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24-03-2022 дата публикации

SOLDER PASTE

Номер: US20220088725A1

Автор: KAWAMATA Yuji, KAWASAKI Hiroyoshi, SHIRATORI Masato

Принадлежит:

A solder paste contains a flux and a metal powder, wherein the flux contains: 0.5% by mass to 20.0% by mass of a (carboxyalkyl)isocyanurate adduct; 5.0% by mass to 45.0% by mass of a rosin; and a solvent. The (carboxyalkyl)isocyanurate adduct is at least one selected from the group consisting of mono(carboxyalkyl)isocyanurate adducts, bis(carboxyalkyl)isocyanurate adducts and tris(carboxyalkyl)isocyanurate adducts. 5. The solder paste according to claim 1 , wherein the alloy constitution further comprises at least one selected from the group consisting of 0% by mass to 4% by mass of Ag and 0% by mass to 0.9% by mass of Cu.6. The solder paste according to claim 1 , wherein the flux further comprises a resin.7. The solder paste according to claim 6 , wherein the resin is a rosin.8. The solder paste according to claim 1 , wherein an amount of the (carboxyalkyl)isocyanurate adduct claim 1 , relative to a total mass of the flux claim 1 , is 0.5% by mass to 20.0% by mass.9. The solder paste according to claim 1 , wherein the (carboxyalkyl)isocyanurate adduct is at least one selected from the group consisting of mono(carboxyalkyl)isocyanurate adducts claim 1 , bis(carboxyalkyl)isocyanurate adducts and tris(carboxyalkyl)isocyanurate adducts.10. The solder paste according to claim 9 , where the tris(carboxyalkyl)isocyanurate adducts are a tris(2-carboxyethyl)isocyanurate claim 9 , a tris(1-carboxymethyl)isocyanurate claim 9 , and a tris(3-carboxypropyl)isocyanurate and one of the bis(carboxyalkyl)isocyanurate adducts is a bis(2-carboxyethyl)isocyanurate.11. The solder paste according claim 1 , whereinthe flux comprises, relative to a total mass of the flux, 0.5% by mass to 20.0% by mass of the (carboxyalkyl)isocyanurate adduct, 5.0% by mass to 50.0% by mass of a rosin, and a solvent.15. The solder paste according to claim 11 , wherein the alloy constitution further comprises at least one selected from the group consisting of 0% by mass to 4% by mass of Ag and 0% by mass to 0 ...

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Номер записи: 79

16-03-2017 дата публикации

FLUX FOR BRAZING

Номер: US20170072515A1

Автор: Becker Andreas, SESEKE-KOYRO Ulrich

Принадлежит:

The invention concerns a flux for brazing, a process for brazing metal parts employing said flux, a flux composition containing said flux, aluminum parts coated with said flux or said flux composition, a process for brazing and a brazed metal object obtainable by said brazing process. The flux is high in KAlFand low in KAlF. 1. A flux comprising a fundamental flux , wherein the fundamental flux comprises from 80 mol % to 100 mol % KAlF , the content of KAlFin the flux is equal to or lower than 2 mol % including 0 mol % , the content of free KF in the flux is lower than 0.2% by weight including 0% by weight , and wherein the flux further comprises from 0.1 to 20 weight % relative to the total weight of the flux of at least one additive salt , wherein the at least one additive salt comprises at least one anion selected from the group consisting of F , CO , O , nitrate , phosphate , borate , metaborate and oxalate , and at least one cation selected from the group consisting of earth alkali metal cations.2. The flux according to wherein the at least one additive salt is selected from the group consisting of CaF claim 1 , BeF claim 1 , MgF claim 1 , BaF claim 1 , SrF claim 1 , CaO claim 1 , BeO claim 1 , MgO claim 1 , BaO claim 1 , SrO claim 1 , CaCO claim 1 , BeCO claim 1 , MgCO claim 1 , BaCO claim 1 , and SrCO.3. The flux according to wherein the at least one additive salt is selected from the group consisting of CaF claim 2 , BeF claim 2 , MgF claim 2 , BaFand SrF.4. The flux according to claim 1 , wherein the fundamental flux comprises one or more components selected from the group consisting of KAlF claim 1 , KAlF claim 1 , potassium fluorozincates claim 1 , cesium fluoroaluminates claim 1 , potassium fluorostannates and cesium fluorostannates claim 1 , and hydrates wherein the one or more components are comprised in the fundamental flux from 0 to 20 mol % claim 1 , adding up with the content of KAlFto 100 mol %.5. The flux according to claim 1 , wherein the flux ...

