)的重量比为0.7‑1.4。该玻璃具有优异连接性能，与氧化铝陶瓷结构件连接处具有较高机械强度，该玻璃的线性热膨胀系数与氧化铝陶瓷接近，可降低熔接后降温过程中开裂风险，同时该玻璃的透光率≥90％，可满足氧化铝‑玻璃结构件中可视化或光信号传输的需求。

Composite structure for microlithography and optical arrangement

The invention relates to a composite structure for microlithography, in particular a holding device for a wafer (11), comprising two or more components (17a to 17e), the surfaces whereof are bonded together at least at one bond. At least one of the components (17a to 17e) consists of cordierite (Mg2Al4Si5O18) or of silicon carbide (SiC). The invention also relates to an optical arrangement, in particular a projection illumination apparatus for microlithography, comprising at least one such composite structure, preferably a wafer stage (12' ).

Composite body

接合体の製造方法及び接合体の製造装置

接合体の製造方法及び接合体の製造装置

【課題】ガラス部材及び接合対象部材に対する接合材の全体にわたる密着性を高めることを可能にした接合体の製造方法及び接合体の製造装置を提供する。【解決手段】接合体の製造方法は、治具本体２０の凹部２２内に積層体１６を配置した治具本体２０上に治具本体用蓋体２１を載置する載置工程と、載置工程の後、治具本体２０の凹部２２内の圧力雰囲気を調整することで、治具本体用蓋体２１により積層体１６を押圧する押圧工程を備える。接合体の製造方法は、押圧工程により積層体１６を押圧した状態でガラス部材１２と接合対象部材１３とに接合した接合部を積層体１６の接合材１５から形成する接合部形成工程を備える。【選択図】図６

图像生成装置、包括这样的装置的平视显示器和用于制造图像生成装置的方法

一种图像生成装置，包括产生光束的光源和由光束穿过的屏幕(5)，该屏幕被设计成用于改变光束以便形成图像。屏幕(5)包括透明元件(150)，该透明元件由光束横穿并设计成移除在屏幕(5)的水平处生成的热量。所述透明元件(150)由烧结的透明陶瓷制成。还描述了包括这样的装置的平视显示器，以及用于制造图像生成装置的方法。

Joined body production method and joined body production device

Disclosed is a method for manufacturing a bonded body that includes a glass member, a bonding subject member, and a bonding portion bonded to the glass member and the bonding subject member. The method includes a setting step, a pressing step, and a bonding portion formation step. The setting step is a step of setting a jig main body lid on a jig main body in a state in which a stack is disposed in a recess of the jig main body. The pressing step is a step of adjusting an atmospheric pressure in the recess of the jig main body after the setting step to press the stack with the jig main body lid. The bonding portion formation step is a step of forming the bonding portion from a bonding material included in the stack in a state in which the stack is pressed in the pressing step.

Silica member and led device

The present invention relates to a silica member characterized in that the silica member is equipped with a body section comprising a silica glass, the body section is equipped with an other member joining section for another member, the other member joining section is provided with, in order from the body section side, an underlayer, an intermediate layer, and a surface layer formed from Au, the porosity of the underlayer is within the range of 5-10%, the porosity of the intermediate layer is within the range of 4-5%, the thickness of the underlayer is within the range of 20-100 nm, and the thickness of the intermediate layer is within the range of 100-200 nm.

複合基板および複合基板を用いた機能デバイス、並びに複合基板および機能デバイスの製造方法

【課題】接合される２つの基板の間の接合部における強度が強い複合基板を提供する。【解決手段】複合基板（１）は、機能素子が設けられる第１基板（２）と、第１基板（２）に融着により接合されたガラスセラミック焼結体からなる第２基板（３）とを有する。第１基板（２）と第２基板（３）との界面には、結晶化したガラスが存在する。【選択図】図１

电子器件制造方法、封装制造方法、电子器件和电子设备

本发明提供电子器件制造方法、封装制造方法、电子器件和电子设备。本发明的封装的制造方法包括以下的工序：准备设置低熔点玻璃（270）的底座基板（210）和盖（259）；在减压环境下将低熔点玻璃（270）加热到流动点以上，使低熔点玻璃（270）消泡；在利用低熔点玻璃（270）使底座基板（210）以及盖（250）重合之后，在减压环境下将低熔点玻璃（270）加热到流动点以上，接合底座基板（210）以及盖（250）。

Joining method for optical part

A method for joining an optical part made of quartz glass and a supporting part made of ceramic includes forming a metal layer on a surface of the supporting part by electroless plating, polishing the formed metal layer with a polishing pad to form a first smoothed face on the supporting part surface, polishing a surface of the optical part with the polishing pad to form a second smoothed face, cleaning the first smoothed face and the second smoothed face with ultrasonic cleaning water, forming a first metal film on the first smoothed face by vapor deposition and forming a second metal film on the second smoothed face by vapor deposition, and joining the first metal film and the second metal film to each other by interatomic joining by atomic diffusion between the faces at which the first metal film and the second metal film contact with each other.

