09-05-2013 дата публикации
Номер: US20130115472A1
The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board. 1. A halogen-free resin composition , comprising:(A) 100 parts by weight of cyanate ester resin;(B) 5 to 50 parts by weight of styrene-maleic anhydride (SMA);(C) 5 to 100 parts by weight of polyphenylene oxide (PPO) resin;(D) 10 to 150 parts by weight of phosphazene; and(E) 10 to 1000 parts by weight of inorganic filler.4. The halogen-free resin composition according to claim 1 , further comprising maleimide claim 1 , which comprises at least one selected from a group consisting of 4 claim 1 ,4′-diphenylmethane bismaleimide claim 1 , oligomer of phenylmethane maleimide claim 1 , m-phenylenebismaleimide claim 1 , bisphenol A diphenyl ether bismaleimide claim 1 , 3 claim 1 ,3′-dimethyl-5 claim 1 ,5′-diethyl-4 claim 1 ,4′-diphenylmethane bismaleimide claim 1 , 4-methyl-1 claim 1 ,3-phenylene bismaleimide claim 1 , and 1 claim 1 ,6-bismaleimide-(2 claim 1 ,2 claim 1 ,4-trimethyl) hexane.5. The halogen-free resin composition according to claim 1 , wherein the inorganic filler includes at least one selected from a group consisting of silica (fused claim 1 , non-fused claim 1 , porous claim 1 , or hollow) claim 1 , aluminum oxide claim 1 , aluminum hydroxide claim 1 , magnesium oxide claim 1 , magnesium hydroxide claim 1 , calcium carbonate claim 1 , aluminum nitride claim 1 , boron nitride claim 1 , aluminum silicon carbide claim 1 , silicon carbide ...
Подробнее