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Номер записи: 80

18-03-2021 дата публикации

FLUX AND SOLDER PASTE

Номер: US20210078113A1

Автор: Kawanago Tomohisa, NISHIZAKI Takahiro

Принадлежит:

Provided is a flux capable of obtaining predetermined rheological characteristics both at room temperature and under a thermal history that is assumed for soldering and capable of suppressing the amount of a residue after soldering to realize a low residue. The flux contains a first alcohol compound that has two or more OH groups and has a melting point of lower than 25° C. and a second alcohol compound that has two or more OH groups and has a melting point of higher than 25° C., the first alcohol compound is glycerin, the second alcohol compound is 2,5-dimethylhexane-2,5-diol, the flux has a viscosity of 10 Pa·s or more and 50 Pa·s or less at 25° C. and has a viscosity of more than 0 Pa·s and 1 Pa·s or less at 100° C., and, in a case where 10 mg of the flux is heated up to 25° C. to 250° C. under a Natmosphere at a temperature rise rate of 10° C./min, the weight of the flux after heating is 15% or less of the weight of the flux before heating. 1. A flux containing alcohol compounds that has two or more OH groups , the flux comprising:a first alcohol compound that has two or more OH groups and has a melting point of lower than 25° C.; anda second alcohol compound that has two or more OH groups and has a melting point of higher than 25° C.,wherein the first alcohol compound is glycerin, the second alcohol compound is 2,5-dimethylhexane-2,5-diol, and{'sub': '2', 'in a case where 10 mg of the flux having a viscosity of 10 Pa·s or more and 50 Pa·s or less at 25° C. and a viscosity of more than 0 Pa·s and 1 Pa·s or less at 100° C. is heated up to 25° C. to 250° C. under a Natmosphere at a temperature rise rate of 10° C./min, a weight of the flux after heating is 15% or less of the weight of the flux before heating.'}2. The flux according to claim 1 ,{'sub': '2', 'wherein, in a case where 10 mg of the flux is heated up to 25° C. to 250° C. under the Natmosphere at a temperature rise rate of 10° C./min, the weight of the flux after heating is 5% or less of the weight of ...

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Номер записи: 81

18-03-2021 дата публикации

FLUX FOR BRAZING

Номер: US20210078114A1

Автор: Becker Andreas, SESEKE-KOYRO Ulrich

Принадлежит:

The invention concerns a flux for brazing, a process for brazing metal parts employing said flux, a flux composition containing said flux, aluminum parts coated with said flux or said flux composition, a process for brazing and a brazed metal object obtainable by said brazing process. The flux is high in KAlFand low in KAlF. 1. A flux comprising a fundamental flux , wherein the fundamental flux comprises from 80 mol % to 100 mol % KAlF , the content of KAlFin the flux is equal to or lower than 2 mol % including 0 mol % , the content of free KF in the flux is lower than 0.2% by weight including 0% by weight , and wherein the flux further comprises from 0.1 to 20 weight % relative to the total weight of the flux of at least one additive salt , wherein the at least one additive salt comprises at least one anion selected from the group consisting of F , CO , O , nitrate , phosphate , borate , metaborate and oxalate , and at least one cation selected from the group consisting of earth alkali metal cations.2. The flux according to wherein the at least one additive salt is selected from the group consisting of CaF claim 1 , BeF claim 1 , MgF claim 1 , BaF claim 1 , SrF claim 1 , CaO claim 1 , BeO claim 1 , MgO claim 1 , BaO claim 1 , SrO claim 1 , CaCO claim 1 , BeCO claim 1 , MgCO claim 1 , BaCO claim 1 , and SrCO.3. The flux according to wherein the at least one additive salt is selected from the group consisting of CaF claim 2 , BeF claim 2 , MgF claim 2 , BaFand SrF.4. The flux according to claim 1 , wherein the fundamental flux comprises one or more components selected from the group consisting of KAlF claim 1 , KAlF claim 1 , potassium fluorozincates claim 1 , cesium fluoroaluminates claim 1 , potassium fluorostannates and cesium fluorostannates claim 1 , and hydrates wherein the one or more components are comprised in the fundamental flux from 0 to 20 mol % claim 1 , adding up with the content of KAlFto 100 mol %.5. The flux according to claim 1 , wherein the flux ...

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Номер записи: 82

12-06-2014 дата публикации

Flux

Номер: US20140158254A1

Автор: Minakuchi Daisuke, Sugiuran Tatsuya

Принадлежит: SENJU METAL LNDUSTRY CO., LTD.