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電子機器ケース及びその製造方法、並びに電子機器

本発明は、電子機器ケース及びその製造方法、並びに電子機器を開示し、該ケースは、底板及び中枠を含み、中枠が底板に接続され、中枠の材質がガラスで、底板の材質がサファイアであり、又は、底板の材質がガラスで、中枠の材質がサファイアであり、底板と中枠との間が界面なく連続して接続される。

전자 디바이스 하우징, 그 준비 방법, 및 전자 디바이스

전자 디바이스 하우징, 그 준비 방법, 및 전자 디바이스. 하우징은 바닥판 및 중간 프레임을 포함하고, 중간 프레임은 바닥판에 접속되며, 중간 프레임의 재료는 플라스틱이고, 바닥판의 재료는 사파이어이다; 그렇지 않으면, 바닥판의 재료는 유리이고, 중간 프레임의 재료는 사파이어이다. 바닥판과 중간 프레임은 그 사이에 계면없는 연속 접속을 갖는다.

전자 디바이스 하우징, 그 준비 방법, 및 전자 디바이스

전자 디바이스 하우징, 그 준비 방법, 및 전자 디바이스. 하우징은 바닥판 및 중간 프레임을 포함하고, 중간 프레임은 바닥판에 접속되며, 중간 프레임의 재료는 플라스틱이고, 바닥판의 재료는 사파이어이다; 그렇지 않으면, 바닥판의 재료는 유리이고, 중간 프레임의 재료는 사파이어이다. 바닥판과 중간 프레임은 그 사이에 계면없는 연속 접속을 갖는다.

電子機器ケース及びその製造方法、並びに電子機器

Electronic device housing, manufacturing method thereof, and electronic device

An electronic device housing, a manufacturing method thereof, and an electronic device are provided. The housing includes a bottom plate, and a middle frame connected to the bottom plate. The middle frame is made of glass, and the bottom plate is made of sapphire; or the bottom plate is made of glass, and the middle frame is made of sapphire. An interface-free continuous connection is provided between the bottom plate and the middle frame.

Electronic device housing, preparation method therefor and electronic device

一种陶瓷玻璃结合的高脚杯及其容器部和杯脚部的黏结方法

本发明属于玻璃高脚杯领域，一种陶瓷玻璃结合的高脚杯及其容器部和杯脚部的黏结方法。一种陶瓷玻璃结合的高脚杯，包括透明的玻璃材质的容器部和陶瓷材质的杯脚部。一种陶瓷玻璃结合的高脚杯的容器部和杯脚部的黏结方法，包括步骤注浆、烧结成型、开凹洞、黏结和胶水固化。钻凹洞与容器部的接触面积的增大，增加粘合的表面积，使得杯脚部与容器部粘接的更加牢固，并且胶水会渗入到杯脚部的放射状的孔隙之间，使得杯脚部与容器部粘结的强度有极大的提高。

Aus Porzellan und Glas bestehende Gefaesse, Geraete u. dgl. und Verfahren zur Herstellung von solchen

Verfahren zur Vereinigung keramischer Massen mit Glaesern

Keramische Erzeugnisse

Mit Glas verschmelzbarer keramischer Koerper

Joined body production method and joined body production device

Disclosed is a method for manufacturing a bonded body that includes a glass member, a bonding subject member, and a bonding portion bonded to the glass member and the bonding subject member. The method includes a setting step, a pressing step, and a bonding portion formation step. The setting step is a step of setting a jig main body lid on a jig main body in a state in which a stack is disposed in a recess of the jig main body. The pressing step is a step of adjusting an atmospheric pressure in the recess of the jig main body after the setting step to press the stack with the jig main body lid. The bonding portion formation step is a step of forming the bonding portion from a bonding material included in the stack in a state in which the stack is pressed in the pressing step.

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Masse de soudure par fusion, en particulier pour récipients à décharge

Vakuumdichte Stromdurchfuehrung mit hoher Leitfaehigkeit bei Hochfrequenz

Verfahren zur Herstellung hochvakuumdichter Verbindungen durch Verschmelzen von Glasteilen und keramischen Formstuecken

电子器件制造方法、封装制造方法、电子器件和电子设备

本发明提供电子器件制造方法、封装制造方法、电子器件和电子设备。本发明的封装的制造方法包括以下的工序：准备设置低熔点玻璃（270）的底座基板（210）和盖（259）；在减压环境下将低熔点玻璃（270）加热到流动点以上，使低熔点玻璃（270）消泡；在利用低熔点玻璃（270）使底座基板（210）以及盖（250）重合之后，在减压环境下将低熔点玻璃（270）加热到流动点以上，接合底座基板（210）以及盖（250）。

Composite structure for microlithography and optical arrangement

The invention relates to a composite structure for microlithography, in particular a holding device for a wafer (11), comprising two or more components (17a to 17e), the surfaces whereof are bonded together at least at one bond. At least one of the components (17a to 17e) consists of cordierite (Mg2Al4Si5O18) or of silicon carbide (SiC). The invention also relates to an optical arrangement, in particular a projection illumination apparatus for microlithography, comprising at least one such composite structure, preferably a wafer stage (12' ).