To provide a flux that can suppress occurrence of migration surely in a soldered portion on which flux residue is formed. 1. A flux that forms solder paste by mixing the flux with solder powders wherein the flux contains phosphonate ester with an amount thereof such that a hydrophobic film is formed , the phosphonate ester being adsorbed to a surface of a soldered portion during soldering.2. The flux according to characterized in that the phosphonate ester of not less than 1 mass % through less than 30 mass % is contained.3. The flux according to characterized in that the phosphonate ester is diethyl benzylphosphonate claim 1 , diethyl allylphosphonate claim 1 , diethyl (p-methylbenzyl) phosphonate or (2-ethylhexyl)-2-ethylhexyl phosphonate.4. The flux according to characterized in that the phosphonate ester is diethyl benzylphosphonate claim 2 , diethyl allylphosphonate claim 2 , diethyl (p-methylbenzyl) phosphonate or (2-ethylhexyl)-2-ethylhexyl phosphonate. The present invention relates to a flux to be mixed with solder powders and it particularly relates to a flux having an effect of preventing a migration from occurring after soldering.Electrodes have been formed in accordance with terminals of leads or the like of electronic components on a substrate such as a printed circuit board on which the electronic components are mounted. Fixation and electric connection of the electronic components and the substrate has been made largely by soldering. In such a substrate, an ion (or electrochemical) migration may occur on a soldered portion of the terminals of the electronic components and the electrodes of the substrate due to any causes such as water droplets adhered to the electrodes through which direct voltage is applied.The ion migration (hereinafter, referred to as “migration”) is such a phenomenon that metal ions dissolved from an anode transfer electrons in a cathode, between the electrodes through which direct voltage is applied, and reduced metal grows from ...

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Номер записи: 83

22-03-2018 дата публикации

BRAZE GEL, BRAZING PROCESS, AND BRAZING ARTICLE

Номер: US20180080336A1

Автор: LIN Dechao

Принадлежит:

A braze gel includes a braze powder, a braze binder, and a viscosity reducer. The braze gel has a gel viscosity sufficiently low to permit dip coating of a component with the braze gel to apply a braze coating of the braze gel to the component. A brazing process includes applying the braze gel to a portion of a component. The brazing process also includes drying the braze gel to form a braze coating on the component to form a braze-coated component. A brazing article includes a component and a braze coating over a portion of the component. The component may have structural features having a spacing of less than about 5 mm and a depth of at least about 1 mm, which may be honeycomb cells. The component may be a turbine component. 1. (canceled)2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. A process comprising:applying a braze gel having a gel viscosity to a portion of a component comprising an end of the component, the braze gel comprising a braze powder, a braze binder, and a viscosity reducer;drying the braze gel to form a braze coating on the portion of the component to form a braze-coated component comprising the component and the braze coating; andheating the braze coating to a brazing temperature to braze the end of the braze-coated component to a backing member;wherein the gel viscosity is lower than a paste viscosity of a braze paste comprising the braze powder and the braze binder with no viscosity reducer, the gel viscosity permitting dip coating of the component with the braze gel.8. The process of further comprising combining the braze powder claim 7 , the braze binder claim 7 , and the viscosity reducer to form the braze gel having the gel viscosity such that the viscosity reducer reduces the gel viscosity of the braze gel to permit dip coating of the component with the braze gel to apply the braze coating of the braze gel to the portion of the component.9. (canceled)10. The process of claim 9 , wherein the brazing temperature is in ...

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Номер записи: 84

31-03-2022 дата публикации

SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE

Номер: US20220097181A1

Автор: Ichikawa Daigo, Shimoishi Ryutaro, Sugiyama Isao

Принадлежит:

A solder composition of the invention contains: a flux composition containing (A) a rosin resin, (B) an activator, (C) an imidazoline compound having a phenyl group, and (D) an antioxidant; and (E) solder powder, in which the (B) component contains (B1) an organic acid, the (B1) component contains at least one selected from the group consisting of (B11) 1-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, and 1,4-dihydroxy-2-naphthoic acid, and the (C) component is at least one selected from the group consisting of 2-phenylimidazoline and 2-benzylimidazoline. 1. A solder composition comprising:a flux composition comprising (A) a rosin resin, (B) an activator, (C) an imidazoline compound comprising a phenyl group, and (D) an antioxidant; and(E) solder powder, whereinthe (B) component comprises (B1) an organic acid,the (B1) component comprises at least one selected from the group consisting of (B111) 1-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, and 1,4-dihydroxy-2-naphthoic acid, andthe (C) component is at least one selected from the group consisting of 2-phenylimidazoline and 2-benzylimidazoline.2. The solder composition according to claim 1 , wherein the (B1) component comprises at least one selected from the group consisting of (B12) succinic acid and glutaric acid.3. The solder composition according to claim 1 , wherein the (B1) component comprises at least one selected from the group consisting of (B13) sebacic acid and eicosanedioic acid.4. The solder composition according to claim 1 , wherein the (D) component comprises at least one selected from the group consisting of a hindered phenol compound claim 1 , 3 claim 1 ,3′-thiodipropionic acid didodecyl claim 1 , and 1 claim 1 ,2 claim 1 ,3-benzotriazole.5. The solder composition according to claim 4 , wherein the hindered phenol compound is at least one selected from the group consisting of pentaerythritol tetrakis[3-(3 claim 4 ,5-di-tert-butyl-4-hydroxyphenyl)propionate] claim 4 , bis[3-(3-tert- ...