Composite structure for microlithography and optical arrangement

The invention relates to a composite structure for microlithography, in particular a holding device for a wafer (11), comprising two or more components (17a to 17e), the surfaces whereof are bonded together at least at one bond. At least one of the components (17a to 17e) consists of cordierite (Mg2Al4Si5O18) or of silicon carbide (SiC). The invention also relates to an optical arrangement, in particular a projection illumination apparatus for microlithography, comprising at least one such composite structure, preferably a wafer stage (12' ).

접합체의 제조 방법 및 접합체의 제조 장치

접합체의 제조 방법은, 지그(jig) 본체(20)의 오목부(22) 내에 적층체(16)를 배치한 지그 본체(20) 상에 지그 본체용 덮개체(21)를 올려놓는 재치(載置) 공정과, 재치 공정 후에, 지그 본체(20)의 오목부(22) 내의 압력 분위기를 조정함으로써, 지그 본체용 덮개체(21)에 의해 적층체(16)를 가압하는 가압 공정을 구비한다. 접합체의 제조 방법은, 가압 공정에 의해 적층체(16)를 가압한 상태에서 유리 부재(12)와 접합 대상 부재(13)에 접합한 접합부를 적층체(16)의 접합재(15)로 부터 형성하는 접합부 형성 공정을 구비한다.

烹饪用非金属加热装置

本发明公开了一种非金属加热装置，包括壶体和底座，所述壶体由割底的非金属壶体和非金属板组成，所述割底的非金属壶体与非金属板通过玻璃粉涂料成型为一体结构；所述非金属板的底部设有加热装置。采用本发明，加热装置的本体实现全非金属制作，能同时解决成本较低、寿命长、安全、可量产、清洗容易等问题。

Verfahren zur Vereinigung keramischer Massen mit Glaesern

Schmelzmasse zur Verbindung von aus Eisen oder legierten Staehlen bestehenden Teilen elektrischer Entladungsgefaesse mit Teilen aus Glas oder Keramik

Process for producing a watch-glass

Verfahren für anodische bindung mit lichtstrahlung

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실리카 부재 및 led 장치

본 발명은 실리카 유리로 이루어지는 본체부를 구비하고, 상기 본체부는 타부재에 대한 타부재 접합부를 구비하고, 상기 타부재 접합부에는, 상기 본체부의 측으로부터 순서대로, 하지층, 중간층 및, Au로 이루어지는 표면층이 형성되고, 상기 하지층의 공극률이 5％ 이상 10％ 이하의 범위 내이고, 상기 중간층의 공극률이 4％ 이상 5％ 이하의 범위 내이고, 또한, 상기 하지층의 두께가 20㎚ 이상 100㎚ 이하의 범위 내이고, 상기 중간층의 두께가 100㎚ 이상 200㎚ 이하의 범위 내인 것을 특징으로 하는 실리카 부재에 관한 것이다.

接合体的制造方法和接合体的制造装置

接合体的制造方法具备下述工序：载置工序，在治具主体(20)的凹部(22)内将治具主体用盖体(21)载置在配置有层积体(16)的治具主体(20)上；以及按压工序，在载置工序后，通过调整治具主体(20)的凹部(22)内的压力气氛而利用治具主体用盖体(21)按压层积体(16)。接合体的制造方法具备接合部形成工序，在通过按压工序对层积体(16)进行了按压的状态下，由层积体(16)的接合材(15)形成与玻璃部件(12)和接合对象部件(13)接合的接合部。

zwischen keramischen Koerpern und Glas

Ｙａｇセラミックス接合体及びその製造方法

Perfectionnements aux procédés d'établissement de soudures étanches entre pièces de verre ou de matières céramiques glacées

Verfahren zum Verschmelzen von vorzugsweise gesinterten Werkstuecken aus Aluminiumoxyd mit Glas

一种提高碳/碳‑锂铝硅接头剪切性能的方法

本发明涉及一种提高碳/碳‑锂铝硅接头剪切性能的方法，首先利用可控氧化的方法在硅基陶瓷改性层表面构造一种蜂窝状多孔结构，然后使玻璃中间层在热压过程中与改性层形成交错咬合的镶嵌界面结构。本发明通过镶嵌界面结构的设计，显著地提高了改性层与玻璃中间层的有效连接面积，一定程度上解决了界面弱结合的问题。通过该方法制备的C/C‑LAS接头，平均剪切强度达到32.46±1.35MPa，相比专利1的梯度接头提高了35％。通过构建镶嵌界面结构，增加了改性层与中间层的有效连接面积，一定程度上解决了界面弱结合的问题，显著提高了C/C‑LAS接头的剪切强度。

메탈라이징 페이스트 및 그 제조방법

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