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Номер записи: 85

23-03-2017 дата публикации

Alloy surface activation by immersion in aqueous acid solution

Номер: US20170081767A1

Автор: Arthur Heuer, Frank Ernst, Harold Kahn, ZHEN Li

Принадлежит: CASE WESTERN RESERVE UNIVERSITY

A process for surface activation or depassivation of an article, in particular an alloy, by immersion of the alloy in an aqueous acid solution. The surface activation methods of the present invention can be performed during a relatively short period of time and achieve reductions in production costs and provide environmental friendliness as compared to prior art processes. In a further embodiment, after surface activation, the article is immersed in a second liquid that prevents re-formation of a passivating oxide layer on the surface of the article. In a further embodiment the surface-activated alloys are subjected to surface engineering by a process that infuses carbon or nitrogen through the surface at a temperature sufficiently low to suppress precipitation of carbides or nitrides.

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Номер записи: 86

25-03-2021 дата публикации

Flux and Solder Material

Номер: US20210086317A1

Автор: Uchida Noriyoshi, Yukikata Kazuhiro

Принадлежит: KOKI COMPANY LIMITED

An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton. 1. A flux comprising:an iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule,wherein the ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, andan iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.2. The flux according to claim 1 , wherein the ring skeleton is a 5-membered ring or a 6-membered ring.3. The flux according to claim 1 , wherein the ring of the ring skeleton includes a carbon atom claim 1 , and a nitrogen atom or an oxygen atom.4. The flux according to claim 1 , wherein the ring skeleton is one selected from the group consisting of cyclohexane claim 1 , benzene claim 1 , pyridine claim 1 , imidazole claim 1 , hydantoin claim 1 , furan claim 1 , naphthalene claim 1 , and quinoline skeletons.5. The flux according to claim 1 , comprising the iodine-containing cyclic compound in an amount of 0.1% by mass or more and 5.0% by mass or less.6. The flux according to claim 1 , comprising an activator in an amount of 0.5% by mass or more and 20% by mass or less.7. A solder material comprising the flux according to and a solder alloy. The present invention relates to a flux and a solder material containing the flux.Solder used for joining electronic parts, for example, is composed of a solder material containing a solder alloy and flux. The flux is formulated to improve solderability and contains multiple components such as resin, activator, solvent, ...

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Номер записи: 87

02-04-2015 дата публикации

SOLDERING FLUX AND SOLDER PASTE COMPOSITION

Номер: US20150090366A1

Автор: ARAI Masaya, KITAMURA Akira, SEINO Momoko, Tsuchiya Masahiro

Принадлежит: TAMURA CORPORATION

A soldering flux includes a base resin, an activator, and a solvent. The activator contains an acrylic resin having an acid value of not more than 50 mg KOH/g and represented by a general formula (1). 2. The soldering flux according to claim 1 , wherein a weight average molecular weight of the acrylic resin having an acid value of not more than 50 mg KOH/g and represented by the general formula (1) is not more than 50 claim 1 ,000.3. The soldering flux according to claim 1 , wherein a compounding amount of the acrylic resin having an acid value of not more than 50 mg KOH/g and represented by the general formula (1) is from 5% by weight to 50% by weight based on a total amount of the soldering flux claim 1 , and a compounding amount of the activator is from 5% by weight to 50% by weight based on the total amount of the soldering flux.4. The soldering flux according to claim 1 , wherein the compound having a carboxyl group in a cyclohexyl skeleton and represented by the general formula (2) is at least one of a rosin compound (abietic acid claim 1 , abietic acid isomer claim 1 , abietic acid claim 1 , or a derivative of abietic acid isomer) and cyclohexanedicarboxylic acid. The present application claims priority under 35 U.S.C. §119 to Japanese Patent Application No. 2013-203068, filed Sep. 30, 2013. The contents of this application are incorporated herein by reference in their entirety.1. Field of the InventionThe present invention relates to a soldering flux and a solder paste composition.2. Description of the Related ArtIn general, a solder paste composition used when electronic components are mounted on a substrate is produced by mixing a soldering flux with a solder alloy powder. When soldering is performed using the solder paste composition, a portion of the soldering flux tends to remain as flux residue near a solder joint on the substrate.In general, the above soldering flux contains a base resin, an activator, and a solvent. As the base resin, rosin has been ...

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Номер записи: 88

02-04-2015 дата публикации

FLUX FOR SOLDERING AND SOLDER PASTE COMPOSITION

Номер: US20150090367A1

Автор: ARAI Masaya, KITAMURA Akira, SEINO Momoko, Tsuchiya Masahiro

Принадлежит: TAMURA CORPORATION

A flux for soldering includes a base resin, a solvent, and an activating agent. The base resin contains a rosin. An amount of the rosin to be incorporated is from 0% by weight to 30% by weight with respect to a total amount of the base resin. The activating agent includes a compound having a plurality of carboxyl groups on a cyclohexyl structure represented by a general formula (1). 2. The flux for soldering according to claim 1 , wherein an amount of the compound to be incorporated having a plurality of carboxyl groups on a cyclohexyl structure represented by the general formula (1) is of 0.5% by weight or more with respect to a total amount of the flux for soldering.3. The flux for soldering according to claim 1 , wherein the compound having a plurality of carboxyl groups on a cyclohexyl structure represented by the general formula (1) is at least one of cyclohexanedicarboxylic acid claim 1 , hydrogenated trimellitic acid claim 1 , and hydrogenated pyromellitic acid.4. The flux for soldering according to claim 1 ,wherein an amount of the base resin to be incorporated is from 30% by weight to 60% by weight with respect to a total amount of the flux for soldering,an amount of the activating agent to be incorporated is from 5% by weight to 15% by weight with respect to the total amount of the flux for soldering,an amount of the solvent to be incorporated is from 20% by weight to 50% by weight with respect to the total amount of the flux for soldering,the amount of the rosin to be incorporated is from 0% by weight to 30% by weight with respect to the total amount of the base resin, andan amount of the compound to be incorporated having a plurality of carboxyl groups on a cyclohexyl structure represented by the general formula (1) is of 0.5% by weight or more with respect to the total amount of the flux for soldering. The present application claims priority under 35 U.S.C. §119 to Japanese Patent Application No. 2013-203069, filed Sep. 30, 2013. The contents of this ...

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Номер записи: 89

21-03-2019 дата публикации

BONDING MATERIAL

Номер: US20190084093A1

Автор: SAITOU Koichi, SAKATA Masahiro, Takeuchi Masaki, UENO Fumitaka, YAMAGUCHI Masaki, YASU Katsuhiko

Принадлежит:

A bonding material disclosed in this specification contains high melting point metal particles, low melting point metal particles, and a thermosetting flux resin. A mass proportion of the high melting point metal particles with respect to a total mass of the high melting point metal particles and the low melting point metal particles is 55% to 75%. 1. A bonding material comprising:high melting point metal particles;low melting point metal particles whose melting point is lower than a melting point of the high melting point metal particles; anda thermosetting flux resinwherein a mass proportion of the high melting point metal particles with respect to a total mass of the high melting point metal particles and the low melting point metal particles is 55% to 75%.2. The bonding material according to claim 1 , wherein the mass proportion of the high melting point metal particles is 65% to 75%.3. The bonding material according to claim 1 , wherein the high melting point metal particles are any of Cu claim 1 , a Cu alloy claim 1 , Al claim 1 , Ag claim 1 , and Au claim 1 , and have a particle size of 5 μm to 30 μm.4. The bonding material according to claim 1 , wherein the low melting point metal particles are an Sn alloy and have a particle size of 20 μm to 40 μm.5. The bonding material according to claim 1 , wherein surfaces of the high melting point metal particles are plated with Sn or an Sn alloy.6. The bonding material according to claim 1 , wherein the flux resin includes an epoxy resin. The disclosure of Japanese Patent Application No. 2017-181702 filed on Sep. 21, 2017 including the specification, drawings and abstract is incorporated herein by reference in its entirety.The technology disclosed in this specification refers to a bonding material, and particularly, a bonding material that is unlikely to cause the occurrence of whiskers.A bonding material (solder material) obtained by mixing metal particles with a high melting point such as copper (Cu) and metal ...

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Номер записи: 90

21-03-2019 дата публикации

FLUX, SOLDER PASTE, AND METHOD FOR FORMING SOLDER BUMP

Номер: US20190084097A1

Автор: SAKAMOTO Isao, SHIBASAKI Masanori, Sugimoto Jun

Принадлежит: TAMURA CORPORATION

A flux includes a rosin resin, an activator, a thixotropic agent, and a solvent. The solvent includes 30% by mass or more and 60% by mass or less monovalent alcohol with respect to a total mass amount of the flux. The monovalent alcohol has 18 or more and 24 or less of carbon atoms in one molecule. 1. A flux comprising:a rosin resin;an activator;a thixotropic agent; anda solvent including 30% by mass or more and 60% by mass or less monovalent alcohol with respect to a total mass amount of the flux, the monovalent alcohol having 18 or more and 24 or less of carbon atoms in one molecule.2. The flux according to claim 1 , wherein the carbon atoms contained in the one molecule of the monovalent alcohol is 18 or more and 20 or less.3. The flux according to claim 1 , wherein the monovalent alcohol is a branched alcohol or an unsaturated alcohol.4. The flux according to claim 2 , wherein the monovalent alcohol is a branched alcohol or an unsaturated alcohol.5. The flux according to claim 1 , wherein the monovalent alcohol is at least one selected from the group consisting of oleyl alcohol claim 1 , isostearyl alcohol claim 1 , isoeicosanol claim 1 , 2-octyldodecanol claim 1 , and 2-decyltetradecanol.6. The flux according to claim 2 , wherein the monovalent alcohol is at least one selected from the group consisting of oleyl alcohol claim 2 , isostearyl alcohol claim 2 , isoeicosanol claim 2 , 2-octyldodecanol claim 2 , and 2-decyltetradecanol.7. The flux according to claim 3 , wherein the monovalent alcohol is at least one selected from the group consisting of oleyl alcohol claim 3 , isostearyl alcohol claim 3 , isoeicosanol claim 3 , 2-octyldodecanol claim 3 , and 2-decyltetradecanol.8. The flux according to claim 4 , wherein the monovalent alcohol is at least one selected from the group consisting of oleyl alcohol claim 4 , isostearyl alcohol claim 4 , isoeicosanol claim 4 , 2-octyldodecanol claim 4 , and 2-decyltetradecanol.9. The flux according to claim 1 , wherein a ...

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Номер записи: 91

02-04-2015 дата публикации

BRAZE ALLOY LAYERED PRODUCT

Номер: US20150093188A1

Автор: Sjödin Per, Walter Kristian

Принадлежит: ALFA LAVAL CORPORATE AB

The present invention relates to a method for providing a braze alloy layered product comprising the following steps: —applying at least one silicon source and at least one boron source on at least a part of a surface of a substrate, wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the substrate comprises a parent material having a solidus temperature above 1100° C.; —heating the substrate having the applied boron source and the applied silicon source to a temperature lower than the solidus temperature of the parent material of the substrate; and cooling the substrate having the applied boron source and the applied silicon source, and obtaining the braze alloy layered product. The present invention relates further to a braze alloy layered product, a method for providing a brazed product, a method for providing a coated product, and uses of the braze alloy layered product. 144.-. (canceled)45. A method for providing a braze alloy layered product comprising the following steps:applying at least one powder of a silicon source, in which the each particle is of a silicon source, and at least one powder of a boron source, in which each particle is a of a boron source, and wherein the particles have an average particle size less than 250 μm, and applying the powder of silicon source and the powder of boron source on at least a part of a surface of a substrate, wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, wherein the amount of inevitable amount of oxygen is less than 10 wt %, and wherein the substrate comprises a parent material having a solidus temperature above 1100° C.;heating the substrate having the applied boron source and the applied silicon source to a temperature lower than the solidus temperature of the parent material of the substrate; andcooling the ...

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Номер записи: 92

21-03-2019 дата публикации

Method and installation for coating a scaled hot-rolled strip

Номер: US20190085445A1

Автор: Markus Jaenecke

Принадлежит: SMS group GmbH

The invention relates to a method and an installation for coating a scaled hot-rolled strip (10). The method comprises at least the following steps: (i) providing a hot-rolled strip (10) in the form of a hot-rolled preliminary strip, (ii) preparing the surfaces of the hot-rolled strip (10), and (iii) coating of the hot-rolled strip (10) on at least one prepared surface thereof, wherein the coating is carried out at a temperature of ≤100° C. and immediately after the descaling of the hot-rolled strip (10).

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Номер записи: 93

21-03-2019 дата публикации

Method of cleaning pretreatment of ferrous components that have been joined by welding

Номер: US20190085469A1

Автор: Christoph Sturm, Stefan Dietz, Thomas JOHN-SCHILLINGS, Wilfried Serve

Принадлежит: Henkel AG and Co KGaA

The present invention relates to a method of cleaning pretreatment of ferrous components that have been joined by welding, in which residues from the welding operation are removed from the surface of the component and, in this way, subsequent wet-chemical conversion treatments are enabled so as to produce defect-free coatings. For cleaning pretreatment, the component is contacted with an aqueous sulfuric acid etchant which comprises amino alcohols, ethoxylates and/or propoxylates of fatty alcohols having 6 to 12 carbon atoms in the alcohol and iron ions, and is effective without the presence of fluorides. In a further aspect, the present invention encompasses an aqueous acidic etchant for cleaning pretreatment of ferrous components that have been joined by welding.

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Номер записи: 94

09-04-2015 дата публикации

AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME

Номер: US20150096651A1

Автор: Kojio Teppei, Maruo Hiroki, Motomura Koji

Принадлежит:

The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent. 1. An auxiliary joining agent adapted to aid joining of metals ,the auxiliary joining agent containing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant dissolved in the solvent,the solvent including a multi-functional alcohol having a molecular weight of 50 to 200, andthe colorant having a property of volatilizing along with the solvent.2. (canceled)3. The auxiliary joining agent according to claim 1 , wherein the solvent has a boiling point Tb claim 1 , and the colorant has a melting point Tm claim 1 , Tb and Tm satisfying Tb>Tm.4. The auxiliary joining agent according to claim 1 , having hue claim 1 , chroma claim 1 , and brightness that are visually recognizable.5. The auxiliary joining agent according to claim 1 , having a viscosity at 25° C. of 0.1 to 10 Pa·s.6. The auxiliary joining agent according to claim 1 , wherein the colorant is an organic coloring matter.7. The auxiliary joining agent according to claim 6 , wherein the organic coloring matter is at least one selected from the group consisting of azo compounds claim 6 , cyanine compounds claim 6 , and styryl compounds.8. The auxiliary joining agent according to claim 1 , containing the colorant in an amount ...

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Номер записи: 95

09-04-2015 дата публикации

Compositions for use in semiconductor devices

Номер: US20150097139A1

Автор: Donald L. Yates

Принадлежит: Micron Technology Inc

An improved composition and method for cleaning a surface of a semiconductor wafer are provided. The composition can be used to selectively remove a low-k dielectric material such as silicon dioxide, a photoresist layer overlying a low-k dielectric layer, or both layers from the surface of the wafer. The composition is formulated according to the invention to provide a desired removal rate of the low-k dielectric and/or photoresist from the surface of the wafer. By varying a fluorine ion component, and the amounts of the fluorine ion component and an acid component, and controlling the pH, a composition can be formulated in order to achieve a desired low-k dielectric removal rate that ranges from slow and controlled at about 50 to about 1000 angstroms per minute, to a relatively rapid removal of low-k dielectric material at greater than about 1000 angstroms per minute. The composition can also be formulated to selectively remove the photoresist layer, leaving the underlying low-k dielectric layer essentially intact.

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Номер записи: 96

19-03-2020 дата публикации

METAL CARBURIZATION PROCESS TO PRODUCE A UNIFORM, CONCENTRATED SOLID SOLUTION OF INTERSTITIAL CARBON WORKPIECE AND ARTICLES MADE FROM SAME

Номер: US20200087773A1

Автор: ERNST Frank, REN Zhe

Принадлежит:

A carburization method for steel is contemplated, with austenitic stainless steel showing particular promise. The surface is first passivated with an acidic solution and then subjected to low temperature (between ˜350 to 550° C. or between ˜650 to 1,000° F.) carburization in the presence of a concentrated carbon solution (e.g., carbon monoxide, hydrogen gas, and nitrogen gas), followed by a repeated cycle of passivation and carburization under identical conditions but for a comparatively shorter period of time relative to the first cycle. The carburized surface is allowed to cool and cleaned, after which the resulting surface is shown to have ultrahigh tensile strength, increased interatomic bonding strength, and lowered electrical and thermal conductivity. To the extent this method can be employed to completely saturate and penetrate the workpiece (e.g., a foil), the resultant material and article are formed entirely from a novel composition. 1. A process for forming a concentrated solid solution of interstitial carbon in austenitic steel without any underlying substrate layer , said concentrated solid solution having ultrahigh tensile strength , high yield strength , and high Young's modulus , the process comprising:providing a workpiece formed from austenitic steel having an original condition and a defined thickness,activating a surface of the workpiece with an acid-based treatment at an elevated temperature for a selected period of time;after the activating step, carburizing the workpiece at a temperature of less than 550° C. for a selected period of time; andwherein at least one of: the thickness of the workpiece, the acid based-treatment, the elevated temperature for the activating step, the selected period of time for the activating step, the elevated temperature for the carburizing step, and the selected period of time for the carburizing step are selected to ensure any underlying substrate layer is eliminated from the workpiece and wherein, after the ...

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Номер записи: 97

07-04-2016 дата публикации

LASER DEPOSITION AND REPAIR OF REACTIVE METALS

Номер: US20160096234A1

Автор: Bruck Gerald J., Kamel Ahmed

Принадлежит:

Laser processing of reactive metals. One repair process involves laser melting a titanium alloy filler material () in the presence of a flux composition () to form a titanium alloy cladding () bonded to a surface of a titanium-containing component (). A laser beam () may be applied to a flux composition () covering a powdered filler material () such that the laser beam simultaneously melts the flux composition and the powdered filler material to form a melt pool () which solidifies into a resulting alloy layer () covered by a slag layer (). A laser beam () may heat a flux composition () such that an amount of energy applied to the flux composition is controlled so that a molten slag blanket () heats and melts a powdered filler material () by thermal conduction in the presence of a shielding gas (). 1. A method , comprising laser melting a titanium alloy filler material in the presence of a flux composition under an atmosphere comprising greater than 10 ppm of oxygen , to form a titanium alloy cladding bonded to a surface of a titanium-containing component.2. The method of claim 1 , wherein:{'sub': 2', '2', '2', '3', '2', '2', '2', '2', '3', '3', '3', '3', '3', '2', '3', '3', '3', '2', '2', '2', '2', '2', '3', '2', '2', '3', '2', '3', '2', '2', '2', '3', '2', '2', '2', '2', '2', '2', '2', '2', '2', '2', '2', '2', '2', '3', '2', '2', '4', '3', '3', '3', '2', '2', '4', '2', '2', '2', '2', '3', '3', '3', '3', '4', '4', '2', '4', '4', '4', '4', '5', '5', '3', '5', '3', '3', '2', '2', '2', '2', '2', '2', '2', '3', '2', '3', '3', '3', '2', '2', '2', '4', '3', '3', '3', '2', '2', '2', '4', '4', '5', '5', '4', '6', '3', '5', '3', '2', '2', '3', '3', '3', '3', '3', '3', '3', '3', '3', '4', '3, 'the flux composition comprises at least one selected from the group consisting of LiF, LiCl, LiBr, LiI, NaF, NaCl, NaBr, MgF, MgCl, MgBr, AlF, KCl, KF, KBr, CaF, CaF, CaBr, CaCl, CaI, ScBr, ScCl, ScF, ScI, TiF, VCl, VCl, CrCl, CrBr, CrCl, CrF, MnCl, MnBr, MnF, MnF, MnI, FeBr, FeBr, ...

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Номер записи: 98

26-06-2014 дата публикации

Flux for brazing aluminum materials

Номер: US20140174606A1

Автор: Takahiro Nagae

Принадлежит: Daiichi Kigenso Kagaku Kogyo Co Ltd

The present invention provides a flux for brazing aluminum-based materials, the flux being capable of brazing an A5052 alloy or the like containing 1.5 wt % or more of magnesium even when an Al-Si eutectic alloy (Si content: 7 to 12 wt %; A4343 alloy, A4047 alloy; melt starting temperature: about 577 to 615° C.) is used as a brazing material. Specifically, the present invention provides a flux for brazing aluminum-based materials, the flux comprising LiF, AlF 3 , and CsF, and the composition ratio of the three components being adjusted to within the range enclosed by four lines: line C connecting ( 30, 0, 70 ) and ( 30, 70, 0 ), line ( 1 ) connecting ( 31, 33.5, 35.5 ) and ( 51.5, 22.5, 26 ), line ( 2 ) connecting ( 32.5, 28.5, 39 ) and ( 49, 21.5, 29.5 ), and line ( 3 ) connecting ( 57.5, 42.5, 0 ) and ( 57.5, 0, 42.5 ), excluding the points on line C, in the triangular coordinates indicating LiF mol %, AlF 3 mol %, and CsF mol %.

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Номер записи: 99

05-04-2018 дата публикации

USE OF ALKANE SULFONIC ACID FOR CLEANING IN THE SUGAR INDUSTRIES

Номер: US20180093305A1

Автор: Laffitte Jean-Alex, Monguillon Bernard

Принадлежит: Arkema France

The present invention concerns the use of at least one alkane sulfonic acid of formula R—SOH, in which R represents a linear or branched saturated hydrocarbon chain comprising 1 to 4 carbon atoms, for cleaning solid deposits containing at least one aconitic acid salt. The invention also concerns a method for cleaning solid deposits containing at least one aconitic acid salt, using at least one alkane sulfonic acid. 1. A process for cleaning , from a surface , solid deposits to be eliminated , wherein the solid deposits comprise at least one aconitic acid salt , wherein the process comprises the steps of: a) bringing at least one alkane sulfonic acid of formula R—SOH , in which R represents a linear or branched , saturated hydrocarbon-based chain comprising from 1 to 4 carbon atoms , into contact with the solid deposits comprising at least one aconitic acid salt , and b) allowing the at least one alkane sulfonic acid to dissolve the solid deposits comprising at least one aconitic acid salt , thereby eliminating the solid deposits from the surface.2. The process according to claim 1 , wherein the alkane sulfonic acid is selected from the group consisting of methanesulfonic acid claim 1 , ethanesulfonic acid claim 1 , n-propanesulfonic acid claim 1 , iso-propanesulfonic acid claim 1 , n-butanesulfonic acid claim 1 , iso-butanesulfonic acid claim 1 , sec-butanesulfonic acid claim 1 , tert-butanesulfonic acid claim 1 , and mixtures thereof.3. The process according to claim 2 , wherein the alkane sulfonic acid is methanesulfonic acid or ethanesulfonic acid.4. The process according to claim 1 , wherein the at least one alkane sulfonic acid is in the form of a formulation claim 1 , wherein the formulation comprises from 0.01% to 100% of the alkane sulfonic acid relative to the total weight of the formulation.5. The process according to claim 4 , wherein the formulation is aqueous claim 4 , or organic claim 4 , or aqueous-organic claim 4 , or is ready to use claim 4 , or is ...

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Номер записи: 100